Figure 1. Application with VIN to ground short protection, using optional P-MOSFET sensing
Description
The A8502 is a multi-output white LED driver for small-size
LCD backlighting. It integrates a current-mode boost converter
with internal power switch and two current sinks. The boost
converter can drive up to 24 LEDs, 12 LEDs per string, at
120 mA. The LED sinks can be paralleled together to achieve
even higher LED currents, up to 240 mA. The A8502 can
operate with a single power supply, from 5 to 40 V, which
allows the part to withstand load dump conditions encountered
in automotive systems.
If required, the A8502 can drive an external P-FET to
disconnect the input supply from the system in the event of
a fault. The A8502 provides protection against output short
and overvoltage, open or shorted diode, open or shorted LED
pin, shorted boost switch or inductor, shorted FSET or ISET
resistor, and IC overtemperature. A dual level cycle-by-cycle
current limit function provides soft start and protects the internal
current switch against high current overloads.
The A8502 has a synchronization pin that allows PWM
switching frequencies to be synchronized in the range of
580 kHz to 2.3 MHz. The high switching frequency allows
the A8502 to operate above the AM radio band.
A8502-DS, Rev. 3
Features and Benefits
• AEC-Q100 qualified
Wide input voltage range of 5 to 40 V for start/stop, cold
crank and load dump requirements
• Fully integrated LED current sinks and boost converter
with 60 V DMOS
• Sync function to synchronize boost converter switching
frequency up to 2.3 MHz, allowing operation above the
AM band
• Excellent input voltage transient response
• Single resistor primary OVP minimizes VOUT leakage
• Internal secondary OVP for redundant protection
• LED current of 120 mA per channel
• Drives up to 12 series LEDs in 2 parallel strings
• 0.7% to 0.8% LED to LED matching accuracy
• PWM and analog dimming inputs
• 5000:1 PWM dimming at 200 Hz
• Provides driver for optional external PMOS input
disconnect switch
• Extensive protection against:
Shorted boost switch or inductor
Shorted FSET or ISET resistor
Shorted output
Open or shorted LED pin
Open boost Schottky
Overtemperature (OTP)
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
Package: 16-pin TSSOP with exposed
thermal pad (suffix LP) Applications:
LCD backlighting or LED lighting for:
Automotive infotainment
Automotive cluster
Automotive center stack
Typical Application Circuit
Not to scale
A8502
Continued on the next page…
GATE SW
Q1
D1
L1
CVDD
OVP
VOUT
ROVP COUT
RSC
RADJ
VSENSE
VIN
VDD
PWM/EN
APWM
ISET
FSET/SYNC
AGND PGND
COMP
CPRZ
CZ
LED2
LED1
FAULT
PAD
A8502
120
VC
10 H 2 A / 60 V
137 k
0.033
249
100 k
RISET
8.25 kRFSET
10 k
4.7 F
50 V
CIN
4.7 F
50 V
CC
22 nF
RC
20
0.1 F
0.47 F
120 pF
VIN
10 to 14 V
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
2
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Absolute Maximum Ratings*
Characteristic Symbol Notes Rating Unit
LEDx Pins –0.3 to 55 V
OVP Pin –0.3 to 60 V
VIN, VSENSE, GATE Pins VSENSE and GATE pins should not exceed VIN
by more than 0.4 V –0.3 to 40 V
SW Pin Continuous –0.6 to 62 V
t < 50 ns –1.0 V
¯
F
¯
¯
A
¯¯¯
U ¯¯
L
¯
¯
T
¯
Pin -0.3 to 40 V
ISET, FSET, APWM, COMP Pins –0.3 to 5.5 V
All Other Pins –0.3 to 7 V
Operating Ambient Temperature TARange K –40 to 125 ºC
Maximum Junction Temperature TJ(max) 150 ºC
Storage Temperature Tstg –55 to 150 ºC
*Stresses beyond those listed in this table may cause permanent damage to the device. The Absolute Maximum ratings are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the Electrical
Characteristics table is not implied. Exposure to Absolute Maximum-rated conditions for extended periods may affect device reliability.
Selection Guide
Part Number Packing*
A8502KLPTR-T 4000 pieces per 13-in. reel
*Contact Allegro® for additional packing options
The A8502 is provided in a 16-pin TSSOP package (suffix LP) with
an exposed pad for enhanced thermal dissipation. It is lead (Pb) free,
with 100% matte tin lead frame plating.
Description (continued)
Table of Contents
Specifications 2
Pin-out Diagram and Terminal List 3
Characteristic Performance 8
Functional Description 11
Enabling the IC 11
Powering up: LED pin short-to-ground check 11
Soft start function 13
Frequency selection 13
Sync 14
LED current setting and LED dimming 15
PWM dimming 15
APWM pin 16
Analog dimming 18
LED short detect 18
Overvoltage protection 18
Boost switch overcurrent protection 21
Input overcurrent protection and
disconnect switch 22
Setting the current sense resistor 23
Input UVLO 23
VDD 23
Shutdown 24
Fault protection during operation 24
Application Information 26
Design Example for Boost Configuration 26
Design Example for SEPIC Configuration 30
Package Outline Drawing 34
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
3
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Pin-out Diagram
Terminal List Table
Number Name Function
1 VDD Output of internal LDO; connect a 0.1 F decoupling capacitor between this pin and ground.
2 PGND Power ground for internal DMOS device.
3 OVP Overvoltage Condition (OVP) sense; connect the ROVP resistor from VOUT to this pin to
adjust the overvoltage protection.
4 SW The drain of the internal DMOS switch of the boost converter.
5 GATE Output gate driver pin for external P-channel FET control.
6 VSENSE
Connect this pin to the negative sense side of the current sense resistor RSC. The threshold
voltage is measured as VIN – VSENSE . There is also a fixed current sink to allow for trip
threshold adjustment.
7 VIN Input power to the A8502 as well as the positive input used for current sense resistor.
8¯
F
¯
¯
A
¯¯¯
U ¯¯
L
¯
¯
T
¯
Indicates a fault condition. Connect a 100 k resistor between this pin and the required logic
level voltage. The pin is an open drain type configuration that will be pulled low when a fault
occurs.
9 COMP Output of the error amplifier and compensation node. Connect a series RZ-CZ network from
this pin to ground for control loop compensation.
10 APWM Analog trimming option for dimming. Applying a digital PWM signal to this pin adjusts the
internal ISET current.
11 PWM/EN PWM dimming pin, used to control the LED intensity by using pulse width modulation. Also
used to enable the A8502.
12 FSET/SYNC
Frequency/synchronization pin. A resistor RFSET from this pin to ground sets the switching
frequency. This pin can also be used to synchronize two or more A8502s in the system. The
maximum synchronization frequency is 2.3 MHz.
13 ISET Connect the RISET resistor between this pin and ground to set the 100% LED current.
14 AGND LED signal ground.
15 LED1 Connect the cathode of the LED string to this pin.
16 LED2 Connect the cathode of the LED sring to this pin.
–PAD
Exposed pad of the package providing enhanced thermal dissipation. This pad must be
connected to the ground plane(s) of the PCB with at least 8 vias, directly in the pad.
Thermal Characteristics may require derating at maximum conditions, see application information
Characteristic Symbol Test Conditions* Value Unit
Package Thermal Resistance RJA
On 2-layer PCB, 3 in.
