LMZ22003 3A SIMPLE SWITCHER(R) Power Module with 20V Maximum Input Voltage Easy To Use 7 Pin Package Performance Benefits High efficiency reduces system heat generation Complies with EN55022 Class B (Note 5) Low component count, only 5 external components Low output voltage ripple Uses PCB as heat sink, no airflow required System Performance 30116886 18W maximum total output power Up to 3A output current Input voltage range 6V to 20V Output voltage range 0.8V to 6V Efficiency up to 92% 100 4 90 80 3 70 60 50 2 40 30 1 20 10 0 0 0 1 2 OUTPUT CURRENT (A) 3 Key Features Integrated shielded inductor Simple PCB layout Frequency synchronization input (650 kHz to 950 kHz) Flexible startup sequencing using external soft-start, tracking and precision enable Protection against inrush currents and faults such as input UVLO and output short circuit - 40C to 125C junction temperature range Single exposed pad and standard pinout for easy mounting and manufacturing Fast transient response for powering FPGAs and ASICs Fully enabled for Webench(R) Power Designer Pin compatible with LMZ23605/LMZ23603/LMZ22005 3 2 1 JA=12C/W 0 30 40 50 60 70 80 90 100 110 120 130 AMBIENT TEMPERATURE (C) 30116889 Radiated EMI (EN 55022) of Demo Board (See AN-2125) Applications 4 MAXIMUM OUTPUT CURRENT (A) 30116803 Thermal Derating Curve VIN = 12V VOUT = 5.0V Point of load conversions from 12V input rail Time critical projects Space constrained / high thermal requirement applications Negative output voltage applications See AN-2027 50 45 AMPLITUDE (dBuV/m) DISSIPATION (W) Electrical Specifications Efficiency VIN = 12V VOUT = 5.0V EFFICIENCY (%) TO-PMOD 7 Pin Package 10.16 x 13.77 x 4.57 mm (0.4 x 0.542 x 0.18 in) JA = 12C/W, JC = 1.9C/W (Note 6) RoHS Compliant 40 35 30 25 20 15 Class A Limit Class B Limit Horiz Peak Horiz Quasi-peak 10 5 0 0 200 400 600 800 FREQUENCY (MHz) 1000 30116895 (c) 2011 National Semiconductor Corporation 301168 www.national.com LMZ22003 3A SIMPLE SWITCHER(R) Power Module with 20V Maximum Input Voltage June 15, 2011 LMZ22003 Simplified Application Schematic 30116801 Connection Diagram 30116802 Top View 7-Lead TO-PMOD Ordering Information Order Number Package Type NSC Package Drawing Supplied As LMZ22003TZ TO-PMOD-7 TZA07A 45 Units in a Rail LMZ22003TZE TO-PMOD-7 TZA07A 250 Units on Tape and Reel LMZ22003TZX TO-PMOD-7 TZA07A 500 Units on Tape and Reel Pin Descriptions Pin 1 2 3 4 Name Description VIN Supply input -- Nominal operating range is 6V to 20V . A small amount of internal capacitance is contained within the package assembly. Additional external input capacitance is required between this pin and exposed pad (PGND). SYNC Sync Input -- Apply a CMOS logic level square wave whose frequency is between 650 kHz and 950 kHz to synchronize the PWM operating frequency to an external frequency source. When not using synchronization connect to ground. The module free running PWM frequency is 812 kHz (Typ). EN Enable -- Input to the precision enable comparator. Rising threshold is 1.279V typical. Once the module is enabled, a 21 uA source current is internally activated to facilitate programmable hysteresis. AGND Analog Ground -- Reference point for all stated voltages. Must be externally connected to PGND (EP). 5 FB Feedback -- Internally connected to the regulation amplifier, over-voltage comparators. The regulation reference point is 0.796V at this input pin. Connect the feedback resistor divider between the output and AGND to set the output voltage. 6 SS/ TRK Soft-Start/Track -- To extend the 1.6 mSec internal soft-start connect an external soft start capacitor. For tracking connect to an external resistive divider connected to a higher priority supply rail. See applications section www.national.com 2 Name Description 7 VOUT Output Voltage -- Output from the internal inductor. Connect the output capacitor between this pin and exposed pad. EP PGND Exposed Pad / Power Ground Electrical path for the power circuits within the module. -- NOT Internally connected to AGND / pin 4. Used to dissipate heat from the package during operation. Must be electrically connected to pin 4 external to the package. 