Freescale Semiconductor Data Sheet: Technical Data K20 Sub-Family Document Number: K20P144M100SF2V2 Rev. 3, 6/2013 K20P144M100SF2V2 Supports the following: MK20DX128VLQ10, MK20DX128VMD10, MK20DX256VLQ10, MK20DX256VMD10, MK20DN512VLQ10, MK20DN512VMD10 Features * Operating Characteristics - Voltage range: 1.71 to 3.6 V - Flash write voltage range: 1.71 to 3.6 V - Temperature range (ambient): -40 to 105C * Performance - Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz * Memories and memory interfaces - Up to 512 KB program flash memory on nonFlexMemory devices - Up to 256 KB program flash memory on FlexMemory devices - Up to 256 KB FlexNVM on FlexMemory devices - 4 KB FlexRAM on FlexMemory devices - Up to 128 KB RAM - Serial programming interface (EzPort) - FlexBus external bus interface * Clocks - 3 to 32 MHz crystal oscillator - 32 kHz crystal oscillator - Multi-purpose clock generator * System peripherals - Multiple low-power modes to provide power optimization based on application requirements - Memory protection unit with multi-master protection - 16-channel DMA controller, supporting up to 63 request sources - External watchdog monitor - Software watchdog - Low-leakage wakeup unit * Security and integrity modules - Hardware CRC module to support fast cyclic redundancy checks - 128-bit unique identification (ID) number per chip * Human-machine interface - Low-power hardware touch sensor interface (TSI) - General-purpose input/output * Analog modules - Two 16-bit SAR ADCs - Programmable gain amplifier (PGA) (up to x64) integrated into each ADC - Two 12-bit DACs - Two transimpedance amplifiers - Three analog comparators (CMP) containing a 6-bit DAC and programmable reference input - Voltage reference * Timers - Programmable delay block - Eight-channel motor control/general purpose/PWM timer - Two 2-channel quadrature decoder/general purpose timers - Periodic interrupt timers - 16-bit low-power timer - Carrier modulator transmitter - Real-time clock Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. (c) 2012-2013 Freescale Semiconductor, Inc. * Communication interfaces - USB full-/low-speed On-the-Go controller with on-chip transceiver - Two Controller Area Network (CAN) modules - Three SPI modules - Two I2C modules - Six UART modules - Secure Digital host controller (SDHC) - I2S module K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 2 Freescale Semiconductor, Inc. Table of Contents 1 Ordering parts...........................................................................5 5.4.2 Thermal attributes...............................................23 1.1 Determining valid orderable parts......................................5 6 Peripheral operating requirements and behaviors....................24 2 Part identification......................................................................5 6.1 Core modules....................................................................24 2.1 Description.........................................................................5 6.1.1 Debug trace timing specifications.......................24 2.2 Format...............................................................................5 6.1.2 JTAG electricals..................................................25 2.3 Fields.................................................................................5 6.2 System modules................................................................28 2.4 Example............................................................................6 6.3 Clock modules...................................................................28 3 Terminology and guidelines......................................................6 6.3.1 MCG specifications.............................................28 3.1 Definition: Operating requirement......................................6 6.3.2 Oscillator electrical specifications.......................30 3.2 Definition: Operating behavior...........................................7 6.3.3 32 kHz oscillator electrical characteristics..........33 3.3 Definition: Attribute............................................................7 6.4 Memories and memory interfaces.....................................33 3.4 Definition: Rating...............................................................8 6.4.1 Flash electrical specifications.............................33 3.5 Result of exceeding a rating..............................................8 6.4.2 EzPort switching specifications...........................38 3.6 Relationship between ratings and operating 6.4.3 Flexbus switching specifications.........................39 requirements......................................................................8 6.5 Security and integrity modules..........................................42 3.7 Guidelines for ratings and operating requirements............9 6.6 Analog...............................................................................42 3.8 Definition: Typical value.....................................................9 6.6.1 ADC electrical specifications..............................42 3.9 Typical value conditions....................................................10 6.6.2 CMP and 6-bit DAC electrical specifications......50 4 Ratings......................................................................................11 6.6.3 12-bit DAC electrical characteristics...................53 4.1 Thermal handling ratings...................................................11 6.6.4 Voltage reference electrical specifications..........56 4.2 Moisture handling ratings..................................................11 6.7 Timers................................................................................57 4.3 ESD handling ratings.........................................................11 6.8 Communication interfaces.................................................57 4.4 Voltage and current operating ratings...............................11 6.8.1 USB electrical specifications...............................57 5 General.....................................................................................12 6.8.2 USB DCD electrical specifications......................58 5.1 AC electrical characteristics..............................................12 6.8.3 USB VREG electrical specifications...................58 5.2 Nonswitching electrical specifications...............................12 6.8.4 CAN switching specifications..............................59 6.8.5 DSPI switching specifications (limited voltage 5.2.1 Voltage and current operating requirements......13 5.2.2 LVD and POR operating requirements...............14 5.2.3 Voltage and current operating behaviors............14 5.2.4 Power mode transition operating behaviors.......16 5.2.5 Power consumption operating behaviors............17 6.8.7 Inter-Integrated Circuit Interface (I2C) timing..... 62 5.2.6 EMC radiated emissions operating behaviors....20 6.8.8 UART switching specifications............................63 5.2.7 Designing with radiated emissions in mind.........21 6.8.9 SDHC specifications...........................................63 5.2.8 Capacitance attributes........................................21 6.8.10 I2S/SAI switching specifications.........................64 5.3 Switching specifications.....................................................21 range).................................................................59 6.8.6 DSPI switching specifications (full voltage range).................................................................60 6.9 Human-machine interfaces (HMI)......................................71 5.3.1 Device clock specifications.................................21 5.3.2 General switching specifications.........................22 7 Dimensions...............................................................................72 5.4 Thermal specifications.......................................................23 7.1 Obtaining package dimensions.........................................72 5.4.1 Thermal operating requirements.........................23 6.9.1 TSI electrical specifications................................71 8 Pinout........................................................................................72 K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 3 8.1 K20 signal multiplexing and pin assignments....................72 9 Revision history.........................................................................80 8.2 K20 pinouts.......................................................................78 K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 4 Freescale Semiconductor, Inc. Ordering parts 1 Ordering parts 1.1 Determining valid orderable parts Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to freescale.com and perform a part number search for the following device numbers: PK20 and MK20 . 2 Part identification 2.1 Description Part numbers for the chip have fields that identify the specific part. You can use the values of these fields to determine the specific part you have received. 2.2 Format Part numbers for this device have the following format: Q K## A M FFF R T PP CC N 2.3 Fields This table lists the possible values for each field in the part number (not all combinations are valid): Field Description Values Q Qualification status * M = Fully qualified, general market flow * P = Prequalification K## Kinetis family * K20 A Key attribute * D = Cortex-M4 w/ DSP * F = Cortex-M4 w/ DSP and FPU M Flash memory type * N = Program flash only * X = Program flash and FlexMemory Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 5 Terminology and guidelines Field Description Values FFF Program flash memory size * * * * * * * 32 = 32 KB 64 = 64 KB 128 = 128 KB 256 = 256 KB 512 = 512 KB 1M0 = 1 MB 2M0 = 2 MB R Silicon revision * Z = Initial * (Blank) = Main * A = Revision after main T Temperature range (C) * V = -40 to 105 * C = -40 to 85 PP Package identifier * * * * * * * * * * * FM = 32 QFN (5 mm x 5 mm) FT = 48 QFN (7 mm x 7 mm) LF = 48 LQFP (7 mm x 7 mm) LH = 64 LQFP (10 mm x 10 mm) MP = 64 MAPBGA (5 mm x 5 mm) LK = 80 LQFP (12 mm x 12 mm) LL = 100 LQFP (14 mm x 14 mm) MC = 121 MAPBGA (8 mm x 8 mm) LQ = 144 LQFP (20 mm x 20 mm) MD = 144 MAPBGA (13 mm x 13 mm) MJ = 256 MAPBGA (17 mm x 17 mm) CC Maximum CPU frequency (MHz) * * * * * 5 = 50 MHz 7 = 72 MHz 10 = 100 MHz 12 = 120 MHz 15 = 150 MHz N Packaging type * R = Tape and reel * (Blank) = Trays 2.4 Example This is an example part number: MK20DN512ZVMD10 3 Terminology and guidelines 3.1 Definition: Operating requirement An operating requirement is a specified value or range of values for a technical characteristic that you must guarantee during operation to avoid incorrect operation and possibly decreasing the useful life of the chip. K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 6 Freescale Semiconductor, Inc. Terminology and guidelines 3.1.1 Example This is an example of an operating requirement: Symbol VDD Description 1.0 V core supply voltage Min. 0.9 Max. 1.1 Unit V 3.2 Definition: Operating behavior An operating behavior is a specified value or range of values for a technical characteristic that are guaranteed during operation if you meet the operating requirements and any other specified conditions. 3.2.1 Example This is an example of an operating behavior: Symbol IWP Description Min. Digital I/O weak pullup/ 10 pulldown current Max. 130 Unit A 3.3 Definition: Attribute An attribute is a specified value or range of values for a technical characteristic that are guaranteed, regardless of whether you meet the operating requirements. 3.3.1 Example This is an example of an attribute: Symbol CIN_D Description Input capacitance: digital pins Min. -- Max. 7 Unit pF K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 7 Terminology and guidelines 3.4 Definition: Rating A rating is a minimum or maximum value of a technical characteristic that, if exceeded, may cause permanent chip failure: * Operating ratings apply during operation of the chip. * Handling ratings apply when the chip is not powered. 3.4.1 Example This is an example of an operating rating: Symbol VDD Description 1.0 V core supply voltage Min. -0.3 Max. 1.2 Unit V 3.5 Result of exceeding a rating Failures in time (ppm) 40 30 The likelihood of permanent chip failure increases rapidly as soon as a characteristic begins to exceed one of its operating ratings. 20 10 0 Operating rating Measured characteristic K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 8 Freescale Semiconductor, Inc. Terminology and guidelines 3.6 Relationship between ratings and operating requirements g tin ng ati ( n.) mi r era Op era Op g tin e uir req nt me .) ax ) in. (m t era Op ing e uir req (m nt me Op ng ati gr tin a r e .) ax (m Fatal range Degraded operating range Normal operating range Degraded operating range Fatal range Expected permanent failure - No permanent failure - Possible decreased life - Possible incorrect operation - No permanent failure - Correct operation - No permanent failure - Possible decreased life - Possible incorrect operation Expected permanent failure - Operating (power on) g lin nd ing rat (m ) in. ling nd Ha Ha a (m ing rat x.) Fatal range Handling range Fatal range Expected permanent failure No permanent failure Expected permanent failure - Handling (power off) 3.7 Guidelines for ratings and operating requirements Follow these guidelines for ratings and operating requirements: * Never exceed any of the chip's ratings. * During normal operation, don't exceed any of the chip's operating requirements. * If you must exceed an operating requirement at times other than during normal operation (for example, during power sequencing), limit the duration as much as possible. 