248.5 ºC/W
On 4-layer PCB based on JEDEC standard 34 ºC/W
*Additional thermal information available on the Allegro website
VDD
PGND
OVP
SW
GATE
VSENSE
VIN
FAULT
LED2
LED1
AGND
ISET
FSET/SYNC
PWM/EN
APWM
COMP
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
PAD
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
4
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Functional Block Diagram
VDD
Regulator
UVLO
Internal
Soft Start
Enable
PWM
Thermal
Shutdown
Open/Short
LED Detect
ISET
Fault
LED
Driver
1.235 V
Ref
Driver
Circuit
Internal VCC
Internal VCC
VREF
Internal VCC
VREF
VREF
ISS
ISS
IADJ
GOFF
100 k
AGND
Current
Sense
Input Current
Sense Amplifier
PMOS
Driver
Diode
Open
Sense
OVP
Sense
Oscillator
SW
VIN
FSET/SYNC
COMP
VSENSE
GATE
PWM/EN
APWM
PAD
PGND AGND
ISET
OVP
LED2
LED1
FAULT
AGND
PGND
+
+
+
+
+
Fault
Fault
Fault
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
5
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ELECTRICAL CHARACTERISTICS1,2 Valid at VIN = 16 V, TA = 25°C, indicates specifications guaranteed by design and
characterization over the full operating temperature range with TA = TJ = –40°C to 125°C; unless otherwise noted
Characteristics Symbol Test Conditions Min. Typ. Max. Unit
Input Voltage Specifications
Operating Input Voltage Range3VIN 5 40 V
UVLO Start Threshold VUVLOrise VIN rising 4.35 V
UVLO Stop Threshold VUVLOfall VIN falling 3.90 V
UVLO Hysteresis2VUVLOHYS 300 450 600 mV
Input Currents
Input Quiescent Current IQPWM/EN = VIH ; SW = 2 MHz, no load 5.5 10 mA
Input Sleep Supply Current IQSLEEP VIN = 16 V, VPWMEN = VFSETSYNC = 0 V 2.0 10.0 A
Input Logic Levels (PWM/EN and APWM)
Input Logic Level-Low VIL VIN throughout operating input voltage range 400 mV
Input Logic Level-High VIH VIN throughout operating input voltage range 1.5 V
PWM/EN Pin Open Drain
Pull-down Resistor RPWMEN PWM/EN = 5 V 60 100 140 k
APWM Pull-down Resistor RAPWM PWM/EN = VIH 60 100 140 k
APWM
APWM Frequency2fAPWM VIH = 2 V, VIL = 0 V 20 1000 kHz
Error Amplifier
Open Loop Voltage Gain AVOL 44 48 52 dB
Transconductance gmICOMP = ±10 A 750 990 1220 A/V
Source Current IEA(SRC) VCOMP = 1.5 V –350 A
Sink Current IEA(SINK) VCOMP = 1.5 V 350 A
COMP Pin Pull-down Resistance RCOMP ¯
F
¯
¯
A
¯
U ¯¯
L
¯
¯
T
¯
= 0 2000 
Overvoltage Protection
Overvoltage Threshold VOVP(th) OVP connected to VOUT 7.7 8.1 8.5 V
OVP Sense Current IOVPH 188 199 210 A
OVP Leakage Current IOVPLKG ROVP = 40.2 k, VIN = 16 V, PWM/EN = VIL 0.1 1 A
Secondary Overvoltage Protection VOVP(sec) 53 55 58 V
Boost Switch
Switch On-Resistance RSW ISW = 0.750 A, VIN = 16 V 75 300 600 m
Switch Leakage Current ISWLKG VSW = 16 V, PWM/EN = VIL 0.1 1 A
Switch Current Limit ISW(LIM) 3.0 3.5 4.2 A
Secondary Switch Current Limit2ISW(LIM2)
Higher than ISW(LIM)(max) for all conditions,
device latches when detected 7.00 A
Soft Start Boost Current Limit ISWSS(LIM) Initial soft start current for boost switch 700 mA
Minimum Switch On-Time tSWONTIME 60 85 111 ns
Minimum Switch Off-Time tSWOFFTIME 30 47 68 ns
Continued on the next page…
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
6
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Oscillator Frequency
Oscillator Frequency fSW
RFSET = 10 k1.8 2 2.2 MHz
RFSET = 20 k0.9 1 1.1 MHz
RFSET = 35.6 k520 580 640 kHz
FSET/SYNC Pin Voltage VFSET RFSET = 10 k1.00 V
FSET Frequency Range fFSET 580 2500 kHz
Synchronization
Synchronized PWM Frequency fSWSYNC 580 2300 kHz
Synchronization Input
Minimum Off-Time tPWSYNCOFF 150 ns
Synchronization Input
Minimum On-Time tPWSYNCON 150 ns
SYNC Input Logic Voltage
VSYNC(H) FSET/SYNC pin, high level 0.4 V
VSYNC(L) FSET/SYNC pin, low level 2.0 V
LED Current Sinks
LEDx Accuracy ErrLED ISET = 120 A2%
LEDx Matching LEDx ISET = 120 A1%
LEDx Regulation Voltage VLED VLED1 = VLED2 , ISET = 120 A 620 720 820 mV
ISET to ILEDx Current Gain AISET ISET = 120 A 960 980 1000 A/A
ISET Pin Voltage VISET 0.988 1.003 1.018 V
Allowable ISET Current ISET 40 120 A
VLED Short Detect VLEDSC
While LED sinks are in regulation, sensed
from LEDx pin to ground 4.6 5.1 5.6 V
Soft Start LEDx Current ILEDSS
Current through each enabled LEDx pin
during soft start 3.2 mA
Maximum PWM Dimming
Until Off-Time2tPWML
Measured while PWM/EN = low, during
dimming control and internal references
are powered-on (exceeding tPWML results in
shutdown)
32,750 fSW
cycles
Minimum PWM On-Time tPWMH First cycle when powering-up device 0.75 2 s
PWM High to LED-On Delay tdPWM(on)
Time between PWM enable and LED current
reaching 90% of maximum 0.5 1 s
PWM Low to LED-Off Delay tdPWM(off)
Time between PWM enable going low and
LED current reaching 10% of maximum 360 500 ns
ELECTRICAL CHARACTERISTICS1,2 (continued) Valid at VIN = 16 V, TA = 25°C, indicates specifications guaranteed by design
and characterization over the full operating temperature range with TA = TJ = –40°C to 125°C; unless otherwise noted
Characteristics Symbol Test Conditions Min. Typ. Max. Unit
Continued on the next page…
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
7
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ELECTRICAL CHARACTERISTICS1,2 (continued) Valid at VIN = 16 V, TA = 25°C, indicates specifications guaranteed by design
and characterization over the full operating temperature range with TA = TJ = –40°C to 125°C; unless otherwise noted
Characteristics Symbol Test Conditions Min. Typ. Max. Unit
GATE Pin
GATE Pin Sink Current IGSINK VGS = VIN 104 A
Gate Fault Shutdown Greater than
2X Current2tGFAULT2 3s
Gate Fault Shutdown Greater than
1–2X Current tGFAULT1 10,000 fSW
cycles
Gate Voltage VGS
Gate to source voltage measured when gate
is on –6.7 V
VSENSE Pin
VSENSE Pin Sink Current IADJ 18.8 20.3 21.8 A
VSENSE Trip Point VSENSEtrip1
Measured between VIN and VSENSE,
RADJ = 0 94 104 114 mV
VSENSE 2X Trip2VSENSEtrip2
2X VSENSEtrip , instantaneous shutdown,
RADJ = 0 180 mV
¯
F
¯
¯
A
¯
¯
U ¯¯
L
¯
¯
T
¯
Pin
¯
F
¯
¯
A
¯
U ¯¯
L
¯
¯
T
¯
Pull-Down Voltage VFAULT IFAULT = 1 mA 0.5 V
¯
F
¯
¯
A
¯
U ¯¯
L
¯
¯
T
¯
Pin Leakage Current IFAULTLKG VFAULT = 5 V 1A
Thermal Protection (TSD)
Thermal Shutdown Threshold2TSD Temperature rising 165 ºC
Thermal Shutdown Hysteresis2TSDHYS 20 ºC
1For input and output current specifications, negative current is defined as coming out of the node or pin (sourcing); positive current is defined as
going into the node or pin (sinking).
2Ensured by design and characterization, not production tested.
3Minimum VIN = 5 V is only required at startup. After startup is completed, the IC is able to function down to VIN = 4 V.
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
8
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
-50 -40 -30 -20 -10 10 20 30 40 50 60 70 80 90 100 110 120 1300-50 -40 -30 -20 -10 10 20 30 40 50 60 70 80 90 100 110 120 1300
-50 -40 -30 -20 -10 10 20 30 40 50 60 70 80 90 100 110 120 1300-50 -40 -30 -20 -10 10 20 30 40 50 60 70 80 90 100 110 120 1300
-50 -40 -30 -20 -10 10 20 30 40 50 60 70 80 90 100 110 120 1300-50 -40 -30 -20 -10 10 20 30 40 50 60 70 80 90 100 110 120 1300
7.7
7.6
7.8
7.9
8.0
8.1
8.2
8.3
8.4
VOVP(th) (V)
190
192
194
196
198
200
202
204
206
208
210
IOVPH (μA)
3.60
3.61
3.62
3.63
3.64
3.65
3.66
3.67
3.68
3.69
3.70
1.80
1.85
1.90
1.95
2.00
2.05
2.10
2.15
2.20
f
SW
(MHz)
Switching Frequency
OVP Pin Sense Current OVP Pin Overvoltage Threshold
4.00
4.05
4.10
4.15
4.20
4.25
4.30
4.35
4.40
V
UVLOrise
(V)V
UVLOfall
(V)
0
1
2
3
4
5
6
7
8
9
10
IQSLEEP (μA)
VIN Input Sleep Mode Current
versus Ambient Temperature
VIN UVLO Start Threshold Voltage
VIN UVLO Stop Threshold Voltage
versus Ambient Temperature
versus Ambient Temperature versus Ambient Temperature
versus Ambient Temperature versus Ambient Temperature
Temperature (°C)
Temperature (°C)
Temperature (°C)
Temperature (°C)
Temperature (°C)
Temperature (°C)
Characteristic Performance
TA = TJ
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
9
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
-50 -40 -30 -20 -10 10 20 30 40 50 60 70 80 90 100 110 120 1300-50 -40 -30 -20 -10 10 20 30 40 50 60 70 80 90 100 110 120 1300
-50 -40 -30 -20 -10 10 20 30 40 50 60 70 80 90 100 110 120 1300-50 -40 -30 -20 -10 10 20 30 40 50 60 70 80 90 100 110 120 1300
-50 -40 -30 -20 -10 10 20 30 40 50 60 70 80 90 100 110 120 1300-50 -40 -30 -20 -10 10 20 30 40 50 60 70 80 90 100 110 120 1300
3.0
2.5
2.0
1.5
1.0
0.5
0
Err
LED
(%)
LED Current Setpoint Accuracy
-6.9
-6.8
-6.7
-6.6
-6.5
-6.4
-6.3
V
GS
(V)
Input Disconnect Switch
Voltage
Gate to Source
118.2
118.0
117.8
117.6
117.4
117.2
117.0
ILED (mA)
I
SET
= 120 μA
I
SET
= 120 μA
-0.5
-0.3
-0.1
0.1
0.3
0.5
$LEDx (%)
LED to LED Matching Accuracy
960
965
970
975
980
985
990
995
1000
A
ISET
Temperature (°C)
Temperature (°C)
Temperature (°C)
Temperature (°C)
Temperature (°C)
ISET to LED Current Gain versus Ambient Temperature
versus Ambient Temperature
LED Current
versus Ambient Temperature
versus Ambient Temperature
versus Ambient Temperature
20.0
20.1
20.2
20.3
20.4
20.5
20.6
20.7
20.8
IADJ (μA)
VSENSE Pin Sink Current
Temperature (°C)
versus Ambient Temperature
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
10
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
100
95
90
85
80
75
70
65
60
Eciency (%)
100
95
90
85
80
75
70
Eciency (%)
Input Voltage, VIN (V)
Eciency for Various LED Conguraons
ILED = 80 mA, LED Vf 3.2 V
Eciency for Various LED Conguraons
ILED = 100 mA, LED Vf 3.2 V
Input Voltage, VIN (V)
5.5 7.0 8.5 10.0 13.0 16.011.5 14.5
5.5 7.0 8.5 10.0 13.0 16.011.5 14.5
2 strings, 6 series LEDs each
2 strings, 7 series LEDs each
2 strings, 8 series LEDs each
2 strings, 6 series LEDs each
2 strings, 7 series LEDs each
2 strings, 8 series LEDs each
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
11
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
The A8502 incorporates a current-mode boost controller with
internal DMOS switch, and two LED current sinks. It can be
used to drive two LED strings of up to 12 white LEDs in series,
with current up to 120 mA per string. For optimal efficiency, the
output of the boost stage is adaptively adjusted to the minimum
voltage required to power both LED strings. This is expressed by
the following equation:
VOUT = max ( VLED1 , VLED2 ) + VREG (1)
where
VLEDx is the voltage drop across LED strings 1 and 2, and
VREG is the regulation voltage of the LED current sinks (typi-
cally 0.72 V at the maximum LED current).