3 www.national.com LMZ22003 Pin LMZ22003 ESD Susceptibility (Note 2) For soldering specifications: see product folder at www.national.com and www.national.com/ms/MS/MS-SOLDERING.pdf Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. VIN to PGND EN, SYNC to AGND SS/TRK, FB to AGND AGND to PGND Junction Temperature Storage Temperature Range Operating Ratings -0.3V to 24V -0.3V to 5.5V -0.3V to 2.5V -0.3V to 0.3V 150C -65C to 150C 2 kV (Note 1) VIN EN, SYNC Operation Junction Temperature 6V to 20V 0V to 5.0V -40C to 125C Electrical Characteristics Limits in standard type are for TJ = 25C only; limits in boldface type apply over the junction temperature (TJ) range of -40C to +125C. Minimum and Maximum limits are guaranteed through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 12V, Vout = 3.3V Symbol Parameter Conditions Min (Note 3) Typ (Note 4) Max (Note 3) 1.10 1.279 1.458 Units SYSTEM PARAMETERS Enable Control VEN EN threshold trip point VEN rising EN input hysteresis current VEN > 1.279V ISS SS source current VSS = 0V tSS Internal soft-start interval VEN-HYS -21 V A Soft-Start 40 50 60 1.6 A msec Current Limit ICL Current limit threshold d.c. average 3.4 Sync input connected to ground. 711 A Internal Switching Oscillator fosc Free-running oscillator frequency fsync Synchronization range 650 VIL-sync Synchronization logic zero amplitude Relative to AGND VIH-sync Synchronization logic one amplitude Relative to AGND. Sync d.c. Synchronization duty cycle range Dmax 812 914 kHz 950 kHz 0.4 V V 1.5 15 Maximum Duty Factor 50 85 83 % % Regulation and Over-Voltage Comparator VFB VFB-OV In-regulation feedback voltage VSS >+ 0.8V IO = 3A 0.776 Feedback over-voltage protection threshold 0.796 0.86 0.816 V V IFB Feedback input bias current 5 nA IQ Non Switching Input Current VFB= 0.86V 2.6 mA ISD Shut Down Quiescent Current VEN= 0V 70 A Thermal Shutdown Rising 165 C Thermal shutdown hysteresis Falling 15 C Junction to Ambient(Note 6) 4 layer Evaluation Printed Circuit Board, 60 vias, No air flow 12.0 C/W 2 layer JEDEC Printed Circuit Board, No air flow 21.5 C/W No air flow 1.9 C/W Thermal Characteristics TSD TSD-HYST JA JC www.national.com Junction to Case 4 Parameter Min (Note 3) Conditions Typ (Note 4) Max (Note 3) Units PERFORMANCE PARAMETERS(Note 7) VO Output voltage ripple Cout = 220uF w/ 7 milliohm ESR + 100uF X7R + 2 x 0.047uF BW@ 20 MHz 9 mV PP VO/VIN Line regulation VIN = 12V to 20V, IO= .001A 0.02 % VO/IOUT Load regulation Peak efficiency VIN = 12V, IO= 0.001A to 3A 1 mV/A VIN = 12V VO = 3.3V IO = 1A 86 % Full load efficiency VIN = 12V VO = 3.3V IO = 3A 85 % Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics. Note 2: The human body model is a 100pF capacitor discharged through a 1.5 k resistor into each pin. Test method is per JESD-22-114. Note 3: Min and Max limits are 100% production tested at 25C. Limits over the operating temperature range are guaranteed through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate National's Average Outgoing Quality Level (AOQL). Note 4: Typical numbers are at 25C and represent the most likely parametric norm. Note 5: EN 55022:2006, +A1:2007, FCC Part 15 Subpart B: 2007. See AN-2125 and layout for information on device under test. Vin = 12V, Vo = 3.3V, Io = 3A Note 6: Theta JA measured on a 3.5" x 3.5" four layer board, with three ounce copper on outer layers and two ounce copper on inner layers, sixty 10 mil thermal vias, no air flow, and 1W power dissipation. Refer to application note layout diagrams. Note 7: Refer to BOM in Table 1. 5 www.national.com LMZ22003 Symbol Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 2 x 10F + 1F X7R Ceramic; CO = 220F Specialty Polymer + 10 uF Ceramic; TAmbient = 25 C for waveforms. Efficiency and dissipation plots marked with * have cycle skipping at light loads resulting is slightly higher Output ripple - See applications section. Efficiency 6.0V Output @ 25C Ambient Dissipation 6.0V Output @ 25C Ambient 100 3 20 Vin 12 Vin 10 Vin DISSIPATION (W) EFFICIENCY (%) 90 80 70 60 50 10 Vin 12 Vin 20 Vin 40 0 1 2 OUTPUT CURRENT (A) 2 1 0 3 0 1 2 OUTPUT CURRENT (A) 30116887 Dissipation 5.0V Output @ 25C Ambient 100 3 20 Vin 12 Vin 9 Vin DISSIPATION (W) 90 80 70 60 50 9 VIn 12 Vin 20 Vin 40 0 1 2 OUTPUT CURRENT (A) 2 1 0 3 0 30116852 www.national.com 3 30116888 Efficiency 5.0V Output @ 25C Ambient EFFICIENCY (%) LMZ22003 Typical Performance Characteristics 1 2 OUTPUT CURRENT (A) 3 30116853 6 Dissipation 3.3V Output @ 25C Ambient 100 3 20 Vin 12 Vin 9 Vin 6 Vin DISSIPATION (W) EFFICIENCY (%) 90 80 70 60 6 Vin 9 Vin 12 Vin 20 Vin 50 40 0 1 2 OUTPUT CURRENT (A) 2 1 0 3 0 1 2 OUTPUT CURRENT (A) 3 30116854 30116855 Efficiency 2.5V Output @ 25C Ambient Dissipation 2.5V Output @ 25C Ambient 90 3 20 Vin 12 Vin 9 Vin 6 Vin DISSIPATION (W) EFFICIENCY (%) 