1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
C2+
C2−
V−
RIN1
RIN2
RIN3
RIN4
RIN5
DOUT1
DOUT2
DOUT3
DIN3
DIN2
DIN1
C1+
V+
VCC
GND
C1−
FORCEON
FORCEOFF
INVALID
ROUT2B
ROUT1
ROUT2
ROUT3
ROUT4
ROUT5
DB, DW, OR PW PACKAGE
(TOP VIEW)
QFN PACKAGE
(TOP VIEW)
GND
C1–
FORCEON
FORCEOFF
INVALID
ROUTB2
ROUT1
ROUT2
RIN1
RIN2
RIN3
RIN4
RIN5
DOUT1
DOUT2
DOUT3
NC
V–
C2–
C2+
C1+
V+
VCC
NC
NC
DIN3
DIN2
DIN1
ROUT5
ROUT4
ROUT3
NC
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
3132 30 29 28 27 26 25
109 11 12 13 14 15 16
MAX3243E
www.ti.com
SLLS657D APRIL 2005REVISED SEPTEMBER 2011
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
Check for Samples: MAX3243E
1FEATURES
2Single-Chip and Single-Supply Interface for
IBMPC/ATSerial Port
ESD Protection for RS-232 Bus Pins
±15-kV Human-Body Model (HBM)
±8-kV IEC61000-4-2, Contact Discharge
±15-kV IEC61000-4-2, Air-Gap Discharge
Meets or Exceeds Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operates With 3-V to 5.5-V VCC Supply
Always-Active Noninverting Receiver Output
(ROUT2B)
Designed to Transmit at a Data Rate up to
500 kbit/s
Low Standby Current . . . 1 μA Typ
External Capacitors . . . 4 ×0.1 μF
Accepts 5-V Logic Input With 3.3-V Supply
Designed to Be Interchangeable With Maxim
MAX3243E
Serial-Mouse Driveability
Auto-Powerdown Feature to Disable Driver
Outputs When No Valid RS-232 Signal Is
Sensed
Package Options Include Plastic Small-Outline
(DW), Shrink Small-Outline (DB), and Thin
Shrink Small-Outline (PW) Packages
APPLICATIONS
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2IBM, PC/AT are trademarks of International Business Machines Corporation.
PRODUCTION DATA information is current as of publication date. Copyright ©20052011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
MAX3243E
SLLS657D APRIL 2005REVISED SEPTEMBER 2011
www.ti.com
DESCRIPTION
The MAX3243E device consists of three line drivers, five line receivers, and a dual charge-pump circuit with
±15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge)
protection on serial-port connection pins. The device meets the requirements of TIA/EIA-232-F and provides the
electrical interface between an asynchronous communication controller and the serial-port connector. This
combination of drivers and receivers matches that needed for the typical serial port used in an IBM PC/AT, or
compatible. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V
supply. In addition, the device includes an always-active noninverting output (ROUT2B), which allows
applications using the ring indicator to transmit data while the device is powered down. The device operates at
data signaling rates up to 250 kbit/s and a maximum of 30-V/μs driver output slew rate.
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is
set low, both drivers and receivers (except ROUT2B) are shut off, and the supply current is reduced to 1 μA.
Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high, and should be done when driving
a serial mouse. With auto-powerdown enabled, the device is activated automatically when a valid signal is
applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any
receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than 2.7 V
or has been between 0.3 V and 0.3 V for less than 30 μs. INVALID is low (invalid data) if all receiver input
voltages are between 0.3 V and 0.3 V for more than 30 μs. Refer to Figure 5 for receiver input levels.
The MAX3243EC is characterized for operation from 0°C to 70°C. The MAX3243EI is characterized for operation
from 40°C to 85°C.