3.8 Definition: Typical value A typical value is a specified value for a technical characteristic that: * Lies within the range of values specified by the operating behavior * Given the typical manufacturing process, is representative of that characteristic during operation when you meet the typical-value conditions or other specified conditions Typical values are provided as design guidelines and are neither tested nor guaranteed. K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 9 Terminology and guidelines 3.8.1 Example 1 This is an example of an operating behavior that includes a typical value: Symbol Description IWP Digital I/O weak pullup/pulldown current Min. 10 Typ. 70 Max. 130 Unit A 3.8.2 Example 2 This is an example of a chart that shows typical values for various voltage and temperature conditions: 5000 4500 4000 TJ IDD_STOP (A) 3500 150 C 3000 105 C 2500 25 C 2000 -40 C 1500 1000 500 0 0.90 0.95 1.00 1.05 1.10 VDD (V) 3.9 Typical value conditions Typical values assume you meet the following conditions (or other conditions as specified): Symbol Description Value Unit TA Ambient temperature 25 C VDD 3.3 V supply voltage 3.3 V K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 10 Freescale Semiconductor, Inc. Ratings 4 Ratings 4.1 Thermal handling ratings Symbol Description Min. Max. Unit Notes TSTG Storage temperature -55 150 C 1 TSDR Solder temperature, lead-free -- 260 C 2 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.2 Moisture handling ratings Symbol MSL Description Moisture sensitivity level Min. Max. Unit Notes -- 3 -- 1 1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.3 ESD handling ratings Symbol Description Min. Max. Unit Notes VHBM Electrostatic discharge voltage, human body model -2000 +2000 V 1 VCDM Electrostatic discharge voltage, charged-device model -500 +500 V 2 Latch-up current at ambient temperature of 105C -100 +100 mA 3 ILAT 1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components. 3. Determined according to JEDEC Standard JESD78, IC Latch-Up Test. 4.4 Voltage and current operating ratings K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 11 General Symbol Description Min. Max. Unit VDD Digital supply voltage -0.3 3.8 V IDD Digital supply current -- 185 mA VDIO Digital input voltage (except RESET, EXTAL, and XTAL) -0.3 5.5 V VAIO Analog1, RESET, EXTAL, and XTAL input voltage -0.3 VDD + 0.3 V Maximum current single pin limit (applies to all digital pins) -25 25 mA ID VDDA Analog supply voltage VDD - 0.3 VDD + 0.3 V VUSB_DP USB_DP input voltage -0.3 3.63 V VUSB_DM USB_DM input voltage -0.3 3.63 V VREGIN USB regulator input -0.3 6.0 V RTC battery supply voltage -0.3 3.8 V VBAT 1. Analog pins are defined as pins that do not have an associated general purpose I/O port function. 5 General 5.1 AC electrical characteristics Unless otherwise specified, propagation delays are measured from the 50% to the 50% point, and rise and fall times are measured at the 20% and 80% points, as shown in the following figure. Figure 1. Input signal measurement reference All digital I/O switching characteristics assume: 1. output pins * have CL=30pF loads, * are configured for fast slew rate (PORTx_PCRn[SRE]=0), and * are configured for high drive strength (PORTx_PCRn[DSE]=1) 2. input pins * have their passive filter disabled (PORTx_PCRn[PFE]=0) K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 12 Freescale Semiconductor, Inc. General 5.2 Nonswitching electrical specifications 5.2.1 Voltage and current operating requirements Table 1. Voltage and current operating requirements Symbol Description Min. Max. Unit VDD Supply voltage 1.71 3.6 V VDDA Analog supply voltage 1.71 3.6 V VDD - VDDA VDD-to-VDDA differential voltage -0.1 0.1 V VSS - VSSA VSS-to-VSSA differential voltage -0.1 0.1 V 1.71 3.6 V * 2.7 V VDD 3.6 V 0.7 x VDD -- V * 1.7 V VDD 2.7 V 0.75 x VDD -- V * 2.7 V VDD 3.6 V -- 0.35 x VDD V * 1.7 V VDD 2.7 V -- 0.3 x VDD V 0.06 x VDD -- V -5 -- mA VBAT VIH VIL RTC battery supply voltage Input high voltage Input low voltage VHYS Input hysteresis IICDIO Digital pin negative DC injection current -- single pin * VIN < VSS-0.3V IICAIO IICcont 1 Analog2, EXTAL, and XTAL pin DC injection current -- single pin 3 mA * VIN < VSS-0.3V (Negative current injection) -5 -- * VIN > VDD+0.3V (Positive current injection) -- +5 -25 -- -- +25 Contiguous pin DC injection current --regional limit, includes sum of negative injection currents or sum of positive injection currents of 16 contiguous pins * Negative current injection * Positive current injection mA VODPU Open drain pullup voltage level VDD VDD V VRAM VDD voltage required to retain RAM 1.2 -- V VPOR_VBAT -- V VRFVBAT Notes VBAT voltage required to retain the VBAT register file 4 1. All 5 V tolerant digital I/O pins are internally clamped to VSS through an ESD protection diode. There is no diode connection to VDD. If VIN is less than VDIO_MIN, a current limiting resistor is required. The negative DC injection current limiting resistor is calculated as R=(VDIO_MIN-VIN)/|IICDIO|. 2. Analog pins are defined as pins that do not have an associated general purpose I/O port function. Additionally, EXTAL and XTAL are analog pins. 3. All analog pins are internally clamped to VSS and VDD through ESD protection diodes. If VIN is less than VAIO_MIN or greater than VAIO_MAX, a current limiting resistor is required. The negative DC injection current limiting resistor is calculated as R=(VAIO_MIN-VIN)/|IICAIO|. The positive injection current limiting resistor is calculated as R=(VIN-VAIO_MAX)/|IICAIO|. Select the larger of these two calculated resistances if the pin is exposed to positive and negative injection currents. 4. Open drain outputs must be pulled to VDD. K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 13 General 5.2.2 LVD and POR operating requirements Table 2. VDD supply LVD and POR operating requirements Symbol Description Min. Typ. Max. Unit VPOR Falling VDD POR detect voltage 0.8 1.1 1.5 V VLVDH Falling low-voltage detect threshold -- high range (LVDV=01) 2.48 2.56 2.64 V Low-voltage warning thresholds -- high range 1 VLVW1H * Level 1 falling (LVWV=00) 2.62 2.70 2.78 V VLVW2H * Level 2 falling (LVWV=01) 2.72 2.80 2.88 V VLVW3H * Level 3 falling (LVWV=10) 2.82 2.90 2.98 V VLVW4H * Level 4 falling (LVWV=11) 2.92 3.00 3.08 V -- 80 -- mV 1.54 1.60 1.66 V VHYSH Low-voltage inhibit reset/recover hysteresis -- high range VLVDL Falling low-voltage detect threshold -- low range (LVDV=00) Low-voltage warning thresholds -- low range 1 VLVW1L * Level 1 falling (LVWV=00) 1.74 1.80 1.86 V VLVW2L * Level 2 falling (LVWV=01) 1.84 1.90 1.96 V VLVW3L * Level 3 falling (LVWV=10) 1.94 2.00 2.06 V VLVW4L * Level 4 falling (LVWV=11) 2.04 2.10 2.16 V -- 60 -- mV VHYSL Low-voltage inhibit reset/recover hysteresis -- low range Notes VBG Bandgap voltage reference 0.97 1.00 1.03 V tLPO Internal low power oscillator period -- factory trimmed 900 1000 1100 s 1. Rising thresholds are falling threshold + hysteresis voltage Table 3. VBAT power operating requirements Symbol Description VPOR_VBAT Falling VBAT supply POR detect voltage Min. Typ. Max. Unit 0.8 1.1 1.5 V Notes K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 14 Freescale Semiconductor, Inc. General 5.2.3 Voltage and current operating behaviors Table 4. Voltage and current operating behaviors Symbol VOH Min. Typ.1 Max. Unit * 2.7 V VDD 3.6 V, IOH = -9mA VDD - 0.5 -- -- V * 1.71 V VDD 2.7 V, IOH = -3mA VDD - 0.5 -- -- V * 2.7 V VDD 3.6 V, IOH = -2mA VDD - 0.5 -- -- V * 1.71 V VDD 2.7 V, IOH = -0.6mA VDD - 0.5 -- -- V -- -- 100 mA Description Notes Output high voltage -- high drive strength Output high voltage -- low drive strength IOHT Output high current total for all ports VOL Output low voltage -- high drive strength 2 * 2.7 V VDD 3.6 V, IOL = 10mA -- -- 0.5 V * 1.71 V VDD 2.7 V, IOL = 5mA -- -- 0.5 V * 2.7 V VDD 3.6 V, IOL = 2mA -- -- 0.5 V * 1.71 V VDD 2.7 V, IOL = 1mA -- -- 0.5 V -- -- 100 mA Output low voltage -- low drive strength IOLT Output low current total for all ports IINA Input leakage current, analog pins and digital pins configured as analog inputs 3, 4 * VSS VIN VDD * All pins except EXTAL32, XTAL32, EXTAL, XTAL * EXTAL (PTA18) and XTAL (PTA19) * EXTAL32, XTAL32 IIND -- 0.002 0.5 A -- 0.004 1.5 A -- 0.075 10 A Input leakage current, digital pins 4, 5 * VSS VIN VIL * All digital pins -- 0.002 0.5 A -- 0.002 0.5 A -- 0.004 1 A * VIN = VDD * All digital pins except PTD7 * PTD7 IIND Input leakage current, digital pins 4, 5, 6 * VIL < VIN < VDD * VDD = 3.6 V -- 18 26 A * VDD = 3.0 V -- 12 49 A * VDD = 2.5 V -- 8 13 A * VDD = 1.7 V -- 3 6 A Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 15 General Table 4. Voltage and current operating behaviors (continued) Symbol IIND Description Min. Max. Unit Input leakage current, digital pins * VDD < VIN < 5.5 V ZIND Typ.1 Notes 4, 5 -- 1 50 A Input impedance examples, digital pins 4, 7 * VDD = 3.6 V -- -- 48 k * VDD = 3.0 V -- -- 55 k * VDD = 2.5 V -- -- 57 k * VDD = 1.7 V -- -- 85 k RPU Internal pullup resistors 20 35 50 k 8 RPD Internal pulldown resistors 20 35 50 k 9 1. 2. 3. 4. 5. 6. 7. Typical values characterized at 25C and VDD = 3.6 V unless otherwise noted. Open drain outputs must be pulled to VDD. Analog pins are defined as pins that do not have an associated general purpose I/O port function. Digital pins have an associated GPIO port function and have 5V tolerant inputs, except EXTAL and XTAL. Internal pull-up/pull-down resistors disabled. Characterized, not tested in production. Examples calculated using VIL relation, VDD, and max IIND: ZIND=VIL/IIND. This is the impedance needed to pull a high signal to a level below VIL due to leakage when VIL < VIN < VDD. These examples assume signal source low = 0 V. 8. Measured at VDD supply voltage = VDD min and Vinput = VSS 9. Measured at VDD supply voltage = VDD min and Vinput = VDD I IND Digital input Source + - Z IND 5.2.4 Power mode transition operating behaviors All specifications except tPOR, and VLLSxRUN recovery times in the following table assume this clock configuration: * * * * * CPU and system clocks = 100 MHz Bus clock = 50 MHz FlexBus clock = 50 MHz Flash clock = 25 MHz MCG mode: FEI K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 16 Freescale Semiconductor, Inc. General Table 5. Power mode transition operating behaviors Symbol tPOR Description Min. Max. After a POR event, amount of time from the point VDD reaches 1.71 V to execution of the first instruction across the operating temperature range of the chip. Unit Notes 1 * VDD slew rate 5.7 kV/s * VDD slew rate < 5.7 kV/s * VLLS1 RUN * VLLS2 RUN * VLLS3 RUN * LLS RUN * VLPS RUN * STOP RUN s -- 300 -- 1.7 V / (VDD slew rate) -- 130 s -- 92 s -- 92 s -- 5.9 s -- 5.0 s -- 5.0 s 1. Normal boot (FTFL_OPT[LPBOOT]=1) 5.2.5 Power consumption operating behaviors Table 6. Power consumption operating behaviors Symbol IDDA IDD_RUN Description Analog supply current Typ. Max. Unit Notes -- -- See note mA 1 Run mode current -- all peripheral clocks disabled, code executing from flash * @ 1.8V * @ 3.0V IDD_RUN Min. 2 -- 37 63 mA -- 38 64 mA Run mode current -- all peripheral clocks enabled, code executing from flash * @ 1.8V * @ 3.0V * @ 25C 3, 4 -- 46 77 mA -- 47 63 mA -- 58 79 mA * @ 125C IDD_WAIT Wait mode high frequency current at 3.0 V -- all peripheral clocks disabled -- 20 -- mA 2 IDD_WAIT Wait mode reduced frequency current at 3.0 V -- all peripheral clocks disabled -- 9 -- mA 5 IDD_VLPR Very-low-power run mode current at 3.0 V -- all peripheral clocks disabled -- 1.12 -- mA 6 Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 17 General Table 6. Power consumption operating behaviors (continued) Symbol Description Min. Typ. Max. Unit Notes IDD_VLPR Very-low-power run mode current at 3.0 V -- all peripheral clocks enabled -- 1.71 -- mA 7 IDD_VLPW Very-low-power wait mode current at 3.0 V -- all peripheral clocks disabled -- 0.77 -- mA 8 IDD_STOP Stop mode current at 3.0 V * @ -40 to 25C -- 0.74 1.41 mA * @ 70C -- 2.45 11.5 mA * @ 105C -- 6.61 30 mA * @ -40 to 25C -- 83 435 A * @ 70C -- 425 2000 A * @ 105C -- 1280 4000 A IDD_VLPS IDD_LLS IDD_VLLS3 IDD_VLLS2 IDD_VLLS1 IDD_VBAT Very-low-power stop mode current at 3.0 V Low leakage stop mode current at 3.0 V 9 * @ -40 to 25C -- 4.58 19.9 A * @ 70C -- 30.6 105 A * @ 105C -- 137 500 A Very low-leakage stop mode 3 current at 3.0 V 9 * @ -40 to 25C -- 3.0 23 A * @ 70C -- 18.6 43 A * @ 105C -- 84.9 230 A * @ -40 to 25C -- 2.2 5.4 A * @ 70C -- 9.3 35 A * @ 105C -- 41.4 128 A * @ -40 to 25C -- 2.1 9 A * @ 70C -- 7.6 28 A * @ 105C -- 33.5 95.5 A -- 0.19 0.22 A -- 0.49 0.64 A -- 2.2 3.2 A Very low-leakage stop mode 2 current at 3.0 V Very low-leakage stop mode 1 current at 3.0 V Average current with RTC and 32kHz disabled at 3.0 V * @ -40 to 25C * @ 70C * @ 105C Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 18 Freescale Semiconductor, Inc. General Table 6. Power consumption operating behaviors (continued) Symbol Description Min. IDD_VBAT Average current when CPU is not accessing RTC registers Typ. Max. Unit Notes 10 * @ 1.8V * @ -40 to 25C * @ 70C * @ 105C -- 0.57 0.67 A -- 0.90 1.2 A -- 2.4 3.5 A -- 0.67 0.94 A -- 1.0 1.4 A -- 2.7 3.9 A * @ 3.0V * @ -40 to 25C * @ 70C * @ 105C 1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See each module's specification for its supply current. 2. 100MHz core and system clock, 50MHz bus and FlexBus clock, and 25MHz flash clock . MCG configured for FEI mode. All peripheral clocks disabled. 3. 100MHz core and system clock, 50MHz bus and FlexBus clock, and 25MHz flash clock. MCG configured for FEI mode. All peripheral clocks enabled. 4. Max values are measured with CPU executing DSP instructions. 5. 25MHz core and system clock, 25MHz bus clock, and 12.5MHz FlexBus and flash clock. MCG configured for FEI mode. 6. 4 MHz core, system, FlexBus, and bus clock and 1MHz flash clock. MCG configured for BLPE mode. All peripheral clocks disabled. Code executing from flash. 7. 4 MHz core, system, FlexBus, and bus clock and 1MHz flash clock. MCG configured for BLPE mode. All peripheral clocks enabled but peripherals are not in active operation. Code executing from flash. 8. 4 MHz core, system, FlexBus, and bus clock and 1MHz flash clock. MCG configured for BLPE mode. All peripheral clocks disabled. 9. Data reflects devices with 128 KB of RAM. For devices with 64 KB of RAM, power consumption is reduced by 2 A. For devices with 32 KB of RAM, power consumption is reduced by 3 A. 10. Includes 32kHz oscillator current and RTC operation. 