Enabling the IC
The IC turns on when a logic high signal is applied on the
PWM/EN pin with a minimum duration of tPWMH for the first
clock cycle, and the input voltage present on the VIN pin is
greater than the 4.35 V necessary to clear the UVLO (VUVLOrise )
threshold. The power-up sequence is shown in figure 2. Before
the LEDs are enabled, the A8502 driver goes through a system
check to determine if there are any possible fault conditions that
might prevent the system from functioning correctly. Also, if the
FSET/SYNC pin is pulled low, the IC will not power-up. More
information on the FSET/SYNC pin can be found in the Sync
section of this datasheet.
Powering up: LED pin short-to-ground check
The VIN pin has a UVLO function that prevents the A8502
from powering-up until the UVLO threshold is reached. After
the VIN pin goes above UVLO, and a high signal is present on
the PWM/EN pin, the IC proceeds to power-up. As shown in
figure 3, at this point the A8502 enables the disconnect switch
and checks if any LEDx pins are shorted to ground and/or are not
used.
The LED detect phase starts when the GATE voltage of the
disconnect switch is equal to VIN – 4.5 V. After the voltage
threshold on the LEDx pins exceeds 120 mV, a delay of between
3000 and 4000 clock cycles is used to determine the status of the
pins. Thus, the LED detection duration varies with the switching
Functional Description
Figure 2. Power-up diagram; shows VDD (ch1, 2 V/div.), FSET/SYNC (ch2,
1 V/div.), ISET (ch3, 1 V/div.), and PWM/EN (ch4, 2 V/div.) pins,
time = 200 s/div.
t
VDD
PWM/EN
FSET/SYNC
ISET
C1
C3
C4
C2
Figure 3. Power-up diagram; shows the relationship of an LEDx pin with
respect to the gate voltage of the disconnect switch (if used) during the
LED detect phase, as well as the duration of the LED detect phase for a
switching frequency of 2 MHz; shows GATE (ch1, 5 V/div.), LED (ch2,
500 mV/div.), ISET (ch3, 1 V/div.), and PWM/EN (ch4, 5 V/div.) pins,
time = 500 s/div.
t
GATE
GATE = VIN – 4.5 V
LED detection period
PWM/EN
LEDx
ISET
C1
C3
C4
C2
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
12
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
4A. An LED detect occurring when both LED pins are selected to be used;
shows LED1 (ch1, 500 mV/div.), LED2 (ch2, 500 mV/div.), ISET (ch3,
1 V/div.), and PWM/EN (ch4, 5 V/div.) pins, time = 500 s/div.
4B. Example with LED2 pin not being used; the detect voltage is
about 150 mV; shows LED1 (ch1, 500 mV/div.), LED2 (ch2, 500 mV/div.),
ISET (ch3, 1 V/div.), and PWM/EN (ch4, 5 V/div.) pins, time = 500 s/div.
4C. Example with one LED shorted to ground. The IC will not proceed with
power-up until the shorted LED pin is released, at which point the LED is
checked to see if it is being used; shows LED1 (ch1, 500 mV/div.), LED2 (ch2,
500 mV/div.), ISET (ch3, 1 V/div.), and PWM/EN (ch4, 5 V/div.) pins,
time = 1 ms/div.
t
LED detection period
PWM/EN
LED2
LED1
ISET
C1
C3
C4
C2
t
Pin shorted
Short removed
PWM/EN
LED2
LED1
ISET
C1
C3
C4
C2
t
LED detection period
PWM/EN
LED2
LED1
ISET
C1
C3
C4
C2
frequency, as shown in the following table:
Switching Frequency
(MHz)
Detection Time
(ms)
2 1.5 to 2
1 3 to 4
0.800 3.75 to 5
0.600 5 to 6.7
The LED pin detection voltage thresholds are as follows:
LED Pin Voltage LED Pin Status Action
<70 mV Short-to-ground Power-up is halted
150 mV Not used LED removed from operation
325 mV LED pin in use None
All unused pins should be connected with a 1.54 k resistor to
ground, as shown in figure 5. The unused pin, with the pull-down
resistor, will be taken out of regulation at this point and will not
contribute to the boost regulation loop.
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
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If a LEDx pin is shorted to ground the A8502 will not proceed
with soft start until the short is removed from the LEDx pin. This
prevents the A8502 from powering-up and putting an uncon-
trolled amount of current through the LEDs.
Soft start function
During soft start the LEDx pins are set to sink (ILEDSS) and the
boost switch current is reduced to the ISWSS(LIM) level to limit
the inrush current generated by charging the output capacitors.
When the converter senses that there is enough voltage on the
LEDx pins the converter proceeds to increase the LED current to
the preset regulation current and the boost switch current limit is
switched to the ISW(LIM) level to allow the A8502 to deliver the
necessary output power to the LEDs. This is shown in figure 6.
Frequency selection
The switching frequency on the boost regulator is set by the resis-
tor connected to the FSET/SYNC pin. The switching frequency
can be can be anywhere from 580 kHz to 2.3 MHz. Figure 7
shows the typical switching frequencies, in MHz, for given resis-
tor values, in k.
In case during operation a fault occurs that will increase the
switching frequency, the FSET/SYNC pin is clamped to a
maximum switching frequency of no more than 3.5 MHz. If the
FSET/SYNC pin is shorted to GND the part will shut down. For
more details see the Fault Mode table later in this datasheet.
Figure 5. Channel select setup: (left) using only channel LED1,
(right) using both channels.
GND
1.54 k
A8502
LED1
LED2
LED1
LED2
GND
A8502
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
fSW (MHz)
Resistance for RSET (kΩ)
10.0 30.020.012.5 32.522.517.515.0 25.0 35.0
Figure 6. Startup diagram showing the input current, output voltage, and
output current; shows IOUT (ch1, 200 mA/div.), IIN (ch2, 1 A/div.), VOUT
(ch3, 20 V/div.), and PWM/EN (ch4, 5 V/div.), time = 1 ms/div.
Figure 7. Typical Switching Frequency versus value of RFSET resistor.
t
Inrush current caused by
enabling the disconnect
switch (when used) Operation during
ISWSS(lim)
Normal operation
ISW(lim)
PWM/EN
IIN
IOUT
VOUT
C1
C3
C4
C2
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Fault Tolerant LED Driver
A8502
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Sync
The A8502 can also be synchronized using an external clock
on the FSET/SYNC pin. Figure 8 shows the correspondence of
a sync signal and the FSET/SYNC pin, and figure 9 shows the
result when a sync signal is detected: the LED current does not
show any variation while the frequency changeover occurs. At
power-up if the FSET/SYNC pin is held low, the IC will not
power-up. Only when the FSET/SYNC pin is tri-stated to allow
the pin to rise, to about 1 V, or when a synchronization clock is
detected, will the A8502 try to power-up.
The basic requirement of the sync signal is 150 ns minimum on-
time and 150 ns minimum off time, as indicated by the specifica-
tions for tPWSYNCON and tPWSYNCOFF
. Figure 10 shows the timing
for a synchronization clock into the A8502 at 2.2 MHz. Thus any
pulse with a duty cycle of 33% to 66% at 2.2 MHz can be used to
synchronize the IC.
The SYNC pulse duty cycle ranges for selected switching fre-
quencies are:
SYNC Pulse Frequency
(MHz)
Duty Cycle Range
(%)
2.2 33 to 66
2 30 to 70
1 15 to 85
0.800 12 to 88
0.600 9 to 91
If during operation a sync clock is lost, the IC will revert to the
preset switching frequency that is set by the resistor RFSET. Dur-
ing this period the IC will stop switching for a maximum period
of about 7 s to allow the sync detection circuitry to switch over
to the externally preset switching frequency.
If the clock is held low for more than 7 s, the A8502 will shut
down. In this shutdown mode the IC will stop switching, the
input disconnect switch is open, and the LEDs will stop sinking
current. To shutdown the IC into low power mode, the user must
disable the IC using the PWM pin, by keeping the pin low for a
period of 32,750 clock cycles. If the FSET/SYNC pin is released
at any time after 7 s, the A8502 will proceed to soft start.