ORDERING INFORMATION
TAPACKAGE(1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING
MAX3243ECDW
SOIC DW Tape and reel MAX3243EC
MAX3243ECDWR
MAX3243ECDB
SSOP DB Tape and reel MAX3243EC
0°C to 70°C MAX3243ECDBR
MAX3243ECPW
TSSOP PW Tape and reel MP243EC
MAX3243ECPWR
QFN RHB Tape and reel MAX3243ECRHBR MP243E
MAX3243EIDB
SSOP DB Tape and reel MAX3243EI
MAX3243EIDBR
MAX3243EIDW
SOIC DW Tape and reel MAX3243EI
40°C to 85°C MAX3243EIDWR
MAX3243EIPW
TSSOP PW Tape and reel MP243EI
MAX3243EIPWR
QFN RHB Tape and reel MAX3243EIRHBR MR243E
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
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Product Folder Link(s): MAX3243E
MAX3243E
www.ti.com
SLLS657D APRIL 2005REVISED SEPTEMBER 2011
FUNCTION TABLES
ABC
Each Driver(1)
INPUTS OUTPUT DRIVER STATUS
VALID RIN
DIN FORCEON FORCEOFF DOUT
RS-232 LEVEL
X X L X Z Powered off
L H H X H Normal operation with
auto-powerdown disabled
H H H X L
L L H Yes H Normal operation with
auto-powerdown enabled
H L H Yes L Powered off by auto-powerdown
X L H No Z feature
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
Each Receiver(1)
INPUTS OUTPUT RECEIVER STATUS
RIN FORCEON FORCEOFF ROUT
X X L Z Powered off
L X H H Normal operation with
H X H L auto-powerdown disabled/enabled
Open X H H
(1) H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
ROUT2B and Outputs INVALID (1)
INPUTS OUTPUTS OUTPUT STATUS
VALID RIN RIN2 FORCEON FORCEOFF INVALID ROUT2B
RS-232 LEVEL
Yes L X X H L
Yes H X X H H Always active
Yes Open X X H L
No Open X X L L
(1) H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
Copyright ©20052011, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): MAX3243E
DIN3
DIN2
DIN1
DOUT3
DOUT2
DOUT1
Auto-powerdown INVALID
RIN1
RIN2
RIN3
RIN4
RIN5
FORCEOFF
FORCEON
ROUT1
ROUT2B
ROUT2
ROUT3
ROUT4
ROUT5
14
13
12
22
23
19
20
18
17
16
15
9
10
11
21
4
5
6
7
8
MAX3243E
SLLS657D APRIL 2005REVISED SEPTEMBER 2011
www.ti.com
LOGIC DIAGRAM (POSITIVE LOGIC)
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Product Folder Link(s): MAX3243E
MAX3243E
www.ti.com
SLLS657D APRIL 2005REVISED SEPTEMBER 2011
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC Supply voltage range(2) 0.3 6 V
V+ Positive output supply voltage range(2) 0.3 7 V
VNegative output supply voltage range(2) 0.3 7 V
V+ VOutput supply voltage difference(2) 13 V
Driver (FORCEOFF, FORCEON) 0.3 6
VIInput voltage range V
Receiver 25 25
Driver 13.2 13.2
VOOutput voltage range V
Receiver (INVALID) 0.3 VCC + 0.3
DB package 62
θJA Package thermal impedance(3) (4) DW package 46 °C/W
PW package 62
Lead temperature 1,6 mm (1/16 in) from case for 10 s 260 °C
Tstg Storage temperature range 65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions"is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD= (TJ(max) - TA)/θJA. Operating at the absolute maximum TJof 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS(1)
See Figure 6 MIN NOM MAX UNIT
VCC = 3.3 V 3 3.3 3.6
Supply voltage V
VCC = 5 V 4.5 5 5.5
VCC = 3.3 V 2
VIH Driver and control high-level input voltage DIN, FORCEOFF, FORCEON V
VCC = 5 V 2.4
VIL Driver and control low-level input voltage DIN, FORCEOFF, FORCEON 0.8 V
VIDriver and control input voltage DIN, FORCEOFF, FORCEON 0 5.5 V
VIReceiver input voltage 25 25 V
MAX3243EC 0 70
TAOperating free-air temperature °C
MAX3243EI 40 85
(1) Test conditions are C1C4 = 0.1 μF at VCC = 3.3 V ±0.3 V; C1 = 0.047 μF, C2C4 = 0.33 μF at VCC = 5 V ±0.5 V.
