CD74ACT245M96 - Texas Instruments

Data sheet acquired from Harris Semiconductor

SCHS245B

Features

• Buffered Inputs

• Typical Propagation Delay

- 4ns at VCC = 5V, TA = 25oC, CL = 50pF

• Exceeds 2kV ESD Protection per MIL-STD-883,

Method 3015

• SCR-Latchup-Resistant CMOS Process and Circuit

Design

• Speed of Bipolar FAST™/AS/S with Signiﬁcantly

Reduced Power Consumption

• Balanced Propagation Delays

• AC Types Feature 1.5V to 5.5V Operation and

Balanced Noise Immunity at 30% of the Supply

•±24mA Output Drive Current

- Fanout to 15 FAST™ ICs

- Drives 50Ω Transmission Lines

Description

The ’AC245 and ’ACT245 are octal-bus transceivers that

utilize Advanced CMOS Logic technology. They are non-

inverting three-state bidirectional transceiver-buffers

intended for two-way transmission from “A” bus to “B” bus or

“B” bus to “A”. The logic level present on the direction input

(DIR) determines the data direction. When the output enable

input (OE) is HIGH, the outputs are in the high-impedance

state.

Pinout

CD54AC245, CD54ACT245

(CERDIP)

CD74AC245, CD74ACT245

(PDIP, SOIC, SSOP)

TOP VIEW

Ordering Information

PART

NUMBER TEMP.

RANGE (oC) PACKAGE

CD54AC245F3A -55 to 125 20 Ld CERDIP

CD74AC245E -55 to 125 20 Ld PDIP

CD74AC245M -55 to 125 20 Ld SOIC

CD74AC245SM -55 to 125 20 Ld SSOP

CD54ACT245F3A -55 to 125 20 Ld CERDIP

CD74ACT245E -55 to 125 20 Ld PDIP

CD74ACT245M -55 to 125 20 Ld SOIC

CD74ACT245SM -55 to 125 20 Ld SSOP

NOTES:

1. When ordering, use the entire part number. Add the suffix 96 to

obtain the variant in the tape and reel.

2. Wafer and die for this part number is available which meets all

electrical specifications. Please contact your local TI sales office or

customer service for ordering information.

DIR

GND

VCC

September 1998 - Revised October 2000

CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.

FAST™ is a Trademark of Fairchild Semiconductor.

CD54/74AC245,

CD54/74ACT245

Octal-Bus Transceiver,

Three-State, Non-Inverting

[ /Title

(CD74

AC245

CD74

ACT24

/Sub-

ject

(Octal-

Bus

Trans-

ceiver,

Three-

State,

Non-

Invert-

ing)

/Autho

r ()

/Key-

words

(Har-

ris

Semi-

con-

ductor,

Advan

ced

CMOS

,Harris

Semi-

con-

Functional Diagram

TRUTH TABLE

CONTROL INPUTS

OPERATIONOE DIR

L L B Data to A Bus

L H A Data to B Bus

H X Isolation

H = High Level, L = Low Level, X = Irrelevant

To prevent excess currents in the High-Z (isolation) modes, all I/O

terminals should be terminated with 10kΩ to 1MΩ resistors.

2B0

DIR 1

CD54/74AC245, CD54/74ACT245

Absolute Maximum Ratings Thermal Information

DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 6V

DC Input Diode Current, IIK

For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA

DC Output Diode Current, IOK

For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA

DC Output Source or Sink Current per Output Pin, IO

For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA

DC VCC or Ground Current, ICC or IGND (Note 3) . . . . . . . . .±100mA

Operating Conditions

Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC

Supply Voltage Range, VCC (Note 4)

AC Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V

ACT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V

DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC

Input Rise and Fall Slew Rate, dt/dv

AC Types, 1.5V to 3V . . . . . . . . . . . . . . . . . . . . . . . . . 50ns (Max)

AC Types, 3.6V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . . 20ns (Max)

ACT Types, 4.5V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . 10ns (Max)

Thermal Resistance (Typical, Note 5) θJA (oC/W)

E Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

M Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

SM Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Maximum Junction Temperature (Plastic Package) . . . . . . . . . . 150oC

Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC

Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation

of the device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.