5.2.5.1 Diagram: Typical IDD_RUN operating behavior The following data was measured under these conditions: * MCG in FBE mode for 50 MHz and lower frequencies. MCG in FEE mode at greater than 50 MHz frequencies. * USB regulator disabled * No GPIOs toggled * Code execution from flash with cache enabled * For the ALLOFF curve, all peripheral clocks are disabled except FTFL K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 19 General Figure 2. Run mode supply current vs. core frequency 5.2.6 EMC radiated emissions operating behaviors Table 7. EMC radiated emissions operating behaviors for 144LQFP and 144MAPBGA Symbol Description Frequency band (MHz) 144LQFP 144MAPBGA Unit Notes 1, 2 VRE1 Radiated emissions voltage, band 1 0.15-50 23 12 dBV VRE2 Radiated emissions voltage, band 2 50-150 27 24 dBV VRE3 Radiated emissions voltage, band 3 150-500 28 27 dBV VRE4 Radiated emissions voltage, band 4 500-1000 14 11 dBV IEC level 0.15-1000 K K -- VRE_IEC 2, 3 1. Determined according to IEC Standard 61967-1, Integrated Circuits - Measurement of Electromagnetic Emissions, 150 kHz to 1 GHz Part 1: General Conditions and Definitions and IEC Standard 61967-2, Integrated Circuits - Measurement of Electromagnetic Emissions, 150 kHz to 1 GHz Part 2: Measurement of Radiated Emissions--TEM Cell and Wideband TEM Cell Method. Measurements were made while the microcontroller was running basic application code. The reported emission level is the value of the maximum measured emission, rounded up to the next whole number, from among the measured orientations in each frequency range. K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 20 Freescale Semiconductor, Inc. General 2. VDD = 3.3 V, TA = 25 C, fOSC = 12 MHz (crystal), fSYS = 96 MHz, fBUS = 48 MHz 3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions--TEM Cell and Wideband TEM Cell Method 5.2.7 Designing with radiated emissions in mind To find application notes that provide guidance on designing your system to minimize interference from radiated emissions: 1. Go to www.freescale.com. 2. Perform a keyword search for "EMC design." 5.2.8 Capacitance attributes Table 8. Capacitance attributes Symbol Description Min. Max. Unit CIN_A Input capacitance: analog pins -- 7 pF CIN_D Input capacitance: digital pins -- 7 pF 5.3 Switching specifications 5.3.1 Device clock specifications Table 9. Device clock specifications Symbol Description Min. Max. Unit System and core clock -- 100 MHz System and core clock when Full Speed USB in operation 20 -- MHz Bus clock -- 50 MHz FlexBus clock -- 50 MHz fFLASH Flash clock -- 25 MHz fLPTMR LPTMR clock -- 25 MHz Notes Normal run mode fSYS fSYS_USB fBUS FB_CLK VLPR mode1 fSYS System and core clock -- 4 MHz fBUS Bus clock -- 4 MHz FlexBus clock -- 4 MHz Flash clock -- 1 MHz FB_CLK fFLASH Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 21 General Table 9. Device clock specifications (continued) Symbol Description fERCLK fLPTMR_pin fLPTMR_ERCLK Min. Max. Unit External reference clock -- 16 MHz LPTMR clock -- 25 MHz LPTMR external reference clock -- 16 MHz -- 8 MHz fFlexCAN_ERCLK FlexCAN external reference clock fI2S_MCLK I2S master clock -- 12.5 MHz fI2S_BCLK I2S bit clock -- 4 MHz Notes 1. The frequency limitations in VLPR mode here override any frequency specification listed in the timing specification for any other module. 5.3.2 General switching specifications These general purpose specifications apply to all signals configured for GPIO, UART, CAN, CMT, and I2C signals. Table 10. General switching specifications Symbol Description Min. Max. Unit Notes GPIO pin interrupt pulse width (digital glitch filter disabled) -- Synchronous path 1.5 -- Bus clock cycles 1, 2 GPIO pin interrupt pulse width (digital glitch filter disabled, analog filter enabled) -- Asynchronous path 100 -- ns 3 GPIO pin interrupt pulse width (digital glitch filter disabled, analog filter disabled) -- Asynchronous path 16 -- ns 3 External reset pulse width (digital glitch filter disabled) 100 -- ns 3 2 -- Bus clock cycles Mode select (EZP_CS) hold time after reset deassertion Port rise and fall time (high drive strength) 4 * Slew disabled * 1.71 VDD 2.7V -- 12 ns * 2.7 VDD 3.6V -- 6 ns * 1.71 VDD 2.7V -- 36 ns * 2.7 VDD 3.6V -- 24 ns * Slew enabled Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 22 Freescale Semiconductor, Inc. General Table 10. General switching specifications (continued) Symbol Description Min. Max. Unit Notes Port rise and fall time (low drive strength) 5 * Slew disabled * 1.71 VDD 2.7V -- 12 ns * 2.7 VDD 3.6V -- 6 ns * 1.71 VDD 2.7V -- 36 ns * 2.7 VDD 3.6V -- 24 ns * Slew enabled 1. This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or may not be recognized. In Stop, VLPS, LLS, and VLLSx modes, the synchronizer is bypassed so shorter pulses can be recognized in that case. 2. The greater synchronous and asynchronous timing must be met. 3. This is the minimum pulse width that is guaranteed to be recognized as a pin interrupt request in Stop, VLPS, LLS, and VLLSx modes. 4. 75 pF load 5. 15 pF load 5.4 Thermal specifications 5.4.1 Thermal operating requirements Table 11. Thermal operating requirements Symbol Description Min. Max. Unit TJ Die junction temperature -40 125 C TA Ambient temperature -40 105 C 5.4.2 Thermal attributes Board type Symbol Description 144 LQFP Single-layer (1s) RJA Thermal 45 resistance, junction to ambient (natural convection) 144 MAPBGA 48 Unit Notes C/W 1 Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 23 Peripheral operating requirements and behaviors Board type Symbol Description Unit Notes Four-layer (2s2p) RJA Thermal 36 resistance, junction to ambient (natural convection) 29 C/W 1 Single-layer (1s) RJMA Thermal 36 resistance, junction to ambient (200 ft./ min. air speed) 38 C/W 1 Four-layer (2s2p) RJMA Thermal 30 resistance, junction to ambient (200 ft./ min. air speed) 25 C/W 1 -- RJB Thermal resistance, junction to board 24 16 C/W 2 -- RJC Thermal resistance, junction to case 9 9 C/W 3 -- JT Thermal 2 characterization parameter, junction to package top outside center (natural convection) 2 C/W 4 1. 2. 3. 4. 144 LQFP 144 MAPBGA Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions--Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions--Forced Convection (Moving Air). Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions--Junction-to-Board. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate temperature used for the case temperature. The value includes the thermal resistance of the interface material between the top of the package and the cold plate. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions--Natural Convection (Still Air). 6 Peripheral operating requirements and behaviors 6.1 Core modules K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 24 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.1.1 Debug trace timing specifications Table 12. Debug trace operating behaviors Symbol Description Min. Max. Unit Tcyc Clock period Frequency dependent MHz Twl Low pulse width 2 -- ns Twh High pulse width 2 -- ns Tr Clock and data rise time -- 3 ns Tf Clock and data fall time -- 3 ns Ts Data setup 3 -- ns Th Data hold 2 -- ns Figure 3. TRACE_CLKOUT specifications TRACE_CLKOUT Ts Th Ts Th TRACE_D[3:0] Figure 4. Trace data specifications 6.1.2 JTAG electricals Table 13. JTAG limited voltage range electricals Symbol J1 J2 Description Min. Max. Unit Operating voltage 2.7 3.6 V TCLK frequency of operation MHz * Boundary Scan 0 10 * JTAG and CJTAG 0 25 * Serial Wire Debug 0 50 1/J1 -- TCLK cycle period ns Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 25 Peripheral operating requirements and behaviors Table 13. JTAG limited voltage range electricals (continued) Symbol Min. Max. Unit * Boundary Scan 50 -- ns * JTAG and CJTAG 20 -- ns * Serial Wire Debug 10 -- ns J4 TCLK rise and fall times -- 3 ns J5 Boundary scan input data setup time to TCLK rise 20 -- ns J6 Boundary scan input data hold time after TCLK rise 0 -- ns J7 TCLK low to boundary scan output data valid -- 25 ns J8 TCLK low to boundary scan output high-Z -- 25 ns J9 TMS, TDI input data setup time to TCLK rise 8 -- ns J10 TMS, TDI input data hold time after TCLK rise 1 -- ns J11 TCLK low to TDO data valid -- 17 ns J12 TCLK low to TDO high-Z -- 17 ns J13 TRST assert time 100 -- ns J14 TRST setup time (negation) to TCLK high 8 -- ns J3 Description TCLK clock pulse width Table 14. JTAG full voltage range electricals Symbol J1 Description Min. Max. Unit Operating voltage 1.71 3.6 V TCLK frequency of operation MHz * Boundary Scan 0 10 * JTAG and CJTAG 0 20 * Serial Wire Debug 0 40 1/J1 -- ns * Boundary Scan 50 -- ns * JTAG and CJTAG 25 -- ns * Serial Wire Debug 12.5 -- ns J2 TCLK cycle period J3 TCLK clock pulse width J4 TCLK rise and fall times -- 3 ns J5 Boundary scan input data setup time to TCLK rise 20 -- ns J6 Boundary scan input data hold time after TCLK rise 0 -- ns J7 TCLK low to boundary scan output data valid -- 25 ns J8 TCLK low to boundary scan output high-Z -- 25 ns J9 TMS, TDI input data setup time to TCLK rise 8 -- ns J10 TMS, TDI input data hold time after TCLK rise 1.4 -- ns J11 TCLK low to TDO data valid -- 22.1 ns J12 TCLK low to TDO high-Z -- 22.1 ns Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 26 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 14. JTAG full voltage range electricals (continued) Symbol Description Min. Max. Unit J13 TRST assert time 100 -- ns J14 TRST setup time (negation) to TCLK high 8 -- ns J2 J3 J3 TCLK (input) J4 J4 Figure 5. Test clock input timing TCLK J5 Data inputs J6 Input data valid J7 Data outputs Output data valid J8 Data outputs J7 Data outputs Output data valid Figure 6. Boundary scan (JTAG) timing K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 27 Peripheral operating requirements and behaviors TCLK J9 TDI/TMS J10 Input data valid J11 TDO Output data valid J12 TDO J11 TDO Output data valid Figure 7. Test Access Port timing TCLK J14 J13 TRST Figure 8. TRST timing 6.2 System modules There are no specifications necessary for the device's system modules. 6.3 Clock modules K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 28 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.3.1 MCG specifications Table 15. MCG specifications Symbol Description Min. Typ. Max. Unit -- 32.768 -- kHz 31.25 -- 39.0625 kHz fdco_res_t Resolution of trimmed average DCO output frequency at fixed voltage and temperature -- using SCTRIM and SCFTRIM -- 0.3 0.6 %fdco 1 fdco_res_t Resolution of trimmed average DCO output frequency at fixed voltage and temperature -- using SCTRIM only -- 0.2 0.5 %fdco 1 fints_ft Internal reference frequency (slow clock) -- factory trimmed at nominal VDD and 25 C fints_t Internal reference frequency (slow clock) -- user trimmed Notes fdco_t Total deviation of trimmed average DCO output frequency over voltage and temperature -- +0.5/-0.7 3 %fdco 1, fdco_t Total deviation of trimmed average DCO output frequency over fixed voltage and temperature range of 0-70C -- 0.3 3 %fdco 1 fintf_ft Internal reference frequency (fast clock) -- factory trimmed at nominal VDD and 25C -- 4 -- MHz fintf_t Internal reference frequency (fast clock) -- user trimmed at nominal VDD and 25 C 3 -- 5 MHz floc_low Loss of external clock minimum frequency -- RANGE = 00 (3/5) x fints_t -- -- kHz floc_high Loss of external clock minimum frequency -- RANGE = 01, 10, or 11 (16/5) x fints_t -- -- kHz 31.25 -- 39.0625 kHz 20 20.97 25 MHz 40 41.94 50 MHz 60 62.91 75 MHz 80 83.89 100 MHz -- 23.99 -- MHz -- 47.97 -- MHz -- 71.99 -- MHz -- 95.98 -- MHz FLL ffll_ref fdco FLL reference frequency range DCO output frequency range Low range (DRS=00) 2, 3 640 x ffll_ref Mid range (DRS=01) 1280 x ffll_ref Mid-high range (DRS=10) 1920 x ffll_ref High range (DRS=11) 2560 x ffll_ref fdco_t_DMX32 DCO output frequency Low range (DRS=00) 4, 5 732 x ffll_ref Mid range (DRS=01) 1464 x ffll_ref Mid-high range (DRS=10) 2197 x ffll_ref High range (DRS=11) 2929 x ffll_ref Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 29 Peripheral operating requirements and behaviors Table 15. MCG specifications (continued) Symbol Jcyc_fll Description FLL period jitter * fDCO = 48 MHz * fDCO = 98 MHz tfll_acquire FLL target frequency acquisition time Min. Typ. Max. Unit -- 180 -- -- 150 -- -- -- 1 ms 48.0 -- 100 MHz -- 1060 -- A -- 600 -- A 2.0 -- 4.0 MHz Notes ps 6 PLL fvco VCO operating frequency Ipll PLL operating current * PLL @ 96 MHz (fosc_hi_1 = 8 MHz, fpll_ref = 2 MHz, VDIV multiplier = 48) Ipll PLL operating current * PLL @ 48 MHz (fosc_hi_1 = 8 MHz, fpll_ref = 2 MHz, VDIV multiplier = 24) fpll_ref PLL reference frequency range Jcyc_pll PLL period jitter (RMS) Jacc_pll 7 8 * fvco = 48 MHz -- 120 -- ps * fvco = 100 MHz -- 50 -- ps PLL accumulated jitter over 1s (RMS) 8 * fvco = 48 MHz -- 1350 -- ps * fvco = 100 MHz -- 600 -- ps Dlock Lock entry frequency tolerance 1.49 -- 2.98 % Dunl Lock exit frequency tolerance 4.47 -- 5.97 % tpll_lock 7 Lock detector detection time -- -- 10-6 150 x + 1075(1/ fpll_ref) s 9 1. This parameter is measured with the internal reference (slow clock) being used as a reference to the FLL (FEI clock mode). 2. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=0. 3. The resulting system clock frequencies should not exceed their maximum specified values. The DCO frequency deviation (fdco_t) over voltage and temperature should be considered. 4. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=1. 5. The resulting clock frequency must not exceed the maximum specified clock frequency of the device. 6. This specification applies to any time the FLL reference source or reference divider is changed, trim value is changed, DMX32 bit is changed, DRS bits are changed, or changing from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE, FBE, FBI). If a crystal/resonator is being used as the reference, this specification assumes it is already running. 7. Excludes any oscillator currents that are also consuming power while PLL is in operation. 8. This specification was obtained using a Freescale developed PCB. PLL jitter is dependent on the noise characteristics of each PCB and results will vary. 9. This specification applies to any time the PLL VCO divider or reference divider is changed, or changing from PLL disabled (BLPE, BLPI) to PLL enabled (PBE, PEE). If a crystal/resonator is being used as the reference, this specification assumes it is already running. 