Figure 9. Transition of the SW waveform when the SYNC pulse is
detected. The A8502 switching at 2 MHz, applied SYNC pulse at 1 MHz;
shows VOUT (ch1, 20 V/div.), IOUT (ch2, 200 mA/div.), FSET/SYNC (ch3,
2 V/div.), and SW node (ch4, 20 V/div.), time = 5 s/div.
t
SW node
FSET/SYNC
IOUT
VOUT
C1
C3
C4
C2
Figure 8. Diagram showing a synchronized FSET/SYNC pin and switch
node; shows VOUT (ch1, 20 V/div.), IOUT (ch2, 200 mA/div.), FSET/SYNC
(ch3, 2 V/div.), and SW node (ch4, 20 V/div.), time = 2 s/div.
t
SW node
2 MHz operation 1 MHz operation
FSET/SYNC
IOUT
VOUT
C1
C3
C4
C2
150 ns
150 ns
T = 454 ns
154 ns
t
PWSYNCON
t
PWSYNCOFF
Figure 10. SYNC pulse on and off time requirements.
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
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LED current setting and LED dimming
The maximum LED current can be up to 120 mA per channel,
and is set through the ISET pin. To set the ILED current, connect
a resistor, RISET, between this pin and ground, according to the
following formula:
RISET = (1.003 × 980) / ILED (2)
where ILED is in A and RISET is in . This sets the maximum cur-
rent through the LEDs, referred to as the 100% current. Standard
RISET values, at gain equals 980, are as follows:
Standard Closest RISET
Resistor Value
(kΩ)
LED current per LED, ILED
(mA)
8.25 120
9.76 100
12.1 80
15.0 65
PWM dimming
The LED current can be reduced from the 100% current level
by PWM dimming using the PWM/EN pin. When the PWM/EN
pin is pulled high, the A8502 turns on and all enabled LEDs sink
100% current. When PWM/EN is pulled low, the boost converter
and LED sinks are turned off. The compensation (COMP) pin is
floated, and critical internal circuits are kept active. The typical
PWM dimming frequencies fall between 200 Hz and 1 kHz. Fig-
ures 11A to 11D provide examples of PWM switching behavior.
Figure 11A. Typical PWM diagram showing VOUT, ILED, and COMP pin as
well as the PWM signal. PWM dimming frequency is 500 Hz at 50% duty
cycle; shows VOUT (ch1, 10 V/div.), COMP (ch2, 2 V/div.), PWM (ch3,
5 V/div.), and ILED (ch4, 50 mA/div.), time = 500 s/div.
t
ILED
PWM
COMP
VOUT
C1
C3
C4
C2
Figure 11B. Typical PWM diagram showing VOUT, ILED, and COMP pin as
well as the PWM signal. PWM dimming frequency is 500 Hz at 1% duty
cycle ; shows VOUT (ch1, 10 V/div.), COMP (ch2, 2 V/div.), PWM (ch3,
5 V/div.), and ILED (ch4, 50 mA/div.), time = 500 s/div.
Figure 11D. Delay from falling edge of PWM signal to LED current turn off;
shows PWM (ch1, 2 V/div.), and ILED (ch2, 50 mA/div.), time = 200 ns/div.
Figure 11C. Delay from rising edge of PWM signal to LED current; shows
PWM (ch1, 2 V/div.), and ILED (ch2, 50 mA/div.), time = 200 ns/div.
t
ILED
PWM
C1
C2
t
ILED
PWM
COMP
VOUT
C1
C3
C4
C2
t
ILED
PWM
C1
C2
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Fault Tolerant LED Driver
A8502
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Another important feature of the A8502 is the PWM signal to
LED current delay. This delay is typically less than 500 ns, which
allows greater accuracy at low PWM dimming duty cycles, as
shown in figure 12.
APWM pin
The APWM pin is used in conjunction with the ISET pin (see fig-
ure 13). This is a digital signal pin that internally adjusts the ISET
current. When this pin is not used it should be tied to ground.
The typical input signal frequency is between 20 kHz and 1 MHz.
The duty cycle of this signal is inversely proportional to the per-
centage of current that is delivered to the LEDs (figure 14).
To use this pin for a trim function, the user should set the maxi-
mum output current to a value higher than the required current by
at least 5%. The LED ISET current is then trimmed down to the
appropriate value. Another consideration that also is important
is the limitation of the user APWM signal duty cycle. In some
cases it might be preferable to set the maximum ISET current to be
25% to 50% higher, thus allowing the APWM signal to have duty
cycles that are between 25% and 50%.
Figure 13. Simplified block diagram of the APWM and ISET circuit.
Figure 14. Output current versus duty cycle; 200 kHz APWM signal.
Figure 15. Percentage Error of the LED current versus PWM duty cycle;
200 kHz APWM signal.
APWM
Current
Adjust
ISET
Current
Mirror
LED
Driver
ISET
RISET
PWM
A8502
150
100
50
0
IOUT (mA)
PWM Duty Cycle, D (%)
0406020 80 100
–15
–10
–5
0
PWM Duty Cycle, D (%)
0406020 80 100
ErrLED (%)
10
8
6
4
2
0
ErrLED (%)
PWM Duty Cycle, D (%)
0.1 1 10 100
Worst-case
Typical
Figure 12. Percentage Error of the LED current versus PWM duty cycle
(at 200 Hz PWM frequency).
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Fault Tolerant LED Driver
A8502
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Figure 16. Diagram showing the transition of LED current from 120 mA
to 90 mA, when a 25% duty cycle signal is applied to the APWM pin;
PWM = 1; shows ILED (ch1, 50 mA/div.), APWM (ch2, 5 V/div.), and
PWM/EN (ch3, 5 V/div.), time = 500 s/div.
Figure 17. Diagram showing the transition of LED current from 90 mA
to 120 mA, when a 25% duty cycle signal is removed from the APWM pin.
PWM = 1; shows ILED (ch1, 50 mA/div.), APWM (ch2, 5 V/div.), and
PWM/EN (ch3, 5 V/div.), time = 500 s/div.
t
ILED
APWM
PWM/EN
C1
C3
C2
t
ILED
APWM
PWM/EN
C1
C3
C2
As an example, a system that delivers a full LED current of
120 mA per LED would deliver 90 mA of current per LED when
an APWM signal is applied with a duty cycle of 25% (figures
16 and 17).
Although the APWM dimming function has a wide frequency
range, if this function is used strictly as an analog dimming
function it is recommended to use frequency ranges between
50 and 500 kHz for best accuracy. The frequency range must be
considered only if the user is not using this function as a closed
loop trim function. Another limitation is that the propagation
delay between this APWM signal and IOUT takes several milli-
seconds to change the actual LED current. This effect is shown in
figures 16-18.
Figure 18. Transition of output current level when a 50% duty cycle signal
is applied to the APWM pin, in conjunction with a 50% duty cycle PWM
dimming being applied to the PWM pin; shows IOUT (ch1, 100 mA/div.),
APWM (ch2, 5 V/div.), and PWM/EN (ch3, 5 V/div.), time = 1 ms/div.
t
IOUT
APWM
PWM/EN
C1
C3
C2
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Fault Tolerant LED Driver
A8502
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Analog dimming
The A8502 can also be dimmed by using an external DAC or
another voltage source applied either directly to the ground side
of the RISET resistor or through an external resistor to the ISET
pin (see figure 19). The limit of this type of dimming depends on
the range of the ISET pin. In the case of the A8502 the limit is
40 to 125 A.
• For a single resistor (panel A of figure 18), the ISET current is
controlled by the following formula:
ISET =
VISET VDAC
RISET
(3)
where VISET is the ISET pin voltage and VDAC is the DAC output
voltage.
When the DAC voltage is 0 V the LED current will be at its
maximum. To keep the internal gain amplifier stable, the user
should not decrease the current through the RISET resistor to less
than 40 A
• For a dual-resistor configuration (panel B of figure 19), the ISET
current is controlled by the following formula:
ISET =
VISET
RISET
VDAC VISET
R1
(4)
The advantage of this circuit is that the DAC voltage can be
higher or lower, thus adjusting the LED current to a higher or
lower value of the preset LED current set by the RISET resistor:
VDAC = 1.003 V; the output is strictly controlled by RISET
VDAC > 1.003 V; the LED current is reduced
VDAC < 1.003 V; the LED current is increased
LED short detect
Both LEDx pins are capable of handling the maximum VOUT
that the converter can deliver, thus providing protection from the
LEDx pin to VOUT in the event of a connector short.
An LEDx pin that has a voltage exceeding VLEDSC will be
removed from operation (see figure 20). This is to prevent the IC
from dissipating too much power by having a large voltage pres-
ent on an LEDx pin.
While the IC is being PWM-dimmed, the IC rechecks the dis-
abled LED every time the PWM signal goes high, to prevent false
tripping of an LED short event. This also allows some self-cor-
rection if an intermittent LED pin short to VOUT is present.
Overvoltage protection
The A8502 has overvoltage protection (OVP) and open Schottky
diode (D1 in figure 1) protection. The OVP protection has a
Figure 19. Simplified diagrams of voltage control of ILED: typical
applications using a DAC to control ILED using a single resistor (upper),
and dual resistors (lower).
Figure 20. Example of the disabling of an LED string when the LED pin
voltage is increased above 4.6 V; shows IOUT (ch1, 200 mA/div.), LED1
(ch2, 5 V/div.), and PWM/EN (ch3, 5 V/div.), time = 10 s/div.
t
IOUT
LED1
PWM/EN
C1
C3
C2
GND
DAC
VDAC
GND
A8502
ISET
GND
DAC
VDAC
GND
A8502
ISET
R
ISET
R1
R
ISET
(A)
(B)
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Fault Tolerant LED Driver
A8502
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default level of 8.1 V and can be increased up to 53 V by con-
necting resistor ROVP between the OVP pin and VOUT
. When
the current into the OVP pin exceeds 199 A (typical), the OVP
comparator goes low and the boost stops switching.
