SPWF04SA, SPWF04SC Datasheet Standalone and Serial-to-Wi-Fi b/g/n intelligent modules Features * * 2.4 GHz IEEE 802.11 b/g/n transceiver High performance STM32F439 ARM(R) Cortex(R)-M4 256 kB SRAM 2 MB embedded high-speed Flash memory 1 MB Flash memory for user storage, extendable via SD/MMC interface or external SPI Flash Integrated TCP/IP protocol stack - 8 simultaneous TCP or UDP clients and 2 socket servers (supporting up to 8 clients each) - Secured socket and upper layers (i.e. HTTPS) supporting up to TLS 1.2, including X.509 Certificates, AES (128, 256), hash (MD5, SHA-1, SHA-256, SHA-384) and public key algorithms for key exchange (RSA, DH, ECDH) and digital signature (RSA, ECDSA). Web server supporting SSI Open, WEP, WPA2 PSK, WPA2 enterprise WPS for station System modes: station, IBSS, and miniAP (supporting up to 5 stations) miniAP easily provisioned (SSID, PWD) Fast Wi-Fi re-association after reset Secure Firmware and FileSystem updates Over-The-Air (OTA) TX power - 18.3 dBm @ 1 Mbps DSSS - 13.7 dBm @ 54 Mbps OFDM RX sensitivity - -96.0 dBm @ 1 Mbps DSSS - -74.5 dBm @ 54 Mbps OFDM 21 configurable GPIOs available UART and SPI interface to host system Advanced low-power modes - Standby with RTC: 43 A - Sleep = 3 mA - Idle connected (DTIM=1) = 5 mA - RX traffic 105 mA typical - TX traffic 260 mA typical @ 10 dBm AT command set interface through UART SPI interface with simple protocol Application subsystem - Embedded real-time MicroPython environment for customer applications and on-board development - MicroPython API library for easy access to Wi-Fi subsystem capabilities and device peripherals (i.e. UART, SPI, IC) Small form factor: 26.92 x 15.24 x 2.35 mm - - - - * Product status link * * * * * * * * SPWF04SA, SPWF04SC * * * * * * * * DS11839 - Rev 6 - October 2018 For further information contact your local STMicroelectronics sales office. www.st.com SPWF04SA, SPWF04SC * * * * * Single voltage supply (3.3 V typical) Antenna options: integrated antenna/U.FL connector Industrial temperature range: -40 C to 85 C FCC/CE/IC certified RoHS compliant Applications * * * * * * * DS11839 - Rev 6 Smart appliances Industrial control and data acquisition Home automation and security systems Wireless sensors Cable replacement Medical equipment Machine-to-machine communication page 2/27 SPWF04SA, SPWF04SC Description 1 Description The SPWF04SA and the SPWF04SC are ready-to-use Wi-Fi modules conceived for Internet of Things (IoT) applications. These modules integrate a Cortex-M4-based STM32 microcontroller and a powerful Wi-Fi transceiver, compliant with IEEE 802.11 b/g/n standard for the 2.4 GHz band. The modules are cloud compatible thanks to the complete protocol package, which includes application and security layers. They can operate in serial-to-Wi-Fi and standalone mode, with customer applications developed in the subsystem based on the MicroPython environment. The modules are configured around a single-chip 802.11 transceiver with integrated PA and comprehensive power management subsystem, and an STM32F4 microcontroller with UART/SPI interface and an extensive GPIO suite; they also incorporate timing clocks and a voltage regulator. The SPWF04SA module is configured with a highly-efficient, embedded micro 2.4 GHz ISM band antenna, or with an external U.FL antenna connector (SPWF04SC); both are certified FCC/IC and CE. With low power consumption and an ultra-compact (2.7 x 1.5 cm) footprint, the modules are ideal for fixed and mobile wireless applications, as well as challenging battery-operated applications. The SPWF04Sx parts are released with an integrated full featured TCP/IP protocol stack with added web server and additional application service capabilities, including REST API for accessing files on servers in the cloud and support for dynamic web pages with SSI functions to easily interact with the module and the host processor over the air. Application note AN4965 on www.st.com provides details on HTTP server capabilities. Multiple higher level protocols over TCP are supported by the module including: HTTP, MQTT, SMTP, and WebSockets to easily connect application to the cloud. Multiple protocols supported over UDP include: TFTP, SNTP