6.3.2 Oscillator electrical specifications This section provides the electrical characteristics of the module. K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 30 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.3.2.1 Oscillator DC electrical specifications Table 16. Oscillator DC electrical specifications Symbol Description Min. Typ. Max. Unit VDD Supply voltage 1.71 -- 3.6 V IDDOSC IDDOSC Supply current -- low-power mode (HGO=0) Notes 1 * 32 kHz -- 500 -- nA * 4 MHz -- 200 -- A * 8 MHz (RANGE=01) -- 300 -- A * 16 MHz -- 950 -- A * 24 MHz -- 1.2 -- mA * 32 MHz -- 1.5 -- mA Supply current -- high gain mode (HGO=1) 1 * 32 kHz -- 25 -- A * 4 MHz -- 400 -- A * 8 MHz (RANGE=01) -- 500 -- A * 16 MHz -- 2.5 -- mA * 24 MHz -- 3 -- mA * 32 MHz -- 4 -- mA Cx EXTAL load capacitance -- -- -- 2, 3 Cy XTAL load capacitance -- -- -- 2, 3 RF Feedback resistor -- low-frequency, low-power mode (HGO=0) -- -- -- M Feedback resistor -- low-frequency, high-gain mode (HGO=1) -- 10 -- M Feedback resistor -- high-frequency, low-power mode (HGO=0) -- -- -- M Feedback resistor -- high-frequency, high-gain mode (HGO=1) -- 1 -- M Series resistor -- low-frequency, low-power mode (HGO=0) -- -- -- k Series resistor -- low-frequency, high-gain mode (HGO=1) -- 200 -- k Series resistor -- high-frequency, low-power mode (HGO=0) -- -- -- k -- 0 -- k RS 2, 4 Series resistor -- high-frequency, high-gain mode (HGO=1) Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 31 Peripheral operating requirements and behaviors Table 16. Oscillator DC electrical specifications (continued) Symbol Vpp5 1. 2. 3. 4. 5. Description Min. Typ. Max. Unit Peak-to-peak amplitude of oscillation (oscillator mode) -- low-frequency, low-power mode (HGO=0) -- 0.6 -- V Peak-to-peak amplitude of oscillation (oscillator mode) -- low-frequency, high-gain mode (HGO=1) -- VDD -- V Peak-to-peak amplitude of oscillation (oscillator mode) -- high-frequency, low-power mode (HGO=0) -- 0.6 -- V Peak-to-peak amplitude of oscillation (oscillator mode) -- high-frequency, high-gain mode (HGO=1) -- VDD -- V Notes VDD=3.3 V, Temperature =25 C See crystal or resonator manufacturer's recommendation Cx,Cy can be provided by using either the integrated capacitors or by using external components. When low power mode is selected, RF is integrated and must not be attached externally. The EXTAL and XTAL pins should only be connected to required oscillator components and must not be connected to any other devices. 6.3.2.2 Symbol Oscillator frequency specifications Table 17. Oscillator frequency specifications Description Min. Typ. Max. Unit fosc_lo Oscillator crystal or resonator frequency -- low frequency mode (MCG_C2[RANGE]=00) 32 -- 40 kHz fosc_hi_1 Oscillator crystal or resonator frequency -- high frequency mode (low range) (MCG_C2[RANGE]=01) 3 -- 8 MHz fosc_hi_2 Oscillator crystal or resonator frequency -- high frequency mode (high range) (MCG_C2[RANGE]=1x) 8 -- 32 MHz fec_extal Input clock frequency (external clock mode) -- -- 50 MHz tdc_extal Input clock duty cycle (external clock mode) 40 50 60 % Crystal startup time -- 32 kHz low-frequency, low-power mode (HGO=0) -- 750 -- ms Crystal startup time -- 32 kHz low-frequency, high-gain mode (HGO=1) -- 250 -- ms Crystal startup time -- 8 MHz high-frequency (MCG_C2[RANGE]=01), low-power mode (HGO=0) -- 0.6 -- ms Crystal startup time -- 8 MHz high-frequency (MCG_C2[RANGE]=01), high-gain mode (HGO=1) -- 1 -- ms tcst Notes 1, 2 3, 4 1. Other frequency limits may apply when external clock is being used as a reference for the FLL or PLL. 2. When transitioning from FBE to FEI mode, restrict the frequency of the input clock so that, when it is divided by FRDIV, it remains within the limits of the DCO input clock frequency. 3. Proper PC board layout procedures must be followed to achieve specifications. K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 32 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 4. Crystal startup time is defined as the time between the oscillator being enabled and the OSCINIT bit in the MCG_S register being set. NOTE The 32 kHz oscillator works in low power mode by default and cannot be moved into high power/gain mode. 6.3.3 32 kHz oscillator electrical characteristics This section describes the module electrical characteristics. 6.3.3.1 32 kHz oscillator DC electrical specifications Table 18. 32kHz oscillator DC electrical specifications Symbol Description Min. Typ. Max. Unit VBAT Supply voltage 1.71 -- 3.6 V Internal feedback resistor -- 100 -- M Parasitical capacitance of EXTAL32 and XTAL32 -- 5 7 pF Peak-to-peak amplitude of oscillation -- 0.6 -- V RF Cpara 1 Vpp 1. When a crystal is being used with the 32 kHz oscillator, the EXTAL32 and XTAL32 pins should only be connected to required oscillator components and must not be connected to any other devices. 6.3.3.2 Symbol fosc_lo tstart fec_extal32 32 kHz oscillator frequency specifications Table 19. 32 kHz oscillator frequency specifications Description Min. Typ. Max. Unit Oscillator crystal -- 32.768 -- kHz Crystal start-up time -- 1000 -- ms 1 Externally provided input clock frequency -- 32.768 -- kHz 2 700 -- VBAT mV 2, 3 vec_extal32 Externally provided input clock amplitude Notes 1. Proper PC board layout procedures must be followed to achieve specifications. 2. This specification is for an externally supplied clock driven to EXTAL32 and does not apply to any other clock input. The oscillator remains enabled and XTAL32 must be left unconnected. 3. The parameter specified is a peak-to-peak value and VIH and VIL specifications do not apply. The voltage of the applied clock must be within the range of VSS to VBAT. 6.4 Memories and memory interfaces K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 33 Peripheral operating requirements and behaviors 6.4.1 Flash electrical specifications This section describes the electrical characteristics of the flash memory module. 6.4.1.1 Flash timing specifications -- program and erase The following specifications represent the amount of time the internal charge pumps are active and do not include command overhead. Table 20. NVM program/erase timing specifications Symbol Description Min. Typ. Max. Unit thvpgm4 thversscr Longword Program high-voltage time -- 7.5 18 s Sector Erase high-voltage time -- 13 113 ms 1 -- 104 904 ms 1 Notes thversblk256k Erase Block high-voltage time for 256 KB Notes 1. Maximum time based on expectations at cycling end-of-life. 6.4.1.2 Symbol Flash timing specifications -- commands Table 21. Flash command timing specifications Description Min. Typ. Max. Unit -- -- 1.7 ms Read 1s Block execution time trd1blk256k * 256 KB program/data flash trd1sec2k Read 1s Section execution time (flash sector) -- -- 60 s 1 tpgmchk Program Check execution time -- -- 45 s 1 trdrsrc Read Resource execution time -- -- 30 s 1 tpgm4 Program Longword execution time -- 65 145 s Erase Flash Block execution time tersblk256k tersscr * 256 KB program/data flash Erase Flash Sector execution time 2 -- 122 985 ms -- 14 114 ms 2 Program Section execution time tpgmsec512 * 512 bytes flash -- 2.4 -- ms tpgmsec1k * 1 KB flash -- 4.7 -- ms tpgmsec2k * 2 KB flash -- 9.3 -- ms trd1all Read 1s All Blocks execution time -- -- 1.8 ms trdonce Read Once execution time -- -- 25 s Program Once execution time -- 65 -- s tersall Erase All Blocks execution time -- 250 2000 ms 2 tvfykey Verify Backdoor Access Key execution time -- -- 30 s 1 tpgmonce 1 Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 34 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 21. Flash command timing specifications (continued) Symbol Description Min. Typ. Max. Unit Notes Swap Control execution time tswapx01 * control code 0x01 -- 200 -- s tswapx02 * control code 0x02 -- 70 150 s tswapx04 * control code 0x04 -- 70 150 s tswapx08 * control code 0x08 -- -- 30 s Program Partition for EEPROM execution time tpgmpart64k * 64 KB FlexNVM -- 138 -- ms tpgmpart256k * 256 KB FlexNVM -- 145 -- ms * Control Code 0xFF -- 70 -- s tsetram32k * 32 KB EEPROM backup -- 0.8 1.2 ms tsetram64k * 64 KB EEPROM backup -- 1.3 1.9 ms tsetram256k * 256 KB EEPROM backup -- 4.5 5.5 ms Set FlexRAM Function execution time: tsetramff Byte-write to FlexRAM for EEPROM operation teewr8bers Byte-write to erased FlexRAM location execution time -- 175 260 s 3 Byte-write to FlexRAM execution time: teewr8b32k * 32 KB EEPROM backup -- 385 1800 s teewr8b64k * 64 KB EEPROM backup -- 475 2000 s teewr8b128k * 128 KB EEPROM backup -- 650 2400 s teewr8b256k * 256 KB EEPROM backup -- 1000 3200 s Word-write to FlexRAM for EEPROM operation teewr16bers Word-write to erased FlexRAM location execution time -- 175 260 s Word-write to FlexRAM execution time: teewr16b32k * 32 KB EEPROM backup -- 385 1800 s teewr16b64k * 64 KB EEPROM backup -- 475 2000 s teewr16b128k * 128 KB EEPROM backup -- 650 2400 s teewr16b256k * 256 KB EEPROM backup -- 1000 3200 s Longword-write to FlexRAM for EEPROM operation teewr32bers Longword-write to erased FlexRAM location execution time -- 360 540 s Longword-write to FlexRAM execution time: teewr32b32k * 32 KB EEPROM backup -- 630 2050 s teewr32b64k * 64 KB EEPROM backup -- 810 2250 s teewr32b128k * 128 KB EEPROM backup -- 1200 2675 s teewr32b256k * 256 KB EEPROM backup -- 1900 3500 s K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 35 Peripheral operating requirements and behaviors 1. Assumes 25 MHz flash clock frequency. 2. Maximum times for erase parameters based on expectations at cycling end-of-life. 3. For byte-writes to an erased FlexRAM location, the aligned word containing the byte must be erased. 6.4.1.3 Flash high voltage current behaviors Table 22. Flash high voltage current behaviors Symbol Description IDD_PGM IDD_ERS 6.4.1.4 Symbol Min. Typ. Max. Unit Average current adder during high voltage flash programming operation -- 2.5 6.0 mA Average current adder during high voltage flash erase operation -- 1.5 4.0 mA Reliability specifications Table 23. NVM reliability specifications Description Min. Typ.1 Max. Unit Notes Program Flash tnvmretp10k Data retention after up to 10 K cycles 5 50 -- years tnvmretp1k Data retention after up to 1 K cycles 20 100 -- years nnvmcycp Cycling endurance 10 K 50 K -- cycles 2 Data Flash tnvmretd10k Data retention after up to 10 K cycles 5 50 -- years tnvmretd1k Data retention after up to 1 K cycles 20 100 -- years nnvmcycd Cycling endurance 10 K 50 K -- cycles 2 FlexRAM as EEPROM tnvmretee100 Data retention up to 100% of write endurance 5 50 -- years tnvmretee10 Data retention up to 10% of write endurance 20 100 -- years Write endurance 3 nnvmwree16 * EEPROM backup to FlexRAM ratio = 16 35 K 175 K -- writes nnvmwree128 * EEPROM backup to FlexRAM ratio = 128 315 K 1.6 M -- writes nnvmwree512 * EEPROM backup to FlexRAM ratio = 512 1.27 M 6.4 M -- writes nnvmwree4k * EEPROM backup to FlexRAM ratio = 4096 10 M 50 M -- writes nnvmwree32k * EEPROM backup to FlexRAM ratio = 32,768 80 M 400 M -- writes 1. Typical data retention values are based on measured response accelerated at high temperature and derated to a constant 25C use profile. Engineering Bulletin EB618 does not apply to this technology. Typical endurance defined in Engineering Bulletin EB619. 2. Cycling endurance represents number of program/erase cycles at -40C Tj 125C. 3. Write endurance represents the number of writes to each FlexRAM location at -40C Tj 125C influenced by the cycling endurance of the FlexNVM (same value as data flash) and the allocated EEPROM backup per subsystem. Minimum and typical values assume all byte-writes to FlexRAM. K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 36 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.4.1.5 Write endurance to FlexRAM for EEPROM When the FlexNVM partition code is not set to full data flash, the EEPROM data set size can be set to any of several non-zero values. The bytes not assigned to data flash via the FlexNVM partition code are used by the flash memory module to obtain an effective endurance increase for the EEPROM data. The built-in EEPROM record management system raises the number of program/erase cycles that can be attained prior to device wear-out by cycling the EEPROM data through a larger EEPROM NVM storage space. While different partitions of the FlexNVM are available, the intention is that a single choice for the FlexNVM partition code and EEPROM data set size is used throughout the entire lifetime of a given application. The EEPROM endurance equation and graph shown below assume that only one configuration is ever used. Writes_subsystem = EEPROM - 2 x EEESPLIT x EEESIZE EEESPLIT x EEESIZE x Write_efficiency x nnvmcycd where * Writes_subsystem -- minimum number of writes to each FlexRAM location for subsystem (each subsystem can have different endurance) * EEPROM -- allocated FlexNVM for each EEPROM subsystem based on DEPART; entered with the Program Partition command * EEESPLIT -- FlexRAM split factor for subsystem; entered with the Program Partition command * EEESIZE -- allocated FlexRAM based on DEPART; entered with the Program Partition command * Write_efficiency -- * 0.25 for 8-bit writes to FlexRAM * 0.50 for 16-bit or 32-bit writes to FlexRAM * nnvmcycd -- data flash cycling endurance (the following graph assumes 10,000 cycles) K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 37 Peripheral operating requirements and behaviors Figure 9. EEPROM backup writes to FlexRAM 6.4.2 EzPort switching specifications Table 24. EzPort switching specifications Num Description Min. Max. Unit Operating voltage 1.71 3.6 V EP1 EZP_CK frequency of operation (all commands except READ) -- fSYS/2 MHz EP1a EZP_CK frequency of operation (READ command) -- fSYS/8 MHz EP2 EZP_CS negation to next EZP_CS assertion 2 x tEZP_CK -- ns EP3 EZP_CS input valid to EZP_CK high (setup) 5 -- ns EP4 EZP_CK high to EZP_CS input invalid (hold) 5 -- ns EP5 EZP_D input valid to EZP_CK high (setup) 2 -- ns EP6 EZP_CK high to EZP_D input invalid (hold) 5 -- ns EP7 EZP_CK low to EZP_Q output valid -- 16 ns EP8 EZP_CK low to EZP_Q output invalid (hold) 0 -- ns EP9 EZP_CS negation to EZP_Q tri-state -- 12 ns K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 38 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors EZP_CK EP2 EP4 EP3 EZP_CS EP9 EP7 EP8 EZP_Q (output) EP5 EP6 EZP_D (input) Figure 10. EzPort Timing Diagram 6.4.3 Flexbus switching specifications All processor bus timings are synchronous; input setup/hold and output delay are given in respect to the rising edge of a reference clock, FB_CLK. The FB_CLK frequency may be the same as the internal system bus frequency or an integer divider of that frequency. The following timing numbers indicate when data is latched or driven onto the external bus, relative to the Flexbus output clock (FB_CLK). All other timing relationships can be derived from these values. Table 25. Flexbus limited voltage range switching specifications Num Description Min. Max. Unit Notes Operating voltage 2.7 3.6 V Frequency of operation -- FB_CLK MHz FB1 Clock period 20 -- ns FB2 Address, data, and control output valid -- 11.5 ns 1 FB3 Address, data, and control output hold 0.5 -- ns 1 FB4 Data and FB_TA input setup 8.5 -- ns 2 FB5 Data and FB_TA input hold 0.5 -- ns 2 1. Specification is valid for all FB_AD[31:0], FB_BE/BWEn, FB_CSn, FB_OE, FB_R/W,FB_TBST, FB_TSIZ[1:0], FB_ALE, and FB_TS. K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 39 Peripheral operating requirements and behaviors 2. Specification is valid for all FB_AD[31:0] and FB_TA. Table 26. Flexbus full voltage range switching specifications Num Description Min. Max. Unit Operating voltage 1.71 3.6 V Frequency of operation Notes -- FB_CLK MHz 1/FB_CLK -- ns Address, data, and control output valid -- 13.5 ns 1 FB3 Address, data, and control output hold 0 -- ns 1 FB4 Data and FB_TA input setup 13.7 -- ns 2 FB5 Data and FB_TA input hold 0.5 -- ns 2 FB1 Clock period FB2 1. Specification is valid for all FB_AD[31:0], FB_BE/BWEn, FB_CSn, FB_OE, FB_R/W,FB_TBST, FB_TSIZ[1:0], FB_ALE, and FB_TS. 2. Specification is valid for all FB_AD[31:0] and FB_TA. K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 40 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors FB1 FB_CLK FB3 FB5 FB_A[Y] Address FB4 FB2 FB_D[X] Address Data FB_RW FB_TS FB_ALE AA=1 FB_CSn AA=0 FB_OEn FB4 FB_BEn FB5 AA=1 FB_TA FB_TSIZ[1:0] AA=0 TSIZ Figure 11. FlexBus read timing diagram K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 41 Peripheral operating requirements and behaviors FB1 FB_CLK FB2 FB3 FB_A[Y] FB_D[X] Address Address Data FB_RW FB_TS FB_ALE AA=1 FB_CSn AA=0 FB_OEn FB4 FB_BEn FB5 AA=1 FB_TA FB_TSIZ[1:0] AA=0 TSIZ Figure 12. FlexBus write timing diagram 6.5 Security and integrity modules There are no specifications necessary for the device's security and integrity modules. 