3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M™ MetPak™ 2-FB Power Socket
2 mm 4/5-Row, Right Angle, Solder or Press-Fit Tail MP2 Series
TS-1125-B
Sheet 3 of 4
Table 1
Pin Count No of Rows
08 4
10 5
Table 2 - Tail & Post Lengths
Contact-to-PC Board Tail
Termination Option No. Dim. “A” Dim. “B”
Solder Press-Fit*
S1 2.72 [0.107] 5.20 [0.205]
S2 3.53 [0.139] 6.00 [0.236]
M1 2.72 [0.107] 3.57 [0.141]
M2 P1 3.53 [0.139] 3.57 [0.141]
*Compliant-Pin Tail
Table 3 - Plating
Plating Suffix Press-Fit Tails* Solder Tails Plating Composition
TG (RIA E2 & C2 apply) RIA E3 & C2 apply
0.25 μm [10 μ”] Min. Au Contact Area
2.54 μm [100 μ”] Min. SnPb Tail Area
1.27 μm [50 μ”] Min. Ni all over
TG30 (RIA E2 & C2 apply) RIA E3 & C2 apply
0.76 μm [30 μ”] Min. Au Contact Area
2.54 μm [100 μ”] Min. SnPb Tail Area
1.27 μm [50 μ”] Min. Ni all over
TR30 (RIA E2 & C2 apply) RIA E3 & C2 apply
0.08 μm [3 μ”] Min. Au Contact Area
0.67 μm [27 μ”] Min. PdNi Contact Area
2.54 μm [100 μ”] Min. SnPb Tail Area
1.27 μm [50 μ”] Min. Ni all over
TR40B (RIA E2 & C2 apply) RIA E3 & C2 apply
0.13 μm [5 μ”] Min. Hard Au Contact Area, Lubricated
1.02 μm [40 μ”] Min. PdNi Contact Area
0.10 μm [4 μ”] Min. Pd Contact Area
2.54 μm [100 μ”] Min. SnPb Tail Area
1.27 μm [50 μ”] Min. Ni all over
FJ RIA E1 & C1 apply RIA E1 & C1 apply
0.25 μm [10 μ”] Min. Au Contact Area
5.08 μm [200 μ”] Min. Matt Whisker Mitigating Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
KR RIA E1 & C1 apply RIA E1 & C1 apply
0.76 μm [30 μ”] Min. Au Contact Area
5.08 μm [200 μ”] Min. Matt Whisker Mitigating Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
RF RIA E1 & C1 apply RIA E1 & C1 apply
1.27 μm [50 μ”] Min. Au Contact Area, Lubricated
5.08 μm [200 μ”] Min. Matt Whisker Mitigating Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
LR RIA E1 & C1 apply RIA E1 & C1 apply
0.08 μm [3 μ”] Min. Au Contact Area
0.67 μm [27 μ”] Min. PdNi Contact Area
5.08 μm [200 μ”] Min. Matt Whisker Mitigating Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
PD RIA E1 & C1 apply RIA E1 & C1 apply
0.13 μm [5 μ”] Min. Hard Au Contact Area, Lubricated
1.02 μm [40 μ”] Min. PdNi Contact Area
0.10 μm [4 μ”] Min. Pd Contact Area
5.08 μm [200 μ”] Min. Matt Whisker Mitigating Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
*Compliant-Pin Tail