and mDNS; the module also includes IPv6 networking capabilities. The SW package also has an AT command layer interface for user-friendly access to the stack functionalities via the UART serial port and an SPI interface supporting master and slave messages from and to the host processor respectively (see user manual UM2114 on www.st.com). The SPWF04Sx includes a MicroPython scripting engine to enable simple and fast custom application development on the module MCU: no external MCU is needed and the customer application runs directly on the module. The interpreter implementation is fully compatible with the standard MicroPython version 1.6. In standalone mode, MicroPython use Wi-Fi interfaces and MCU peripherals such as UART, SPI, I2C, GPIOs via standard MicroPython APIs (see application note AN4964 on www.st.com). 1 MB of the internal Flash is dedicated to store the user file system while a hardware interface allows the usage of an external memory via SPI/SDIO (Serial Flash/SD Card) to further extend the file system storage capabilities. The module supports WPA2-Personal and WPA2-Enterprise security and WPS (Wi-Fi protected setup). For secure end-to-end communication with the cloud, an SSL/TLS stack is embedded in every module, with no licensing charge. See application note AN4963 on www.st.com for details on security. The module firmware may be updated at any time via UART and over-the-air (FOTA); the FOTA operation can be performed with different level of security, as described in AN4963. ST may update the module firmware at any time; check regularly for documentation and firmware updates on www.st.com/wifimodules. DS11839 - Rev 6 page 3/27 SPWF04SA, SPWF04SC Schematic diagram 2 Schematic diagram Figure 1. SPWF04S block diagram 3.3 V UART/SPI GPIOs/Peripherals Ext. Serial Memory Boot0 Reset DS11839 - Rev 6 STM32F4 120 MHZ Flash: 2 MB RAM: 256 kB A CW1100 b/g/n Integrated PA Tx /Rx Switch Filter C 38 MHz page 4/27 SPWF04SA, SPWF04SC General electrical specifications 3 General electrical specifications Table 1. Absolute maximum ratings Rating Min. Typ. Max. Unit Voltage supply -0.3 - 4.0 V Vin for 5 V tolerant pins -0.3 - 5.5 V Vin for all other pins -0.3 - 3.6 V Storage temperature range -55 - 105 C Table 2. Operating conditions and input power specifications Parameter Test conditions Min. Operating temperature range Industrial -40 Input supply voltage 3.3 V supply input 3.1 Standby Both the STM32 and the radio are in standby power states 43 A Sleep The STM32 is in stop power state and the radio is in sleep power state 3 mA Low power state The STM32 is active and the radio is in sleep power state 33 mA 1 Mbps DSSS 360 mA 6 Mbps 350 mA 54 Mbps 290 mA MCS0 350 mA MCS7 280 mA 802.11b 105 mA 802.11g 105 mA 802.11n 105 mA 802.11b 3.3 V supply TX (@ max power) 802.11g 802.11n RX Typ. 3.3 Max. Unit 85 C 3.6 V Note: Measure preformed at Ta = 25 C, VDD = 3.3 V on channel 1. DS11839 - Rev 6 page 5/27 SPWF04SA, SPWF04SC Digital interface specifications 4 Digital interface specifications Table 3. Digital interface specifications, I/O pins Parameter Inputs Outputs DS11839 - Rev 6 Test conditions Min. VIH 2.3 VIL 0 VOH IOH=4 mA 2.4 VOL IOL=4 mA 0 Typ. - Max. Unit 3.6 V 0.9 V 3.6 V 0.4 V page 6/27 SPWF04SA, SPWF04SC RF characteristics 5 RF characteristics Table 4. RF characteristics Parameter RX sensitivity (1) Test conditions Value Unit 11b, 1 Mbps -96 dBm 11b, 2 Mbps -93 dBm 11b, 5.5 Mbps -91 dBm 11b, 11 Mbps -87 dBm 11g, 9 Mbps -89.5 dBm 11g, 18 Mbps -86 dBm 11g, 36 Mbps -80 dBm 11g, 54 Mbps -74.5 dBm 11n, MCS1, 13 Mbps -86.5 dBm 11n, MCS3, 26 Mbps -81.5 dBm 11n, MCS5, 52 Mbps -74 dBm 11n, MCS7, 65 Mbps -71 dBm Channel-to-channel desensitivity CH1 to 14 11g, 54 Mbps, 10%PER 1 dB Maximum input signal CH7 11g, 54 Mbps -20 dBm 11 Mbps 38 dBc 9 Mbps 20 dBc 54 Mbps 4 dBc MCS1 24 dBc MCS7 3 dBc 18.3 dBm 18.3 dBm @ 11g spectral mask 18.3 dBm 11g, 54 Mbps EVM = -27 dB, 4.5% 13.7 dBm 11n, MCS0 @ 11n spectral mask 18.3 dBm 11n, MCS7 EVM = -27 dB 13.5 dBm Average -1.2 dBi Adjacent channel rejection 11b, 1 Mbps 11b, 11 Mbps Max TX output power (1) On-board antenna gain 11g, 9 Mbps @ 11b spectral mask 1. Output power and sensitivities are measured with a 50 connection