The following equation can be used to determine the resistance
for setting the OVP level:
ROVP = ( VOUTovp VOVP(th)
) / IOVPH (5)
where:
VOUTovp is the target overvoltage level,
ROVP is the value of the external resistor, in ,
VOVP(th) is the pin OVP trip point found in the Electrical Charac-
teristics table, and
IOVPH is the current into the OVP pin.
There are several possibilities for why an OVP condition would
be encountered during operation, the two most common being: a
disconnected output, and an open LED string. Examples of these
are provided in figures 21 and 22.
Figure 21 illustrates when the output of the A8502 is discon-
nected from load during normal operation. The output voltage
instantly increases up to OVP voltage level and then the boost
stops switching to prevent damage to the IC. If the output is
drained off, eventually the boost might start switching for a short
duration until the OVP threshold is hit again.
Figure 22 displays a typical OVP event caused by an open LED
string. After the OVP condition is detected, the boost stops
switching, and the open LED string is removed from operation.
Afterwards VOUT is allowed to fall, and eventually the boost will
resume switching and the A8502 will resume normal operation.
A8502 also has built-in secondary overvoltage protection to
protect the internal switch in the event of an open diode condi-
tion. Open Schottky diode detection is implemented by detecting
overvoltage on the SW pin of the device. If voltage on the SW
Figure 21. OVP protection in an output disconnect event; shows VOUT
(ch1, 10 V/div.), SW node (ch2, 50 V/div.), PWM (ch3, 5 V/div.), and
ILED (ch4, 200 mA/div.), time = 1 ms/div.
Figure 22. OVP protection in an open LED string event; shows VOUT
(ch1, 10 V/div.), SW node (ch2, 50 V/div.), PWM (ch3, 5 V/div.), and
ILED (ch4, 200 mA/div.), time = 500 s/div.
t
VOUT
PWM
SW node
Output disconnect
event detected
ILED
C1
C3
C4
C2
t
VOUT
PWM
SW node
ILED
C1
C3
C4
C2
LED string open
condition detected
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Fault Tolerant LED Driver
A8502
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pin exceeds the device safe operating voltage rating, the A8502
disables and remains latched. To clear this fault, the IC must be
shut down either by using the PWM/EN signal or by going below
the UVLO threshold on the VIN pin. Figure 23 illustrates this.
As soon as the switch node voltage (SW) exceeds 60 V, the IC
shuts down. Due to small delays in the detection circuit, as well
as there being no load present, the switch node voltage will rise
above the trip point voltage.
Figure 24 illustrates when the A8502 is being enabled during an
open diode condition. The IC goes through all of its initial LED
detection and then tries to enable the boost, at which point the
open diode is detected.
Figure 23. OVP protection in an open Schottky diode event, while the IC is
in normal operation; shows PWM (ch1, 5 V/div.), SW node (ch2, 50 V/div.),
VOUT (ch3, 20 V/div.), and IOUT (ch4, 200 mA/div.), time = 1 s/div.
Figure 24. OVP protection when the IC is enabled during an open diode
condition; shows PWM (ch1, 5 V/div.), SW node (ch2, 50 V/div.), VOUT
(ch3, 10 V/div.), and IOUT (ch4, 200 mA/div.), time = 500 s/div.
t
VOUT
PWM
SW node
Open diode
condition detected
IOUT
C1
C3
C4
C2
t
VOUT
PWM
SW node
Open diode
condition detected
IOUT
C1
C3
C4
C2
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Fault Tolerant LED Driver
A8502
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Figure 25. Normal operation of the switch node (SW); inductor current
(IL) and output voltage (VOUT) for 9 series LEDs in each of 2 strings
configuration; shows SW node (ch1, 20 V/div.), inductor current, IL
(ch2, 1 A/div.), VOUT (ch3, 10 V/div.), and PWM/EN (ch4, 5 V/div.),
time = 2 s/div.
Figure 26. Cycle-by-cycle current limiting; inductor current (yellow trace, IL),
note reduction in output voltage as compared to normal operation with the
same configuration (figure 23); shows SW node (ch1, 20 V/div.), inductor
current, IL (ch2, 1 A/div.), VOUT (ch3, 10 V/div.), and PWM/EN (ch4,
5 V/div.), time = 2 s/div.
Figure 27. Secondary boost switch current limit; when this limit is hit, the
A8502 immediately shuts down; shows PWM/EN (ch1, 5 V/div.), ¯
F
¯
¯
A
¯
U ¯¯
L
¯
¯
T
¯
(ch2, 5 V/div.), SW node (ch3, 50 V/div.), and inductor current, IL (ch4,
2 A/div.), time = 100 ns/div.
t
VOUT
PWM/EN
SW node
IL
C1
C3
C4
C2
t
VOUT
PWM/EN
SW node
IL
C1
C3
C4
C2
t
IL
PWM/EN
SW node
C1
C3
C4
C2
FAULT
Boost switch overcurrent protection
The boost switch is protected with cycle-by-cycle current limiting
set at a minimum of 3.0 A. There is also a secondary current limit
that is sensed on the boost switch. When detected this current
limit immediately shuts down the A8502. The level of this cur-
rent limit is set above the cycle-by-cycle current limit to protect
the switch from destructive currents when the boost inductor is
shorted. Various boost switch overcurrent conditions are shown in
figures 25 through 27.
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Fault Tolerant LED Driver
A8502
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Input overcurrent protection and disconnect switch
The primary function of the input disconnect switch is to protect
the system and the device from catastrophic input currents during
a fault condition. The external circuit implementing the discon-
nect is shown in figure 28. If the input disconnect switch is not
used, the VSENSE pin must be tied to VIN and the GATE pin
must be left open.
When selecting the external PMOS, check for the following
parameters:
• Drain-source breakdown voltage V(BR)DSS > –40 V
• Gate threshold voltage (make sure it is fully conducting at
VGS = -4 V, and cut-off at –1 V)
• RDS(on): Make sure the on-resistance is rated at VGS = -4.5 V or
similar, not at -10 V; derate it for higher temperature
The input disconnect switch has two modes of operation:
• 1X mode When the input current is between one and two times
the preset current limit value, the disconnect switch enters a con-
stant-current mode for a maximum duration of 10,000 cycles or
5 ms at 2 MHz. During this time, the Fault flag is set immediately
and the disconnect switch goes into a linear mode of operation,
in which the input current will be limited to a value approximate
to the 1X current trip point level (figure 29). If the fault corrects
itself before the expiration of the timer, the Fault flag will be
removed and normal operation will resume.
The user can also during this time decide whether to shut down
the A8502. To immediately shut down the device, pull the FSET/
SYNC pin low for more than 7 s. After the FSET/SYNC pin has
been low for a period longer than 7 s, the IC will stop switching,
the input disconnect switch will open, and the LEDx pins will
stop sinking current. The A8502 can be powered-down into low
power mode. To do so, disable the IC by keeping the PWM/EN
pin low for a period of 32,750 clock cycles. To keep the discon-
Figure 28. Typical circuit showing the implementation of the input
disconnect feature.
GATE
RADJ
RCCC
RSC
To L1
VSENSE
VIN A8502
Q1
VIN
Figure 29. Showing typical wave forms for a 3-A, 1X current limit under a
fault condition; shows fSW = 800 kHz, ¯
F
¯
¯
A
¯
U ¯¯
L
¯
¯
T
¯
(ch1, 5 V/div.), IIN (ch2, 2 A/
div.), GATE (ch3, 5 V/div.), and PWM/EN (ch4, 5 V/div.), time = 5 ms/div.
t
GATE
PWM/EN
IIN
C1
C3
C4
C2
FAULT
(1) Initial fault
detected
(2) Disconnect switch
goes into a linear mode
(4) After 12.5 ms,
disconnect switch
shuts down
(3) IIN limited to 3 A
Figure 30. 2X mode, secondary overcurrent fault condition. IIN is the input
current through the switch. The Fault flag is set at the 1X current limit, and
when the 2X current limit is reached the A8502 disables the gate of the
disconnect switch (GATE); shows ¯
F
¯
¯
A
¯
U ¯¯
L
¯
¯
T
¯
(ch1, 5 V/div.), GATE (ch2,
10 V/div.), IIN (ch3, 2 A/div.), and PWM/EN (ch4, 5 V/div.), time = 5 s/div.
t
GATE
PWM/EN
IIN
C1
C3
C4
C2
FAULT
Fault flag set at
1X trip point
A8502 shuts down at
2X trip point
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
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nect switch stable while the disconnect switch is in 1X mode, use
a 22 nF capacitor for CC and a 20 resistor for RC.
• 2X current limit If the input current level goes above 2X of the
preset current limit threshold, the A8502 will shut down in less
than 3 s regardless of user input (figure 30). This is a latched
condition. The Fault flag is also set to indicate a fault. This
feature is meant to prevent catastrophic failure in the system due
to inductor short to ground, switch pin short to ground, or output
short to ground.
Setting the current sense resistor
The typical threshold for the current sense circuit is 104 mV,
when RADJ is 0 . This voltage can be trimmed by the RADJ
resistor. The typical 1X trip point should be set at about 3 A,
which coincides with the cycle-by-cycle current limit minimum
threshold.
For example, given 3 A of input current, and the calculated maxi-
mum value of the sense resistor, RSC = 0.033 .
The RSC chosen is 0.03 , a standard.
Also:
RADJ = (VSENSETRIPVADJ ) / IADJ (6)
The trip point voltage is calculated as:
VADJ = 3.0 A × 0.03 = 0.090 V
RADJ = (0.104 – 0.09 V) / (20.3 A) = 731
Input UVLO
When VIN and VSENSE rise above the VUVLOrise threshold, the
A8502 is enabled. A8502 is disabled when VIN falls below the
VUVLOfall threshold for more than 50 s. This small delay is used
to avoid shutting down because of momentary glitches in the
input power supply. When VIN falls below 4.35 V, the IC will
shut down (see figure 31).