ELECTRICAL CHARACTERISTICS(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
IIInput leakage current FORCEOFF, FORCEON ±0.01 ±1μA
No load,
Auto-powerdown disabled 0.3 1 mA
FORCEOFF and FORCEON at VCC
Powered off No load, FORCEOFF at GND 1 10
Supply current
ICC No load, FORCEOFF at VCC,
(TA= 25°C) μA
FORCEON at GND,
Auto-powerdown enabled 1 10
All RIN are open or grounded,
All DIN are grounded
(1) Test conditions are C1C4 = 0.1 μF at VCC = 3.3 V ±0.3 V; C1 = 0.047 μF, C2C4 = 0.33 μF at VCC = 5 V ±0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
Copyright ©20052011, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): MAX3243E
MAX3243E
SLLS657D APRIL 2005REVISED SEPTEMBER 2011
www.ti.com
DRIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
VOH High-level output voltage All DOUT at RL= 3 kto GND 5 5.4 V
VOL Low-level output voltage All DOUT at RL= 3 kto GND 55.4 V
Output voltage DIN1 = DIN2 = GND, DIN3 = VCC, 3-kto GND at DOUT3,
VO±5 V
(mouse driveability) DOUT1 = DOUT2 = 2.5 mA
IIH High-level input current VI= VCC ±0.01 ±1μA
IIL Low-level input current VIat GND ±0.01 ±1μA
Vhys Input hysteresis ±1 V
VCC = 3.6 V, VO= 0 V
IOS Short-circuit output current(3) ±60 mA
VCC = 5.5 V, VO= 0 V
roOutput resistance VCC, V+, and V= 0 V, VO=±2 V 300 10M
Ioff Output leakage current FORCEOFF = GND, VO=±12 V, VCC = 0 to 5.5 V ±25 μA
(1) Test conditions are C1C4 = 0.1 μF at VCC = 3.3 V ±0.3 V; C1 = 0.047 μF, C2C4 = 0.33 μF at VCC = 5 V ±0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise
noted) (see Figure 6)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
CL= 1000 pF, RL= 3 k
Maximum data rate 250 500 kbit/s
One DOUT switching, See Figure 1
tsk(p) Pulse skew(3) CL= 150 pF to 2500 pF, RL= 3 kto 7 k, See Figure 2 100 ns
VCC = 3.3 V, CL= 150 pF to 1000 pF 6 30
Slew rate, transition region
SR(tr) RL= 3 kto 7 k, V/μs
(see Figure 1) CL= 150 pF to 2500 pF 4 30
PRR = 250 kbit/s
(1) Test conditions are C1C4 = 0.1 μF at VCC = 3.3 V + 0.3 V; C1 = 0.047 μF, C2C4 = 0.33 μF at VCC = 5 V ±0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
(3) Pulse skew is defined as |tPLH tPHL| of each channel of the same device.
ESD Protection
PARAMETER TEST CONDITIONS TYP UNIT
HBM ±15 kV
Driver outputs (pins 911) IEC61000-4-2, Air-Gap Discharge ±15 kV
IEC61000-4-2, Contact Discharge ±8 kV
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Product Folder Link(s): MAX3243E
MAX3243E
www.ti.com
SLLS657D APRIL 2005REVISED SEPTEMBER 2011
RECEIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
VOH High-level output voltage IOH =1 mA VCC 0.6 VCC 0.1 V
VOL Low-level output voltage IOH = 1.6 mA 0.4 V
VCC = 3.3 V 1.6 2.4
VIT+ Positive-going input threshold voltage V
VCC = 5 V 1.9 2.4
VCC = 3.3 V 0.6 1.1
VITNegative-going input threshold voltage V
VCC = 5 V 0.8 1.4
Vhys Input hysteresis (VIT+ VIT) 0.5 V
Ioff Output leakage current (except ROUT2B) FORCEOFF = 0 V ±0.05 ±10 μA
riInput resistance VI=±3 V or ±25 V 3 5 7 kΩ
(1) Test conditions are C1C4 = 0.1 μF at VCC = 3.3 V ±0.3 V; C1 = 0.047 μF, C2C4 = 0.33 μF at VCC = 5 V ±0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS TYP(2) UNIT
tPLH Propagation delay time, low- to high-level output CL= 150 pF, See Figure 3 150 ns
tPHL Propagation delay time, high- to low-level output 150 ns
ten Output enable time CL= 150 pF, RL= 3 kΩ, See Figure 4 200 ns
tdis Output disable time 200 ns
tsk(p) Puse skew(3) See Figure 3 50 ns
(1) Test conditions are C1C4 = 0.1 μF at VCC = 3.3 V ±0.3 V; C1 = 0.047 μF, C2C4 = 0.33 μF at VCC = 5 V ±0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
(3) Pulse skew is defined as |tPLH - tPHL| of each channel of the same device.