at the antenna port. DS11839 - Rev 6 page 7/27 SPWF04SA, SPWF04SC Pinout description 6 Pinout description Table 5. Pinout description Signal name Type Pin number Function Notes GPIOs - general purpose input/output GPIO[0] - GPIO[18] I/O See for corresponding pin numbers, main and alternate functionsSection 6 RXD/MOSI I 8 5 V tolerant TXD/MISO O 6 5 V tolerant CTS/nCS I 9 Active low, 5 V tolerant RTS/CLK O 10 5 V tolerant I 3 Reset input I 2 Boot loader (3) Host interface Reset (1) (2) RESETn Active low for 5 ms with pull-up to 3.3 VDC. Not 5 V tolerant Bootloader BOOT0 External memory interface (4) SDIO CLK / SPI CLK 31 SDIO D0 / SPI MISO 32 SDIO CMD / SPI MOSI 33 Other pins VCC (3.3 V) 24 Voltage supply Ground 23 Ground Ground Paddle 25 Ground GPIO19 / LSE (5) 34 HSE(5) 35 GPIO20 / SWD I/O 26 SWD CLK 29 Decouple with 10 F capacitor Add plenty of Ground vias for thermal dissipation and ground 1. See Section 6 Pinout description for a UART and SPI selection modes and interface details. 2. In order to recover from unexpected behavior, the HOST processor, when connected, could conveniently control the RESETn pin of the module. 3. To enable the firmware download, pin BOOT0 needs to be high during power-up. RESETn needs to be pulled low at least 5 ms to initiate the firmware download sequence. 4. Automatic detection via the configuration variable ext_volume. 5. Reserved for future usage. Table 6. GPIOs main and alternate functions Alternate function Signal name Pin n GPIO[0] DS11839 - Rev 6 16 Main function (1) General Purpose input/ output System function (2) Peripheral driver (3) Restore to factory setting (5) ADC MicroPython Interfaces (4) Electrical notes Input pull-down and 5 V tolerant page 8/27 SPWF04SA, SPWF04SC Pinout description Alternate function Signal name Pin n Main function (1) System function (2) Peripheral driver (3) GPIO[1] 17 General purpose input/ output ADC GPIO[2] 19 General purpose input/ output PWM GPIO[3] 1 General purpose input/ output GPIO[4] 18 General purpose input/ output GPIO[5] 20 General purpose input/ output GPIO[6] 22 General purpose input/ output Wake-up sleep inhibit (6) GPIO[7] 13 MiniAP: general purpose input/output; STA: WPS PushButton STA/MiniAP switch (startup) (7) GPIO[8] 4 General purpose input/ output MicroPython selection mode (8) GPIO[9] 7 General purpose input/ output MicroPython Interfaces (4) Electrical notes Input pull-down and 5 V tolerant TX UART Ext memory: SPI_nCS Floating and 5 V tolerant Input pull down and 5 V tolerant PWM I2C SDA I2C SCL Input pull-down and 5 V tolerant RTS UART SPI HOST interface: SPI nHostInterrupt (9) LED drive: module running (10) GPIO[10] 5 General purpose input/ output GPIO[11] 11 General purpose input/ output RX UART GPIO[12] 12 General purpose input/ output CTS UART GPIO[13] 15 LED drive: Wi-Fi link-up MISO SPI GPIO[14] 14 LED Drive: power-up MOSI SPI GPIO[15] 21 General purpose input/ output DAC GPIO[16] 27 General Purpose input/ output ADC GPIO[17] 28 General purpose input/ output GPIO[18] 30 General purpose input/ output SCK SPI 1. Main function is set at the module initialization when "factory" configuration is used. The GPIOs are all set as input pulldown with the exception of GPIO7 that is set as input pull-up. 2. Alternate System Functions are activated when the related pin is connected or when the command/specific configuration is used. 3. Alternate Peripheral Drivers are activated when the corresponding peripheral command is used. 4. Alternate MicroPython Functions are activated when the related class is initialized. 5. To perform the restore of the factory variable set, the pin GPIO0 must be high during power-up. 6. This alternate function is running when low power mode variable is enabled. Ext. RC is suggested in order to stabilize the signal. The value is high to wakeup the module. 7. To enable the STA or MiniAP switch, the GPIO[7] needs to be low together with the HW reset. GPIO7 is set by default as input pull-up. WPS push button function is enabled if this pin is set to low during active phase. 