Semiconductor Components Industries, LLC, 2011
October, 2011 Rev. 4
1Publication Order Number:
PACDN1404/D
PACDN1404
ESD Protection Arrays in
Chip Scale Package
Product Description
The PACDN1404 and PACDN1408 are 4 and 8channel transient
voltage suppressor arrays that provide a very high level of protection
for sensitive electronic components that may be subjected to ESD.
These devices are designed and characterized to safely dissipate
ESD strikes at levels well beyond the maximum requirements set forth
in the IEC 6100042 international standard (Level 4, 8 kV contact
discharge). All I/Os are rated at 25 kV using the IEC 6100042
contact discharge method. Using the MILSTD883D (Method 3015)
specification for Human Body Model (HBM) ESD, all pins are
protected for contact discharges to greater than 30 kV.
The Chip Scale Package format of these devices provide extremely
small footprints that are necessary in portable electronics such as
cellular phones, PDAs, internet appliances and PCs. The large solder
bumps allow for standard attachments to laminate boards without the
use of underfill. The PACDN1404 and PACDN1408 are packaged in
RoHScompliant, leadfree finishing.
Features
Four or Eight Transient Voltage Suppressors in a Single Package
InSystem Electrostatic Discharge (ESD) Protection to 25 kV
Contact Discharge per IEC 6100042 International Standard
Compact Chip Scale Package (CSP) in a 0.65 mm Pitch Format
Saves Board Space and Eases Layout in Space Critical
Applications Compared to Discrete Solutions and Traditional Wire
Bonded Packages
6 and 10Bump WLCSPs
These Devices are PbFree and are RoHS Compliant
Applications
ESD Protection for Sensitive Electronic Equipment
I/O Port, Keypad and Button Circuitry Protection for Portable
Devices
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Cameras and Camcorders
Notebooks
Desktop PCs
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WLCSP6
CG SUFFIX
CASE 567BD
WLCSP10
CG SUFFIX
CASE 567BM
MARKING DIAGRAM
D14
D14 = PACDN1404CG
DN1408 = PACDN1408CG
ELECTRICAL SCHEMATIC
A1 A3
PACDN1404
B1 B3
A2
B2
A2 A5
PACDN1408
B2 B5
A3
B3
A4
B4
A1
B1
Device Package Shipping
ORDERING INFORMATION
PACDN1404CG WLCSP6
(PbFree)
3500/Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
PACDN1408CG WLCSP10
(PbFree)
3500/Tape & Reel
DN1408
PACDN1404
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2
PACKAGE / PINOUT DIAGRAMS
Top View
(Bumps Down View)
PACDN1404
6Bump WLCSP Package
Orientation
Marking
AB1 B2 B3
A1 A2 A3
D14
+
B
123
Bottom View
(Bumps Up View)
Top View
(Bumps Down View)
PACDN1408
10Bump WLCSP Package
AB1 B2 B3
A1 A2 A3
DN1408
B
123
Bottom View
(Bumps Up View)
B4 B5
A4 A5
Orientation
Marking +
45
SPECIFICATIONS
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameter Rating Units
Storage Temperature Range 65 to +150 C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 2. STANDARD OPERATING CONDITIONS
Parameter Rating Units
Operating Temperature Range 40 to +85 C
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol Parameter Conditions Min Typ Max Units
VREV Reverse Standoff Voltage IDIODE = 10 mA5.5 V
ILEAK Leakage Current VIN = 3.3 V DC 100 nA
VSIG Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
5.6
1.2
6.8
0.8
8.0
0.4
V
VESD Insystem ESD Withstand Voltage
a) Human Body Model, MILSTD883,
Method 3015
b) Contact Discharge per
IEC 6100042 Level 4
(Note 2)
30
25
kV
VCL Clamping Voltage during ESD Discharge
MILSTD883 (Method 3015), 8 kV
Positive Transients
Negative Transients
(Note 2)
+12
8
V
CChannel Capacitance At 2.5 V DC, f = 1 MHz 39 47 pF
1. TA = 25C unless otherwise specified. GND in this document refers to the lower supply voltage.
2. ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground.
PACDN1404
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3
APPLICATION INFORMATION
Parameter Value
Pad Size on PCB 0.240 mm
Pad Shape Round
Pad Definition NonSolder Mask Defined Pads
Solder Mask Opening 0.290 mm Round
Solder Stencil Thickness 0.125 mm 0.150 mm
Solder Stencil Aperture Opening (Laser Cut, 5% Tapered Walls) 0.300 mm Round
Solder Flux Ratio 50/50 by Volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance Edge To Corner Ball 50 mm
Solder Ball Side Coplanarity 20 mm
Maximum Dwell Time Above Liquidous (183C) 60 seconds
Maximum Soldering Temperature for Leadfree Devices Using a Leadfree Solder Paste 260C
Figure 1. Recommended NonSolder Mask Defined Pad Illustration
NonSolder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 2. Leadfree (SnAgCu) Solder Ball Reflow Profile
200
250
150
100
50
0 1:00.0 2:00.0 3:00.0 4:00.0
Time (minutes)
Temperature (5C)
PACDN1404
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4
PACKAGE DIMENSIONS
WLCSP6, 1.80x1.15
CASE 567BD01
ISSUE O
SEATING
PLANE
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
2X DIM
A
MIN MAX
0.60
MILLIMETERS
A1
D1.80 BSC
E
b0.34 0.39
e0.65 BSC
0.69
È
È
D
E
AB
PIN A1
REFERENCE
e
A0.05 BC
0.03 C
0.05 C
6X b
123
B
A
0.05 C
A
A1
A2
C
0.23 0.29
1.15 BSC
0.05 C
2X TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
e
A2 0.38 REF
PITCH 0.25
6X
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.65
0.65
RECOMMENDED
A1 PACKAGE
OUTLINE
PITCH
PACDN1404
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5
PACKAGE DIMENSIONS
WLCSP10, 3.10x1.15
CASE 567BM01
ISSUE O
SEATING
PLANE
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
2X DIM
A
MIN MAX
0.60
MILLIMETERS
A1
D3.10 BSC
E
b0.34 0.39
e0.65 BSC
0.75
ÈÈ
ÈÈ
D
E
AB
PIN A1
REFERENCE
e
A0.05 BC
0.03 C
0.05 C
10X b
12 3
B
A
0.05 C
A
A1
A2
C
0.23 0.29
1.15 BSC
0.05 C
2X TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
e
A2 0.40 REF
PITCH 0.25
10X
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.65
0.65
RECOMMENDED
A1 PACKAGE
OUTLINE
PITCH
45
ÉÉÉÉÉÉÉÉ
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81358171050
PACDN1404/D
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