80 70 60 50 6 Vin 9 Vin 12 Vin 20 Vin 40 30 0 1 2 OUTPUT CURRENT (A) 2 1 0 3 0 1 2 OUTPUT CURRENT (A) 3 30116856 30116857 Efficiency 1.8V Output @ 25C Ambient Dissipation 1.8V Output @ 25C Ambient 90 3 20 Vin 12 Vin 9 Vin 6 Vin DISSIPATION (W) EFFICIENCY (%) 80 70 60 50 6 Vin 9 Vin 12 Vin 20 Vin 40 30 0 1 2 OUTPUT CURRENT (A) LMZ22003 Efficiency 3.3V Output @ 25C Ambient 2 1 0 3 0 30116858 1 2 OUTPUT CURRENT (A) 3 30116859 7 www.national.com Dissipation 1.5V Output @ 25C Ambient 85 3 20 Vin 12 Vin 9 Vin 6 Vin DISSIPATION (W) EFFICIENCY (%) 75 65 55 45 6 Vin 9 Vin 12 Vin 20 Vin 35 25 0 1 2 OUTPUT CURRENT (A) 2 1 0 3 0 1 2 OUTPUT CURRENT (A) 30116860 Dissipation 1.2V Output @ 25C Ambient 80 3 20 Vin 12 Vin 9 Vin 6 Vin DISSIPATION (W) EFFICIENCY (%) 70 60 50 40 6 Vin 9 Vin 12 Vin 20 Vin 30 20 0 1 2 OUTPUT CURRENT (A) 2 1 0 3 0 1 2 OUTPUT CURRENT (A) 30116862 Dissipation 1.0V Output @ 25C Ambient 80 3 20 Vin 12 Vin 9 VIn 6 Vin DISSIPATION (W) 70 60 50 40 6 Vin 9 Vin 12 Vin 20 Vin 20 0 1 2 OUTPUT CURRENT (A) 2 1 0 3 0 30116864 www.national.com 3 30116863 Efficiency 1.0V Output @ 25C Ambient 30 3 30116861 Efficiency 1.2V Output @ 25C Ambient EFFICIENCY (%) LMZ22003 Efficiency 1.5V Output @ 25C Ambient 1 2 OUTPUT CURRENT (A) 3 30116865 8 Dissipation 0.8V Output @ 25C Ambient 70 3 20 Vin* 12 Vin 9 Vin 6 Vin DISSIPATION (W) EFFICIENCY (%) 60 50 40 30 6 Vin 9 Vin 12 Vin 20 Vin* 20 10 0 1 2 OUTPUT CURRENT (A) 2 1 0 3 0 1 2 OUTPUT CURRENT (A) 3 30116890 30116891 Efficiency 6.0V Output @ 85C Ambient Dissipation 6.0V Output @ 85C Ambient 100 3 20 Vin 12 Vin 10 Vin DISSIPATION (W) EFFICIENCY (%) 90 80 70 60 50 10 Vin 12 Vin 20 Vin 40 0 1 2 OUTPUT CURRENT (A) 2 1 0 3 0 1 2 OUTPUT CURRENT (A) 3 30116826 30116827 Efficiency 5.0V Output @ 85C Ambient Dissipation 5.0V Output @ 85C Ambient 100 3 20 Vin 12 Vin 9 Vin DISSIPATION (W) EFFICIENCY (%) 90 80 70 60 50 9 Vin 12 Vin 20 Vin 40 0 1 2 OUTPUT CURRENT (A) LMZ22003 Efficiency 0.8V Output @ 25C Ambient 2 1 0 3 0 30116828 1 2 OUTPUT CURRENT (A) 3 30116829 9 www.national.com Dissipation 3.3V Output @ 85C Ambient 90 3 20 Vin 12 Vin 9 Vin 6 Vin DISSIPATION (W) EFFICIENCY (%) 80 70 60 50 6 Vin 9 Vin 12 Vin 20 Vin 40 30 0 1 2 OUTPUT CURRENT (A) 2 1 0 3 0 1 2 OUTPUT CURRENT (A) 30116830 Dissipation 2.5V Output @ 85C Ambient 90 3 20 Vin 12 Vin 9 Vin 6 Vin DISSIPATION (W) EFFICIENCY (%) 80 70 60 50 6 Vin 9 Vin 12 Vin 20 Vin 40 30 0 1 2 OUTPUT CURRENT (A) 2 1 0 3 0 1 2 OUTPUT CURRENT (A) 30116832 Dissipation 1.8V Output @ 85C Ambient 90 3 20 Vin 12 Vin 9 Vin 6 Vin DISSIPATION (W) 80 70 60 50 6 Vin 9 Vin 12 Vin 20 Vin 30 0 1 2 OUTPUT CURRENT (A) 2 1 0 3 0 30116834 www.national.com 3 30116833 Efficiency 1.8V Output @ 85C Ambient 40 3 30116831 Efficiency 2.5V Output @ 85C Ambient EFFICIENCY (%) LMZ22003 Efficiency 3.3V Output @ 85C Ambient 1 2 OUTPUT CURRENT (A) 3 30116835 10 Dissipation 1.5V Output @ 85C Ambient 80 3 20 Vin 12 Vin 9 Vin 6 Vin DISSIPATION (W) EFFICIENCY (%) 70 60 50 40 6 Vin 9 Vin 12 Vin 20 Vin 30 20 0 1 2 OUTPUT CURRENT (A) 2 1 0 3 0 1 2 OUTPUT CURRENT (A) 3 30116836 30116837 Efficiency 1.2V Output @ 85C Ambient Dissipation 1.2V Output @ 85C Ambient 80 3 20 Vin 12 Vin 9 Vin 6 Vin DISSIPATION (W) EFFICIENCY (%) 70 60 50 40 6 Vin 9 Vin 12 Vin 20 Vin 30 20 0 1 2 OUTPUT CURRENT (A) 2 1 0 3 0 1 2 OUTPUT CURRENT (A) 3 30116838 30116839 Efficiency 1.0V Output @ 85C Ambient Dissipation 1.0V Output @ 85C Ambient 75 3 20 Vin 12 Vin 9 Vin 6 Vin DISSIPATION (W) EFFICIENCY (%) 65 55 45 35 6 Vin 9 Vin 12 Vin 20 Vin 25 15 0 1 2 OUTPUT CURRENT (A) LMZ22003 Efficiency 1.5V Output @ 85C Ambient 2 1 0 3 0 30116840 1 2 OUTPUT CURRENT (A) 3 30116841 11 www.national.com Dissipation 0.8V Output @ 85C Ambient 70 3 20 Vin* 12 Vin 9 Vin 6 Vin DISSIPATION (W) EFFICIENCY (%) 60 50 40 6 Vin 9 Vin 12 Vin 20 Vin* 30 20 0 2 1 0 1 2 OUTPUT CURRENT (A) 3 0 1 2 OUTPUT CURRENT (A) 30116892 Thermal Derating VIN= 12V, VOUT = 3.3V 4 MAXIMUM OUTPUT CURRENT (A) MAXIMUM OUTPUT CURRENT (A) 4 3 2 1 JA=12C/W 0 30 40 50 60 70 80 90 100 110 120 130 AMBIENT TEMPERATURE (C) 3 2 1 JA = 12 C/W 0 30 40 50 60 70 80 90 100 110 120 130 TEMPERATURE (C) 30116889 30116894 Normalized Line and Load Regulation VOUT = 3.3V Output Ripple 12VIN 3.3VO @ 3A, BW = 20 MHz 1.002 1.001 1.000 0.999 9 Vin 12 Vin 20 Vin 0.998 0 1 2 OUTPUT CURRENT (A) 3 30116805 30116842 www.national.com 3 30116893 Thermal Derating VIN = 12V, VOUT = 5.0V NORMALLIZED OUTPUT VOLTAGE (V/V) LMZ22003 Efficiency 0.8V Output @ 85C Ambient 12 LMZ22003 Output Ripple 