ESD Protection
PARAMETER TEST CONDITIONS TYP UNIT
HBM ±15 kV
Driver outputs (pins 48) IEC61000-4-2, Air-Gap discharge ±15 kV
IEC61000-4-2, Contact Discharge ±8 kV
Copyright ©20052011, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): MAX3243E
MAX3243E
SLLS657D APRIL 2005REVISED SEPTEMBER 2011
www.ti.com
AUTO-POWERDOWN SECTION
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER TEST CONDITIONS MIN MAX UNIT
Receiver input threshold FORCEON = GND,
VIT+(valid) 2.7 V
for INVALID high-level output voltage FORCEOFF = VCC
Receiver input threshold FORCEON = GND,
VIT(valid) 2.7 V
for INVALID high-level output voltage FORCEOFF = VCC
Receiver input threshold FORCEON = GND,
VT(invalid) 0.3 0.3 V
for INVALID low-level output voltage FORCEOFF = VCC
IOH = -1 mA, FORCEON = GND,
VOH INVALID high-level output voltage VCC 0.6 V
FORCEOFF = VCC
IOL = 1.6 mA, FORCEON = GND,
VOL INVALID low-level output voltage 0.4 V
FORCEOFF = VCC
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER TEST CONDITIONS TYP(1) UNIT
tvalid Propagation delay time, low- to high-level output VCC = 5 V 1 μs
tinvalid Propagation delay time, high- to low-level output VCC = 5 V 30 μs
ten Supply enable time VCC = 5 V 100 μs
(1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA= 25°C.
8Submit Documentation Feedback Copyright ©20052011, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
50
TEST CIRCUIT VOLTAGE WAVEFORMS
−3 V
−3 V
3 V
3 V
0 V
3 V
Output
Input
VOL
VOH
tTLH
Generator
(see Note B) RL
3 V
FORCEOFF
RS-232
Output
tTHL
CL
(see Note A)
SR(tr) +6 V
tTHL or tTLH
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.
50
TEST CIRCUIT VOLTAGE WAVEFORMS
0 V
3 V
Output
Input
VOL
VOH
tPLH
Generator
(see Note B) RL
3 V
FORCEOFF
RS-232
Output
tPHL
CL
(see Note A)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.
50% 50%
1.5 V 1.5 V
TEST CIRCUIT VOLTAGE WAVEFORMS
50
−3 V
3 V
Output
Input
VOL
VOH
tPHL
Generator
(see Note B) tPLH
Output
CL
(see Note A)
3 V or 0 V
FORCEON
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.
3 V
FORCEOFF
1.5 V 1.5 V
50% 50%
MAX3243E
www.ti.com
SLLS657D APRIL 2005REVISED SEPTEMBER 2011
PARAMETER MEASUREMENT INFORMATION
Figure 1. Driver Slew Rate
Figure 2. Driver Pulse Skew
Figure 3. Receiver Propagation Delay Times
Copyright ©20052011, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): MAX3243E
TEST CIRCUIT VOLTAGE WAVEFORMS
50
Generator
(see Note B)
3 V or 0 V Output
VOL
VOH
tPZH
(S1 at GND)
3 V
−3 V
0.3 V
Output
Input
0.3 V
3 V or 0 V
FORCEON
FORCEOFF
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.
C. tPLZ and tPHZ are the same as tdis.
D. tPZL and tPZH are the same as ten.
1.5 V 1.5 V
50%
tPHZ
(S1 at GND)
tPLZ
(S1 at VCC)
50%
tPZL
(S1 at VCC)
RL
S1
VCC GND
CL
(see Note A)
Output
MAX3243E
SLLS657D APRIL 2005REVISED SEPTEMBER 2011
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Figure 4. Receiver Enable and Disable Times
10 Submit Documentation Feedback Copyright ©20052011, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
TEST CIRCUIT VOLTAGE WAVEFORMS
50
3 V
2.7 V
−2.7 V
INVALID
Output
Receiver
Input
Generator
(see Note B)
FORCEOFF
tvalid
ROUT
FORCEON
Auto-
powerdown INVALID
DOUT
0 V
0 V
−3 V
DIN
CL = 30 pF
(see Note A)
VCC
0 V
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
2.7 V
−2.7 V
0.3 V
−0.3 V
0 V
Valid RS-232 Level, INVALID High
Indeterminate
Indeterminate
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low
Valid RS-232 Level, INVALID High
Auto-powerdown disables drivers and reduces supply
current to 1 µA.
V+
0 V
V−
V+
VCC
ten
V−
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.