6.6 Analog K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 42 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.6.1 ADC electrical specifications The 16-bit accuracy specifications listed in Table 27 and Table 28 are achievable on the differential pins ADCx_DP0, ADCx_DM0, ADCx_DP1, ADCx_DM1, ADCx_DP3, and ADCx_DM3. The ADCx_DP2 and ADCx_DM2 ADC inputs are connected to the PGA outputs and are not direct device pins. Accuracy specifications for these pins are defined in Table 29 and Table 30. All other ADC channels meet the 13-bit differential/12-bit single-ended accuracy specifications. 6.6.1.1 16-bit ADC operating conditions Table 27. 16-bit ADC operating conditions Symbol Description Conditions Min. Typ.1 Max. Unit VDDA Supply voltage Absolute 1.71 -- 3.6 V VDDA Supply voltage Delta to VDD (VDD - VDDA) -100 0 +100 mV 2 VSSA Ground voltage Delta to VSS (VSS - VSSA) -100 0 +100 mV 2 VREFH ADC reference voltage high 1.13 VDDA VDDA V VREFL ADC reference voltage low VSSA VSSA VSSA V VADIN Input voltage * 16-bit differential mode VREFL -- 31/32 * VREFH V * All other modes VREFL -- * 16-bit mode -- 8 10 * 8-bit / 10-bit / 12-bit modes -- 4 5 -- 2 5 CADIN RADIN RAS Input capacitance Input resistance Notes VREFH pF k Analog source resistance 13-bit / 12-bit modes fADCK < 4 MHz -- -- 5 k fADCK ADC conversion clock frequency 13-bit mode 1.0 -- 18.0 MHz 4 fADCK ADC conversion clock frequency 16-bit mode 2.0 -- 12.0 MHz 4 Crate ADC conversion rate 13-bit modes No ADC hardware averaging 3 5 20.000 -- 818.330 Ksps Continuous conversions enabled, subsequent conversion time Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 43 Peripheral operating requirements and behaviors Table 27. 16-bit ADC operating conditions (continued) Symbol Crate Description Conditions ADC conversion rate 16-bit mode Min. Typ.1 Max. Unit Notes 5 No ADC hardware averaging 37.037 -- 461.467 Ksps Continuous conversions enabled, subsequent conversion time 1. Typical values assume VDDA = 3.0 V, Temp = 25 C, fADCK = 1.0 MHz, unless otherwise stated. Typical values are for reference only, and are not tested in production. 2. DC potential difference. 3. This resistance is external to MCU. To achieve the best results, the analog source resistance must be kept as low as possible. The results in this data sheet were derived from a system that had < 8 analog source resistance. The RAS/CAS time constant should be kept to < 1 ns. 4. To use the maximum ADC conversion clock frequency, CFG2[ADHSC] must be set and CFG1[ADLPC] must be clear. 5. For guidelines and examples of conversion rate calculation, download the ADC calculator tool. SIMPLIFIED INPUT PIN EQUIVALENT CIRCUIT Z ADIN SIMPLIFIED CHANNEL SELECT CIRCUIT Pad leakage due to input protection Z AS R AS ADC SAR ENGINE R ADIN V ADIN C AS V AS R ADIN INPUT PIN R ADIN INPUT PIN R ADIN INPUT PIN C ADIN Figure 13. ADC input impedance equivalency diagram 6.6.1.2 16-bit ADC electrical characteristics Table 28. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) Symbol Description IDDA_ADC Supply current Conditions1. Min. Typ.2 Max. Unit Notes 0.215 -- 1.7 mA 3 Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 44 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 28. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Symbol fADACK Description ADC asynchronous clock source Sample Time TUE DNL INL EFS Conditions1. Min. Typ.2 Max. Unit Notes * ADLPC = 1, ADHSC = 0 1.2 2.4 3.9 MHz * ADLPC = 1, ADHSC = 1 2.4 4.0 6.1 MHz tADACK = 1/ fADACK * ADLPC = 0, ADHSC = 0 3.0 5.2 7.3 MHz * ADLPC = 0, ADHSC = 1 4.4 6.2 9.5 MHz LSB4 5 LSB4 5 LSB4 5 LSB4 VADIN = VDDA See Reference Manual chapter for sample times Total unadjusted error * 12-bit modes -- 4 6.8 * <12-bit modes -- 1.4 2.1 Differential nonlinearity * 12-bit modes -- 0.7 -1.1 to +1.9 Integral nonlinearity Full-scale error -0.3 to 0.5 * <12-bit modes -- 0.2 * 12-bit modes -- 1.0 -2.7 to +1.9 -0.7 to +0.5 * <12-bit modes -- 0.5 * 12-bit modes -- -4 -5.4 * <12-bit modes -- -1.4 -1.8 5 EQ ENOB Quantization error * 16-bit modes -- -1 to 0 -- * 13-bit modes -- -- 0.5 Effective number 16-bit differential mode of bits * Avg = 32 * Avg = 4 LSB4 6 12.8 14.5 -- bits 11.9 13.8 -- bits 12.2 13.9 -- bits 11.4 13.1 -- bits 16-bit single-ended mode * Avg = 32 * Avg = 4 SINAD THD Signal-to-noise plus distortion See ENOB Total harmonic distortion 16-bit differential mode 6.02 x ENOB + 1.76 * Avg = 32 16-bit single-ended mode * Avg = 32 SFDR Spurious free dynamic range dB 7 -- -94 -- dB -- -85 -- dB 16-bit differential mode * Avg = 32 16-bit single-ended mode * Avg = 32 7 82 95 -- dB 78 90 -- dB Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 45 Peripheral operating requirements and behaviors Table 28. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Symbol Description EIL Input leakage error Conditions1. Min. Typ.2 Max. IIn x RAS Unit Notes mV IIn = leakage current (refer to the MCU's voltage and current operating ratings) VTEMP25 Temp sensor slope Across the full temperature range of the device 1.55 1.62 1.69 mV/C Temp sensor voltage 25 C 706 716 726 mV 1. All accuracy numbers assume the ADC is calibrated with VREFH = VDDA 2. Typical values assume VDDA = 3.0 V, Temp = 25 C, fADCK = 2.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 3. The ADC supply current depends on the ADC conversion clock speed, conversion rate and ADC_CFG1[ADLPC] (low power). For lowest power operation, ADC_CFG1[ADLPC] must be set, the ADC_CFG2[ADHSC] bit must be clear with 1 MHz ADC conversion clock speed. 4. 1 LSB = (VREFH - VREFL)/2N 5. ADC conversion clock < 16 MHz, Max hardware averaging (AVGE = %1, AVGS = %11) 6. Input data is 100 Hz sine wave. ADC conversion clock < 12 MHz. 7. Input data is 1 kHz sine wave. ADC conversion clock < 12 MHz. Figure 14. Typical ENOB vs. ADC_CLK for 16-bit differential mode K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 46 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Figure 15. Typical ENOB vs. ADC_CLK for 16-bit single-ended mode 6.6.1.3 16-bit ADC with PGA operating conditions Table 29. 16-bit ADC with PGA operating conditions Symbol Description Conditions Min. Typ.1 Max. Unit VDDA Supply voltage Absolute 1.71 -- 3.6 V VREFPGA PGA ref voltage VADIN VCM RPGAD VREF_OU VREF_OU VREF_OU T T T V Notes 2, 3 Input voltage VSSA -- VDDA V Input Common Mode range VSSA -- VDDA V Gain = 1, 2, 4, 8 -- 128 -- k IN+ to IN-4 Gain = 16, 32 -- 64 -- Gain = 64 -- 32 -- Differential input impedance RAS Analog source resistance -- 100 -- 5 TS ADC sampling time 1.25 -- -- s 6 Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 47 Peripheral operating requirements and behaviors Table 29. 16-bit ADC with PGA operating conditions (continued) Symbol Crate Description Conditions ADC conversion rate 13 bit modes Min. Typ.1 Max. Unit Notes 18.484 -- 450 Ksps 7 37.037 -- 250 Ksps 8 No ADC hardware averaging Continuous conversions enabled Peripheral clock = 50 MHz 16 bit modes No ADC hardware averaging Continuous conversions enabled Peripheral clock = 50 MHz 1. Typical values assume VDDA = 3.0 V, Temp = 25C, fADCK = 6 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 2. ADC must be configured to use the internal voltage reference (VREF_OUT) 3. PGA reference is internally connected to the VREF_OUT pin. If the user wishes to drive VREF_OUT with a voltage other than the output of the VREF module, the VREF module must be disabled. 4. For single ended configurations the input impedance of the driven input is RPGAD/2 5. The analog source resistance (RAS), external to MCU, should be kept as minimum as possible. Increased RAS causes drop in PGA gain without affecting other performances. This is not dependent on ADC clock frequency. 6. The minimum sampling time is dependent on input signal frequency and ADC mode of operation. A minimum of 1.25s time should be allowed for Fin=4 kHz at 16-bit differential mode. Recommended ADC setting is: ADLSMP=1, ADLSTS=2 at 8 MHz ADC clock. 7. ADC clock = 18 MHz, ADLSMP = 1, ADLST = 00, ADHSC = 1 8. ADC clock = 12 MHz, ADLSMP = 1, ADLST = 01, ADHSC = 1 6.6.1.4 16-bit ADC with PGA characteristics with Chop enabled (ADC_PGA[PGACHPb] =0) Table 30. 16-bit ADC with PGA characteristics Symbol Description Conditions IDDA_PGA Supply current Low power (ADC_PGA[PGALPb]=0) IDC_PGA Input DC current Min. Typ.1 Max. Unit Notes -- 420 644 A 2 A 3 Gain =1, VREFPGA=1.2V, VCM=0.5V -- 1.54 -- A Gain =64, VREFPGA=1.2V, VCM=0.1V -- 0.57 -- A Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 48 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 30. 16-bit ADC with PGA characteristics (continued) Symbol G BW Description Gain4 Input signal bandwidth PSRR Power supply rejection ratio CMRR Common mode rejection ratio Min. Typ.1 Max. * PGAG=0 0.95 1 1.05 * PGAG=1 1.9 2 2.1 * PGAG=2 3.8 4 4.2 * PGAG=3 7.6 8 8.4 * PGAG=4 15.2 16 16.6 * PGAG=5 30.0 31.6 33.2 * PGAG=6 58.8 63.3 67.8 -- -- 4 kHz -- -- 40 kHz -- -84 -- dB VDDA= 3V 100mV, fVDDA= 50Hz, 60Hz * Gain=1 -- -84 -- dB * Gain=64 -- -85 -- dB VCM= 500mVpp, fVCM= 50Hz, 100Hz Conditions * 16-bit modes * < 16-bit modes Gain=1 Unit Notes RAS < 100 VOFS Input offset voltage -- 0.2 -- mV Output offset = VOFS*(Gain+1) TGSW Gain switching settling time -- -- 10 s 5 dG/dT Gain drift over full temperature range * Gain=1 * Gain=64 -- 6 10 ppm/C -- 31 42 ppm/C * Gain=1 * Gain=64 -- 0.07 0.21 %/V -- 0.14 0.31 %/V dG/dVDDA Gain drift over supply voltage EIL Input leakage error All modes IIn x RAS mV VDDA from 1.71 to 3.6V IIn = leakage current (refer to the MCU's voltage and current operating ratings) VPP,DIFF SNR THD Maximum differential input signal swing V 6 16-bit differential mode, Average=32 where VX = VREFPGA x 0.583 Signal-to-noise ratio * Gain=1 80 90 -- dB * Gain=64 52 66 -- dB Total harmonic distortion * Gain=1 85 100 -- dB * Gain=64 49 95 -- dB 16-bit differential mode, Average=32, fin=100Hz Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 49 Peripheral operating requirements and behaviors Table 30. 16-bit ADC with PGA characteristics (continued) Symbol Description SFDR Spurious free dynamic range Effective number of bits ENOB SINAD Signal-to-noise plus distortion ratio Min. Typ.1 Max. Unit Notes * Gain=1 85 105 -- dB * Gain=64 53 88 -- dB 16-bit differential mode, Average=32, fin=100Hz * Gain=1, Average=4 11.6 13.4 -- bits * Gain=1, Average=8 8.0 13.6 -- bits * Gain=64, Average=4 7.2 9.6 -- bits * Gain=64, Average=8 6.3 9.6 -- bits * Gain=1, Average=32 12.8 14.5 -- bits * Gain=2, Average=32 11.0 14.3 -- bits * Gain=4, Average=32 7.9 13.8 -- bits * Gain=8, Average=32 7.3 13.1 -- bits * Gain=16, Average=32 6.8 12.5 -- bits * Gain=32, Average=32 6.8 11.5 -- bits * Gain=64, Average=32 7.5 10.6 -- bits Conditions See ENOB 6.02 x ENOB + 1.76 16-bit differential mode,fin=100Hz dB 1. Typical values assume VDDA =3.0V, Temp=25C, fADCK=6MHz unless otherwise stated. 2. This current is a PGA module adder, in addition to ADC conversion currents. 3. Between IN+ and IN-. The PGA draws a DC current from the input terminals. The magnitude of the DC current is a strong function of input common mode voltage (VCM) and the PGA gain. 4. Gain = 2PGAG 5. After changing the PGA gain setting, a minimum of 2 ADC+PGA conversions should be ignored. 6. Limit the input signal swing so that the PGA does not saturate during operation. Input signal swing is dependent on the PGA reference voltage and gain setting. 6.6.2 CMP and 6-bit DAC electrical specifications Table 31. Comparator and 6-bit DAC electrical specifications Symbol Description Min. Typ. Max. Unit VDD Supply voltage 1.71 -- 3.6 V IDDHS Supply current, High-speed mode (EN=1, PMODE=1) -- -- 200 A IDDLS Supply current, low-speed mode (EN=1, PMODE=0) -- -- 20 A VAIN Analog input voltage VSS - 0.3 -- VDD V VAIO Analog input offset voltage -- -- 20 mV Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 50 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 31. Comparator and 6-bit DAC electrical specifications (continued) Symbol VH Description Min. Typ. Max. Unit * CR0[HYSTCTR] = 00 -- 5 -- mV * CR0[HYSTCTR] = 01 -- 10 -- mV * CR0[HYSTCTR] = 10 -- 20 -- mV * CR0[HYSTCTR] = 11 -- 30 -- mV Analog comparator hysteresis1 VCMPOh Output high VDD - 0.5 -- -- V VCMPOl Output low -- -- 0.5 V tDHS Propagation delay, high-speed mode (EN=1, PMODE=1) 20 50 200 ns tDLS Propagation delay, low-speed mode (EN=1, PMODE=0) 80 250 600 ns Analog comparator initialization delay2 -- -- 40 s 6-bit DAC current adder (enabled) -- 7 -- A IDAC6b INL 6-bit DAC integral non-linearity -0.5 -- 0.5 LSB3 DNL 6-bit DAC differential non-linearity -0.3 -- 0.3 LSB 1. Typical hysteresis is measured with input voltage range limited to 0.6 to VDD-0.6 V. 2. Comparator initialization delay is defined as the time between software writes to change control inputs (Writes to DACEN, VRSEL, PSEL, MSEL, VOSEL) and the comparator output settling to a stable level. 