1. Product profile
1.1 General description
NPN general-purpose transistors in Surface-Mounted Device (SMD) plastic packages.
[1] Valid for all available selection groups.
1.2 Features and benefits
General-purpose transistors
SMD plastic packages
Three different gain selections
1.3 Applications
General-purpose switching and amplification
BC847 series
45 V, 100 mA NPN general-purpose transistors
Rev. 8 — 20 August 2012 Product data sheet
Table 1. Product overview
Type number[1] Package PNP complement
NXP JEITA JEDEC
BC847 SOT23 - TO-236AB BC857
BC847A BC857A
BC847B BC857B
BC847C BC857C
BC847W SOT323 SC-70 - BC857W
BC847AW BC857AW
BC847BW BC857BW
BC847CW BC857CW
BC847T SOT416 SC-75 - BC857T
BC847AT BC857AT
BC847BT BC857BT
BC847CT BC857CT
BC847AM SOT883 SC-101 - BC857AM
BC847BM BC857BM
BC847CM BC857CM
BC847_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 8 — 20 August 2012 2 of 18
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
1.4 Quick reference data
2. Pinning information
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCEO collector-emitter voltage open base - - 45 V
ICcollector current - - 100 mA
hFE DC current gain VCE =5V; I
C=2mA 110 - 800
hFE group A 110 180 220
hFE group B 200 290 450
hFE group C 420 520 800
Table 3. Pinning
Pin Description Simplified outline Graphic symbol
SOT23, SOT323, SOT416
1base
2emitter
3 collector
SOT883
1base
2emitter
3 collector
006aaa144
12
3
sym021
3
2
1
3
1
2
Transparent
top view
sym021
3
2
1
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Product data sheet Rev. 8 — 20 August 2012 3 of 18
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
3. Ordering information
[1] Valid for all available selection groups.
4. Marking
[1] * = placeholder for manufacturing site code
Tabl e 4. Ordering information
Type number[1] Package
Name Description Version
BC847 - plastic surface-mounted package; 3 leads SOT23
BC847A
BC847B
BC847C
BC847W SC-70 plastic surface-mounted package; 3 leads SOT323
BC847AW
BC847BW
BC847CW
BC847T SC-75 plastic surface-mounted package; 3 leads SOT416
BC847AT
BC847BT
BC847CT
BC847AM SC-101 leadless ultra small plastic package; 3 solder lands;
body 1.0 0.6 0.5 mm SOT883
BC847BM
BC847CM
Table 5. Marking codes
Type number Marking code[1] Type number Marking code[1]
BC847 1H* BC847T 1N
BC847A 1E* BC847AT 1E
BC847B 1F* BC847BT 1F
BC847C 1G* BC847CT 1G
BC847W 1H* BC847AM D4
BC847AW 1E* BC847BM D5
BC847BW 1F* BC847CM D6
BC847CW 1G*
BC847_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 8 — 20 August 2012 4 of 18
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB with 60 m copper strip line, standard footprint.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB with 60 m copper strip line, standard footprint.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - 50 V
VCEO collector-emitter voltage open base - 45 V
VEBO emitter-base voltage open collector - 6 V
ICcollector current - 100 mA
ICM peak collector current single pulse;
tp1ms -200mA
IBM peak base current single pulse;
tp1ms -100mA
Ptot total power dissipation Tamb 25 C[1]
SOT23 - 250 mW
SOT323 - 200 mW
SOT416 - 150 mW
SOT883 [2] -250mW
Tjjunction temperature - 150 C
Tamb ambient temperature 65 +150 C
Tstg storage temperature 65 +150 C
Table 7. Thermal characteris tics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1]
SOT23 - - 500 K/W
SOT323 - - 625 K/W
SOT416 - - 833 K/W
SOT883 [2] --500K/W
BC847_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 8 — 20 August 2012 5 of 18
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
7. Characteristics
[1] Pulse test: tp300 s; = 0.02.
[2] VBE decreases by approximately 2 mV/K with increasing temperature.
