AUIRF1405ZS
AUIRF1405ZL
VDSS 55V
RDS(on) max. 4.9m
ID 150A
Features
Advanced Process Techn ology
Ultra Low On-Resistance
175°C Operating Temp erature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
Description
Specifically designed for Automotive applications, this
HEXFET® Power MOSFET utilizes the latest processing
techniques to achieve extremely low on-resistance per silicon
area. Additional features of this design are a 175°C junction
operating temperature, fast switching speed and improved
repetitive avalanche rating . These features combine to make
this design an extremely efficient and reliable device for use in
Automotive applications and a wide variety of other
applications.
1 2015-11-11
HEXFET® is a registered trademark of Infineon.
*Qualification standards can be found at www.infineon.com
AUTOMOTIVE GRADE
Symbol Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 150 A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 110
IDM Pulsed Drain Current 600
PD @TC = 25°C Maximum Power Dissipation 230 W
Linear Derating Factor 1.5 W/°C
VGS Gate-to-Source Voltage ± 20 V
EAS Single Pulse Avalanche Energy (Thermally Limited) 270
mJ
EAS (tested) Single Pulse Avalanche Energy Tested Value 420
IAR Avalanche Current See Fig.15,16, 12a, 12b A
EAR Repetitive Avalanche Energy mJ
TJ Operating Junction and -55 to + 175
TSTG Storage Temperature Range °C
Soldering Temperature, for 10 seconds (1.6mm from case) 300
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only; and functional operation of the device at these or any other condition beyond thos e indicated in the specifications is not
implied. Exposure to absolute-maximum-rated conditions for extended peri ods may affect device reliabilit y. The thermal resistance
and power dissipation ratin gs are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless
otherwise specified.
Thermal Resistance
Symbol Parameter Typ. Max. Units
RJC Junction-to-Case ––– 0.65 °C/W
RJA Junction-to-Ambient ( PCB Mount, steady state) 40
D2Pak
AUIRF1405ZS TO-262
AUIRF1405ZL
S
D
G
S
D
G
D
Base part number Package Type Standard Pack
Form Quantity
AUIRF1405ZL TO-262 Tube 50 AUIRF1405ZL
AUIRF1405ZS D2-Pak Tube 50 AUIRF1405ZS
Tape and Reel Left 800 AUIRF1405ZSTRL
Orderable Part Number
G D S
Gate Drain Source
HEXFET® Power MOSFET
AUIRF1405ZS/L
2 2015-11-11
Notes:
Repetitive rating; pulse width limited by max. junction temperature. (See fig. 11)
Limited by TJmax, starting TJ = 25°C, L = 0.10mH, RG = 25, IAS = 75A, VGS =10V. Part not recommended for use above this value.
Pulse width 1.0ms; dut y cycle 2%.
C
oss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS.
Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical repetitive avalanche performance.
This value determined from sample failure population, starting TJ = 25°C, L = 0.10mH, RG = 25, IAS = 75A, VGS =10V.
This is applied to D2Pak When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and
soldering techniques refer to application note #AN-994
Static @ TJ = 25°C (unless otherwise specifie d)
Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage 55 ––– ––– V VGS = 0V, ID = 250µA
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient ––– 0.049 ––– V/°C Reference to 25°C, ID = 1mA
RDS(on) Static Drain-to-Source On-Resistance ––– 3.7 4.9 m VGS = 10V, ID = 75A
VGS(th) Gate Threshold Voltage 2.0 ––– 4.0 V VDS = VGS, ID = 250µA
gfs Forward Trans conductance 88 ––– ––– S VDS = 25V, ID = 75A
IDSS Drain-to-Source Leakage Current ––– ––– 20 µA VDS = 55 V, VGS = 0V
––– ––– 250 VDS = 55V,VGS = 0V,TJ =125°C
IGSS Gate-to-Source Forward Leakage ––– ––– 200 nA VGS = 20V
Gate-to-Source Reverse Leakage ––– ––– -200 VGS = -20V
Dynamic Electrical Characte ristics @ TJ = 25°C (unless otherwise specified)
Qg Total Gate Charge ––– 120 180 nC
ID = 75A
Qgs Gate-to-Source Charge ––– 31 ––– VDS = 44V
Qgd Gate-to-Drain Charge ––– 46 ––– VGS = 10V
td(on) Turn-On Delay Time ––– 18 –––
ns
VDD = 25V
tr Rise Time ––– 110 ––– ID = 75A
td(off) Turn-Off Delay Time ––– 48 ––– RG= 4.4
tf Fall Time ––– 82 ––– VGS = 10V
LD Internal Drain Inductance ––– 4.5 ––– nH
Between lead,
6mm (0.25in.)
