© Semiconductor Components Industries, LLC, 2008
May, 2008 − Rev. 10
1Publication Order Number:
NL27WZ07/D
NL27WZ07
Dual Buffer with Open Drain
Outputs
The NL27WZ07 is a high performance dual buffer with open drain
outputs operating from a 1.65 to 5.5 V supply.
The internal circuit is composed of multiple stages, including an open
drain output which provides the capability to set output switching level.
This allows the NL27WZ07 to be used to interface 5 V circuits to circuits
of any voltage between VCC and 7 V using an external resistor and power
supply.
Features
•Extremely High Speed: tPD 2.3 ns (typical) at VCC = 5 V
•Designed for 1.65 V to 5.5 V VCC Operation, CMOS compatible
•Over Voltage Tolerant Inputs
•LVTTL Compatible − Interface Capability with 5 V TTL Logic
with VCC = 3 V
•LVCMOS Compatible
•24 mA Output Sink Capability
•Near Zero Static Supply Current Substantially Reduces System
Power Requirements
•Chip Complexity: FET = 72; Equivalent Gate = 18
•Pb−Free Packages are Available
IN A2 OUT Y21
Figure 1. Pinout (Top View)
Figure 2. Logic Symbol
1OUT Y1IN A1
1
2
3
5
6
VCC
IN A1 OUT Y1
GND
IN A2 OUT Y24
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
SC−88
DF SUFFIX
CASE 419B
TSOP−6
DT SUFFIX
CASE 318G
PIN ASSIGNMENT
1
2
3IN A2
IN A1
GND
4
5V
CC
OUT Y2
OUT Y16
FUNCTION TABLE
L
H
A Input Y Output
L
Z
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1
6
M7 M G
G
1
M7 = Device Code
M = Date Code*
G= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
1M7 M G
G
M
1
NL27WZ07
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2
MAXIMUM RATINGS
Symbol Characteristics Value Unit
VCC DC Supply Voltage *0.5 to )7.0 V
VIDC Input Voltage *0.5 ≤ VI ≤ )7.0 V
VODC Output Voltage Output in Z or LOW State (Note 1) *0.5 ≤ VO ≤ 7.0 V
IIK DC Input Diode Current VI < GND *50 mA
IOK DC Output Diode Current VO < GND *50 mA
IODC Output Sink Current $50 mA
ICC DC Supply Current per Supply Pin $100 mA
IGND DC Ground Current per Ground Pin $100 mA
TSTG Storage Temperature Range *65 to )150 °C
PDPower Dissipation in Still Air SC−88, TSOP−6 200 mW
qJA Thermal Resistance SC−88, TSOP−6 333 °C/W
TLLead Temperature, 1 mm from case for 10 s 260 °C
TJJunction Temperature under Bias )150 °C
ILatchup Latchup Performance Above VCC and Below GND at 85°C (Note 5) $500 mA
MSL Moisture Sensitivity Level 1
FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
VESD ESD Classification Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
> 2000
> 200
N/A
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. IO absolute maximum rating must be observed.
2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.
3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC Supply Voltage Operating
Data Retention Only
1.65
1.5
5.5
5.5
V
VIInput Voltage 0 5.5 V
VOOutput Voltage (Z or LOW State) 0 5.5 V
TAOperating Free−Air Temperature −55 +125 °C
Dt/DVInput Transition Rise or Fall Rate VCC = 2.5 V $0.2 V
VCC =3.0 V $0.3 V
VCC =5.0 V $0.5 V
0
0
0
20
10
5
ns/V
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3
DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Condition
VCC
(V)
TA = 25°C−55°C ≤TA ≤ 125°C
Unit
Min Typ Max Min Max
VIH High−Level Input Voltage 1.65 to 1.95
2.3 to 5.5
0.75 VCC
0.75 VCC
0.75 VCC
0.75 VCC
V
VIL Low−Level Input Voltage 1.65 to 1.95
2.3 to 5.5
0.3 VCC
0.3 VCC
0.3 VCC
0.3 VCC
V
ILKG Z−State Output Leakage
Current
VIN = VIL
VOUT = VCC or GND
2.3 to 5.5 $5.0 $10.0 mA
VOL Low−Level Output Voltage
VIN = VIL
IOL = 100 mA1.65 to 5.5 0.0 0.1 0.1 V
IOL = 4 mA 1.65 0.08 0.24 0.24
IOL = 8 mA 2.3 0.20 0.3 0.3
IOL = 12 mA 2.7 0.22 0.4 0.4
IOL = 16 mA 3.0 0.28 0.4 0.4
IOL = 24 mA 3.0 0.38 0.55 0.55
IOL = 32 mA 4.5 0.42 0.55 0.55
IIN Input Leakage Current VIN or VOUT = VCC or
GND
0 to 5.5 $0.1 $1.0 mA
IOFF Power Off−Output
Leakage Current
VOUT = 5.5 V 0 1 10 mA
ICC Quiescent Supply Current VIN = VCC or GND 5.5 1 10 mA
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Symbol