Table 8. Characteristics
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ICBO collector-base cut-off
current VCB =30V; I
E=0A - - 15 nA
VCB =30V; I
E=0A;
Tj= 150 C--5A
IEBO emitter-base cut-of f
current VEB =5V; I
C= 0 A - - 100 nA
hFE DC current gain VCE =5V; I
C=10A
hFE group A - 90 -
hFE group B - 150 -
hFE group C - 270 -
DC current gain VCE =5V; I
C=2mA 110 - 800
hFE group A 110 180 220
hFE group B 200 290 450
hFE group C 420 520 800
VCEsat collector-emitter
saturation voltage IC=10mA; I
B=0.5mA - 90 200 mV
IC=100mA; I
B=5mA [1] - 200 400 mV
VBEsat base-emitter
saturation voltage IC=10mA; I
B=0.5mA [2] - 700 - mV
IC=100mA; I
B=5mA [2] - 900 - mV
VBE base-emitter vo ltage IC=2mA; V
CE =5V [2] 580 660 700 mV
IC=10mA; V
CE =5V - - 770 mV
fTtransition frequency VCE =5V; I
C=10mA;
f=100MHz 100--MHz
Cccollector capacitance VCB =10V; I
E=i
e=0A;
f=1MHz --1.5pF
Ceemitter capacitance VEB =0.5V; I
C=i
c=0A;
f=1MHz -11-pF
NF n oise figure IC=200A; VCE =5V;
RS=2k; f = 1 kHz;
B=200Hz
-210dB
BC847_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 8 — 20 August 2012 6 of 18
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
VCE =5V
(1) Tamb = 150 C
(2) Tamb =25C
(3) Tamb =55 C
VCE =5V
(1) Tamb =55 C
(2) Tamb =25C
(3) Tamb = 150 C
Fig 1. Group A: DC current gain as a fun c tion of
collector current; typical valu es Fig 2. Group A: Base-emitter voltage as a function of
collector current; typical values
IC/IB=20
(1) Tamb = 150 C
(2) Tamb =25C
(3) Tamb =55 C
IC/IB=10
(1) Tamb =55 C
(2) Tamb =25C
(3) Tamb = 150 C
Fig 3. Group A: Collecto r-emitter saturation voltage
as a function of collector current; typical
values
Fig 4. Group A: Base-emitter sa turation voltage as a
function of collector current; typical values
mgt723
10−111010
2103
IC (mA)
0
400
300
200
100
hFE
(1)
(2)
(3)
mgt724
10−111010
2103
IC (mA)
0
1200
1000
800
600
400
200
VBE
(mV)
(1)
(2)
(3)
103
102
10
mgt725
10−111010
2103
IC (mA)
VCEsat
(mV)
(1)
(2)
(3)
mgt726
10−111010
2103
IC (mA)
0
1200
1000
800
600
400
200
VBEsat
(mV)
(1)
(2)
(3)
BC847_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 8 — 20 August 2012 7 of 18
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
VCE =5V
(1) Tamb = 150 C
(2) Tamb =25C
(3) Tamb =55 C
VCE =5V
(1) Tamb =55 C
(2) Tamb =25C
(3) Tamb = 150 C
Fig 5. Group B: DC current gain as a fun c tion of
collector current; typical valu es Fig 6. Group B: Base-emitter voltage as a function of
collector current; typical values
IC/IB=20
(1) Tamb = 150 C
(2) Tamb =25C
(3) Tamb =55 C
IC/IB=10
(1) Tamb =55 C
(2) Tamb =25C
(3) Tamb = 150 C
Fig 7. Group B: Collecto r-emitter saturation voltage
as a function of collector current; typical
values
Fig 8. Group B: Base-emitter sa turation voltage as a
function of collector current; typical values
mgt727
10−111010
2103
IC (mA)
0
600
500
400
300
200
100
hFE
(1)
(2)
(3)
0
1200
1000
800
600
400
200
mgt728
10−210−111010
2103
IC (mA)
VBE
(mV)
(1)
(2)
(3)
104
103
102
10
mgt729
10−111010
2103
IC (mA)
VCEsat
(mV)
(1)
(2)
(3)
mgt730
10−111010
2103
IC (mA)
0
1200
1000
800
600
400
200
VBEsat
(mV)
(1)
(2)
(3)
BC847_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 8 — 20 August 2012 8 of 18
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
VCE =5V
(1) Tamb = 150 C
(2) Tamb =25C
(3) Tamb =55 C
VCE =5V
(1) Tamb =55 C
(2) Tamb =25C
(3) Tamb = 150 C
Fig 9. Group C: DC current gain as a fun c tion of
collector current; typical valu es Fig 10. Group C: Base-emitter voltage as a function of
collector current; typical values
IC/IB=20
(1) Tamb = 150 C
(2) Tamb =25C
(3) Tamb =55 C
IC/IB=10
(1) Tamb =55 C
(2) Tamb =25C
(3) Tamb = 150 C
Fig 11. Group C: Collector-emitter saturation voltage
as a function of collector current; typical
values
Fig 12. Group C: Base-emitter saturation voltage as a
function of collector current; typical values
mgt731
10−111010
2103
IC (mA)
0
1200
1000
800
600
400
200
hFE
(1)
(2)
(3)
0
1200
1000
800
600
400
200
mgt732
10−210−111010
2103
IC (mA)
VBE
(mV)
(1)
(2)
(3)
104
103
102
10
mgt733
10−111010
2103
IC (mA)
VCEsat
(mV)
(1)
(2)(3)
mgt734
10
−1
11010
2
10
3
I
C
(mA)
0
1200
1000
800
600
400
200
V
BEsat
(mV)
(1)
(2)
(3)
BC847_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 8 — 20 August 2012 9 of 18
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
8. Package outline
Fig 13. Package outline SOT23 (TO-236AB)
Fig 14. Package outline SOT323 (SC-70)
04-11-04Dimensions in mm
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1 1.4
1.2
0.48
0.38 0.15
0.09
12
3
04-11-04Dimensions in mm
0.45
0.15
1.1
0.8
2.2
1.8
2.2
2.0 1.35
1.15
1.3
0.4
0.3 0.25
0.10
12
3
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Product data sheet Rev. 8 — 20 August 2012 10 of 18
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
Fig 15. Package outline SOT416 (SC-75)
Fig 16. Package outline SOT883 (SC-101)
04-11-04Dimensions in mm
0.95
0.60
1.8
1.4
1.75
1.45 0.9
0.7
0.25
0.10
1
0.30
0.15
12
30.45
0.15
03-04-03Dimensions in mm
0.62
0.55
0.55
0.47 0.50
0.46
0.65
0.20
0.12
3
21
0.30
0.22
0.30
0.22
1.02
0.95
0.35
BC847_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 8 — 20 August 2012 11 of 18
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
9. Packing information
[1] For further information and the availability of packing methods, see Section 13.