LS Internal Source Inductance ––– 7.5 ––– from package
and center of die contact
Ciss Input Capacitance ––– 4780 –––
pF
VGS = 0V
Coss Output Capacitance ––– 770 ––– VDS = 25V
Crss Reverse Transfer Capacitance ––– 410 ––– ƒ = 1.0MHz
Coss Output Capacitance ––– 2730 ––– VGS = 0V, VDS = 1.0V ƒ = 1.0MHz
Coss Output Capacitance ––– 600 ––– VGS = 0V, VDS = 44V ƒ = 1.0MHz
Coss eff. Effective Output Capacitance ––– 910 ––– VGS = 0V, VDS = 0V to 44V
Diode Characteristics
Parameter Min. Typ. Max. Units Conditions
IS Continuous Source Current ––– ––– 75 A
MOSFET symbol
(Body Diode) showing the
ISM Pulsed Source Current ––– ––– 600 integral reverse
(Body Diode) p-n junction diode.
VSD Diode Forward Voltage ––– ––– 1.3 V TJ = 25°C,IS = 75A,VGS = 0V
trr Reverse Recovery Time ––– 30 46 ns TJ = 25°C ,IF = 75A, VDD = 25V
Qrr Reverse Recovery Charge ––– 30 45 nC di/dt = 100A/µs
ton Forward Turn-On Time Intrinsic turn-on time is negligible (turn -on is dominated by LS+LD)
AUIRF1405ZS/L
3 2015-11-11
Fig. 2 Typical Output Characteristics
Fig. 3 Typical Transfer Characteri stics Fig. 4 Typical Forward T rans conductance
vs. Drain Current
Fig. 1 Typical Output Characteristics
0.1 110 100
VDS, Drain-to-Source Voltage (V)
1
10
100
1000
ID, Drain-to-Source Current (A)
4.5V
20µs PULSE WIDTH
Tj = 25°C
VGS
TOP 15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
0.1 110 100
VDS, Drain-to-Source Voltage (V)
1
10
100
1000
ID, Drain-to-Source Current (A)
4.5V
20µs PULSE WIDTH
Tj = 175°C
VGS
TOP 15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
4 6 8 10 12
VGS, Gate-to-Source Voltage (V)
1
10
100
1000
ID, Drain-to-Source Current )
TJ = 25°C
TJ = 150°C
VDS = 25V
20µs PULSE WIDTH
0 25 50 75 100 125 150 175 200
ID,Drain-to-Source Current (A)
0
25
50
75
100
125
150
175
200
Gfs, Forward Transconductance (S)
TJ = 25°C
TJ = 175°C
AUIRF1405ZS/L
4 2015-11-11
Fig 5. Typical Capacita nce vs.
Drain-to-Source Voltage Fig 6. Typical Gate Charge vs.