NOTES:

3. For up to 4 outputs per device, add ±25mA for each additional output.

4. Unless otherwise specified, all voltages are referenced to ground.

5. The package thermal impedance is calculated in accordance with JESD 51-7.

DC Electrical Speciﬁcations

PARAMETER SYMBOL

TEST

CONDITIONS VCC

(V)

25oC-40oC TO

85oC-55oC TO

125oC

UNITSVI(V) IO(mA) MIN MAX MIN MAX MIN MAX

AC TYPES

High Level Input Voltage VIH - - 1.5 1.2 - 1.2 - 1.2 - V

3 2.1 - 2.1 - 2.1 - V

5.5 3.85 - 3.85 - 3.85 - V

Low Level Input Voltage VIL - - 1.5 - 0.3 - 0.3 - 0.3 V

3 - 0.9 - 0.9 - 0.9 V

5.5 - 1.65 - 1.65 - 1.65 V

High Level Output Voltage VOH VIH or VIL -0.05 1.5 1.4 - 1.4 - 1.4 - V

-0.05 3 2.9 - 2.9 - 2.9 - V

-0.05 4.5 4.4 - 4.4 - 4.4 - V

-4 3 2.58 - 2.48 - 2.4 - V

-24 4.5 3.94 - 3.8 - 3.7 - V

-75

(Note 6, 7) 5.5 - - 3.85 - - - V

-50

(Note 6, 7) 5.5----3.85 - V

CD54/74AC245, CD54/74ACT245

Low Level Output Voltage VOL VIH or VIL 0.05 1.5 - 0.1 - 0.1 - 0.1 V

0.05 3 - 0.1 - 0.1 - 0.1 V

0.05 4.5 - 0.1 - 0.1 - 0.1 V

12 3 - 0.36 - 0.44 - 0.5 V

24 4.5 - 0.36 - 0.44 - 0.5 V

(Note 6, 7) 5.5 - - - 1.65 - - V

(Note 6, 7) 5.5-----1.65 V

Input Leakage Current IIVCC or

GND - 5.5 - ±0.1 - ±1-±1µA

Three-State Leakage

Current IOZ VIH or VIL

VO=V

or GND

- 5.5 - ±0.5 - ±5-±10 µA

Quiescent Supply Current

MSI ICC VCC or

GND 0 5.5 - 8 - 80 - 160 µA

ACT TYPES

High Level Input Voltage VIH - - 4.5 to

5.5 2-2-2-V

Low Level Input Voltage VIL - - 4.5 to

5.5 - 0.8 - 0.8 - 0.8 V

High Level Output Voltage VOH VIH or VIL -0.05 4.5 4.4 - 4.4 - 4.4 - V

-24 4.5 3.94 - 3.8 - 3.7 - V

-75

(Note 6, 7) 5.5 - - 3.85 - - - V

-50

(Note 6, 7) 5.5----3.85 - V

Low Level Output Voltage VOL VIH or VIL 0.05 4.5 - 0.1 - 0.1 - 0.1 V

24 4.5 - 0.36 - 0.44 - 0.5 V

(Note 6, 7) 5.5 - - - 1.65 - - V

(Note 6, 7) 5.5-----1.65 V

Input Leakage Current IIVCC or

GND - 5.5 - ±0.1 - ±1-±1µA

Three-State or Leakage

Current IOZ VIH or VIL

VO=V

or GND

- 5.5 - ±0.5 - ±5-±10 µA

Quiescent Supply Current

MSI ICC VCC or

GND 0 5.5 - 8 - 80 - 160 µA

AdditionalSupplyCurrentper

Input Pin TTL Inputs High

1 Unit Load

∆ICC VCC

-2.1 - 4.5 to

5.5 - 2.4 - 2.8 - 3 mA

NOTES:

6. Test one output at a time for a 1-second maximum duration. Measurement is made by forcing current and measuring voltage to minimize

power dissipation.