VDD
The VDD pin provides regulated bias supply for internal circuits.
Connect the capacitor CVDD with a value of 0.1 F or greater to
this pin. The internal LDO can deliver no more than 2 mA of cur-
rent with a typical VDD of about 3.5 V, enabling this pin to serve
as the pull-up voltage for the ¯
F
¯
¯
A
¯
¯
U
¯
¯
L
¯
¯
T
¯
pin.
Figure 31. Shutdown showing a falling input voltage (VIN); shows VIN
(ch1, 2 V/div.), IOUT (ch2, 200 mA/div.), VDD (ch3, 5 V/div.), and PWM/EN
(ch4, 2 V/div.), time = 5 ms/div.
t
IOUT
PWM/EN
VIN
VDD
C1
C2
C3
C4
Figure 32. Shutdown using the enable function, showing the 16 ms
delay between the PWM/EN signal and when the VDD and GATE of
the disconnect switch turns off; shows GATE (ch1, 10 V/div.), IOUT (ch2,
200 mA/div.), VDD (ch3, 5 V/div.), and PWM/EN (ch4, 2 V/div.),
time = 5 ms/div.
t
IOUT
PWM/EN
GATE
VDD
C2
C1
C3
C4
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
24
Allegro MicroSystems, Inc.
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Shutdown
If the PWM/EN pin is pulled low for more than tPWML (32,750
clock cycles), the device enters shutdown mode and clears all
internal fault registers. As an example, at a 2 MHz clock fre-
quency, it will take approximately 16.3 ms to shut down the IC
into the low power mode (figure 32). When the A8502 is shut
down, the IC will disable all current sources and wait until the
PWM/EN signal goes high to re-enable the IC. If faster shut
down is required, the FSET/SYNC pin can be used.
Fault protection during operation
The A8502 constantly monitors the state of the system to deter-
mine if any fault conditions occur during normal operation. The
response to a triggered fault condition is summarized in the Fault
Mode table.
The possible fault conditions that the device can detect are: Open
LED pin, LED pin shorted to ground, shorted inductor, VOUT
short to ground, SW pin shorted to ground, ISET pin shorted to
ground, and input disconnect switch source shorted to ground.
Note the following:
• Some of the protection features might not be active during
startup, to prevent false triggering of fault conditions.
• Some of these faults will not be protected if the input disconnect
switch is not being used. An example of this is VOUT short to
ground.
Fault Mode Table
Fault Name Type Active
Fault
Flag
Set
Description Boost Disconnect
switch
Sink
driver
Primary switch
overcurrent protection
(cycle-by-cycle
current limit)
Auto-restart Always No This fault condition is triggered by the cycle-by-
cycle current limit, ISW(LIM).
Off for
a single
cycle
On On
Secondary switch
current limit Latched Always Yes
When the current through the boost switch exceeds
secondary current SW limit (ISW(LIM2)) the device
immediately shuts down the disconnect switch,
LED drivers, and boost. The Fault flag is set. To re-
enable the device, the PWM/EN pin must be pulled
low for 32,750 clock cycles.
Off Off Off
Input disconnect
current limit Latched Always Yes
The device is immediately shut off if the voltage
across the input sense resistor is 2X the preset
current value. The Fault flag is set. If the input
current limit is between 1X and 2X, the Fault flag
is set but the IC will continue to operate normally
for tGFAULT1 or until it is shut down. To re-enable
the device the PWM/EN pin must be pulled low for
32,750 clock cycles.
Off Off Off
Secondary OVP Latched Always Yes
Secondary overvoltage protection is used for open
diode detection. When diode D1 opens, the SW pin
voltage will increase until VOVP(SEC) is reached. This
fault latches the IC. The input disconnect switch is
disabled as well as the LED drivers, and the Fault
flag is set. To re-enable the part the PWM pin must
be pulled low for 32,750 clock cycles.
Off Off Off
Continued on the next page…
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
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Fault Mode Table (continued)
Fault Name Type Active
Fault
Flag
Set
Description Boost Disconnect
Switch
Sink
driver
LED Pin Short
Protection Auto-restart Startup No
This fault prevents the device from starting-up if
either of the LEDx pins are shorted. The device
stops soft-start from starting while either of the
LEDx pins are determined to be shorted. After the
short is removed, soft-start is allowed to start.
Off On Off
LED Pin open Auto-restart Normal
Operation No
When an LEDx pin is open the device will determine
which LED pin is open by increasing the output
voltage until OVP is reached. Any LED string not
in regulation will be turned off. The device will then
go back to normal operation by reducing the output
voltage to the appropriate voltage level.
On On
Off for
open
pins.
On
for all
others.
ISET Short Protection Auto-restart Always No
This fault occurs when the ISET current goes above
150% of the maximum current. The boost will stop
switching, the disconnect switch will turn off, and
the IC will disable the LED sinks until the fault is
removed. When the fault is removed the IC will try
to to regulate to the preset LED current.
Off On Off
FSET/SYNC Short
Protection Auto-restart Always Yes
Fault occurs when the FSET/SYNC current goes
above 150% of maximum current, about 180 A.
The boost will stop switching, the disconnect switch
will turn off, and the IC will disable the LED sinks
until the fault is removed. When the fault is removed
the IC will try to restart with soft-start.
Off Off Off
Overvoltage
Protection Auto-restart Always No
Fault occurs when OVP pin exceeds VOVP(th)
threshold. The A8502 will immediately stop
switching to try to reduce the output voltage. If the
output voltage decreases then the A8502 will restart
switching to regulate the output voltage.
Stop
during
OVP
event.
On On
LED Short Protection Auto-restart Always No
Fault occurs when the LED pin voltage exceeds
VLEDSC. When the LED short protection is detected
the LED string that is above the threshold will be
removed from operation.
On On
Off for
shorted
pins.
On
for all
others.
Overtemperature
Protection Auto-restart Always No Fault occurs when the die temperature exceeds the
overtemperature threshold, 165°C. Off Off Off
VIN UVLO Auto-restart Always No Fault occurs when VIN drops below VUVLO
, 3.90 V
maximum. This fault resets all latched faults. Off Off Off
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
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Allegro MicroSystems, Inc.
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Application Information
Design Example for Boost Configuration
This section provides a method for selecting component values
when designing an application using the A8502. The resulting
design is diagrammed in figure 33.
Assumptions: For the purposes of this example, the following are
given as the application requirements:
• VBAT: 10 to 14 V
• Quantity of LED channels, #CHANNELS : 2
• Quantity of series LEDs per channel, #SERIESLEDS : 10
• LED current per channel, ILED
: 120 mA
• LED Vf at 120 mA: 3.2 V
• fSW
: 2 MHz
• TA(max): 65°C
• PWM dimming frequency: 200 Hz, 1% duty cycle
Procedure: The procedure consists of selecting the appropriate
configuration and then the individual component values, in an
ordered sequence.
Step 1 Connect LEDs to pins LED1 and LED2.
Step 2 Determining the LED current setting resistor RISET:
RISET = (VISET × AISET) / ILED (7)
= (1.003 (V) × 980) / 120 (mA) = 8.19 k
Choose a 8.25 k resistor.
Step 3 Determining the OVP resistor. The OVP resistor is
connected between the OVP pin and the output voltage of the
converter.
Step 3a The first step is determining the maximum voltage based
on the LED requirements. The regulation voltage, VLED , of the
A8502 is 720 mV. A constant term, 2 V, is added to give margin
to the design due to noise and output voltage ripple.
VOUT(OVP) = #SERIESLEDS × Vf + VLED + 2 (V) (8)
= 10 × 3.2 (V) + 0.720 (V) + 2 (V)
= 34.72 V
Then the OVP resistor is:
ROVP = (VOUT(OVP) VOVP(th) ) / IOVPH (9)
= (34.72 V – 8.1 V) / 199 A = 133.77 k
where both I
OVPH and VOVP(th) are taken from the Electrical
Characteristics table.
Chose a value of resistor that is higher value than the calculated
ROVP . In this case a value of 137 k was selected. Below is the
actual value of the minimum OVP trip level with the selected
resistor:
VOUT(OVP) = 137 (k) × 199 (A )+ 8.1 (V) = 35.36 V
Step 3b At this point a quick check must be done to determine if
the conversion ratio is acceptable for the selected frequency.
Dmaxofboost = 1 – tSWOFFTIME × fSW (10)
= 1 – 68 (ns) × 2 (MHz) = 86.4%
where the minimum off-time (tSWOFFTIME) is found in the Electri-
cal Characteristics table.
The Theoretical Maximum VOUT is then calculated as:
VOUT(max) Vd
=–
1 – Dmaxofboost
VIN(min)
0.4 (V) 73.13 V
==
1 – 0.864
10 (V)
(11)
where Vd is the diode forward voltage.
The Theoretical Maximum VOUT value must be greater than the
value VOUT(OVP) . If this is not the case, the switching frequency
of the boost converter must be reduced to meet the maximum
duty cycle requirements.
Step 4 Selecting the inductor. The inductor must be chosen such
that it can handle the necessary input current. In most applica-
tions, due to stringent EMI requirements, the system must operate
in continuous conduction mode throughout the whole input volt-
age range.
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
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Step 4a Determining the duty cycle, calculated as follows:
D(max) Vd
=+
VIN(min)
VOUT(OVP)
72.04%
==
35.36 (V) + 0.4 (V)
1
1
10 (V)
(12)
Step 4b Determining the maximum and minimum input current
to the system. The minimum input current will dictate the induc-
tor value. The maximum current rating will dictate the current
rating of the inductor. First, the maximum input current, given:
IOUT
=
#CHANNELS ILED
0.240 A
==
2 0.120 (A)
(13)
then:
IIN(max) =
VIN(min)
VOUT(OVP) IOUT
H
0.94 A
==
35.36 (V)
10 (V) 0.90
240 (mA)
(14)
where is efficiency.