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Parameter
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
Condition
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
VCC (V)
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
TA = 25°C
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
−55°C ≤TA ≤ 125°C
ÎÎ
ÎÎ
ÎÎ
Unit
Min
Typ
Max
ÎÎÎ
ÎÎÎ
Min
ÎÎÎÎ
ÎÎÎÎ
Max
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
tPZL
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Propagation Delay
(Figure 3 and 4)
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
RL = R1= 5000 W, CL = 15 pF
ÎÎÎÎ
ÎÎÎÎ
1.8 $0.15
1.8
5.3
11.5
ÎÎÎ
ÎÎÎ
1.8
ÎÎÎÎ
ÎÎÎÎ
12.0
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ns
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
RL = R1= 500 W, CL = 50 pF
ÎÎÎÎ
ÎÎÎÎ
2.5 $0.2
1.2
3.7
5.8
ÎÎÎ
ÎÎÎ
1.2
ÎÎÎÎ
ÎÎÎÎ
6.4
ÎÎÎÎ
ÎÎÎÎ
3.3 $0.3
0.8
2.9
4.4
ÎÎÎ
ÎÎÎ
0.8
ÎÎÎÎ
ÎÎÎÎ
4.8
ÎÎÎÎ
ÎÎÎÎ
5.0 $0.5
0.5
2.3
3.5
ÎÎÎ
ÎÎÎ
0.5
ÎÎÎÎ
ÎÎÎÎ
3.9
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
tPLZ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Propagation Delay
(Figure 3 and 4)
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
RL = R1= 5000 W, CL = 15 pF
ÎÎÎÎ
ÎÎÎÎ
1.8 $0.15
1.8
5.3
11.5
ÎÎÎ
ÎÎÎ
1.8
ÎÎÎÎ
ÎÎÎÎ
12.0
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ns
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
RL = R1= 500 W, CL = 50 pF
ÎÎÎÎ
ÎÎÎÎ
2.5 $0.2
1.2
2.8
5.8
ÎÎÎ
ÎÎÎ
1.2
ÎÎÎÎ
ÎÎÎÎ
6.4
ÎÎÎÎ
ÎÎÎÎ
3.3 $0.3
0.8
2.1
4.4
ÎÎÎ
ÎÎÎ
0.8
ÎÎÎÎ
ÎÎÎÎ
4.8
ÎÎÎÎ
ÎÎÎÎ
5.0 $0.5
0.5
1.4
3.5
ÎÎÎ
ÎÎÎ
0.5
ÎÎÎÎ
ÎÎÎÎ
3.9
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Unit
CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF
COUT Output Capacitance VCC = 5.5 V, VI = 0 V or VCC 4.0 pF
CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 4.0 pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ) ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin ) ICC VCC.
NL27WZ07
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4
Figure 3. Switching Waveforms
PULSE
GENERATOR
RT
DUT
VCC
RL
CL
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
50%
50% VCC
tPZL tPLZ
VCC
GND
HIGH
IMPEDANCE
VOL )0.3 V
A
Y
VCC 2
R1
ORDERING INFORMATION
Device Package Shipping†
NL27WZ07DFT2 SC−88 / SOT−363 / SC−70
3000 / Tape & Reel
NL27WZ07DFT2G SC−88 / SOT−363 / SC−70
(Pb−Free)
NL27WZ07DTT1 TSOP−6 / SOT−23 / SC−59
NL27WZ07DTT1G TSOP−6 / SOT−23 / SC−59
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NL27WZ07
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5
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
E0.2 (0.008) MM
123
D
e
A1
A
A3
C
L
654
−E−
b6 PL
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
DIM MIN NOM MAX
MILLIMETERS
A0.80 0.95 1.10
A1 0.00 0.05 0.10
A3
b0.10 0.21 0.30
C0.10 0.14 0.25
D1.80 2.00 2.20
0.031 0.037 0.043
0.000 0.002 0.004
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
MIN NOM MAX
INCHES
0.20 REF 0.008 REF
HE
HE
E1.15 1.25 1.35
e0.65 BSC
L0.10 0.20 0.30
2.00 2.10 2.20
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
ǒmm
inchesǓ
SCALE 20:1
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NL27WZ07
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6
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE T
23
456
D
1
e
b
E
A1
A
0.05 (0.002)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
c
L
0.95
0.037
1.9
0.075
0.95
0.037
ǒmm
inchesǓ
SCALE 10:1
1.0
0.039
2.4
0.094
0.7
0.028
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HE
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.90 1.00 1.10 0.035
INCHES
A1 0.01 0.06 0.10 0.001
b0.25 0.38 0.50 0.010
c0.10 0.18 0.26 0.004
D2.90 3.00 3.10 0.114
E1.30 1.50 1.70 0.051
e0.85 0.95 1.05 0.034
L0.20 0.40 0.60 0.008
0.039 0.043
0.002 0.004
0.014 0.020
0.007 0.010
0.118 0.122
0.059 0.067
0.037 0.041
0.016 0.024
NOM MAX
2.50 2.75 3.00 0.099 0.108 0.118
HE
− −
0°10°0°10°
q
q
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NL27WZ07/D
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