12VIN 3.3VO@ 3A BW = 250 MHz Transient Response 12VIN 3.3VO0.5 to 3A Step 30116806 30116808 Short Circuit Current vs Input Voltage 9 8 CURRENT (A) 7 Output Current 6 5 4 3 2 Input Current 1 0 0 4 8 12 16 INPUT VOLTAGE (V) 20 30116818 13 www.national.com LMZ22003 Block Diagram 30116810 ENABLE DIVIDER, RENT, RENB AND RENHSELECTION Internal to the module is a 2 mega ohm pull-up resistor connected from VIN to Enable. For applications not requiring precision under voltage lock out (UVLO), the Enable input may be left open circuit and the internal resistor will always enable the module. In such case, the internal UVLO occurs typically at 4.3V (VINrising). In applications with separate supervisory circuits Enable can be directly interfaced to a logic source. In the case of sequencing supplies, the divider is connected to a rail that becomes active earlier in the power-up cycle than the LMZ22003 output rail. Enable provides a precise 1.279V threshold to allow direct logic drive or connection to a voltage divider from a higher enable voltage such as VIN. Additionally there is 21 A(typ) of switched offset current allowing programmable hysteresis. See Figure 1. The function of the enable divider is to allow the designer to choose an input voltage below which the circuit will be disabled. This implements the feature of programmable UVLO. The two resistors should be chosen based on the following ratio: RENT / RENB = (VIN UVLO / 1.279V) - 1 (1) General Description The LMZ22003 SIMPLE SWITCHER(c) power module is an easy-to-use step-down DC-DC solution capable of driving up to 3A load. The LMZ22003 is available in an innovative package that enhances thermal performance and allows for hand or machine soldering. The LMZ22003 can accept an input voltage rail between 6V and 20V and deliver an adjustable and highly accurate output voltage as low as 0.8V. The LMZ22003 only requires two external resistors and three external capacitors to complete the power solution. The LMZ22003 is a reliable and robust design with the following protection features: thermal shutdown, programmable input under-voltage lockout, output over-voltage protection, short-circuit protection, output current limit, and allows startup into a pre-biased output. The sync input allows synchronization over the 650 to 950 kHz switching frequency range. Design Steps for the LMZ22003 Application The LMZ22003 is fully supported by Webench(R) which offers: component selection, electrical and thermal simulations. Additionally there are both evaluation and demonstration boards that may be used as a starting point for design. The following list of steps can be used to manually design the LMZ22003 application. All references to values refer to the typical applications schematic figure 4. * Select minimum operating VIN with enable divider resistors * Program VO with resistor divider selection * Select CO * Select CIN * Determine module power dissipation * Layout PCB for required thermal performance The LMZ22003 typical application shows 12.7k for RENB and 42.2k for RENT resulting in a rising UVLO of 5.46V. Note that this divider presents 8.33V to the input when the divider is raised to 20V which would exceed the recommended 5.5V limit for Enable. A midpoint 5.1V Zener clamp is applied to allow the application to cover the full 6V to 20V range of operation. The zener clamp is not required if the target application prohibits the maximum Enable input voltage from being exceeded. Additional enable voltage hysteresis can be added with the inclusion of RENH. It is possible to select values for RENT and RENB such that RENH is a value of zero allowing it to be omitted from the design. Rising threshold can be calculated as follows: VEN(rising) = 1.279 ( 1 + (RENT|| 2 meg)/ RENB) www.national.com 14 LMZ22003 Whereas the falling threshold level can be calculated using: VEN(falling) = VEN(rising) - 21 A ( RENT|| 2 meg || RENTB + RENH ) Enable Input Detail 30116809 FIGURE 1. Using a 0.22F capacitor results in 3.5 msec typical soft-start duration; and 0.47F results in 7.5 msec typical. 