50% VCC 50% VCC
2.7 V
−2.7 V
0.3 V
0.3 V
tinvalid
Supply
Voltages
MAX3243E
www.ti.com
SLLS657D APRIL 2005REVISED SEPTEMBER 2011
PARAMETER MEASUREMENT INFORMATION
Figure 5. INVALID Propagation Delay Timnes and Supply Enabling Time
Copyright ©20052011, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Link(s): MAX3243E
MAX3243E
SLLS657D APRIL 2005REVISED SEPTEMBER 2011
www.ti.com
APPLICATION INFORMATION
Figure 6. Typical Operating Circuit and Capacitor Values
12 Submit Documentation Feedback Copyright ©20052011, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
+DUT
RD
1.5 k
VHBM 100 pF
CS
MAX3243E
www.ti.com
SLLS657D APRIL 2005REVISED SEPTEMBER 2011
APPLICATION INFORMATION
ESD Protection
TI MAX3243E devices have standard ESD protection structures incorporated on the pins to protect against
electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver
outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures
were designed to successfully protect these bus pins against ESD discharge of ±15-kV in all states: normal
operation, shutdown, and powered down. The MAX3243E devices are designed to continue functioning properly
after an ESD occurrence without any latchup.
The MAX3243E devices have three specified ESD limits on the driver outputs and receiver inputs, with respect to
GND:
±15-kV Human Body Model (HBM)
±15-kV IEC61000-4-2, Air-Gap Discharge (formerly IEC1000-4-2)
±8-kV IEC61000-4-2, Contact Discharge
ESD Test Conditions
ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a
reliability report that documents test setup, methodology, and results.
Human Body Model (HBM)
The Human Body Model of ESD testing is shown in Figure 7, while Figure 8 shows the current waveform that is
generated during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the
ESD voltage of concern, and subsequently discharged into the DUT through a 1.5k-Ωresistor.
Figure 7. HBM ESD Test Circuit
Copyright ©20052011, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Link(s): MAX3243E
100 150 20050
0
1.5
1.0
0.5
0.0
DUT = 10-V 1- Zener Diode
VHBM = 2 kV
Time (ns)
IDUT(A)
+DUT
150 pF
CS
RCRD
50−100 M330
High-Voltage
DC Source
MAX3243E
SLLS657D APRIL 2005REVISED SEPTEMBER 2011
www.ti.com
APPLICATION INFORMATION
Figure 8. Typical HBM Current Waveform
IEC61000-4-2 (Formerly Known as IEC1000-4-2)
Unlike the HBM, MM, and CDM ESD tests that apply to component level integrated circuits, the IEC61000-4-2 is
a system-level ESD testing and performance standard that pertains to the end equipment. The MAX3243E is
designed to enable the manufacturer in meeting the highest level (Level 4) of IEC61000-4-2 ESD protection with
no further need of external ESD protection circuitry. The more stringent IEC test standard has a higher peak
current than the HBM, due to the lower series resistance in the IEC model.
Figure 9 shows the IEC61000-4-2 model, and Figure 10 shows the current waveform for the corresponding
±8-kV Contact-Discharge (Level 4) test. This waveform is applied to a probe that has been connected to the
DUT. On the other hand, the corresponding ±15-kV (Level 4) Air-Gap Discharge test involves approaching the
DUT with an already energized probe.
Figure 9. Simplified IEC61000-4-2 ESD Test Circuit
14 Submit Documentation Feedback Copyright ©20052011, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
(30A) 100%
90%
10%
30 ns 60 ns
I
t
tr = 0.7 ns to 1 ns
IPeak
(8A)
(16A)
(Vcontact = 8 kV)
MAX3243E
www.ti.com
SLLS657D APRIL 2005REVISED SEPTEMBER 2011
APPLICATION INFORMATION
Figure 10. Typical Current Waveform of IEC61000-4-2 ESD Generator
Machine Model
The Machine Model (MM) ESD test applies to all pins using a 200-pF capacitor with no discharge resistance.
The purpose of the MM test is to simulate possible ESD conditions that can occur during the handling and
assembly processes of manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins.
However, after PC board assembly, the MM test is no longer as pertinent to the RS-232 pins.