8. When this GPIO is high at the start-up the module enters the MicroPython mode. 9. To select the SPI as host interface, this GPIO must be driven high at the reset time. DS11839 - Rev 6 page 9/27 SPWF04SA, SPWF04SC Pinout description 10. Selected by using the configuration variable Blink_led. Note: Use an external pull up/pull down connected to a given GPIO to prevent unwanted behavior. DS11839 - Rev 6 page 10/27 SPWF04SA, SPWF04SC Host interfaces 7 Host interfaces The SPWF04S supports UART and SPI interfaces to connect the module with a host processor. The pins to be used in the two possible configurations are indicated in the Table 5. Pinout description. By default, the SPWF04S works using the UART port with AT commands. To switch SPI on, the pin corresponding to GPIO[9] must be driven high during boot to force the device to handle incoming commands over SPI instead of UART. 7.1 UART interface The SPWF04S can be interfaced with an external host using the UART interface shown in Figure 2. UART connection with host device. This configuration is used by default, with four signals including RTS and CTS for HW flow control. The UART baud rate is configurable in the 1200-921600 range. The default configuration is 115200/8/n/1 with flow control disabled. Figure 2. UART connection with host device 7.2 SPI interface The SPWF04S can be interfaced as a slave with an external host by using the SPI interface as shown in Figure 3. SPI connection with host device. There are four SPI signals and an additional host interrupt signal. SPI signals are detailed in the Table 7. SPI signals. This interrupt signal allows the SPI slave to alert the SPI master that it has data to send. In turn, the SPI master needs to assert the GPIO connected to the SPWF04S chip select and to start the CLK signal to send data to the slave. DS11839 - Rev 6 page 11/27 SPWF04SA, SPWF04SC SPI interface Figure 3. SPI connection with host device Table 7. SPI signals SPWF04S signal name Description RTS/Clk Clock (up to 22 MHz) from MCU to SPWF04S CTS/nCS Active low indicates the selection of the slave before a data transmission from the master GPIO[9] (nHostInt) nHostInt. Interrupt sent from the SPWF04S to the host to indicate the transmission of data from the slave RXD/MOSI Data from Host to SPWF04S TXD/MISO Data from SPWF04S to the Host The host SPI can work up to the speed of 22 MHz. The communication between host and the SPWF04S is handled in half duplex. Data is transmitted and received with the most significant bit first (SPI mode 0). That means the clock polarity (CPOL) and the clk phase (CPHA) used to configure SPI are both set to zero. The mode 0 is commonly used as default for microcontrollers. Figures from Figure 4. Single 1 byte transaction to Figure 6. RX master transaction detail the signaling over the SPI. In particular, Figure 4. Single 1 byte transaction shows a single 1-byte transaction in mode 0. Tlead should be at least half a clock cycle long, and so its value depends on the host clock frequency. SPI data is latched by the master and slave using the CLK signal. So, when data needs to be transferred, the MISO and MOSI signals change between each clock. After each single request sent from master to the slave, the master MUST waits for a confirmation message sent from the slave. The message is notified to the master using the nHost Irq. All the data transferred in both directions are packed using a well-defined packet format described in the user manual. Figure 4. Single 1 byte transaction DS11839 - Rev 6 page 12/27 SPWF04SA, SPWF04SC SPI interface The Figure 5. TX master transaction and Figure 6. RX master transaction show a Mmaster TX transaction and a master RX transaction, respectively. The communication starts with the host sending the write SYNC word (0x02), followed by header information, and then payload, when applicable. Once the command has been analyzed by the device, it asserts the IRQ interrupt line. Then the host detects the interrupts and then writes the read SYNC word (0x02) and starts to generate the clock. The device then clears the interrupt line and prepares the response. The host then reads continuously until the SYNC pattern is detected. All data until that point is discarded. The SYNC word is then followed by headers and then payload, when applicable. Figure 5. TX master transaction Figure 6. RX master