0.47 F is a recommended initial value. As the soft-start input exceeds 0.796V the output of the power stage will be in regulation and the 50 A current is deactivated. Note that the following conditions will reset the soft-start capacitor by discharging the SS input to ground with an internal current sink. * The Enable input being pulled low * Thermal shutdown condition * Internal Vcc UVLO (Approx 4.3V input to VIN) OUTPUT VOLTAGE SELECTION Output voltage is determined by a divider of two resistors connected between VO and ground. The midpoint of the divider is connected to the FB input. The regulated output voltage determined by the external divider resistors RFBT and RFBB is: VO = 0.796V * (1 + RFBT / RFBB) (2) Rearranging terms; the ratio of the feedback resistors for a desired output voltage is: RFBT / RFBB = (VO / 0.796V) - 1 (3) These resistors should generally be chosen from values in the range of 1.0 k to 10.0 k. TRACKING SUPPLY DIVIDER OPTION The tracking function allows the module to be connected as a slave supply to a primary voltage rail (often the 3.3V system rail) where the slave module output voltage is lower than that of the master. Proper configuration allows the slave rail to power up coincident with the master rail such that the voltage difference between the rails during ramp-up is small (i.e. <0.15V typ). The values for the tracking resistive divider should be selected such that the effect of the internal 50uA current source is minimized. In most cases the ratio of the tracking divider resistors is the same as the ratio of the output voltage setting divider. Proper operation in tracking mode dictates the soft-start time of the slave rail be shorter than the master rail; a condition that is easy satisfy since the CSS cap is replaced by RTKB. The tracking function is only supported for the power up interval of the master supply; once the SS/ TRK rises past 0.8V the input is no longer enabled and the 50 uA internal current source is switched off. For VO = 0.8V the FB pin can be connected to the output directly and RFBB can be set to 8.06k to provide minimum output load. A table of values for RFBT , and RFBB, is included in the simplified applications schematic on page 2. SOFT-START CAPACITOR SELECTION Programmable soft-start permits the regulator to slowly ramp to its steady state operating point after being enabled, thereby reducing current inrush from the input supply and slowing the output voltage rise-time. Upon turn-on, after all UVLO conditions have been passed, an internal 1.6mSec circuit slowly ramps the SS/TRK input to implement internal soft start. If 2 mSec is an adequate turn- on time then the Css capacitor can be left unpopulated. Longer soft-start periods are achieved by adding an external capacitor to this input. Soft start duration is given by the formula: tSS = VREF * CSS / Iss = 0.796V * CSS / 50uA (4) This equation can be rearranged as follows: CSS = tSS * 50A / 0.796V (5) 15 www.national.com LMZ22003 Tracking Option Input Detail (As a point of reference, the worst case ripple current will occur when the module is presented with full load current and when VIN = 2 * VO). Recommended minimum input capacitance is 22uF X7R (or X5R) ceramic with a voltage rating at least 25% higher than the maximum applied input voltage for the application. It is also recommended that attention be paid to the voltage and temperature derating of the capacitor selected. It should be noted that ripple current rating of ceramic capacitors may be missing from the capacitor data sheet and you may have to contact the capacitor manufacturer for this parameter. If the system design requires a certain minimum value of peak-to-peak input ripple voltage (VIN) be maintained then the following equation may be used. CIN IO * D * (1-D) / fSW-CCM * VIN(9) If VIN is 1% of VIN for a 12V input to 3.3V output application this equals 120 mV and fSW = 812 kHz. 30116815 CIN 3A * 3.3V/12V * (1- 3.3V/12V) / (812000 * 0.120 V) 6.14F FIGURE 2. CO SELECTION None of the required CO output capacitance is contained within the module. A minimum value of 200 F is required based on the values of internal compensation in the error amplifier. Low ESR tantalum, organic semiconductor or specialty polymer capacitor types are recommended for obtaining lowest ripple. The output capacitor CO may consist of several capacitors in parallel placed in close proximity to the module. The output capacitor assembly must also meet the worst case minimum ripple current rating of 0.5 * ILR P-P, as calculated in equation (14) below. Beyond that, additional capacitance will reduce output ripple so long as the ESR is low enough to permit it. Loop response verification is also valuable to confirm closed loop behavior. For applications with dynamic load steps; the following equation provides a good first pass approximation of CO for load transient