Copyright ©20052011, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Link(s): MAX3243E
MAX3243E
SLLS657D APRIL 2005REVISED SEPTEMBER 2011
www.ti.com
REVISION HISTORY
Changes from Revision C (February 2009) to Revision D Page
Deleted "VALID RIN RS-232 LEVEL"from INPUTS. ........................................................................................................... 3
Deleted "ROUT2B is active"RECEIVER STATUS and combined ROUT outputs. .............................................................. 3
Added New Table "ROUT2B and INVALID Outputs"defining truth table for ROUT2B and INVALID outputs. ................... 3
Changed VALID_RINentry from YESto NO................................................................................................................ 3
16 Submit Documentation Feedback Copyright ©20052011, Texas Instruments Incorporated
Product Folder Link(s): MAX3243E
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
MAX3243ECDB ACTIVE SSOP DB 28 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3243EC
MAX3243ECDBG4 ACTIVE SSOP DB 28 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3243EC
MAX3243ECDBR ACTIVE SSOP DB 28 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3243EC
MAX3243ECDW ACTIVE SOIC DW 28 20 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3243EC
MAX3243ECDWR ACTIVE SOIC DW 28 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3243EC
MAX3243ECPW ACTIVE TSSOP PW 28 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP243EC
MAX3243ECPWE4 ACTIVE TSSOP PW 28 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP243EC
MAX3243ECPWR ACTIVE TSSOP PW 28 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP243EC
MAX3243ECPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP243EC
MAX3243ECRHBR ACTIVE VQFN RHB 32 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 MP243E
MAX3243EIDB ACTIVE SSOP DB 28 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3243EI
MAX3243EIDBR ACTIVE SSOP DB 28 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3243EI
MAX3243EIDW ACTIVE SOIC DW 28 20 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3243EI
MAX3243EIDWR ACTIVE SOIC DW 28 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3243EI
MAX3243EIDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3243EI
MAX3243EIPW ACTIVE TSSOP PW 28 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP243EI
MAX3243EIPWE4 ACTIVE TSSOP PW 28 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP243EI
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
MAX3243EIPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP243EI
MAX3243EIPWR ACTIVE TSSOP PW 28 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP243EI
MAX3243EIPWRE4 ACTIVE TSSOP PW 28 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP243EI
MAX3243EIPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP243EI
MAX3243EIRHBR ACTIVE VQFN RHB 32 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 MR243E
MAX3243EIRHBRG4 ACTIVE VQFN RHB 32 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 MR243E
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 3
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
MAX3243ECDWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1
MAX3243ECPWR TSSOP PW 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1
MAX3243ECRHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2
MAX3243EIDWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1
MAX3243EIPWR TSSOP PW 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1
MAX3243EIRHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Jul-2018
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MAX3243ECDWR SOIC DW 28 1000 367.0 367.0 55.0
MAX3243ECPWR TSSOP PW 28 2000 367.0 367.0 38.0
MAX3243ECRHBR VQFN RHB 32 3000 367.0 367.0 35.0
MAX3243EIDWR SOIC DW 28 1000 367.0 367.0 55.0
MAX3243EIPWR TSSOP PW 28 2000 367.0 367.0 38.0
MAX3243EIRHBR VQFN RHB 32 3000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Jul-2018
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
26X 0.65
2X
8.45
28X 0.38
0.22
8.2
7.4 TYP
SEATING
PLANE
0.05 MIN
0.25
GAGE PLANE
0 -8
2 MAX
B5.6
5.0
NOTE 4
A
10.5
9.9
NOTE 3
0.95
0.55
(0.15) TYP
SSOP - 2 mm max heightDB0028A
SMALL OUTLINE PACKAGE
4214853/B 03/2018
1
14 15
28
0.15 C A B
PIN 1 INDEX AREA
SEE DETAIL A
0.1 C
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-150.
A 15
DETAIL A
TYPICAL
SCALE 1.500
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
28X (1.85)
28X (0.45)
26X (0.65)
(7)
(R0.05) TYP
SSOP - 2 mm max heightDB0028A
SMALL OUTLINE PACKAGE
4214853/B 03/2018
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SYMM
SYMM
1
14 15
28
15.000
METAL
SOLDER MASK
OPENING METAL UNDER
SOLDER MASK SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK DETAILS
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
28X (1.85)
28X (0.45)
26X (0.65)
(7)
(R0.05) TYP
SSOP - 2 mm max heightDB0028A
SMALL OUTLINE PACKAGE
4214853/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
SYMM
SYMM
1
14 15
28
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Mouser Electronics
Authorized Distributor
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MAX3243EIRHBRG4 MAX3243ECDB MAX3243ECDBE4 MAX3243ECDBR MAX3243ECDBRE4 MAX3243ECDW
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MAX3243EIDBR MAX3243EIDW MAX3243EIDWR MAX3243EIPW MAX3243EIPWE4 MAX3243EIPWR
MAX3243EIPWRE4 MAX3243ECRHBR MAX3243EIRHBR MAX3243ECDBG4 MAX3243ECPWG4
MAX3243ECPWRG4 MAX3243EIDBG4 MAX3243EIDWRG4 MAX3243EIPWG4 MAX3243EIPWRG4