7. Test verifies a minimum 50Ω transmission-line-drive capability at 85oC, 75Ω at 125oC.

DC Electrical Speciﬁcations (Continued)

PARAMETER SYMBOL

TEST

CONDITIONS VCC

(V)

25oC-40oC TO

85oC-55oC TO

125oC

UNITSVI(V) IO(mA) MIN MAX MIN MAX MIN MAX

CD54/74AC245, CD54/74ACT245

ACT Input Load Table

INPUT UNIT LOAD

An, Bn 0.83

OE 0.64

DIR 0.25

NOTE: Unit load is ∆ICC limit specified in DC Electrical Specifications

Table, e.g., 2.4mA max at 25oC.

Switching Speciﬁcations Input tr, tf = 3ns, CL= 50pF (Worst Case)

PARAMETER SYMBOL VCC (V)

-40oC TO 85oC -55oC TO 125oC

UNITSMIN TYP MAX MIN TYP MAX

AC TYPES

Propagation Delay,

Data to Output tPLH, tPHL 1.5 - - 96 - - 106 ns

3.3

(Note 9) 3.2 - 10.8 3 - 11.9 ns

(Note 10) 2.2 - 7.7 2.1 - 8.5 ns

Propagation Delay,

Output Disable to Output tPLZ, tPHZ 1.5 - - 159 - - 175 ns

3.3 4.7 - 15.9 4.4 - 17.5 ns

5 3.7 - 12.7 3.5 - 14 ns

Propagation Delay,

Output Enable to Output tPZL, tPZH 1.5 - - 159 - - 175 ns

3.3 5.6 - 19 5.3 - 21 ns

5 3.7 - 12.7 3.5 - 14 ns

Minimum (Valley) VOH During

Switching of Other Outputs

(Output Under Test Not Switching)

VOHV

See Figure 1 5 - 4 at

25oC- - 4 at

25oC-V

Maximum (Peak) VOL During

Switching of Other Outputs

(Output Under Test Not Switching)

VOLP

See Figure 1 5 - 1 at

25oC- - 1 at

25oC-V

Three-State Output Capacitance CO- - 15 - - 15 - pF

Input Capacitance CI- - -10- -10pF

Power Dissipation Capacitance CPD

(Note 11) - - 57 - - 57 - pF

ACT TYPES

Propagation Delay,

Data to Output tPLH, tPHL 5

(Note 10) 2.7 - 9.1 2.5 - 10 ns

Propagation Delay,

Output Disable to Output tPLZ, tPHZ 5 3.7 12.7 3.5 14 ns

Propagation Delay,

Output Enable to Output tPZL, tPZH 5 3.8 13.1 3.6 14.4 ns

Minimum (Valley) VOH During

Switching of Other Outputs

(Output Under Test Not Switching)

VOHV

See Figure 1 5 - 4 at

25oC- - 4 at

25oC-V

Maximum (Peak) VOL During

Switching of Other Outputs

(Output Under Test Not Switching)

VOLP

See Figure 1 5 - 1 at

25oC- - 1 at

25oC-V

CD54/74AC245, CD54/74ACT245

Three-State Output Capacitance CO- - 15 - - 15 - pF

Input Capacitance CI- - -10- -10pF

Power Dissipation Capacitance CPD

(Note 11) - - 57 - - 57 - pF

NOTES:

8. Limits tested 100%

9. 3.3V Min is at 3.6V, Max is at 3V.

10. 5V Min is at 5.5V, Max is at 4.5V.

11. CPD is used to determine the dynamic power consumption per channel.

AC: PD = VCC2 fi(CPD + CL)

ACT: PD = VCC2 fi(CPD + CL) + VCC ∆ICC where fi = input frequency, CL = output load capacitance, VCC = supply voltage.

NOTES:

12. Input pulses have the follo wing char acteristics: PRR ≤ 1MHz, tr = 3ns, SKEW 1ns .

13. R.F. fixture with 700MHz design rules required. IC should be soldered into test board and bypassed with 0.1µF capacitor. Scope and

probes require 700MHz bandwidth.