[2] Valid for all available selection groups.
Table 9. Packing methods
The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]
Type
number[2] Package Description Packing quantity
3000 5000 10000
BC847 SOT23 4 mm pitch, 8 mm tape and reel -215 - -235
BC847A
BC847B
BC847C
BC847W SOT323 4 mm pitch, 8 mm tape and reel -115 - -135
BC847AW
BC847BW
BC847CW
BC847T SOT416 4 mm pitch, 8 mm tape and reel -115 - -135
BC847AT
BC847BT
BC847CT
BC847AM SOT883 2 mm pitch, 8 mm tape and reel - - -315
BC847BM
BC847CM
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Product data sheet Rev. 8 — 20 August 2012 12 of 18
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
10. Soldering
Fig 17. Reflow soldering footprin t SOT23 (TO-236AB)
Fig 18. Wave soldering footprint SOT23 (TO-236AB)
solder lands
solder resist
occupied area
solder paste
sot023_fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot023_fw
2.8
4.5
1.4
4.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mm
BC847_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 8 — 20 August 2012 13 of 18
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
Fig 19. Reflow soldering footprint SOT323 (SC-70)
Fig 20. Wave soldering footprint SOT323 (SC-70)
solder lands
solder resist
occupied area
solder paste
sot323_fr
2.65
2.35 0.6
(3×)
0.5
(3×)
0.55
(3×)
1.325
1.85
1.3
3
2
1
Dimensions in mm
BC847_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 8 — 20 August 2012 14 of 18
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
Fig 21. Reflow soldering footprint SOT416 (SC-75)
Fig 22. Reflow soldering footprint SOT883 (SC-101)
solder lands
solder resist
occupied area
solder paste
sot416_fr
0.85
1.7
2.2
2
0.5
(3×)
0.6
(3×)
1
1.3
Dimensions in mm
solder lands
solder resist
occupied area
solder paste
sot883_fr
1.3
0.3
0.6 0.7
0.4
0.9
0.3
(2×)
0.4
(2×)
0.25
(2×)
R0.05 (12×)
0.7
Dimensions in mm
BC847_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 8 — 20 August 2012 15 of 18
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
11. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BC847_SER v.8 20120820 Product data sheet - BC847_BC547_SER v.7
Modifications: •Type numbers removed: BC847B/DG, BC847BW/DG, BC847AT/DG, BC857, BC857B
and BC857C
•Section 12 “Legal information”: updated
BC847_BC547_SER v.7 20081210 Product data sheet - BC847_BC547_SER v.6
BC847_BC547_SER v.6 20050519 Product data sheet - -
BC847_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 8 — 20 August 2012 16 of 18
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificatio n — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond tho se described in the
Product data sheet.
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Limited warr a nty and liability — Information in this document is believed to
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representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
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In no event shall NXP Semiconductors be liable for any indirect, incidental,
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profits, lost savings, business interruption, costs related to the removal or
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Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semicondu ctors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
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authorized or warranted to be suitable for use in life support, lif e-critical or
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damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
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Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applicati ons or customer product
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customer’s third party customer(s). Customers should provide appropriate
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NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
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testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
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applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
BC847_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 8 — 20 August 2012 17 of 18
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference dat a is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qua lif ied nor test ed
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in au tomotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and st andards, customer
(a) shall use the product without NXP Semicond uctors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
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liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
12.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors BC847 series
45 V, 100 mA NPN general-purpose transist ors
© NXP B.V. 2012. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 20 August 2012
Document id entifier: BC847_SER
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
9 Packing information . . . . . . . . . . . . . . . . . . . . 11
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
13 Contact information. . . . . . . . . . . . . . . . . . . . . 17
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18