transaction DS11839 - Rev 6 page 13/27 SPWF04SA, SPWF04SC Package information 8 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Figure 7. Module dimensions GSPG1909161035SG Note: An antenna area of 217 x 520 mils must be free of any ground metalization or traces under the unit. The area extending away from the antenna should be free from metal on the PCB and housing to meet expected performance levels. Pin 25 is the required paddle ground and is not shown in this diagram. DS11839 - Rev 6 page 14/27 SPWF04SA, SPWF04SC Package information Figure 8. Module footprint Note: PCB design requires a detailed review of the center exposed pad. This pad requires good thermal conductivity. Soldering coverage should be maximized and checked via x-ray for proper design. There is a tradeoff between providing enough soldering for conductivity and applying too much, which allows the module to "float" on the paddle creating reliability issues. ST recommends two approaches, a large center via that allows excess solder to flow down into the host PCB with smaller vias around it, or many smaller vias with just enough space for the viscosity of the chosen solder/flux to allow some solder to flow into the smaller vias. Either of these approaches must result in 60% or more full contact solder coverage on the paddle after reflow. ST strongly encourages PCB layout teams to work with their EMS providers to ensure vias and solder paste designs that will result in satisfactory performance. DS11839 - Rev 6 page 15/27 SPWF04SA, SPWF04SC Module reflow 9 Module reflow The SPWF04SA and SPWF04SC are surface mount modules with a 6-layer PCB. The recommended final assembly reflow profiles are indicated below. The soldering phase must be executed with care: in order to prevent an undesired melting phenomenon, particular attention must be paid to the setup of the peak temperature. The following are some suggestions for the temperature profile based on the IPC/JEDEC J- STD-020C, July 2004 recommendations. Table 8. Soldering values Profile feature PB-free assembly Average ramp-up rate (TSMA X to TP) 3 C/s max. Preheat: 150 C Temperature min. (Ts min.) 200 C Temperature max. (Ts max.) 60 - 100 s Time (Ts min. to Ts max.) (ts) Critical zone: 217 C Temperature TL 60 - 70 s Time TL Peak temperature (TP) 240 + 0 C Time within 5 C of actual peak temperature (TP) Ramp-down rate 10 - 20 s 6 C/s Time from 25 C to peak temperature 8 minutes max. Figure 9. Soldering profile AM17477v1 DS11839 - Rev 6 page 16/27 SPWF04SA, SPWF04SC Regulatory compliance 10 Regulatory compliance 10.1 RoHS compliance In order to meet environmental requirements, ST defines different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. The SPWF04S modules comply with the ECOPACK2 level of RoHS compliance grade. The material declaration file is available at: www.st.com. 10.2 RF certifications The RF certifications obtained for the SPWF04S modules are summarized below. Table 9. RF certification summary Directives FCC IC ETSI Id S9NSPWFS04 8976C-SPWFS04 Certified rules and STD Notes FCC part 15 ID that applies to the version SPWF04SA and SPWF04SC when this is used with the antennas specified in the Table 8. Soldering values. Both versions are modular approved in the meaning defined by FCC IC RSS-247 ID that applies to the version SPWF04SA and SPWF04SC when this is used with the antennas specified in the Table 8. Soldering values. Both versions are modular approved in the meaning defined by IC * EN301 489-17 V3.1.1 (2017-02) * EN 201 489-1 V2.1.1 (2017-02) * EN 60950-1:2006 + A11:2009 + A12:2011 + A1:2010 + A2:2013 + AC:2011 * EN 62479:2010 * EN 300 328 V2.1.1 (2016-11) Compliant ID that applies to the version SPWF04SA and SPWF04SC when this is used with the antennas specified in the Table 8. Soldering values The certifications of the version SPWF04SC that has an integrated U.FL connector applies when the module is connected with the antenna specified in the Table 8. Soldering values. DS11839 - Rev 6 page 17/27 SPWF04SA, SPWF04SC RF certifications Table 10. Antennas used for certification of SPWF04SC Product name 2010B4844-01 (standard) Article n. Titanis 2.4 GHz 10.2.1 2010B6090-01 (reverse thread) Frequency 2.4 - 2.5 GHz Polarization Linear Operating temperature -40 to +85 degC Impedance 50 Weight 7.4 g Antenna type Swivel FCC and IC The device SPWF04S has been tested and complies with the FCC part 15 and IC RSS-247 regulations. These limits are designed to provide reasonable protection against harmful interference in approved installations. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: * The device must not cause harmful interference. * The device must accept any interference received, including interference that may cause undesired operation. Modifications or changes to this equipment not expressly approved by the party responsible for compliance may render void the user's authority to operate this equipment. The module has been approved by Industry Canada to operate with the antenna type listed in Table 10. Antennas used for certification of SPWF04SC with the maximum possible gain there indicated. Antenna types not included in Table 10. Antennas used for certification of SPWF04SC and that have a gain greater than the maximum gain indicated for that type in the Table 11. Titanis antenna characteristics, are strictly prohibited for use with this module. Table 11. Titanis antenna characteristics Characteristics Min. Typ. Conditions (1) Max. Peak gain 4.0 dBi 4.1 dBi 4.4 dBi Efficiency 80% 85% 90% VSWR 1.1:1 1.2:1 1.3:1 Frequency 2.4 - 2.5 GHz, measured in 3D chamber (near field) Frequency 2.4 - 2.5 GHz, measured in network analyzer 1. Note all data provided in this table are based on the Antenova reference board. The safe user distance, for RF exposure, is 50 mm (in compliance with 447498 D01 General RF Exposure Guidance v06 and RSS-102 issue 5). Modular approval, FCC and IC * * FCC ID: S9NSPWFS04 IC: 8976C-SPWFS04 In accordance with FCC part 15, the modules SPWF04SA and SPWF04SC are listed above as a modular transmitter device. DS11839 - Rev 6 page 18/27 SPWF04SA, SPWF04SC RF certifications Labeling instructions When integrating the SPWF04SA and SPWF04SC into the final product, it must be ensured that the FCC labeling requirements specified below are satisfied. Based on the Public Notice from FCC, the product into which the ST transmitter module is installed must display a label referring to the enclosed module. The label should use wording like the following: Contains Transmitter Module * FCC ID: S9NSPWFS04 * IC: 8976C-SPWFS04 Any similar wording that expresses the same meaning may also be used. 10.2.2 CE This module complies with the following European EMI/EMC and safety directives and standards: * EN 301 489-17 V3.1.1 (2017-02) * EN 301 489-1 V2.1.1 (2017-02) * EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013 * EN 62479:2010 * EN 300 328 V2.1.1 (2016-11) The module is provided by CE marking: Figure 10. CE label For additional information please refer to: * STMicroelectronics Via C. Olivetti , 2 Agrate Brianza 20864 (ITALY) The SPWF04SA / (SPWF04SC) module current production firmware release is: * 1.x (If needed, for module firmware update please refer to www.st.com) DS11839 - Rev 6 page 19/27 SPWF04SA, SPWF04SC Module marking and traceability 11 Module marking and traceability The SPWF04Sx top-side contains the following information: * CE label printed on the shield Figure 11. SPWF04SA front side The SPWF04x bottom-side contains the following information: * Model number indicating the RF module family: SPWF04Sx * FCC USA certification number: FCC ID: S9NSPWFS04 * IC Canada certification number: IC: 8976C-SPWFS04 * 2D laser data matrix Figure 12. SPWF04SA bottom-side The 2D data matrix laser marked stores a serial number codified in the following format: WW YY K PP NNN, where: * WW - week * YY - year * K - product ID (refer to the table below) * PP - internal ST use only * NNN - internal ST use only Table 12. Module product ID DS11839 - Rev 6 K Product family identification < SPWF04SA > SPWF04SC page 20/27 SPWF04SA, SPWF04SC Module marking and traceability Every module is completely traceable thanks to the following applied rules: * Each module bulk package is identified by a bulk ID * The bulk ID and module 2D data matrix are linked by a reciprocal traceability link * The module 2D data matrix traces the lot number of any raw material used DS11839 - Rev 6 page 21/27 SPWF04SA, SPWF04SC Ordering information 12 Ordering information Table 13. Ordering information Order codes Description SPWF04SA Wi-Fi module with integrated antenna and protocol stack SPWF04SC Wi-Fi module with integrated U.FL connector and protocol stack Note: Refer to the UM2114 for a complete list of stack features and commands. DS11839 - Rev 6 page 22/27 SPWF04SA, SPWF04SC Revision history Table 14. Document revision history Date Revision Changes 04-Oct-2016 1 Initial release. 