ESDA25B1
®
October 1999 - Ed : 2
6 BIDIRECTIONAL TRANSIL FUNCTIONS
VERY LOW CA PACITANCE : C= 20 pF @ VRM
150 W peak puls e power (8/20 µs)
FEATURES SO-8
FUNCTIONA L DI AGRAM
1
2
3
4
I/O 1
I/O 2
I/O 3 I/O 4
I/O 6
GNDGND
I/O 5
8
7
6
5
DESCRIPTION
The ESDA25B1 is a monolithic voltage suppressor
designed to protect components which are
connected to dat a and transmission lines against
EDS.
TRANSIL ARRAY
FOR ESD PROTEC TION
Appl icati on Spec ific Disc retes
A.S.D.
Where transient overvoltage protection in ESD
sensitive equipment is required, s uch as :
- COMPUTE R
- PR INTE RS
- COMMUNICA TI ON SYSTEM S
It is particulary recommended for RS232 I/O port
protection where the line int erface withstands only
2 kV ESD surges.
APPLICATIONS
BENEFITS
High ESD protection level : up to 25 kV
High integration
Suitable for high dens ity boar ds
IEC 1000-4-2 : level 4
MIL STD 883C-Method 3015-6 : c lass 3
(human body model)
COMPLIES WITH THE FOLLOWING STANDARDS :
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Symbol Parameter
VRM Stand-off voltage
VBR Breakdown voltage
VCL Clamping voltage
IRM Leakage current
IPP Peak puls e current
αT Voltage temperature c oefficient
C Capacitance
Rd Dynamic resistance
ELECTRICAL CHARACTERISTICS (Tamb = 25° C)
Symbol Parameter Value Unit
VPP Electrostatic dischar ge
MIL STD 883C - Method 3015- 6 25 kV
PPP Peak pulse power (8/20µs) 150 W
Tstg
TjStorage temperature range
Maximum junc tion t emperature - 55 to + 150
125 °C
°C
TLMaximum lead temperature for s oldering during 10s 260 °C
ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C)
Types VBR @ IRIRM @ VRM Rd αTC
min. max. max. typ. max. typ.
note 1 note 1 note 2 note 3 0V bias
VVmA
µ
AV
10-4/°CpF
ESDA25B1 25 30 1 2 24 1.5 9.7 15
note 1 : Between any I/O pin and Groung
note 2 : Square pulse, Ipp = 25A, tp=2.5µs.
note 3 : V BR = αT* (Tamb -25°C) * VBR (25°C)
ESDA25B1
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The ES DA f amily has been designed t o c lamp fast
spikes like ESD. Generally the PCB designers
need to calculate easily the clamping voltage VCL.
This is why we give the dynamic resistance in
addition to the classical parameters. The voltage
across the protection cell can be calculated with
the following formula:
VCL = VBR + Rd IPP
Where Ipp is the peak current through the ESDA cell.
DYNAM IC RE SISTANCE M EASUREMENT
The short duration of the E SD has led us t o pr efer
a more adapted test wave, as below defined, to the
classical 8/20µs and 10/1000µs surges.
2.5µs duration measurement wave.
As the value of the dynamic resistance remains
stable for a surge duration lower than 20µs, the
2.5µs rectangular surge is well adapted. In addition
both rise and fall time s are optimized to avoid any
parasitic phenomenon during the m easur ement of
Rd.
CALCULATION OF THE CLAMPING VOLTAGE
USE OF T HE DY NAM IC RE SIS TA NCE
2µs
tp = 2.5µs
t
I
Ipp
ESDA25B1
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0 25 50 75 100 125 150
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1 Ppp[Tj initial]/Ppp[Tj initial=25°C]
Tj initial(°C)
Fig. 1 : Peak power dissipation versus initial
junction temperature.
20 25 30 35 40 45 50 55 60
0.1
1.0
10.0
50.0 Ipp(A)
tp=2.5µs
V (V)
CL
Fig. 3 : Clamping voltage versus peak pulse
current (Tj initial = 25 °C).
Rectangular waveform tp = 2.5 µs.
110100
10
100
1000
2000 Ppp(W)
tp(µs)
Fig. 2 : Peak pulse power versus exponential
pulse duration (Tj initial = 25 ° C).
12 510 30
1
2
5
10
20 C(pF)
F=1MHz
Vosc=30mV
V (V)
R
Fig. 4 : Capacitance versus reverse applied
voltage (typical values).
25 50 75 100 125
1
10
100
200 I [Tj] / I [Tj=25°C]
RR
Tj(°C)
Fig. 5 : Relative variation of leakage current versus
junction temperature (ty pical values ).
ESDA25B1
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PACKAGE M ECHANICAL DATA
SO-8 Plastic
Packaging : Preferred pac kaging is tape and reel.
Weight : 0.08g.
Information furnished is beli eved to be accurate and rel iable. However, STMic roelectronics assumes no responsibility for the consequen ces of
use of such informat ion nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMic roelectronics . Specificat ions men tioned in this publica tion ar e subject to
change without notice. Thi s publication supersedes and replaces all information previously supplied.
STMicroelectro nics products are not authori zed for use as critical components in l i fe s upport devices or systems wi thout express written ap-
proval of S TMicroelectronics. The ST logo is a registe red trademark o f STMicroelectron ics
© 1999 STMicroelectroni cs - Printed i n Italy - All rights rese rved.
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MARKING : Logo, Date Code, E 25B1
REF. DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 1.75 0.069
a1 0.1 0.25 0.004 0.010
a2 1.65 0.065
a3 0.65 0.85 0.026 0.033
b 0.35 0.48 0.014 0.019
b1 0.19 0.25 0.007 0.010
C 0.25 0.5 0.010 0.020
c1 45° (typ)
D 4.8 5.0 0.189 0.197
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 3.81 0.150
F 3.8 4.0 0.15 0.157
L 0.4 1.27 0.016 0.050
M 0.6 0.024
S8
°
(ma x)
OR DER CODE
ESDA 25 B 1 RL
ESD ARRA Y
VBR min PACKAGE : SO-8
Bidirectionel
PACKAGING:
RL = Tape and reel
= Tube
ESDA25B1
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