requirements. Where VO-Tran is 100 mV on a 3.3V output design. Additional bulk capacitance with higher ESR may be required to damp any resonant effects of the input capacitance and parasitic inductance of the incoming supply lines. The LMZ22003 typical applications schematic and evaluation board include a 150 F 50V aluminum capacitor for this function. There are many situations where this capacitor is not necessary. POWER DISSIPATION AND BOARD THERMAL REQUIREMENTS When calculating module dissipation use the maximum input voltage and the average output current for the application. Many common operating conditions are provided in the characteristic curves such that less common applications can be derived through interpolation. In all designs, the junction temperature must be kept below the rated maximum of 125C. COIO-Tran/((*VO-Tran- ESR * IO-Tran) * ( F*SW/ VO))(6) For the design case of VIN = 12V, VO = 3.3V, IO = 3A, and TAMB(MAX) = 85C, the module must see a thermal resistance from case to ambient of less than: Solving: CA< (TJ-MAX - TA-MAX) / PIC-LOSS - JC (10) CO 2.5A / ((0.1V - .007*2.5A) * ( 800000 Hz/ 3.3V) 125F (7) Given the typical thermal resistance from junction to case to be 1.9 C/W. Use the 85C power dissipation curves in the Typical Performance Characteristics section to estimate the PIC-LOSS for the application being designed. In this application it is 2W. Note that the stability requirement for 200 F minimum output capacitance will take precedence. One recommended output capacitor combination is a 220uF, 7 milliohm ESR specialty polymer cap in parallel with a 100 uF 6.3V X5R ceramic. This combination provides excellent performance that may exceed the requirements of certain applications. Additionally some small ceramic capacitors can be used for high frequency EMI suppression. CA = (125 - 85) / 2W - 1.9 = 18.1(11) To reach CA = 18.1, the PCB is required to dissipate heat effectively. With no airflow and no external heat-sink, a good estimate of the required board area covered by 2 oz. copper on both the top and bottom metal layers is: Board_Area_cm2 = 500C x cm2/W / CA (12) CIN SELECTION The LMZ22003 module contains a small amount of internal ceramic input capacitance. Additional input capacitance is required external to the module to handle the input ripple current of the application. The input capacitor can be several capacitors in parallel. This input capacitance should be located in very close proximity to the module. Input capacitor selection is generally directed to satisfy the input ripple current requirements rather than by capacitance value. Input ripple current rating is dictated by the equation: As a result, approximately 28 square cm of 2 oz copper on top and bottom layers is required for the PCB design. The PCB copper heat sink must be connected to the exposed pad. Approximately sixty, 10mil (254 m) thermal vias spaced 39 mils (1.0 mm) apart connect the top copper to the bottom copper. For an example of a high thermal performance PCB layout for SIMPLE SWITCHER(c) power modules, refer to AN-2085, AN-2125, AN-2020 and AN-2026. PC BOARD LAYOUT GUIDELINES PC board layout is an important part of DC-DC converter design. Poor board layout can disrupt the performance of a DC- I(CIN(RMS)) 1 /2 * IO * SQRT (D / 1-D) (8) where D VO / VIN www.national.com 16 39mils (1.0 mm). Ensure enough copper area is used for heatsinking to keep the junction temperature below 125C. Additional Features SYNCHRONIZATION INPUT The PWM switching frequency can be synchronized to an external frequency source. If this feature is not used, connect this input either directly to ground, or connect to ground through a resistor of 1.5 k ohm or less. The allowed synchronization frequency range is 650kHz to 950 kHz. The typical input threshold is 1.4V transition level. Ideally the input clock should overdrive the threshold by a factor of 2, so direct drive from 3.3V logic via a 1.5k Thevenin source resistance is recommended. Note that applying a sustained "logic 1" corresponds to zero Hz PWM frequency and will cause the module to stop switching. OUTPUT OVER-VOLTAGE PROTECTION If the voltage at FB is greater than a 0.86V internal reference, the output of the error amplifier is pulled toward ground, causing VO to fall. 30116811 FIGURE 3. 