Next, calculate minimum input current, as follows:
IIN(min) =
VIN(max)
VOUT(OVP) IOUT
H
0.67 A
==
35.36 (V)
14 (V) 0.90
240 (mA)
(15)
A good approximation of efficiency, , can be taken from the
efficiency curves located in the datasheet. A value of 90% is a
good starting approximation.
Step 4c Determining the inductor value. To ensure that the induc-
tor operates in continuous conduction mode, the value of the
inductor must be set such that the ½ inductor ripple current is not
greater than the average minimum input current. As a first pass
assume Iripple to be 40% of the maximum inductor current:
IL = IIN(max) × Iripple (16)
= 0.94 (A) × 0.40 = 0.376 A
then:
L=
VIN(min) D(max)
fSW
IL
9.57 H
0.376 (A)
==
0.72
10 (V)
2 (MHz)
(17)
Step 4d Double-check to make sure the ½ current ripple is less
than IIN(min):
IIN(min) > 1/2 IL (18)
0.67 A > 0.19 A
A good inductor value to use would be 10 H.
Step 4e This step is used to verify that there is sufficient slope
compensation for the inductor chosen. The slope compensation
value is determined by the following formula:
2 10
6
Slope Compensation ==
fSW
3.6
3.6 A /s
(19)
Next insert the inductor value used in the design:
=
VIN(min) D(max)
fSW
Lused
ILused
10 (H) 0.36 A
==
0.72
10 (V)
2.0 (MHz)
(20)
Calculate the minimum required slope:
=
(1 – D(max))
(1 – 0.72)
f
SW
Required Slope (min) I
Lused
0.36 (A)
1
1
1
10
6
110
6
==
2.57 A/s
2.0 (MHz)
(21)
If the minimum required slope is greater than the calculated slope
compensation, the inductor value must be increased.
Note: The slope compensation value is in A/s, and 1×10
–6 is a
constant multiplier.
Step 4f Determining the inductor current rating. The inductor
current rating must be greater than the IIN(max) value plus half of
the ripple current IL, calculated as follows:
L(min) = IIN(max) + 1/2 ILused (22)
= 0.94 (A) + 0.36 (A) / 2 = 1.12 A
Step 5 Determining the resistor value for a particular switching
frequency. Use the RFSET values shown in figure 7. For example,
a 10 k resistor will result in a 2 MHz switching frequency.
Step 6 Choosing the proper switching diode. The switching diode
must be chosen for three characteristics when it is used in LED
lighting circuitry. The most obvious two are: current rating of the
diode and reverse voltage rating.
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
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The reverse voltage rating should be such that during operation
condition, the voltage rating of the device is larger than the maxi-
mum output voltage. In this case it is VOUT(OVP).
The peak current through the diode is calculated as:
Idp = IIN(max) + 1/2 ILused (23)
= 0.94 (A) + 0.36 (A) / 2 = 1.12 A
The third major component in deciding the switching diode is the
reverse current, IR , characteristic of the diode. This characteristic
is especially important when PWM dimming is implemented.
During PWM off-time the boost converter is not switching. This
results in a slow bleeding off of the output voltage, due to leakage
currents. IR can be a large contributor, especially at high tempera-
tures. On the diode that was selected in this design, the current
varies between 1 and 100 A.
Step 7 Choosing the output capacitors. The output capacitors
must be chosen such that they can provide filtering for both the
boost converter and for the PWM dimming function. The biggest
factors that contribute to the size of the output capacitor are:
PWM dimming frequency and PWM duty cycle. Another major
contributor is leakage current, ILK
. This current is the combina-
tion of the OVP leakage current as well as the reverse current of
the switching diode. In this design the PWM dimming frequency
is 200 Hz and the minimum duty cycle is 1%. Typically, the volt-
age variation on the output, VCOUT , during PWM dimming must
be less than 250 mV, so that no audible hum can be heard. The
capacitance can be calculated as follows:
COUT =
fPWM(dimming)
1 – D(min)
1 – 0.01
200 (Hz)
ILK
200 (A) 3.96 F
==
0.250 (V)
VCOUT
(24)
A capacitor larger than 3.96 F should be selected due to degra-
dation of capacitance at high voltages on the capacitor. A ceramic
4.7 F 50 V capacitor is a good choice to fulfill this requirement.
Corresponding capacitors include:
Vendor Value Part number
Murata 4.7 F 50 V GRM32ER71H475KA88L
Murata 2.2 F 50 V GRM31CR71H225KA88L
The rms current through the capacitor is given by:
ICOUTrms =
1 – D(max)
D(max) + ILused
IOUT
0.240 (A) 0.39 A
× 12
× 12
==
IIN(max)
1 – 0.72
0.72 + 0.36 (A)
0.94 (A)
(25)
The output capacitor must have a current rating of at least
390 mA. The capacitor selected in this design was a 4.7 F 50 V
capacitor with a 3 A current rating.
Step 8 Selecting input capacitor. The input capacitor must be
selected such that it provides a good filtering of the input voltage
waveform. A good estimation rule is to set the input voltage rip-
ple, VIN
, to be 1% of the minimum input voltage. The minimum
input capacitor requirements are as follows:
CIN =
fSW
0.36 (A)
ILused
0.23 F
8
==
VIN
2 (MHz) 0.1 (V)
8
(26)
The rms current through the capacitor is given by:
CINrms =
(1 – D
IOUT × ILused
0.095 A
12
==
IIN(max)
(1 – 0.72)×
0.240 (A) × 0.36 (A)
0.94 (A)
12
(27)
A good ceramic input capacitor with ratings of 2.2 F 50 V or
4.7 F 50 V will suffice for this application. Corresponding
capacitors include:
Vendor Value Part number
Murata 4.7 F 50 V GRM32ER71H475KA88L
Murata 2.2 F 50 V GRM31CR71H225KA88L
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
29
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Step 9 Choosing the input disconnect switch components. Set
the input disconnect 1X current limit to 3 A by choosing a sense
resistor. The calculated maximum value of the sense resistor is:
RSC(max) = VSENSEtrip / 3.0 (A) (28)
= 0.104 (V) / 3.0 (A) = 0.035
The RSC chosen is 0.033 , a standard.
The trip point voltage must be:
VADJ = 3.0 (A) × 0.033 () = 0.099 (V), therefore
RADJ = (VSENSEtrip VADJ ) / IADJ (typ) (29)
= (0.104 (V) – 0.099 (V)) / 20.3 (A) = 246.31
A value of 249 was chosen for this design.
GATE SW
Q1
L1 D1
CVDD
OVP
VOUT
ROVP COUT
RSC
RADJ
VSENSE
VIN
VDD
PWM/EN
APWM
ISET
FSET/SYNC
AGND PGND
COMP
CPRZ
CZ
LED2
LED1
10 LEDs
each string
FAULT
PAD
A8502
150
VC
10 H 2 A / 60 V
137 k
0.033
249
100 k
RISET
8.25 kRFSET
10 k
4.7 F
CIN
4.7 F
CC
22 nF
RC
20
0.1 F
0.47 F
120 pF
VIN
10 to 14 V
Figure 33. The schematic diagram showing calculated values from the design example above.
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
30
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Design Example for SEPIC Configuration
This section provides a method for selecting component values
when designing an application using the A8502 in SEPIC (Sin-
gle-Ended Primary-Inductor Converter) circuit. SEPIC topology
has the advantage that it can generate a positive output voltage
either higher or lower than the input voltage. The resulting design
is diagrammed in figure 34.
Assumptions: For the purposes of this example, the following are
given as the application requirements:
• VBAT: 6 to 14 V ( VIN(min): 5 V and VIN(max): 16 V )
• Quantity of LED channels, #CHANNELS : 2
• Quantity of series LEDs per channel, #SERIESLEDS : 4
• LED current per channel, ILED
: 120 mA
• LED Vf at 120 mA: 3.3 V
• fSW
: 2 MHz
• TA(max): 65°C
• PWM dimming frequency: 200 Hz, 1% duty cycle
Procedure: The procedure consists of selecting the appropriate
configuration and then the individual component values, in an
ordered sequence.
Step 1 Connect LEDs to pins LED1 and LED2. Note: if only one
LED channel is needed, the unused LEDx pin should be pulled to
ground using a 1.5 k resistor. Alternatively, short the LED1 and
LED2 pins together, and half the LED current, to 60 mA
per channel.
Step 2 Determining the LED current setting resistor RISET:
RISET = (VISET × AISET) / ILED (30)
= (1.003 (V) × 980) / 120 mA = 8.19 k
Choose a 8.25 k resistor 1% resistor (or 16.2 k if ILED is
60mA/channel).
Step 3 Determining the OVP resistor. The OVP resistor is
connected between the OVP pin and the output voltage of the
converter.
Step 3a The first step is determining the maximum voltage based
on the LED requirements. The regulation voltage, VLED , of the
A8502 is 720 mV. A constant term, 2 V, is added to give margin
to the design due to noise and output voltage ripple.
VOUT(OVP) = #SERIESLEDS × Vf + VLED + 2 (V) (31)
= 4 × 3.2 (V) + 0.720 (V) + 2 (V) = 15.9 V
Then the OVP resistor is:
ROVP = (VOUT(OVP) VOVP(th) ) / IOVPH (32)
= (15.9 (V) – 8.1 (V)) / 0.199 (mA) = 39.196 k
where both I
OVPH and VOVP(th) are taken from the Electrical
Characteristics table.