FIGURE 1. SIMULTANEOUS SWITCHING TRANSIENT WAVEFORMS

Switching Speciﬁcations Input tr, tf = 3ns, CL= 50pF (Worst Case) (Continued)

PARAMETER SYMBOL VCC (V)

-40oC TO 85oC -55oC TO 125oC

UNITSMIN TYP MAX MIN TYP MAX

OTHER

OUTPUTS

OUTPUT

UNDER

TEST

VOH

VOL

VOHV

VOLP

VOL

VOH

CD54/74AC245, CD54/74ACT245

NOTE:

14. For AC Series only: When VCC = 1.5V, RL = 1kΩ.

FIGURE 2. THREE-STATE PROPAGATION DELAY TIMES AND TEST CIRCUIT

FIGURE 3. PROPAGATION DELAY TIMES

DUT WITH

THREE-

STATE

OTHER

INPUTS

TIED HIGH

OR LOW

OUTPUT

DISABLE

GND (tPHZ, tPZH)

OPEN (tPHL, tPLH)

OUTPUT RL

50pF

2 VCC (tPLZ, tPZL)

(OPEN DRAIN)

500Ω

500ΩOUT

INPUT LEVEL

90%

10%

GND

tr = 3ns

tPZL

0.2 VCC VOL (≠VCC)

0.8 VCC

OUTPUTS

ENABLED

OUTPUTS

DISABLED

OUTPUTS

ENABLED

tPLZ

tPHZ tPZH

OUTPUTS

DISABLED

tf = 3ns

OUTPUT:

LOW TO OFF

TO LOW

OUTPUT:

HIGH TO OFF

TO HIGH

(NOTE 14)

tr = 3ns

INPUT

LEVEL

GND

tPLH

tf = 3ns

90%

10%

tPHL

DUT

OUTPUT

RL (NOTE)

OUTPUT

LOAD

500Ω

50pF

NOTE: For AC Series Only: When VCC = 1.5V, RL = 1kΩ.

FIGURE 4. PROPAGATION DELAY TIMES

AC ACT

Input Level VCC 3V

Input Switching Voltage, VS0.5 VCC 1.5V

Output Switching Voltage, VS0.5 VCC 0.5 VCC

CD54/74AC245, CD54/74ACT245

PACKAGE OPTION ADDENDUM

www.ti.com 17-Aug-2012

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

CD54AC245F3A ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

CD54ACT245F3A ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type

CD74AC245E ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

CD74AC245EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

CD74AC245M ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74AC245M96 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74AC245M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74AC245M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74AC245ME4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74AC245MG4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74AC245SM96 ACTIVE SSOP DB 20 TBD Call TI Call TI

CD74AC245SM96E4 ACTIVE SSOP DB 20 TBD Call TI Call TI

CD74AC245SM96G4 ACTIVE SSOP DB 20 TBD Call TI Call TI

CD74ACT245E ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

CD74ACT245EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

CD74ACT245M ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74ACT245M96 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74ACT245M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74ACT245M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74ACT245ME4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74ACT245MG4 ACTIVE SOIC DW 20 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

PACKAGE OPTION ADDENDUM

www.ti.com 17-Aug-2012

Addendum-Page 2

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

CD74ACT245SM96 ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74ACT245SM96E4 ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74ACT245SM96G4 ACTIVE SSOP DB 20 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF CD54AC245, CD54ACT245, CD74AC245, CD74ACT245 :

•Catalog: CD74AC245, CD74ACT245

•Military: CD54AC245, CD54ACT245

PACKAGE OPTION ADDENDUM

www.ti.com 17-Aug-2012

Addendum-Page 3

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Military - QML certified for Military and Defense Applications

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

CD74AC245M96 SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1

CD74ACT245M96 SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1

CD74ACT245SM96 SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 17-Aug-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

CD74AC245M96 SOIC DW 20 2000 367.0 367.0 45.0

CD74ACT245M96 SOIC DW 20 2000 367.0 367.0 45.0

CD74ACT245SM96 SSOP DB 20 2000 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 17-Aug-2012

Pack Materials-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

4040065 /E 12/01

28 PINS SHOWN

Gage Plane

8,20

7,40

0,55

0,95

0,25

12,90

12,30

10,50

8,50

Seating Plane

9,907,90

10,50

9,90

0,38

5,60

5,00

0,22

2016

6,50

0,05 MIN

5,905,90

DIM

A MAX

A MIN

PINS **

2,00 MAX

6,90

7,50

0,65 M

0,15

0°–ā8°

0,10

0,09

0,25

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All

semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time

of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which

have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such

components to meet such requirements.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265