1. Minimize area of switched current loops. From an EMI reduction standpoint, it is imperative to minimize the high di/dt paths during PC board layout as shown in the figure above. The high current loops that do not overlap have high di/dt content that will cause observable high frequency noise on the output pin if the input capacitor (Cin1) is placed at a distance away from the LMZ22003. Therefore place CIN1 as close as possible to the LMZ22003 VIN and PGND exposed pad. This will minimize the high di/dt area and reduce radiated EMI. Additionally, grounding for both the input and output capacitor should consist of a localized top side plane that connects to the PGND exposed pad (EP). 2. Have a single point ground. The ground connections for the feedback, soft-start, and enable components should be routed to the AGND pin of the device. This prevents any switched or load currents from flowing in the analog ground traces. If not properly handled, poor grounding can result in degraded load regulation or erratic output voltage ripple behavior. Additionally provide the single point ground connection from pin 4 (AGND) to EP/ PGND. 3. Minimize trace length to the FB pin. Both feedback resistors, RFBT and RFBB should be located close to the FB pin. Since the FB node is high impedance, maintain the copper area as small as possible. The traces from RFBT, RFBB should be routed away from the body of the LMZ22003 to minimize possible noise pickup. 4. Make input and output bus connections as wide as possible. This reduces any voltage drops on the input or output of the converter and maximizes efficiency. To optimize voltage accuracy at the load, ensure that a separate feedback voltage sense trace is made to the load. Doing so will correct for voltage drops and provide optimum output accuracy. 5. Provide adequate device heat-sinking. Use an array of heat-sinking vias to connect the exposed pad to the ground plane on the bottom PCB layer. If the PCB has a plurality of copper layers, these thermal vias can also be employed to make connection to inner layer heat-spreading ground planes. For best results use a 6 x 10 via array with minimum via diameter of 10mils (254 m) thermal vias spaced CURRENT LIMIT The LMZ22003 is protected by both low side (LS) and high side (HS) current limit circuitry. The LS current limit detection is carried out during the off-time by monitoring the current through the LS synchronous MOSFET. Referring to the Functional Block Diagram, when the top MOSFET is turned off, the inductor current flows through the load, the PGND pin and the internal synchronous MOSFET. If this current exceeds the low side current limit value, the current limit comparator disables the start of the next switching period. Switching cycles are prohibited until current drops below the limit. It should also be noted that d.c. current limit is dependent on both duty cycle as illustrated in the graph in the typical performance section. The HS current limit monitors the current of top side MOSFET. Once HS current limit is detected, the HS MOSFET is shutoff immediately, until the next cycle. Exceeding HS current limit causes VO to fall. Typical behavior of exceeding LS current limit is that fSW drops to 1/2 of the operating frequency. THERMAL PROTECTION The junction temperature of the LMZ22003 should not be allowed to exceed its maximum ratings. Thermal protection is implemented by an internal Thermal Shutdown circuit which activates at 165 C (typ) causing the device to enter a low power standby state. In this state the main MOSFET remains off causing VO to fall, and additionally the CSS capacitor is discharged to ground. Thermal protection helps prevent catastrophic failures for accidental device overheating. When the junction temperature falls back below 150 C (typ Hyst = 15C) the SS pin is released, VO rises smoothly, and normal operation resumes. Applications requiring maximum output current especially those at high input voltage may require additional derating at elevated temperatures. PRE-BIASED STARTUP The LMZ22003 will properly start up into a pre-biased output. This startup situation is common in multiple rail logic applications where current paths may exist between different power rails during the startup sequence. The following scope capture shows proper behavior in this mode. Trace one is Enable going high. Trace two is 1.5V pre-bias rising to 3.3V. Risetime determined by CSS, trace three. 