Ball Grid Array (BGA) Sockets 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 * Fax 401-823-8723 * Email info@advintcorp.com * Internet http://www.advintcorp.com BGA Sockets Standard Socket (S): * Mates with Standard Adapter (A) * Socket size same size as BGA device body * Use with SMT Adapter for LGA and reworked BGA device socketing Extraction Socket (SB): * Mates with Extraction Slot Adapter (AX) * Socket size equals BGA body + .079/(2.0) * Protects valuable PCB during device/adapter extraction - tool never touches PCB * Available in 1.0, 1.27 and 1.5mm pitch only Features: * Advanced(R) exclusive eutectic solder ball terminals offer superior SMT processing. * Uses same footprint as BGA device. * Proven long-term performance in vigorous temperature cycling applications - solder ball terminal absorbs TCE mismatch. * Closed bottom socket terminal for 100% anti-wicking of solder. * Gold contacts allow gold/gold interconnections to male Adapter pins. * Low insertion force socket with multifingered high reliability Beryllium Copper contacts. * Coplanarity consistently under .006 inch industry standard. * In-house Tape and Reel packaging available. * See page 4 for How It Works. Terminals and Contacts: Guide Post Socket (SG): * Integral molded corners allow accurate positioning of device/adapter assembly in blind-mating applications. * Mates with Extraction Slot Adapter (AX) * Socket size equals BGA body + .276/(7.00) * Available in 1.27 and 1.5mm pitch only Terminals: 1.27 & 1.5mm Pitch Terminals Type -636 Type -673 Solder Ball Thru-Hole Thru-Hole .117 (2.97) .117 (2.97) .105 (2.67) .105 (2.67) .095 (2.41) .024/(0.61) Dia. .018 Dia. (0.46) PATENTED .090 (2.29) .015 Dia. (0.38) PATENTED 0.80mm Pitch Terminals Type -731 Type -702 0.75mm Pitch Terminals Type -758 Thru-Hole Solder Ball .125 (3.18) Solder Ball .125 (3.18) PATENTED .090 (2.29) .125 (3.18) .128 (3.25) .030 Dia. (0.76) .125 (3.18) .080 (2.03) .020/(0.51) Dia. .018/(0.46) Dia. .011 Dia. (0.28) G - Gold over Nickel PATENTED How To Order Body Material: M - Molded High Temp. Glass Filled Thermoplastic (P.P.S.), U.L. Rated 94V-O, -60C to 260C (-76F to 500F) F - FR-4 Glass Epoxy, U.L. Rated 94V-O Solder: 63Sn/37Pb, Eutectic, 183C (361.4F) inch/(mm) Solder Ball STANDARD Terminals: Brass - Copper Alloy (C36000) ASTM-B-16 Contacts: Beryllium Copper - Copper Alloy (C17200), ASTM-B-194 Plating: 1.0mm Pitch Terminals Type -716 Type -717 1 M G S XXX -636 G Contact Plating G - Gold Footprint Dash# If Applicable Body Type M - Molded PPS (1.27 & 1.5mm pitch) F - FR-4 (0.75, 0.80 & 1.0mm pitch) Pitch B = .059/(1.5mm) G = .050/(1.27mm) H = .039/(1.0mm) J = .0315/(0.80mm) K = .0295/(0.75mm) G Terminal Plating G - Gold Terminal Type Number of Positions See BGA Footprint section or web site Model Type S = Standard Socket SB = Extraction Slot (1.5, 1.27 and 1.0mm pitch only) SG = Guide Post Socket (1.5 and 1.27mm pitch only) Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Page 5