3. 1 LSB = Vreference/64 K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 51 Peripheral operating requirements and behaviors 0.08 0.07 0.06 HYSTCTR Setting CM P Hystereris (V) 0.05 00 0.04 01 10 11 0.03 0.02 0.01 0 0.1 0.4 0.7 1 1.3 1.6 1.9 Vin level (V) 2.2 2.5 2.8 3.1 Figure 16. Typical hysteresis vs. Vin level (VDD=3.3V, PMODE=0) K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 52 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 0.18 0.16 0.14 CMP P Hystereris (V) 0.12 HYSTCTR Setting 0.1 00 01 0.08 0 08 10 11 0.06 0.04 0.02 0 0.1 0.4 0.7 1 1.3 1.6 Vin level (V) 1.9 2.2 2.5 2.8 3.1 Figure 17. Typical hysteresis vs. Vin level (VDD=3.3V, PMODE=1) 6.6.3 12-bit DAC electrical characteristics 6.6.3.1 Symbol 12-bit DAC operating requirements Table 32. 12-bit DAC operating requirements Desciption Min. Max. Unit VDDA Supply voltage 1.71 3.6 V VDACR Reference voltage 1.13 3.6 V TA Temperature Operating temperature range of the device CL Output load capacitance -- 100 pF IL Output load current -- 1 mA Notes 1 C 2 1. The DAC reference can be selected to be VDDA or the voltage output of the VREF module (VREF_OUT) 2. A small load capacitance (47 pF) can improve the bandwidth performance of the DAC K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 53 Peripheral operating requirements and behaviors 6.6.3.2 Symbol 12-bit DAC operating behaviors Table 33. 12-bit DAC operating behaviors Description IDDA_DACL Supply current -- low-power mode Min. Typ. Max. Unit -- -- 330 A -- -- 1200 A Notes P IDDA_DACH Supply current -- high-speed mode P tDACLP Full-scale settling time (0x080 to 0xF7F) -- low-power mode -- 100 200 s 1 tDACHP Full-scale settling time (0x080 to 0xF7F) -- high-power mode -- 15 30 s 1 -- 0.7 1 s 1 -- -- 100 mV tCCDACLP Code-to-code settling time (0xBF8 to 0xC08) -- low-power mode and high-speed mode Vdacoutl DAC output voltage range low -- high-speed mode, no load, DAC set to 0x000 Vdacouth DAC output voltage range high -- highspeed mode, no load, DAC set to 0xFFF VDACR -100 -- VDACR mV INL Integral non-linearity error -- high speed mode -- -- 8 LSB 2 DNL Differential non-linearity error -- VDACR > 2 V -- -- 1 LSB 3 DNL Differential non-linearity error -- VDACR = VREF_OUT -- -- 1 LSB 4 -- 0.4 0.8 %FSR 5 Gain error -- 0.1 0.6 %FSR 5 Power supply rejection ratio, VDDA > = 2.4 V 60 -- 90 dB TCO Temperature coefficient offset voltage -- 3.7 -- V/C TGE Temperature coefficient gain error -- 0.000421 -- %FSR/C Rop Output resistance load = 3 k -- -- 250 SR Slew rate -80h F7Fh 80h VOFFSET Offset error EG PSRR 1. 2. 3. 4. 5. 6. V/s * High power (SPHP) 1.2 1.7 -- * Low power (SPLP) 0.05 0.12 -- -- -- -80 CT Channel to channel cross talk BW 3dB bandwidth 6 dB kHz * High power (SPHP) 550 -- -- * Low power (SPLP) 40 -- -- Settling within 1 LSB The INL is measured for 0+100mV to VDACR-100 mV The DNL is measured for 0+100 mV to VDACR-100 mV The DNL is measured for 0+100mV to VDACR-100 mV with VDDA > 2.4V Calculated by a best fit curve from VSS+100 mV to VDACR-100 mV VDDA = 3.0V, reference select set for VDDA (DACx_CO:DACRFS = 1), high power mode(DACx_C0:LPEN = 0), DAC set to 0x800, Temp range from -40C to 105C K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 54 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Figure 18. Typical INL error vs. digital code K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 55 Peripheral operating requirements and behaviors Figure 19. Offset at half scale vs. temperature 6.6.4 Voltage reference electrical specifications Table 34. VREF full-range operating requirements Symbol Description Min. Max. Unit VDDA Supply voltage 1.71 3.6 V TA Temperature CL Output load capacitance Operating temperature range of the device C 100 nF Notes 1, 2 1. CL must be connected to VREF_OUT if the VREF_OUT functionality is being used for either an internal or external reference. 2. The load capacitance should not exceed +/-25% of the nominal specified CL value over the operating temperature range of the device. K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 56 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 35. VREF full-range operating behaviors Symbol Description Min. Typ. Max. Unit Notes Vout Voltage reference output with factory trim at nominal VDDA and temperature=25C 1.1915 1.195 1.1977 V Vout Voltage reference output -- factory trim 1.1584 -- 1.2376 V Vout Voltage reference output -- user trim 1.193 -- 1.197 V Vstep Voltage reference trim step -- 0.5 -- mV Vtdrift Temperature drift (Vmax -Vmin across the full temperature range) -- -- 80 mV Ibg Bandgap only current -- -- 80 A 1 Ilp Low-power buffer current -- -- 360 uA 1 Ihp High-power buffer current -- -- 1 mA 1 V 1, 2 VLOAD Load regulation * current = 1.0 mA -- 200 -- Tstup Buffer startup time -- -- 100 s Vvdrift Voltage drift (Vmax -Vmin across the full voltage range) -- 2 -- mV 1 1. See the chip's Reference Manual for the appropriate settings of the VREF Status and Control register. 2. Load regulation voltage is the difference between the VREF_OUT voltage with no load vs. voltage with defined load Table 36. VREF limited-range operating requirements Symbol Description Min. Max. Unit TA Temperature 0 50 C Notes Table 37. VREF limited-range operating behaviors Symbol Vout Description Voltage reference output with factory trim Min. Max. Unit 1.173 1.225 V Notes 6.7 Timers See General switching specifications. 6.8 Communication interfaces K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 57 Peripheral operating requirements and behaviors 6.8.1 USB electrical specifications The USB electricals for the USB On-the-Go module conform to the standards documented by the Universal Serial Bus Implementers Forum. For the most up-to-date standards, visit usb.org. 6.8.2 USB DCD electrical specifications Table 38. USB DCD electrical specifications Symbol Description Min. Typ. Max. Unit VDP_SRC USB_DP source voltage (up to 250 A) 0.5 -- 0.7 V Threshold voltage for logic high 0.8 -- 2.0 V VLGC IDP_SRC USB_DP source current 7 10 13 A IDM_SINK USB_DM sink current 50 100 150 A RDM_DWN D- pulldown resistance for data pin contact detect 14.25 -- 24.8 k VDAT_REF Data detect voltage 0.25 0.33 0.4 V 6.8.3 USB VREG electrical specifications Table 39. USB VREG electrical specifications Symbol Description Min. VREGIN Typ.1 Max. Unit Input supply voltage 2.7 -- 5.5 V IDDon Quiescent current -- Run mode, load current equal zero, input supply (VREGIN) > 3.6 V -- 120 186 A IDDstby Quiescent current -- Standby mode, load current equal zero -- 1.1 10 A IDDoff Quiescent current -- Shutdown mode -- 650 -- nA -- -- 4 A * VREGIN = 5.0 V and temperature=25 C * Across operating voltage and temperature ILOADrun Maximum load current -- Run mode -- -- 120 mA ILOADstby Maximum load current -- Standby mode -- -- 1 mA VReg33out Regulator output voltage -- Input supply (VREGIN) > 3.6 V 3 3.3 3.6 V 2.1 2.8 3.6 V Regulator output voltage -- Input supply (VREGIN) < 3.6 V, pass-through mode 2.1 -- 3.6 V COUT External output capacitor 1.76 2.2 8.16 F ESR External output capacitor equivalent series resistance 1 -- 100 m * Run mode * Standby mode VReg33out Notes 2 Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 58 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 39. USB VREG electrical specifications (continued) Symbol ILIM Description Short circuit current Min. Typ.1 Max. Unit -- 290 -- mA Notes 1. Typical values assume VREGIN = 5.0 V, Temp = 25 C unless otherwise stated. 2. Operating in pass-through mode: regulator output voltage equal to the input voltage minus a drop proportional to ILoad. 6.8.4 CAN switching specifications See General switching specifications. 6.8.5 DSPI switching specifications (limited voltage range) The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with master and slave operations. Many of the transfer attributes are programmable. The tables below provide DSPI timing characteristics for classic SPI timing modes. Refer to the DSPI chapter of the Reference Manual for information on the modified transfer formats used for communicating with slower peripheral devices. Table 40. Master mode DSPI timing (limited voltage range) Num Description Min. Max. Unit Operating voltage 2.7 3.6 V Frequency of operation -- 25 MHz 2 x tBUS -- ns Notes DS1 DSPI_SCK output cycle time DS2 DSPI_SCK output high/low time (tSCK/2) - 2 (tSCK/2) + 2 ns DS3 DSPI_PCSn valid to DSPI_SCK delay (tBUS x 2) - 2 -- ns 1 DS4 DSPI_SCK to DSPI_PCSn invalid delay (tBUS x 2) - 2 -- ns 2 DS5 DSPI_SCK to DSPI_SOUT valid -- 8 ns DS6 DSPI_SCK to DSPI_SOUT invalid 0 -- ns DS7 DSPI_SIN to DSPI_SCK input setup 14 -- ns DS8 DSPI_SCK to DSPI_SIN input hold 0 -- ns 1. The delay is programmable in SPIx_CTARn[PSSCK] and SPIx_CTARn[CSSCK]. 2. The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC]. K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 59 Peripheral operating requirements and behaviors DSPI_PCSn DS3 DS1 DS2 DS4 DSPI_SCK DS8 DS7 (CPOL=0) DSPI_SIN Data First data Last data DS5 DSPI_SOUT DS6 First data Data Last data Figure 20. DSPI classic SPI timing -- master mode Table 41. Slave mode DSPI timing (limited voltage range) Num Description Operating voltage Min. Max. Unit 2.7 3.6 V 12.5 MHz 4 x tBUS -- ns (tSCK/2) - 2 (tSCK/2) + 2 ns Frequency of operation DS9 DSPI_SCK input cycle time DS10 DSPI_SCK input high/low time DS11 DSPI_SCK to DSPI_SOUT valid -- 20 ns DS12 DSPI_SCK to DSPI_SOUT invalid 0 -- ns DS13 DSPI_SIN to DSPI_SCK input setup 2 -- ns DS14 DSPI_SCK to DSPI_SIN input hold 7 -- ns DS15 DSPI_SS active to DSPI_SOUT driven -- 14 ns DS16 DSPI_SS inactive to DSPI_SOUT not driven -- 14 ns DSPI_SS DS10 DS9 DSPI_SCK (CPOL=0) DS15 DSPI_SOUT First data DS13 DSPI_SIN DS12 DS16 DS11 Data Last data DS14 First data Data Last data Figure 21. DSPI classic SPI timing -- slave mode K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 60 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.8.6 DSPI switching specifications (full voltage range) The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with master and slave operations. Many of the transfer attributes are programmable. The tables below provides DSPI timing characteristics for classic SPI timing modes. Refer to the DSPI chapter of the Reference Manual for information on the modified transfer formats used for communicating with slower peripheral devices. Table 42. Master mode DSPI timing (full voltage range) Num Description Operating voltage Frequency of operation Min. Max. Unit Notes 1.71 3.6 V 1 -- 12.5 MHz 4 x tBUS -- ns DSPI_SCK output high/low time (tSCK/2) - 4 (tSCK/2) + 4 ns DS3 DSPI_PCSn valid to DSPI_SCK delay (tBUS x 2) - 4 -- ns 2 DS4 DSPI_SCK to DSPI_PCSn invalid delay (tBUS x 2) - 4 -- ns 3 DS5 DSPI_SCK to DSPI_SOUT valid -- 8.5 ns DS6 DSPI_SCK to DSPI_SOUT invalid -1.2 -- ns DS7 DSPI_SIN to DSPI_SCK input setup 19.1 -- ns DS8 DSPI_SCK to DSPI_SIN input hold 0 -- ns DS1 DSPI_SCK output cycle time DS2 1. The DSPI module can operate across the entire operating voltage for the processor, but to run across the full voltage range the maximum frequency of operation is reduced. 2. The delay is programmable in SPIx_CTARn[PSSCK] and SPIx_CTARn[CSSCK]. 3. The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC]. DSPI_PCSn DS3 DS1 DS2 DS4 DSPI_SCK DS8 DS7 (CPOL=0) DSPI_SIN Data First data Last data DS5 DSPI_SOUT First data DS6 Data Last data Figure 22. DSPI classic SPI timing -- master mode Table 43. Slave mode DSPI timing (full voltage range) Num Description Operating voltage Frequency of operation Min. Max. Unit 1.71 3.6 V -- 6.25 MHz Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 61 Peripheral operating requirements and behaviors Table 43. Slave mode DSPI timing (full voltage range) (continued) Num Description Min. Max. Unit 8 x tBUS -- ns (tSCK/2) - 4 (tSCK/2) + 4 ns DS9 DSPI_SCK input cycle time DS10 DSPI_SCK input high/low time DS11 DSPI_SCK to DSPI_SOUT valid -- 24 ns DS12 DSPI_SCK to DSPI_SOUT invalid 0 -- ns DS13 DSPI_SIN to DSPI_SCK input setup 3.2 -- ns DS14 DSPI_SCK to DSPI_SIN input hold 7 -- ns DS15 DSPI_SS active to DSPI_SOUT driven -- 19 ns DS16 DSPI_SS inactive to DSPI_SOUT not driven -- 19 ns DSPI_SS DS10 DS9 DSPI_SCK DS15 (CPOL=0) DSPI_SOUT DS12 First data DS13 DSPI_SIN DS16 DS11 Last data Data DS14 First data Data Last data Figure 23. DSPI classic SPI timing -- slave mode 6.8.7 Inter-Integrated Circuit Interface (I2C) timing Table 44. I 2C timing Characteristic Symbol Standard Mode Fast Mode Unit Minimum Maximum Minimum Maximum SCL Clock Frequency fSCL 0 100 0 400 kHz Hold time (repeated) START condition. After this period, the first clock pulse is generated. tHD; STA 4 -- 0.6 -- s LOW period of the SCL clock tLOW 4.7 -- 1.3 -- s HIGH period of the SCL clock tHIGH 4 -- 0.6 -- s Set-up time for a repeated START condition tSU; STA 4.7 -- 0.6 -- s Data hold time for I2C bus devices tHD; DAT 01 3.452 03 0.91 s Data set-up time tSU; DAT 2504 -- 1002, 5 -- ns Rise time of SDA and SCL signals tr -- 1000 20 +0.1Cb6 300 ns Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 62 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 44. I 2C timing (continued) Characteristic Symbol Standard Mode Fast Mode Minimum Maximum Minimum Maximum Unit ns Fall time of SDA and SCL signals tf -- 300 20 +0.1Cb5 300 Set-up time for STOP condition tSU; STO 4 -- 0.6 -- s Bus free time between STOP and START condition tBUF 4.7 -- 1.3 -- s Pulse width of spikes that must be suppressed by the input filter tSP N/A N/A 0 50 ns 1. The master mode I2C deasserts ACK of an address byte simultaneously with the falling edge of SCL. If no slaves acknowledge this address byte, then a negative hold time can result, depending on the edge rates of the SDA and SCL lines. 