Gate-to-Source Voltage
Fig 8. Maximum Safe Operating Area
Fig. 7 Typical Source-to-Drain Diode
Forward Voltage
110 100
VDS, Drain-to-Source Voltage (V)
100
1000
10000
100000
C, Capacitance(pF)
VGS = 0V, f = 1 MHZ
Ciss = Cgs + Cgd, C ds SHORTED
Crss = Cgd
Coss = Cds + Cgd
Coss
Crss
Ciss
0 20 40 60 80 100 120
QG Total Gate Charge (nC)
0.0
2.0
4.0
6.0
8.0
10.0
12.0
VGS, Gate-to-Source Voltage (V)
VDS= 44V
VDS= 28V
ID= 75A
0.0 0.5 1.0 1.5 2.0 2.5
VSD, Source-to-Drain Voltage (V)
0.10
1.00
10.00
100.00
1000.00
ISD, Reverse Drain Current (A)
TJ = 25°C
TJ = 175°C
VGS = 0V
1 10 100 1000
VDS, Drain-to-Source Voltage (V)
1
10
100
1000
10000
ID, Drain-to-Source Current (A)
1msec
10msec
OPERATION IN THIS AREA
LIMITED BY R DS(on)
100µsec
Tc = 25°C
Tj = 175°C
Single Pulse
AUIRF1405ZS/L
5 2015-11-11
Fig 10. Normalized On-Resistance
vs. Temperature
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig 9. Maximum Drain Current vs. Case Temperature
25 50 75 100 125 150 175
TC , Case Temperature (°C)
0
25
50
75
100
125
150
ID, Drain Current (A)
-60 -40 -20 020 40 60 80 100 120 140 160 180
TJ , Junction Temperature (°C)
0.5
1.0
1.5
2.0
2.5
RDS(on) , Drain-to-Source On Resistance
(Normalized)
ID = 75A
VGS = 10V
1E-006 1E-005 0.0001 0.001 0.01 0.1 110
t1 , Rectangular Pulse Duration (sec)
0.001
0.01
0.1
1
Thermal Response ( Z thJC )
0.20
0.10
D = 0.50
0.02
0.01
0.05
SINGLE PULSE
( THERMAL RESPONSE ) Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
AUIRF1405ZS/L
6 2015-11-11
Fig 14. Threshold Voltage vs. Temperature
Fig 12c. Maximum Avalanche Energy
vs. Drain Current
Fig 12a. Unclamped Inductive Test Circuit
Fig 12b. Unclamped Inductive Waveforms
R
G
I
AS
0.01
t
p
D.U.T
L
VDS
+
-V
DD
DRIVER
A
15V
20V
tp
V
(BR)DSS
I
AS
Fig 13b. Gate Charge Test Circuit
Fig 13a. Gate Charge Waveform
Vds
Vgs
Id
Vgs(th)
Qgs1 Qgs2 Qgd Qgodr
25 50 75 100 125 150 175
Starting TJ , Junction Temperature (°C)
0
100
200
300
400
500
EAS , Single Pulse Avalanche Energy (mJ)
ID
TOP 31A
53A
BOTTOM 75A
-75 -50 -25 025 50 75 100 125 150 175 200
TJ , Temperature ( °C )
1.0
1.5
2.0
2.5
3.0
3.5
4.0
VGS(th) Gate threshold Voltage (V)
ID = 250µA
AUIRF1405ZS/L
7 2015-11-11
Fig 15. Typical Avalanche Current vs. Pulse width
Notes on Repetiti ve Avalanche Cur ves , Figures 15, 16:
(For further info, see AN-1005 at www.infineon.com)
1. Avalanche failures assumption:
Purely a thermal phenomenon and failure occurs at a temperature far in
excess of Tjmax. This is validated for every part type.
2. Safe operation in Avalanche is allowed as long as Tjmax is not exceeded.
3. Equation below based on circuit and waveforms shown in Figures 12a, 12b.
4. PD (ave) = Average power dissipation per single avalanche pulse.
5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase
during avalanche).
6. Iav = Allowable avalanche current.
7. T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as
25°C in Figure 15, 16).
t
av = Average time in avalanche.