10-Feb-2017 2 Updated features and description on the cover page. Added Section 12: "Module marking and traceability". 03-Mar-2017 3 Updated Figure 9: "Module footprint". 28-Apr-2017 4 Datasheet status promoted from preliminary data to production data. Updated Section "Features". Updated Table 5: "Pinout description" and Table 6: "GPIOs main and alternate functions". 14-Nov-2017 5 Updated Figure 4: "Single 1 byte transaction" and Figure 5: "TX master transaction". Updated Table 9: "RF certification summary". Updated Section 11.2.2: "CE". Minor text changes. 05-Oct-2018 DS11839 - Rev 6 6 Updated Table 6. GPIOs main and alternate functions, Figure 8. Module footprint. page 23/27 SPWF04SA, SPWF04SC Contents Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 2 Schematic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 General electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Digital interface specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 Pinout description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 7 Host interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 7.1 UART interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7.2 SPI interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 8 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 9 Module reflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 10 Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 10.1 RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 10.2 RF certifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 10.2.1 FCC and IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 10.2.2 CE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 11 Module marking and traceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 12 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 DS11839 - Rev 6 page 24/27 SPWF04SA, SPWF04SC List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Absolute maximum ratings . . . . . . . . . . . . . . . . . . Operating conditions and input power specifications . Digital interface specifications, I/O pins . . . . . . . . . . RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . Pinout description . . . . . . . . . . . . . . . . . . . . . . . . GPIOs main and alternate functions . . . . . . . . . . . . SPI signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Soldering values . . . . . . . . . . . . . . . . . . . . . . . . . RF certification summary . . . . . . . . . . . . . . . . . . . Antennas used for certification of SPWF04SC . . . . . Titanis antenna characteristics. . . . . . . . . . . . . . . . Module product ID . . . . . . . . . . . . . . . . . . . . . . . . Ordering information. . . . . . . . . . . . . . . . . . . . . . . Document revision history . . . . . . . . . . . . . . . . . . . DS11839 - Rev 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 . 5 . 6 . 7 . 8 . 8 12 16 17 18 18 20 22 23 page 25/27 SPWF04SA, SPWF04SC List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. DS11839 - Rev 6 SPWF04S block diagram . . . . . . . UART connection with host device SPI connection with host device . . Single 1 byte transaction . . . . . . . TX master transaction . . . . . . . . . RX master transaction . . . . . . . . . Module dimensions . . . . . . . . . . . Module footprint . . . . . . . . . . . . . Soldering profile . . . . . . . . . . . . . CE label . . . . . . . . . . . . . . . . . . SPWF04SA front side . . . . . . . . . SPWF04SA bottom-side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 11 12 12 13 13 14 15 16 19 20 20 page 26/27 SPWF04SA, SPWF04SC IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2018 STMicroelectronics - All rights reserved DS11839 - Rev 6 page 27/27