2. The maximum tHD; DAT must be met only if the device does not stretch the LOW period (tLOW) of the SCL signal. 3. Input signal Slew = 10 ns and Output Load = 50 pF 4. Set-up time in slave-transmitter mode is 1 IPBus clock period, if the TX FIFO is empty. 5. A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement tSU; DAT 250 ns must then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, then it must output the next data bit to the SDA line trmax + tSU; DAT = 1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification) before the SCL line is released. 6. Cb = total capacitance of the one bus line in pF. SDA tf tLOW tSU; DAT tr tf tHD; STA tSP tr tBUF SCL S tHD; STA tHD; DAT tHIGH tSU; STA SR tSU; STO P S Figure 24. Timing definition for fast and standard mode devices on the I2C bus 6.8.8 UART switching specifications See General switching specifications. K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 63 Peripheral operating requirements and behaviors 6.8.9 SDHC specifications The following timing specs are defined at the chip I/O pin and must be translated appropriately to arrive at timing specs/constraints for the physical interface. Table 45. SDHC switching specifications Num Symbol Description Min. Max. Unit Operating voltage 1.71 3.6 V Card input clock SD1 fpp Clock frequency (low speed) 0 400 kHz fpp Clock frequency (SD\SDIO full speed\high speed) 0 25\50 MHz fpp Clock frequency (MMC full speed\high speed) 0 20\50 MHz fOD Clock frequency (identification mode) 0 400 kHz SD2 tWL Clock low time 7 -- ns SD3 tWH Clock high time 7 -- ns SD4 tTLH Clock rise time -- 3 ns SD5 tTHL Clock fall time -- 3 ns SDHC output / card inputs SDHC_CMD, SDHC_DAT (reference to SDHC_CLK) SD6 tOD SDHC output delay (output valid) -5 8.3 ns SDHC input / card inputs SDHC_CMD, SDHC_DAT (reference to SDHC_CLK) SD7 tISU SDHC input setup time 5 -- ns SD8 tIH SDHC input hold time 0 -- ns SD3 SD2 SD1 SDHC_CLK SD6 Output SDHC_CMD Output SDHC_DAT[3:0] SD7 SD8 Input SDHC_CMD Input SDHC_DAT[3:0] Figure 25. SDHC timing K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 64 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.8.10 I2S/SAI switching specifications This section provides the AC timing for the I2S/SAI module in master mode (clocks are driven) and slave mode (clocks are input). All timing is given for noninverted serial clock polarity (TCR2[BCP] is 0, RCR2[BCP] is 0) and a noninverted frame sync (TCR4[FSP] is 0, RCR4[FSP] is 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting the bit clock signal (BCLK) and/or the frame sync (FS) signal shown in the following figures. 6.8.10.1 Normal Run, Wait and Stop mode performance over a limited operating voltage range This section provides the operating performance over a limited operating voltage for the device in Normal Run, Wait and Stop modes. Table 46. I2S/SAI master mode timing in Normal Run, Wait and Stop modes (limited voltage range) Num. Characteristic Min. Max. Unit Operating voltage 2.7 3.6 V S1 I2S_MCLK cycle time 40 -- ns S2 I2S_MCLK pulse width high/low 45% 55% MCLK period S3 I2S_TX_BCLK/I2S_RX_BCLK cycle time (output) 80 -- ns S4 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low 45% 55% BCLK period S5 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output valid -- 15 ns S6 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output invalid 0 -- ns S7 I2S_TX_BCLK to I2S_TXD valid -- 15 ns S8 I2S_TX_BCLK to I2S_TXD invalid 0 -- ns S9 I2S_RXD/I2S_RX_FS input setup before I2S_RX_BCLK 15 -- ns S10 I2S_RXD/I2S_RX_FS input hold after I2S_RX_BCLK 0 -- ns K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 65 Peripheral operating requirements and behaviors S1 S2 S2 I2S_MCLK (output) S3 I2S_TX_BCLK/ I2S_RX_BCLK (output) S4 S4 S5 S6 I2S_TX_FS/ I2S_RX_FS (output) S10 S9 I2S_TX_FS/ I2S_RX_FS (input) S7 S8 S7 S8 I2S_TXD S9 S10 I2S_RXD Figure 26. I2S/SAI timing -- master modes Table 47. I2S/SAI slave mode timing in Normal Run, Wait and Stop modes (limited voltage range) Num. Characteristic Min. Max. Unit Operating voltage 2.7 3.6 V S11 I2S_TX_BCLK/I2S_RX_BCLK cycle time (input) 80 -- ns S12 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low (input) 45% 55% MCLK period S13 I2S_TX_FS/I2S_RX_FS input setup before I2S_TX_BCLK/I2S_RX_BCLK 4.5 -- ns S14 I2S_TX_FS/I2S_RX_FS input hold after I2S_TX_BCLK/I2S_RX_BCLK 2 -- ns S15 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output valid -- 21 -- 15 * Multiple SAI Synchronous mode * All other modes ns S16 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output invalid 0 -- ns S17 I2S_RXD setup before I2S_RX_BCLK 4.5 -- ns S18 I2S_RXD hold after I2S_RX_BCLK 2 -- ns -- 25 ns S19 I2S_TX_FS input assertion to I2S_TXD output valid1 1. Applies to first bit in each frame and only if the TCR4[FSE] bit is clear K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 66 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors S11 S12 I2S_TX_BCLK/ I2S_RX_BCLK (input) S12 S15 S16 I2S_TX_FS/ I2S_RX_FS (output) S13 I2S_TX_FS/ I2S_RX_FS (input) S19 S14 S15 S16 S15 S16 I2S_TXD S17 S18 I2S_RXD Figure 27. I2S/SAI timing -- slave modes 6.8.10.2 Normal Run, Wait and Stop mode performance over the full operating voltage range This section provides the operating performance over the full operating voltage for the device in Normal Run, Wait and Stop modes. Table 48. I2S/SAI master mode timing in Normal Run, Wait and Stop modes (full voltage range) Num. Characteristic Min. Max. Unit Operating voltage 1.71 3.6 V S1 I2S_MCLK cycle time 40 -- ns S2 I2S_MCLK pulse width high/low 45% 55% MCLK period S3 I2S_TX_BCLK/I2S_RX_BCLK cycle time (output) 80 -- ns S4 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low 45% 55% BCLK period S5 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output valid -- 15 ns S6 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output invalid -1.0 -- ns S7 I2S_TX_BCLK to I2S_TXD valid -- 15 ns S8 I2S_TX_BCLK to I2S_TXD invalid 0 -- ns S9 I2S_RXD/I2S_RX_FS input setup before I2S_RX_BCLK 20.5 -- ns S10 I2S_RXD/I2S_RX_FS input hold after I2S_RX_BCLK 0 -- ns K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 67 Peripheral operating requirements and behaviors S1 S2 S2 I2S_MCLK (output) S3 I2S_TX_BCLK/ I2S_RX_BCLK (output) S4 S4 S5 S6 I2S_TX_FS/ I2S_RX_FS (output) S10 S9 I2S_TX_FS/ I2S_RX_FS (input) S7 S8 S7 S8 I2S_TXD S9 S10 I2S_RXD Figure 28. I2S/SAI timing -- master modes Table 49. I2S/SAI slave mode timing in Normal Run, Wait and Stop modes (full voltage range) Num. Characteristic Min. Max. Unit Operating voltage 1.71 3.6 V S11 I2S_TX_BCLK/I2S_RX_BCLK cycle time (input) 80 -- ns S12 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low (input) 45% 55% MCLK period S13 I2S_TX_FS/I2S_RX_FS input setup before I2S_TX_BCLK/I2S_RX_BCLK 5.8 -- ns S14 I2S_TX_FS/I2S_RX_FS input hold after I2S_TX_BCLK/I2S_RX_BCLK 2 -- ns S15 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output valid -- 24 -- 20.6 * Multiple SAI Synchronous mode * All other modes ns S16 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output invalid 0 -- ns S17 I2S_RXD setup before I2S_RX_BCLK 5.8 -- ns S18 I2S_RXD hold after I2S_RX_BCLK 2 -- ns -- 25 ns S19 I2S_TX_FS input assertion to I2S_TXD output valid1 1. Applies to first bit in each frame and only if the TCR4[FSE] bit is clear K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 68 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors S11 S12 I2S_TX_BCLK/ I2S_RX_BCLK (input) S12 S15 S16 I2S_TX_FS/ I2S_RX_FS (output) S13 I2S_TX_FS/ I2S_RX_FS (input) S19 S14 S15 S16 S15 S16 I2S_TXD S17 S18 I2S_RXD Figure 29. I2S/SAI timing -- slave modes 6.8.10.3 VLPR, VLPW, and VLPS mode performance over the full operating voltage range This section provides the operating performance over the full operating voltage for the device in VLPR, VLPW, and VLPS modes. Table 50. I2S/SAI master mode timing in VLPR, VLPW, and VLPS modes (full voltage range) Num. Characteristic Min. Max. Unit Operating voltage 1.71 3.6 V S1 I2S_MCLK cycle time 62.5 -- ns S2 I2S_MCLK pulse width high/low 45% 55% MCLK period S3 I2S_TX_BCLK/I2S_RX_BCLK cycle time (output) 250 -- ns S4 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low 45% 55% BCLK period S5 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output valid -- 45 ns S6 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output invalid 0 -- ns S7 I2S_TX_BCLK to I2S_TXD valid -- 45 ns S8 I2S_TX_BCLK to I2S_TXD invalid 0 -- ns S9 I2S_RXD/I2S_RX_FS input setup before I2S_RX_BCLK 45 -- ns S10 I2S_RXD/I2S_RX_FS input hold after I2S_RX_BCLK 0 -- ns K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 69 Peripheral operating requirements and behaviors S1 S2 S2 I2S_MCLK (output) S3 I2S_TX_BCLK/ I2S_RX_BCLK (output) S4 S4 S5 S6 I2S_TX_FS/ I2S_RX_FS (output) S10 S9 I2S_TX_FS/ I2S_RX_FS (input) S7 S8 S7 S8 I2S_TXD S9 S10 I2S_RXD Figure 30. I2S/SAI timing -- master modes Table 51. I2S/SAI slave mode timing in VLPR, VLPW, and VLPS modes (full voltage range) Num. Characteristic Min. Max. Unit Operating voltage 1.71 3.6 V S11 I2S_TX_BCLK/I2S_RX_BCLK cycle time (input) 250 -- ns S12 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low (input) 45% 55% MCLK period S13 I2S_TX_FS/I2S_RX_FS input setup before I2S_TX_BCLK/I2S_RX_BCLK 30 -- ns S14 I2S_TX_FS/I2S_RX_FS input hold after I2S_TX_BCLK/I2S_RX_BCLK 3 -- ns S15 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output valid -- 63 ns S16 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output invalid 0 -- ns S17 I2S_RXD setup before I2S_RX_BCLK 30 -- ns S18 I2S_RXD hold after I2S_RX_BCLK 2 -- ns -- 72 ns S19 I2S_TX_FS input assertion to I2S_TXD output valid1 1. Applies to first bit in each frame and only if the TCR4[FSE] bit is clear K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 70 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors S11 S12 I2S_TX_BCLK/ I2S_RX_BCLK (input) S12 S15 S16 I2S_TX_FS/ I2S_RX_FS (output) S13 I2S_TX_FS/ I2S_RX_FS (input) S19 S14 S15 S16 S15 S16 I2S_TXD S17 S18 I2S_RXD Figure 31. I2S/SAI timing -- slave modes 6.9 Human-machine interfaces (HMI) 6.9.1 TSI electrical specifications Table 52. TSI electrical specifications Symbol Description Min. Typ. Max. Unit VDDTSI Operating voltage 1.71 -- 3.6 V Target electrode capacitance range 1 20 500 pF 1 fREFmax Reference oscillator frequency -- 8 15 MHz 2, 3 fELEmax Electrode oscillator frequency -- 1 1.8 MHz 2, 4 Internal reference capacitor -- 1 -- pF Oscillator delta voltage -- 500 -- mV 2, 5 A 2, 6 A 2, 7 CELE CREF VDELTA IREF IELE Reference oscillator current source base current * 2 A setting (REFCHRG = 0) * 32 A setting (REFCHRG = 15) Electrode oscillator current source base current * 2 A setting (EXTCHRG = 0) * 32 A setting (EXTCHRG = 15) -- 2 3 -- 36 50 -- 2 3 -- 36 50 Notes Pres5 Electrode capacitance measurement precision -- 8.3333 38400 fF/count 8 Pres20 Electrode capacitance measurement precision -- 8.3333 38400 fF/count 9 Pres100 Electrode capacitance measurement precision -- 8.3333 38400 fF/count 10 0.008 1.46 -- fF/count 11 -- -- 16 bits Response time @ 20 pF 8 15 25 s Current added in run mode -- 55 -- A Low power mode current adder -- 1.3 2.5 A MaxSens Maximum sensitivity Res TCon20 ITSI_RUN ITSI_LP Resolution 12 13 K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 71 Dimensions 1. The TSI module is functional with capacitance values outside this range. However, optimal performance is not guaranteed. 2. Fixed external capacitance of 20 pF. 3. REFCHRG = 2, EXTCHRG=0. 4. REFCHRG = 0, EXTCHRG = 10. 5. VDD = 3.0 V. 6. The programmable current source value is generated by multiplying the SCANC[REFCHRG] value and the base current. 7. The programmable current source value is generated by multiplying the SCANC[EXTCHRG] value and the base current. 8. Measured with a 5 pF electrode, reference oscillator frequency of 10 MHz, PS = 128, NSCN = 8; Iext = 16. 9. Measured with a 20 pF electrode, reference oscillator frequency of 10 MHz, PS = 128, NSCN = 2; Iext = 16. 10. Measured with a 20 pF electrode, reference oscillator frequency of 10 MHz, PS = 16, NSCN = 3; Iext = 16. 11. Sensitivity defines the minimum capacitance change when a single count from the TSI module changes. Sensitivity depends on the configuration used. The documented values are provided as examples calculated for a specific configuration of operating conditions using the following equation: (Cref * Iext)/( Iref * PS * NSCN) The typical value is calculated with the following configuration: Iext = 6 A (EXTCHRG = 2), PS = 128, NSCN = 2, Iref = 16 A (REFCHRG = 7), Cref = 1.0 pF The minimum value is calculated with the following configuration: Iext = 2 A (EXTCHRG = 0), PS = 128, NSCN = 32, Iref = 32 A (REFCHRG = 15), Cref = 0.5 pF The highest possible sensitivity is the minimum value because it represents the smallest possible capacitance that can be measured by a single count. 12. Time to do one complete measurement of the electrode. Sensitivity resolution of 0.0133 pF, PS = 0, NSCN = 0, 1 electrode, EXTCHRG = 7. 13. REFCHRG=0, EXTCHRG=4, PS=7, NSCN=0F, LPSCNITV=F, LPO is selected (1 kHz), and fixed external capacitance of 20 pF. Data is captured with an average of 7 periods window. 