D = Duty cycle in avalanche = tav ·f
Z
thJC(D, tav) = Transient thermal resistance, see Figures 13)
PD (ave) = 1/2 ( 1.3·BV·Iav) = T/ ZthJC
Iav = 2T/ [1.3·BV·Zth]
EAS (AR) = PD (ave)·tav
Fig 16. Maximum Avalanche Energy
vs. Temperature
1.0E-08 1.0E-07 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01
tav (sec)
1
10
100
1000
10000
Avalanche Current (A)
0.05
Duty Cycle = Single Pulse
0.10
Allowed avalanche Current vs
avalanche pulsewidth, tav
assuming Tj = 25°C due to
avalanche losses
0.01
25 50 75 100 125 150 175
Starting T J , Junction Temperature (°C)
0
50
100
150
200
250
300
EAR , Avalanche Energy (mJ)
TOP Single Pulse
BOTTOM 10% Duty Cyc le
ID = 75A
AUIRF1405ZS/L
8 2015-11-11
Fig 17. Peak Diode Recov ery dv/dt Test Circuit for N-Channel HEXFET® Power MOSFETs
Fig 18a. Switching Time Test Circuit
Fig 18b. Switching Time Waveforms
AUIRF1405ZS/L
9 2015-11-11
D2Pak (TO-263AB) Package Outline (Dimensions are shown in millimeters (inches))
YWWA
XX XX
Date Code
Y= Year
WW= Work Week
AUIRF1405ZS
Lot Code
Part Number
IR Logo
D2Pak (TO-263AB) Part Marking Info rmation
AUIRF1405ZS/L
10 2015-11-11
TO-262 Part Marking Information
YWWA
XX XX
Date Code
Y= Year
WW= Work Week
AUIRF1405ZL
Lot Code
Part Number
IR Logo
TO-262 Package Outline (Dimensions are shown in millimeters (inches)
AUIRF1405ZS/L
11 2015-11-11
D2Pak (TO-263AB) Tape & Reel Information (Dimensions are shown in millimeters (inches))
3
4
4
TRR
FEED DIRECT ION
1.85 (.073)
1.65 (.065)
1.60 (.063)
1.50 (.059)
4.10 (.161)
3.90 (.153)
TRL
FEED DIRECTION
10.90 (.429)
10.70 (.421) 16.10 (.634)
15.90 (.626)
1.75 (.069)
1.25 (.049)
11.60 (.457)
11.40 (.449) 15.42 (.609)
15.22 (.601)
4.72 (.136)
4.52 (.178)
24.30 (.957)
23.90 (.941)
0.368 (.0145)
0.342 (.0135)
1.60 (.063)
1.50 (.059)
13.50 (.532)
12.80 (.504)
330.00
(14.173)
MAX.
27.40 (1.079)
23.90 (.941)
60.00 (2.362)
MIN.
30.40 (1. 197 )
MAX.
26.40 (1.039)
24.40 (.961)
NOTES :
1. COMFORMS TO EIA-418.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION MEASURED @ HUB.
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.
AUIRF1405ZS/L
12 2015-11-11
Qualification Information
Qualification Level
Automotive
(per AEC-Q101)
Comments: This part number(s) passed Automotive qualification. Infineon’s
Industrial and Consumer qualification level is granted by extension of the higher
Automotive level.
Moisture Sensitivity Level TO-262 MSL1
D2-Pak
ESD
Machine Model Class M4 (+/-425)†
AEC-Q101-002
Human Body Model Class H1C (+/-2000V) †
AEC-Q101-001
Charged Device Model Class C5 (+/-1125V)†
AEC-Q101-005
RoHS Compliant Yes
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2015
All Rights Reserved.
IMPORTANT NOTICE
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics
(“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated herein and/or any
information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third
party.
In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this
document and any applicable legal requirements, norms and standards concerning customer’s products and any use of
the product of Infineon Technologies in customer’s applications.
The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of
customer’s technical departments to evaluate the suitability of the product for the intended application and the
completeness of the product information given in this document with respect to such application.
For further information on the product, technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies office (www.infineon.com).
WARNINGS
Due to technical requirements products may contain dangerous substances. For information on the types in question
please contact your nearest Infineon Technologies office.
Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized
representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a
failure of the product or any consequences of the use thereof can reasonably be expected to result in pe rsonal injury.
Revision History
Date Comments
11/11/2015 Updated datasheet with corporate template
Corrected ordering table on page 1.
† Highest passing voltage.