17 www.national.com LMZ22003 DC converter and surrounding circuitry by contributing to EMI, ground bounce and resistive voltage drop in the traces. These can send erroneous signals to the DC-DC converter resulting in poor regulation or instability. Good layout can be implemented by following a few simple design rules. A good example layout is shown in Figure 5. LMZ22003 Pre-Biased Startup CCM and DCM Operating Modes VIN = 12V, VO = 3.3V, IO = 3A/0.3A 2 sec/div 30116825 30116812 DISCONTINUOUS CONDUCTION AND CONTINUOUS CONDUCTION MODES At light load the regulator will operate in discontinuous conduction mode (DCM). With load currents above the critical conduction point, it will operate in continuous conduction mode (CCM). In CCM, current flows through the inductor through the entire switching cycle and never falls to zero during the off-time. When operating in DCM, inductor current is maintained to an average value equaling Iout. Inductor current exhibits normal behavior for the emulated current mode control method used. Output voltage ripple typically increases during this mode of operation. Following is a comparison pair of waveforms of the showing both CCM (upper) and DCM operating modes. www.national.com The approximate formula for determining the DCM/CCM boundary is as follows: IDCBVO*(VIN-VO)/(2*3.3 H*fSW(CCM)*VIN) (13) The inductor internal to the module is 3.3 H. This value was chosen as a good balance between low and high input voltage applications. The main parameter affected by the inductor is the amplitude of the inductor ripple current (ILR). ILR can be calculated with: ILR P-P=VO*(VIN- VO)/(3.3H*fSW*VIN) (14) Where V IN is the maximum input voltage and fSW is typically 812 kHz. If the output current IO is determined by assuming that IO = IL, the higher and lower peak of ILR can be determined. 18 LMZ22003 Typical Application Schematic Diagram 30116807 FIGURE 4. TABLE 1. Typical Application Bill of Materials Ref Des Description Case Size Manufacturer Manufacturer P/N U1 SIMPLE SWITCHER (R) TO-PMOD-7 National Semiconductor LMZ22003TZ Cin1,5 0.047 F, 50V, X7R 1206 Yageo America CC1206KRX7R9BB473 Cin2,3 10 F, 50V, X7R 1210 Taiyo Yuden UMK325BJ106MM-T Cin6 (OPT) CAP, AL, 150F, 50V Radial G Panasonic EEE-FK1H151P CO1,6 0.047 F, 50V, X7R 1206 Yageo America CC1206KRX7R9BB473 CO2 (OPT) 100 F, 6.3V, X7R 1210 TDK C3225X5R0J107M CO5 220 F, 6.3V, SP-Cap (7343) Panasonic EEF-UE0J221LR RFBT 3.32 k 0805 Panasonic ERJ-6ENF3321V RFBB 1.07 k 0805 Panasonic ERJ-6ENF1071V RSN(OPT) 1.50 k 0805 Vishay Dale CRCW08051K50FKEA RENT 42.2 k 0805 Panasonic ERJ-6ENF4222V RENB 12.7 k 0805 Panasonic ERJ-6ENF1272V RFRA(OPT) 23.7 0805 Vishay Dale CRCW080523R7FKEA RENH 100 0805 Vishay Dale CRCW0805100RFKEA CSS 0.47 F, 10%, X7R, 16V 0805 AVX 0805YC474KAT2A D1(OPT) 5.1V, 0.5W SOD-123 Diodes Inc. MMSZ5231BS-7-F Table 1 19 www.national.com LMZ22003 30116816 FIGURE 5. Top View Evaluation Board - See AN-2085 30116817 FIGURE 6. Top View Demonstration Board - See AN-2125 www.national.com 20 LMZ22003 Physical Dimensions inches (millimeters) unless otherwise noted 7-Lead TZA Package NS Package Number TZA07A 21 www.national.com LMZ22003 3A SIMPLE SWITCHER(R) Power Module with 20V Maximum Input Voltage Notes For more National Semiconductor product information and proven design tools, visit the following Web sites at: www.national.com Products Design Support Amplifiers www.national.com/amplifiers WEBENCH(R) Tools www.national.com/webench Audio www.national.com/audio App Notes www.national.com/appnotes Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns Data Converters www.national.com/adc Samples www.national.com/samples Interface www.national.com/interface Eval Boards www.national.com/evalboards LVDS www.national.com/lvds Packaging www.national.com/packaging Power Management www.national.com/power Green Compliance www.national.com/quality/green Switching Regulators www.national.com/switchers Distributors www.national.com/contacts LDOs www.national.com/ldo Quality and Reliability www.national.com/quality LED Lighting www.national.com/led Feedback/Support www.national.com/feedback Voltage References www.national.com/vref Design Made Easy www.national.com/easy www.national.com/powerwise Applications & Markets www.national.com/solutions Mil/Aero www.national.com/milaero PowerWise(R) Solutions Serial Digital Interface (SDI) www.national.com/sdi Temperature Sensors www.national.com/tempsensors SolarMagicTM www.national.com/solarmagic PLL/VCO www.national.com/wireless www.national.com/training PowerWise(R) Design University THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION ("NATIONAL") PRODUCTS. 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