7 Dimensions 7.1 Obtaining package dimensions Package dimensions are provided in package drawings. To find a package drawing, go to freescale.com and perform a keyword search for the drawing's document number: If you want the drawing for this package Then use this document number 144-pin LQFP 98ASS23177W 144-pin MAPBGA 98ASA00222D 8 Pinout K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 72 Freescale Semiconductor, Inc. Pinout 8.1 K20 signal multiplexing and pin assignments The following table shows the signals available on each pin and the locations of these pins on the devices supported by this document. The Port Control Module is responsible for selecting which ALT functionality is available on each pin. 144 144 LQFP MAP BGA Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 -- L5 RTC_ WAKEUP_B RTC_ WAKEUP_B RTC_ WAKEUP_B -- M5 NC NC NC -- A10 NC NC NC -- B10 NC NC NC -- C10 NC NC NC 1 D3 PTE0 ADC1_SE4a ADC1_SE4a PTE0 SPI1_PCS1 UART1_TX SDHC0_D1 I2C1_SDA RTC_CLKOUT 2 D2 PTE1/ LLWU_P0 ADC1_SE5a ADC1_SE5a PTE1/ LLWU_P0 SPI1_SOUT UART1_RX SDHC0_D0 I2C1_SCL SPI1_SIN 3 D1 PTE2/ LLWU_P1 ADC1_SE6a ADC1_SE6a PTE2/ LLWU_P1 SPI1_SCK UART1_CTS_ SDHC0_DCLK b 4 E4 PTE3 ADC1_SE7a ADC1_SE7a PTE3 SPI1_SIN UART1_RTS_ SDHC0_CMD b 5 E5 VDD VDD VDD 6 F6 VSS VSS VSS 7 E3 PTE4/ LLWU_P2 DISABLED PTE4/ LLWU_P2 SPI1_PCS0 UART3_TX SDHC0_D3 SDHC0_D2 8 E2 PTE5 DISABLED PTE5 SPI1_PCS2 UART3_RX 9 E1 PTE6 DISABLED PTE6 SPI1_PCS3 UART3_CTS_ I2S0_MCLK b 10 F4 PTE7 DISABLED PTE7 11 F3 PTE8 DISABLED PTE8 I2S0_RXD1 UART5_TX I2S0_RX_FS 12 F2 PTE9 DISABLED PTE9 I2S0_TXD1 UART5_RX I2S0_RX_ BCLK 13 F1 PTE10 DISABLED PTE10 UART5_CTS_ I2S0_TXD0 b 14 G4 PTE11 DISABLED PTE11 UART5_RTS_ I2S0_TX_FS b 15 G3 PTE12 DISABLED PTE12 16 E6 VDD VDD VDD 17 F7 VSS VSS VSS 18 H3 VSS VSS VSS 19 H1 USB0_DP USB0_DP USB0_DP 20 H2 USB0_DM USB0_DM USB0_DM 21 G1 VOUT33 VOUT33 VOUT33 22 G2 VREGIN VREGIN VREGIN EzPort SPI1_SOUT USB_SOF_ OUT UART3_RTS_ I2S0_RXD0 b I2S0_TX_ BCLK K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 73 Pinout 144 144 LQFP MAP BGA Pin Name Default ALT0 23 J1 ADC0_DP1 ADC0_DP1 ADC0_DP1 24 J2 ADC0_DM1 ADC0_DM1 ADC0_DM1 25 K1 ADC1_DP1 ADC1_DP1 ADC1_DP1 26 K2 ADC1_DM1 ADC1_DM1 ADC1_DM1 27 L1 PGA0_DP/ ADC0_DP0/ ADC1_DP3 PGA0_DP/ ADC0_DP0/ ADC1_DP3 PGA0_DP/ ADC0_DP0/ ADC1_DP3 28 L2 PGA0_DM/ ADC0_DM0/ ADC1_DM3 PGA0_DM/ ADC0_DM0/ ADC1_DM3 PGA0_DM/ ADC0_DM0/ ADC1_DM3 29 M1 PGA1_DP/ ADC1_DP0/ ADC0_DP3 PGA1_DP/ ADC1_DP0/ ADC0_DP3 PGA1_DP/ ADC1_DP0/ ADC0_DP3 30 M2 PGA1_DM/ ADC1_DM0/ ADC0_DM3 PGA1_DM/ ADC1_DM0/ ADC0_DM3 PGA1_DM/ ADC1_DM0/ ADC0_DM3 31 H5 VDDA VDDA VDDA 32 G5 VREFH VREFH VREFH 33 G6 VREFL VREFL VREFL 34 H6 VSSA VSSA VSSA 35 K3 ADC1_SE16/ CMP2_IN2/ ADC0_SE22 ADC1_SE16/ CMP2_IN2/ ADC0_SE22 ADC1_SE16/ CMP2_IN2/ ADC0_SE22 36 J3 ADC0_SE16/ CMP1_IN2/ ADC0_SE21 ADC0_SE16/ CMP1_IN2/ ADC0_SE21 ADC0_SE16/ CMP1_IN2/ ADC0_SE21 37 M3 VREF_OUT/ CMP1_IN5/ CMP0_IN5/ ADC1_SE18 VREF_OUT/ CMP1_IN5/ CMP0_IN5/ ADC1_SE18 VREF_OUT/ CMP1_IN5/ CMP0_IN5/ ADC1_SE18 38 L3 DAC0_OUT/ CMP1_IN3/ ADC0_SE23 DAC0_OUT/ CMP1_IN3/ ADC0_SE23 DAC0_OUT/ CMP1_IN3/ ADC0_SE23 39 L4 DAC1_OUT/ CMP0_IN4/ CMP2_IN3/ ADC1_SE23 DAC1_OUT/ CMP0_IN4/ CMP2_IN3/ ADC1_SE23 DAC1_OUT/ CMP0_IN4/ CMP2_IN3/ ADC1_SE23 40 M7 XTAL32 XTAL32 XTAL32 41 M6 EXTAL32 EXTAL32 EXTAL32 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 42 L6 VBAT VBAT VBAT 43 -- VDD VDD VDD 44 -- VSS VSS VSS 45 M4 PTE24 ADC0_SE17 ADC0_SE17 PTE24 CAN1_TX UART4_TX EWM_OUT_b 46 K5 PTE25 ADC0_SE18 ADC0_SE18 PTE25 CAN1_RX UART4_RX EWM_IN 47 K4 PTE26 DISABLED UART4_CTS_ b RTC_CLKOUT USB_CLKIN PTE26 EzPort K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 74 Freescale Semiconductor, Inc. Pinout 144 144 LQFP MAP BGA 48 J4 Pin Name PTE27 Default ALT0 DISABLED ALT1 ALT2 PTE27 ALT3 ALT4 ALT5 ALT6 ALT7 EzPort UART4_RTS_ b 49 H4 PTE28 DISABLED 50 J5 PTA0 JTAG_TCLK/ SWD_CLK/ EZP_CLK TSI0_CH1 PTA0 PTE28 UART0_CTS_ FTM0_CH5 b/ UART0_COL_ b JTAG_TCLK/ SWD_CLK EZP_CLK 51 J6 PTA1 JTAG_TDI/ EZP_DI TSI0_CH2 PTA1 UART0_RX FTM0_CH6 JTAG_TDI EZP_DI 52 K6 PTA2 JTAG_TDO/ TSI0_CH3 TRACE_SWO/ EZP_DO PTA2 UART0_TX FTM0_CH7 JTAG_TDO/ EZP_DO TRACE_SWO 53 K7 PTA3 JTAG_TMS/ SWD_DIO TSI0_CH4 PTA3 UART0_RTS_ FTM0_CH0 b 54 L7 PTA4/ LLWU_P3 NMI_b/ EZP_CS_b TSI0_CH5 PTA4/ LLWU_P3 55 M8 PTA5 DISABLED 56 E7 VDD VDD VDD 57 G7 VSS VSS VSS 58 J7 PTA6 DISABLED 59 J8 PTA7 ADC0_SE10 60 K8 PTA8 ADC0_SE11 61 L8 PTA9 62 M9 63 PTA5 JTAG_TMS/ SWD_DIO FTM0_CH1 USB_CLKIN NMI_b FTM0_CH2 CMP2_OUT I2S0_TX_ BCLK JTAG_TRST_ b PTA6 FTM0_CH3 TRACE_ CLKOUT ADC0_SE10 PTA7 FTM0_CH4 TRACE_D3 ADC0_SE11 PTA8 FTM1_CH0 FTM1_QD_ PHA TRACE_D2 DISABLED PTA9 FTM1_CH1 FTM1_QD_ PHB TRACE_D1 PTA10 DISABLED PTA10 FTM2_CH0 FTM2_QD_ PHA TRACE_D0 L9 PTA11 DISABLED PTA11 FTM2_CH1 FTM2_QD_ PHB 64 K9 PTA12 CMP2_IN0 CMP2_IN0 PTA12 CAN0_TX FTM1_CH0 I2S0_TXD0 FTM1_QD_ PHA 65 J9 PTA13/ LLWU_P4 CMP2_IN1 CMP2_IN1 PTA13/ LLWU_P4 CAN0_RX FTM1_CH1 I2S0_TX_FS FTM1_QD_ PHB 66 L10 PTA14 DISABLED PTA14 SPI0_PCS0 UART0_TX I2S0_RX_ BCLK I2S0_TXD1 67 L11 PTA15 DISABLED PTA15 SPI0_SCK UART0_RX I2S0_RXD0 68 K10 PTA16 DISABLED PTA16 SPI0_SOUT UART0_CTS_ b/ UART0_COL_ b I2S0_RX_FS 69 K11 PTA17 ADC1_SE17 ADC1_SE17 PTA17 SPI0_SIN UART0_RTS_ b I2S0_MCLK 70 E8 VDD VDD VDD 71 G8 VSS 72 M12 PTA18 VSS VSS EXTAL0 EXTAL0 PTA18 FTM0_FLT2 EZP_CS_b I2S0_RXD1 FTM_CLKIN0 K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 75 Pinout 144 144 LQFP MAP BGA 73 Pin Name M11 PTA19 Default ALT0 XTAL0 XTAL0 RESET_b ALT1 ALT2 PTA19 ALT3 FTM1_FLT0 ALT4 ALT5 FTM_CLKIN1 ALT6 EzPort LPTMR0_ ALT1 74 L12 RESET_b RESET_b 75 K12 PTA24 DISABLED PTA24 FB_A29 76 J12 PTA25 DISABLED PTA25 FB_A28 77 J11 PTA26 DISABLED PTA26 FB_A27 78 J10 PTA27 DISABLED PTA27 FB_A26 79 H12 PTA28 DISABLED PTA28 FB_A25 80 H11 PTA29 DISABLED PTA29 FB_A24 81 H10 PTB0/ LLWU_P5 ADC0_SE8/ ADC1_SE8/ TSI0_CH0 ADC0_SE8/ ADC1_SE8/ TSI0_CH0 PTB0/ LLWU_P5 I2C0_SCL FTM1_CH0 FTM1_QD_ PHA 82 H9 PTB1 ADC0_SE9/ ADC1_SE9/ TSI0_CH6 ADC0_SE9/ ADC1_SE9/ TSI0_CH6 PTB1 I2C0_SDA FTM1_CH1 FTM1_QD_ PHB 83 G12 PTB2 ADC0_SE12/ TSI0_CH7 ADC0_SE12/ TSI0_CH7 PTB2 I2C0_SCL UART0_RTS_ b FTM0_FLT3 84 G11 PTB3 ADC0_SE13/ TSI0_CH8 ADC0_SE13/ TSI0_CH8 PTB3 I2C0_SDA UART0_CTS_ b/ UART0_COL_ b FTM0_FLT0 85 G10 PTB4 ADC1_SE10 ADC1_SE10 PTB4 FTM1_FLT0 86 G9 PTB5 ADC1_SE11 ADC1_SE11 PTB5 FTM2_FLT0 87 F12 PTB6 ADC1_SE12 ADC1_SE12 PTB6 FB_AD23 88 F11 PTB7 ADC1_SE13 ADC1_SE13 PTB7 FB_AD22 89 F10 PTB8 DISABLED PTB8 90 F9 PTB9 DISABLED PTB9 91 E12 PTB10 ADC1_SE14 ADC1_SE14 92 E11 PTB11 ADC1_SE15 ADC1_SE15 93 H7 VSS VSS VSS UART3_RTS_ b FB_AD21 SPI1_PCS1 UART3_CTS_ b FB_AD20 PTB10 SPI1_PCS0 UART3_RX FB_AD19 FTM0_FLT1 PTB11 SPI1_SCK UART3_TX FB_AD18 FTM0_FLT2 94 F5 VDD VDD VDD 95 E10 PTB16 TSI0_CH9 TSI0_CH9 PTB16 SPI1_SOUT UART0_RX FB_AD17 EWM_IN 96 E9 PTB17 TSI0_CH10 TSI0_CH10 PTB17 SPI1_SIN UART0_TX FB_AD16 EWM_OUT_b 97 D12 PTB18 TSI0_CH11 TSI0_CH11 PTB18 CAN0_TX FTM2_CH0 I2S0_TX_ BCLK FB_AD15 FTM2_QD_ PHA 98 D11 PTB19 TSI0_CH12 TSI0_CH12 PTB19 CAN0_RX FTM2_CH1 I2S0_TX_FS FB_OE_b FTM2_QD_ PHB 99 D10 PTB20 DISABLED PTB20 SPI2_PCS0 FB_AD31 CMP0_OUT 100 D9 PTB21 DISABLED PTB21 SPI2_SCK FB_AD30 CMP1_OUT 101 C12 PTB22 DISABLED PTB22 SPI2_SOUT FB_AD29 CMP2_OUT 102 C11 PTB23 DISABLED PTB23 SPI2_SIN SPI0_PCS5 ALT7 FB_AD28 K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 76 Freescale Semiconductor, Inc. Pinout 144 144 LQFP MAP BGA Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 103 B12 PTC0 ADC0_SE14/ TSI0_CH13 ADC0_SE14/ TSI0_CH13 PTC0 SPI0_PCS4 PDB0_EXTRG FB_AD14 I2S0_TXD1 104 B11 PTC1/ LLWU_P6 ADC0_SE15/ TSI0_CH14 ADC0_SE15/ TSI0_CH14 PTC1/ LLWU_P6 SPI0_PCS3 UART1_RTS_ FTM0_CH0 b FB_AD13 I2S0_TXD0 105 A12 PTC2 ADC0_SE4b/ CMP1_IN0/ TSI0_CH15 ADC0_SE4b/ CMP1_IN0/ TSI0_CH15 PTC2 SPI0_PCS2 UART1_CTS_ FTM0_CH1 b FB_AD12 I2S0_TX_FS 106 A11 PTC3/ LLWU_P7 CMP1_IN1 CMP1_IN1 PTC3/ LLWU_P7 SPI0_PCS1 UART1_RX FTM0_CH2 CLKOUT I2S0_TX_ BCLK 107 H8 VSS VSS VSS 108 -- VDD VDD VDD 109 A9 PTC4/ LLWU_P8 DISABLED PTC4/ LLWU_P8 SPI0_PCS0 UART1_TX FTM0_CH3 FB_AD11 CMP1_OUT 110 D8 PTC5/ LLWU_P9 DISABLED PTC5/ LLWU_P9 SPI0_SCK LPTMR0_ ALT2 I2S0_RXD0 FB_AD10 CMP0_OUT 111 C8 PTC6/ LLWU_P10 CMP0_IN0 CMP0_IN0 PTC6/ LLWU_P10 SPI0_SOUT PDB0_EXTRG I2S0_RX_ BCLK FB_AD9 I2S0_MCLK 112 B8 PTC7 CMP0_IN1 CMP0_IN1 PTC7 SPI0_SIN USB_SOF_ OUT I2S0_RX_FS FB_AD8 113 A8 PTC8 ADC1_SE4b/ CMP0_IN2 ADC1_SE4b/ CMP0_IN2 PTC8 I2S0_MCLK FB_AD7 114 D7 PTC9 ADC1_SE5b/ CMP0_IN3 ADC1_SE5b/ CMP0_IN3 PTC9 I2S0_RX_ BCLK FB_AD6 115 C7 PTC10 ADC1_SE6b ADC1_SE6b PTC10 I2C1_SCL I2S0_RX_FS FB_AD5 116 B7 PTC11/ LLWU_P11 ADC1_SE7b ADC1_SE7b PTC11/ LLWU_P11 I2C1_SDA I2S0_RXD1 FB_RW_b 117 A7 PTC12 DISABLED PTC12 UART4_RTS_ b FB_AD27 118 D6 PTC13 DISABLED PTC13 UART4_CTS_ b FB_AD26 119 C6 PTC14 DISABLED PTC14 UART4_RX FB_AD25 120 B6 PTC15 DISABLED PTC15 UART4_TX FB_AD24 121 -- VSS VSS VSS 122 -- VDD VDD VDD 123 A6 PTC16 DISABLED PTC16 CAN1_RX UART3_RX FB_CS5_b/ FB_TSIZ1/ FB_BE23_16_ b 124 D5 PTC17 DISABLED PTC17 CAN1_TX UART3_TX FB_CS4_b/ FB_TSIZ0/ FB_BE31_24_ b 125 C5 PTC18 DISABLED PTC18 UART3_RTS_ b FB_TBST_b/ FB_CS2_b/ FB_BE15_8_b 126 B5 PTC19 DISABLED PTC19 UART3_CTS_ b FB_CS3_b/ FB_BE7_0_b ALT7 EzPort FTM2_FLT0 FB_TA_b K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 77 Pinout 144 144 LQFP MAP BGA Pin Name Default 127 A5 PTD0/ LLWU_P12 DISABLED 128 D4 PTD1 ADC0_SE5b 129 C4 PTD2/ LLWU_P13 DISABLED ALT0 ADC0_SE5b ALT1 ALT2 ALT3 ALT4 ALT5 PTD0/ LLWU_P12 SPI0_PCS0 UART2_RTS_ b FB_ALE/ FB_CS1_b/ FB_TS_b PTD1 SPI0_SCK UART2_CTS_ b FB_CS0_b PTD2/ LLWU_P13 SPI0_SOUT UART2_RX FB_AD4 ALT6 130 B4 PTD3 DISABLED PTD3 SPI0_SIN UART2_TX FB_AD3 131 A4 PTD4/ LLWU_P14 DISABLED PTD4/ LLWU_P14 SPI0_PCS1 UART0_RTS_ FTM0_CH4 b FB_AD2 EWM_IN 132 A3 PTD5 ADC0_SE6b ADC0_SE6b PTD5 SPI0_PCS2 UART0_CTS_ FTM0_CH5 b/ UART0_COL_ b FB_AD1 EWM_OUT_b 133 A2 PTD6/ LLWU_P15 ADC0_SE7b ADC0_SE7b PTD6/ LLWU_P15 SPI0_PCS3 UART0_RX FTM0_CH6 FB_AD0 FTM0_FLT0 134 M10 VSS VSS VSS 135 F8 VDD VDD FTM0_CH7 VDD 136 A1 PTD7 DISABLED PTD7 CMT_IRO UART0_TX 137 C9 PTD8 DISABLED PTD8 I2C0_SCL UART5_RX FB_A16 138 B9 PTD9 DISABLED PTD9 I2C0_SDA UART5_TX FB_A17 139 B3 PTD10 DISABLED PTD10 UART5_RTS_ b FB_A18 140 B2 PTD11 DISABLED PTD11 SPI2_PCS0 UART5_CTS_ SDHC0_ b CLKIN FB_A19 141 B1 PTD12 DISABLED PTD12 SPI2_SCK SDHC0_D4 FB_A20 142 C3 PTD13 DISABLED PTD13 SPI2_SOUT SDHC0_D5 FB_A21 143 C2 PTD14 DISABLED PTD14 SPI2_SIN SDHC0_D6 FB_A22 144 C1 PTD15 DISABLED PTD15 SPI2_PCS1 SDHC0_D7 FB_A23 ALT7 EzPort FTM0_FLT1 8.2 K20 pinouts The figure below shows the pinout diagram for the devices supported by this document. Many signals may be multiplexed onto a single pin. To determine what signals can be used on which pin, see the previous section. K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 78 Freescale Semiconductor, Inc. PTD15 PTD14 PTD13 PTD12 PTD11 PTD10 PTD9 PTD8 PTD7 VDD VSS PTD6/LLWU_P15 PTD5 PTD4/LLWU_P14 PTD3 PTD2/LLWU_P13 PTD1 PTD0/LLWU_P12 PTC19 PTC18 PTC17 PTC16 VDD VSS PTC15 PTC14 PTC13 PTC12 PTC11/LLWU_P11 PTC10 PTC9 PTC8 PTC7 PTC6/LLWU_P10 PTC5/LLWU_P9 PTC4/LLWU_P8 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 Pinout 84 PTB3 ADC1_DM1 26 83 PTB2 PGA0_DP/ADC0_DP0/ADC1_DP3 27 82 PTB1 PGA0_DM/ADC0_DM0/ADC1_DM3 28 81 PTB0/LLWU_P5 PGA1_DP/ADC1_DP0/ADC0_DP3 29 80 PTA29 PGA1_DM/ADC1_DM0/ADC0_DM3 30 79 PTA28 VDDA 31 78 PTA27 VREFH 32 77 PTA26 VREFL 33 76 PTA25 VSSA 34 75 PTA24 ADC1_SE16/CMP2_IN2/ADC0_SE22 35 74 RESET_b ADC0_SE16/CMP1_IN2/ADC0_SE21 36 73 PTA19 72 25 PTA18 PTB4 ADC1_DP1 71 85 VSS 24 70 PTB5 ADC0_DM1 VDD 86 69 23 PTA17 PTB6 ADC0_DP1 68 87 PTA16 22 67 PTB7 VREGIN PTA15 88 66 21 PTA14 PTB8 VOUT33 65 89 PTA13/LLWU_P4 20 64 PTB9 USB0_DM PTA12 90 63 19 PTA11 PTB10 USB0_DP 62 91 PTA10 18 61 PTB11 VSS PTA9 92 60 17 PTA8 VSS VSS 59 93 PTA7 16 58 VDD VDD PTA6 94 57 15 VSS PTB16 PTE12 56 95 VDD 14 55 PTB17 PTE11 PTA5 96 54 13 PTA4/LLWU_P3 PTB18 PTE10 53 97 PTA3 12 52 PTB19 PTE9 PTA2 98 51 11 PTA1 PTB20 PTE8 50 99 PTA0 10 49 PTB21 PTE7 PTE28 100 48 9 PTE27 PTB22 PTE6 47 101 PTE26 8 46 PTB23 PTE5 PTE25 102 45 7 PTE24 PTC0 PTE4/LLWU_P2 44 103 VSS 6 43 PTC1/LLWU_P6 VSS VDD 104 42 5 VBAT PTC2 VDD 41 105 EXTAL32 4 40 PTC3/LLWU_P7 PTE3 XTAL32 106 39 3 DAC1_OUT/CMP0_IN4/CMP2_IN3/ADC1_SE23 VSS PTE2/LLWU_P1 38 VDD 107 37 108 2 DAC0_OUT/CMP1_IN3/ADC0_SE23 1 VREF_OUT/CMP1_IN5/CMP0_IN5/ADC1_SE18 PTE0 PTE1/LLWU_P0 Figure 32. K20 144 LQFP Pinout Diagram K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 79 Revision history 1 2 3 4 5 6 7 8 9 10 11 12 A PTD7 PTD6/ LLWU_P15 PTD5 PTD4/ LLWU_P14 PTD0/ LLWU_P12 PTC16 PTC12 PTC8 PTC4/ LLWU_P8 NC PTC3/ LLWU_P7 PTC2 A B PTD12 PTD11 PTD10 PTD3 PTC19 PTC15 PTC11/ LLWU_P11 PTC7 PTD9 NC PTC1/ LLWU_P6 PTC0 B C PTD15 PTD14 PTD13 PTD2/ LLWU_P13 PTC18 PTC14 PTC10 PTC6/ LLWU_P10 PTD8 NC PTB23 PTB22 C D PTE2/ LLWU_P1 PTE1/ LLWU_P0 PTE0 PTD1 PTC17 PTC13 PTC9 PTC5/ LLWU_P9 PTB21 PTB20 PTB19 PTB18 D E PTE6 PTE5 PTE4/ LLWU_P2 PTE3 VDD VDD VDD VDD PTB17 PTB16 PTB11 PTB10 E F PTE10 PTE9 PTE8 PTE7 VDD VSS VSS VDD PTB9 PTB8 PTB7 PTB6 F G VOUT33 VREGIN PTE12 PTE11 VREFH VREFL VSS VSS PTB5 PTB4 PTB3 PTB2 G H USB0_DP USB0_DM VSS PTE28 VDDA VSSA VSS VSS PTB1 PTB0/ LLWU_P5 PTA29 PTA28 H J ADC0_DP1 ADC0_DM1 ADC0_SE16/ CMP1_IN2/ ADC0_SE21 PTE27 PTA0 PTA1 PTA6 PTA7 PTA13/ LLWU_P4 PTA27 PTA26 PTA25 J K ADC1_DP1 ADC1_DM1 ADC1_SE16/ CMP2_IN2/ ADC0_SE22 PTE26 PTE25 PTA2 PTA3 PTA8 PTA12 PTA16 PTA17 PTA24 K L PGA0_DP/ ADC0_DP0/ ADC1_DP3 PGA0_DM/ ADC0_DM0/ ADC1_DM3 DAC0_OUT/ CMP1_IN3/ ADC0_SE23 VBAT PTA4/ LLWU_P3 PTA9 PTA11 PTA14 PTA15 RESET_b L PGA1_DP/ M ADC1_DP0/ ADC0_DP3 PGA1_DM/ ADC1_DM0/ ADC0_DM3 VREF_OUT/ CMP1_IN5/ CMP0_IN5/ ADC1_SE18 PTE24 NC EXTAL32 XTAL32 PTA5 PTA10 VSS PTA19 PTA18 M 2 3 4 5 6 7 8 9 10 11 12 1 DAC1_OUT/ RTC CMP0_IN4/ CMP2_IN3/ _WAKEUP_B ADC1_SE23 Figure 33. K20 144 MAPBGA Pinout Diagram 9 Revision history The following table provides a revision history for this document. Table 53. Revision history Rev. No. Date 1 6/2012 Substantial Changes Initial public revision Table continues on the next page... K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 80 Freescale Semiconductor, Inc. Revision history Table 53. Revision history (continued) Rev. No. Date 2 12/2012 3 6/2013 Substantial Changes Replaced TBDs throughout. * * * * * * * * * In ESD handling ratings, added a note for ILAT. Updated "Voltage and current operating requirements" Table 1. Updated IOL data for VOL row in "Voltage and current operating behaviors" Table 4. Updated wakeup times and tPOR value in "Power mode transition operating behaviors" Table 5. In "EMC radiated emissions operating behaviors . . ." Table 7, added a column for 144MAPBGA. In "16-bit ADC operating conditions" Table 27, updated the max spec of VADIN. In "16-bit ADC electrical characteristics" Table 28, updated the temp sensor slope and voltage specs. Updated Inter-Integrated Circuit Interface (I2C) timing. In SDHC specifications, added operating voltage row. K20 Sub-Family Data Sheet, Rev. 3, 6/2013. Freescale Semiconductor, Inc. 81 How to Reach Us: Information in this document is provided solely to enable system and software Home Page: freescale.com implementers to use Freescale products. There are no express or implied copyright Web Support: freescale.com/support information in this document. licenses granted hereunder to design or fabricate any integrated circuits based on the Freescale reserves the right to make changes without further notice to any products herein. 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U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. ARM is the registered trademark of ARM Limited. Cortex-M4 is the trademark of ARM Limited. are the registered trademarks of ARM Limited. (c) 2012-2013Freescale Semiconductor, Inc. Document Number: K20P144M100SF2V2 Rev. 3 06/2013