In this case a value of 39.2 k was selected. Below is the actual
value of the minimum OVP trip level with the selected resistor:
VOUT(OVP) = 39.2 (k) × 0.199 (mA) + 8.1 (V) = 15.9 V
Step 3b At this point a quick check must be done to determine if
the conversion ratio is acceptable for the selected frequency.
Dmax = 1 – tSWOFFTIME × fSW (33)
= 1 – 68 (ns) × 2 (MHz) = 86.4%
where the minimum off-time (tSWOFFTIME) is found in the Electri-
cal Characteristics table.
The Theoretical Maximum VOUT is then calculated as:
VOUT(max) =Vd
1 – Dmax
Dmax
VIN(min)
0.4 (V) 30.3 V
==
1 – 0.86
0.86
5 (V)
(34)
where Vd is the diode forward voltage.
The Theoretical Maximum VOUT value must be greater than the
value VOUT(OVP) . If this is not the case, the switching frequency
of the boost converter must be reduced to meet the maximum
duty cycle requirements.
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
31
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Step 4 Selecting the inductor. The inductor must be chosen such
that it can handle the necessary input current. In most applica-
tions, due to stringent EMI requirements, the system must operate
in continuous conduction mode throughout the whole input volt-
age range.
Step 4a Determining the duty cycle, calculated as follows:
D(max) Vd
=+
Vd
+
VOUT(OVP)
+
VIN(min)
VOUT(OVP)
76.5%
==
5 (V) + 15.9 (V) + 0.4 (V)
+ 0.4 (V)
15.9 (V)
(35)
Step 4b Determining the maximum and minimum input current
to the system. The minimum input current will dictate the induc-
tor value. The maximum current rating will dictate the current
rating of the inductor. First, the maximum input current, given:
IOUT
=
#CHANNELS ILED
0.240 A
==
2 0.120 (A)
(36)
then:
IIN(max) =
VIN(min)
VOUT(OVP) IOUT
H
0.848 A
==
15.9 (V)
5 (V) 0.90
0.24 (A)
(37)
where is efficiency.
Next, calculate minimum input current, as follows:
IIN(min) =
VIN(max)
VOUT(OVP) IOUT
H
0.265 A
==
15.9 (V)
16 (V) 0.90
0.24 (A)
(38)
A good approximation of efficiency, , can be taken from the
efficiency curves located in the datasheet. A value of 90% is a
good starting approximation.
Step 4c Determining the inductor value. To ensure that the induc-
tor operates in continuous conduction mode, the value of the
inductor must be set such that the ½ inductor ripple current is not
greater than the average minimum input current. As a first pass
assume Iripple to be 30% of the maximum inductor current:
IL = IIN(max) × Iripple (39)
= 0.848 × 0.30 = 0.254 A
then:
L=
VIN(min) D(max)
fSW
IL
7.53 H
0.254 (A)
==
0.765
5 (V)
2 (MHz)
(40)
Step 4d Double-check to make sure the ½ current ripple is less
than IIN(min):
IIN(min) > 1/2 IL (41)
0.265 A > 0.127 A
A good inductor value to use would be 10 H.
Step 4e Next insert the inductor value used in the design to deter-
mine the actual inductor ripple current:
=
VIN(min) D(max)
fSW
Lused
ILused
10 (H) 0.191 A
==
0.765
5 (V)
2.0 (MHz)
(42)
Step 4f Determining the inductor current rating. The inductor
current rating must be greater than the IIN(max) value plus half of
the ripple current IL, calculated as follows:
L(min) = IIN(max) + 1/2 ILused (43)
= 0.848 (A) + 0.096 (A) = 0.944 A
Step 5 Determining the resistor value for a particular switching
frequency. Use the RFSET values shown in figure 7. For example,
a 10 k resistor will result in a 2 MHz switching frequency.
Step 6 Choosing the proper switching diode. The switching diode
must be chosen for three characteristics when it is used in LED
lighting circuitry. The most obvious two are: current rating of the
diode and reverse voltage rating.
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
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Allegro MicroSystems, Inc.
115 Northeast Cutoff
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The reverse breakdown voltage rating for the output diode in a
SEPIC circuit should be:
VBD > VOUT(OVP)(max) + VIN(max) (44)
> 15.9 (V) + 16 (V) = 31.9 V
because the maximum output voltage in this case is VOUT(OVP).
The peak current through the diode is calculated as:
Idp = IIN(max) + 1/2 ILused (45)
= 0.848 (A) + 0.096 (A) = 0.944 A
The third major component in deciding the switching diode is the
reverse current, IR , characteristic of the diode. This characteristic
is especially important when PWM dimming is implemented.
During PWM off-time the boost converter is not switching. This
results in a slow bleeding off of the output voltage, due to leakage
currents. IR can be a large contributor, especially at high tempera-
tures. On the diode that was selected in this design, the current
varies between 1 and 100 A. It is often advantageous to pick a
diode with a much higher breakdown voltage, just to reduce the
reverse current. Therefore for this example, pick a diode rated for
a VBD of 60 V, instead of just 40 V.
Step 7 Choosing the output capacitors. The output capacitors
must be chosen such that they can provide filtering for both the
boost converter and for the PWM dimming function. The biggest
factors that contribute to the size of the output capacitor are:
PWM dimming frequency and PWM duty cycle. Another major
contributor is leakage current, ILK
. This current is the combina-
tion of the OVP leakage current as well as the reverse current of
the switching diode. In this design the PWM dimming frequency
is 200 Hz and the minimum duty cycle is 1%. Typically, the volt-
age variation on the output, VCOUT , during PWM dimming must
be less than 250 mV, so that no audible hum can be heard. The
capacitance can be calculated as follows:
COUT =
fPWM(dimming)
1 – D(min)
1 – 0.01
200 (Hz)
ILK
200 (A) 3.96 F
==
0.250 (V)
VCOUT
(46)
A capacitor larger than 3.96 F should be selected due to degra-
dation of capacitance at high voltages on the capacitor. Select a
4.7 F capacitor for this application.
The rms current through the capacitor is given by:
ICOUTrms =
1 – D(max)
D(max)
IOUT
0.240 (A) 0.433 A
==
1 – 0.765
0.765
(47)
The output capacitor must have a ripple current rating of at least
500 mA. The capacitor selected for this design is a 4.7 F 50 V
capacitor with a 1.5 A current rating.
Step 8 Selecting input capacitor. The input capacitor must be
selected such that it provides a good filtering of the input voltage
waveform. A estimation rule is to set the input voltage ripple,
VIN
, to be 1% of the minimum input voltage. The minimum
input capacitor requirements are as follows:
CIN =
fSW
0.191 (A)
ILused
0.24 F
8
==
VIN
2 (MHz) 0.05 (V)
8
(48)
The rms current through the capacitor is given by:
CINrms =
ILused
0.055 A
12
==
0.191 (A)
12
(49)
A good ceramic input capacitor with a rating of 2.2 F 25 V will
suffice for this application.
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
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Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Figure 34. Typical application showing SEPIC configuration, designed according to the application example.
Step 9 Selecting coupling capacitor CSW. The minimum capaci-
tance of CSW is related to the maximum voltage ripple allowed
across it:
CSW =
fSW
0.24 (A) 0.765
IOUT DMAX
0.92 F
==
VSW
2 (MHz)0.1 (V)
(50)
The rms current requirement of the coupling capacitor is given
by:
ICSWrms =
1 – D(max)
D(max)
IIN
0.848 (A) 0.47 A
==
1 – 0.765
0.765
(51)
The voltage rating of the coupling capacitor must be greater than
VIN(max), or 16 V in this case. A ceramic capacitor rated for
2.2 F 25V will suffice for this application.
GATE SW
Q1
L1 D1
CVDD
OVP
VOUT
COUT
RSC
RADJ
VSENSE
VIN
VDD
PWM/EN
APWM
ISET
FSET/SYNC
AGND PGND
COMP
CPRZ
CZ
LED2
LED1
FAULT
PAD
A8502
VC
RISET RFSET
CIN
2.2 F
0.1 F
2.2 F
4.7 F
0.47 F
120 pF
100 k
10 k8.25 k
0.033
20
39.2 k
150
22 nF
10 H2 A / 60 V
10 H
249
CC
RC
VIN
6 to 14 V
ROVP
L2
CSW
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
34
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Package LP, 16-Pin TSSOP with Exposed Thermal Pad
A
1.20 MAX
0.15
0.00
0.30
0.19
0.20
0.09
0.60 ±0.15
1.00 REF
C
SEATING
PLANE
C0.10
16X
0.65 BSC
0.25 BSC
21
16
5.00±0.10
4.40±0.10 6.40±0.20
GAUGE PLANE
SEATING PLANE
ATerminal #1 mark area
B
For Reference Only; not for tooling use (reference MO-153 ABT)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
B
C
Exposed thermal pad (bottom surface); dimensions may vary with device
6.10
0.65
0.45
1.70
3.00
3.00
16
21
Reference land pattern layout (reference IPC7351
SOP65P640X110-17M);
All pads a minimum of 0.20 mm from all adjacent pads; adjust as
necessary to meet application process requirements and PCB layout
tolerances; when mounting on a multilayer PCB, thermal vias at the
exposed thermal pad land can improve thermal dissipation (reference
EIA/JEDEC Standard JESD51-5)
PCB Layout Reference View
C
Branded Face
3 NOM
3 NOM
W ide Input Voltage Range, High Ef ficiency
Fault Tolerant LED Driver
A8502
35
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Copyright ©2011-2012, Allegro MicroSystems, Inc.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to per-
mit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, Inc. assumes no re spon si bil i ty for its use;
nor for any in fringe ment of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
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Revision History
Revision Revision Date Description of Revision
Rev. 3 January 16, 2012 Update Features list and gm