Ap r il 200 6 Re v 1 1/ 1 0
10
Order codes
Part Number Marking Packag e Pack ing
TIP31C
Note: on page 4
TIP31C R
TIP31C O
TIP31C Y TO-220 Tube
TIP31C
Power transistors
General features
New enhanced seri es
High switching spee d
hFE improv ed linearity
hFE Grouping
Applications
Linear and sw itching industrial applica tion
Description
The TIP3 1C is a base island technology NPN
power transistor in TO-220 pla stic package with
better performances than the industry standard
TIP31C that mak e this device suitable for audio,
power linear and switching application s. The
PNP type is TI P3 2C.
Internal schematic diag ram
1
2
3
TO-220
www.st.com
Contents TIP31C
2/10
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curve) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
TIP31C Absolute maxim im ratings
3/10
1 Abs ol ut e max i mim rati n gs
Table 1. Absolute ma ximim ratings
Symbol Parameter Value Unit
VCBO Collector- base voltage (IE = 0) 100 V
VCEO Collector- em it ter volt age (IB = 0) 100 V
VEBO Emitter-base vo ltage (I C = 0) 5V
ICCollector cur rent 3 A
ICM Collec tor peak curre nt 5 A
IBBase current 1 A
PTOT Total dissi pation at Tcase = 25°C
Total dissipation at Tamb = 25°C 40
2W
W
Tstg Storage temperature -65 to 150 °C
TJMax. operating junction temperature 150 °C
Electri cal character istics TIP31 C
4/10
2 Electrical characteristics
(Tcase = 25°C unless othe rwise specified )
Note: Product is pre-sel ected in DC current gain (Group R, Group O and Group Y).
STMicroelectronics reserves the right to ship each groups according to production
availability. Please contact your n eares t STMicroelect ronics sales office for delivery details.
Table 2. E lectrical chara cteri stics
Symbol Paramete r Test condi ti ons Min. Typ. Max. Unit
ICEO Collector cut-off current
(IB = 0) VCE = 60V 0.3 mA
IEBO Emitter cut-off current (IC = 0) VEB = 5V 1mA
ICES Collector cut-off current
(VBE = 0) VCE = 100V 0.2 mA
VCEO(sus)(1)
1. Puls ed duration = 300 ms, duty cycle 1.5%
Collector-emitter
sustaining volt age (IB = 0) IC = 30mA 100 V
VCE(sat)(1) Collector-emitter saturation
voltage IC = 3A_ IB = 375mA 1.2 V
VBE(on)(1) Base- em it ter volt age IC = 3A_____ VCE = 4V 1.8 V
hFE(1) DC current gain
IC = 1A_ ___ VCE = 4V
IC = 3A _____ VCE = 4V
Group R
Group O
Group Y
25
10
20
40
24
44
50
TIP31C Electrical characteri stics
5/10
2.1 Electrical characteristics (curve)
Figure 1. Safe Operating area Figure 2. Deratin g curves
Fi gur e 3. DC -current gain Fi gure 4 . DC - cu rrent gain
Figure 5. Co llecto r-emitter saturation
voltage Figure 6. Base-emitter satu ration
voltage
Electri cal character istics TIP31 C
6/10
Figure 7. Base-emitter on voltage
TIP31C Packag e mechanical data
7/10
3 Package mechanical data
In order to meet environ men tal re quirem ents, ST offers thes e devices in ECOPA CK ®
packages. These packages have a Lead-fr ee second level interconnect. The c ategory of
second level interconnect is marked on the package and on the in ner box label, in
compliance wi th JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK spec ifications are available at: www.st.com
Pack age mech ani cal data TIP31 C
8/10
DIM. mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027
D 15.25 15.75 0.60 0.620
E 10 10.40 0.393 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.244 0.256
J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154
L20 16.40 0.645
L30 28.90 1.137
øP 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
TO-220 MECHANICAL DATA
TIP31C Revision history
9/10
4 Revision history
Table 3. Revision histor y
Date Revision Changes
20-Apr-2006 1 New release
TIP31C
10/10
Pl ease Read Caref u ll y:
I
nformation in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“S T”) reserve th
e
r
ight to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at an
y
t
ime, with out notic e.
A
ll ST product s ar e sold pu rsuant to ST’s term s and con di tions of sal e.
P
urchasers are solely responsible for the choice, selection and use of the S T products and serv i ces des cribed herein , and S T assumes n
o
l
iability whatsoever relating to the choice, selection or use of the ST p roducts and services desc ribed herein.
N
o license, express or implied, by estoppel or otherwise, to any intellectual property right s is grant ed under this document. If any part of th
is
d
ocum ent refers to any thi rd party product s or ser vices it s hall not be deeme d a li cense grant by ST for t he use of suc h third pa rty produc
ts
o
r ser vic es, or any inte llec tual proper ty co ntaine d t herei n or con sid ered as a war rant y cove rin g the us e in any m anner w hats oev er of suc
h
t
hi rd party products or servic es o r any intel l ectual propert y c ontained therein.
U
NLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIE
D
W
ARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIE
D
W
ARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAW
S
O
F ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUA L PROPE RTY RIGHT.
U
NLESS EXP RESSLY APPROVED IN WRI TING B Y AN AUTH ORIZE REP RESENTATI VE OF S T, ST PRODUCTS ARE N OT DESI GNE
D,
A
UTH ORIZE D OR WARRA NT ED FOR US E IN MIL IT ARY, AI R CRA F T , S PACE , L IF E SAVING , OR L IF E SUST AINING APPL I C AT I O N
S,
N
OR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, O
R
S
EVERE PROPERTY OR ENVIRONMENTAL DAMAGE.
R
esale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately vo
id
a
ny w arr anty grant ed by ST for t he ST pro duct or se rvic e des cri bed he rein and shal l no t cre ate o r ext end i n any mann er w hats oeve r, an
y
l
iability of ST.
ST and the ST logo are trad em arks or regi stere d tr ademar ks of ST i n variou s c ountries.
Info rm ation i n this document su persedes and r epl aces all i nf ormati on previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMi croelect ronics - A l l ri ghts reserved
STM i croelectron ics g roup of companies
Austra l i a - Belgium - B razil - C anada - Chi n a - Czech Rep ubl i c - Finland - Fra nce - Germ any - Hong K ong - India - Israel - It aly - Japan -
Malaysia - M al ta - Mor occo - Sin gapore - Spain - Sweden - Sw i t zerlan d - United Kingdo m - Uni t ed States of Ame ri ca
www.st.com