LM26CIM5-YPE/NOPB - Texas Instruments

LM26NV

www.ti.com

SNIS151B –AUGUST 2008–REVISED MARCH 2013

LM26NV SOT-23, ±3°C Accurate, Factory Preset Thermostat

(LM26 without V

TEMP

output)

Check for Samples: LM26NV

1FEATURES DESCRIPTION

The LM26NV is a precision, single digital-output, low-

2• Internal Comparator with Pin Programmable power thermostat comprised of an internal reference,

2°C or 10°C Hysteresis DAC, temperature sensor and comparator. Utilizing

• No External Components Required factory programming, it can be manufactured with

• Open Drain or Push-Pull Digital Output; different trip points as well as different digital output

functionality. The trip point (TOS) can be preset at the

Supports CMOS Logic Levels factory to any temperature in the range of −55°C to

• Internal Temperature Sensor +110°C in 1°C increments. The LM26NV has one

• Internal Voltage Reference and DAC for Trip- digital output (OS/OS/US/US) and one digital input

Point Setting (HYST). The digital output stage can be preset as

either open-drain or push-pull. In addition, it can be

• Currently Available in 5-Pin SOT-23 Plastic factory programmed to be active HIGH or LOW. The

Package digital output can be factory programmed to indicate

• Excellent Power Supply Noise Rejection an over temperature shutdown event (OS or OS) or

an under temperature shutdown event (US or US).

APPLICATIONS When preset as an overtemperature shutdown (OS),

it will go LOW to indicate that the die temperature is

• Microprocessor Thermal Management over the internally preset TOS and go HIGH when the

• Appliances temperature goes below (TOS–THYST). Similarly, when

• Portable Battery Powered Systems preprogrammed as an undertemperature shutdown

(US) it will go HIGH to indicate that the temperature

• Fan Control is below TUS and go LOW when the temperature is

• Industrial Process Control above (TUS+THYST). The typical hysteresis, THYST, can

• HVAC Systems be set to 2°C or 10°C and is controlled by the state of

• Remote Temperature Sensing the HYST pin.

• Electronic System Protection Available parts are detailed in the ordering

information. For other part options, contact a Texas

KEY SPECIFICATIONS Instruments Distributor or Sales Representative for

information on minimum order qualification. The

• Power Supply Voltage: 2.7V to 5.5 V LM26NV is currently available in a 5-lead SOT-23

• Power Supply Current: package.

– 40µA(max)

– 20µA(typ)

• Hysteresis Temperature: 2°C or 10°C(typ)

Table 1. Temperature Trip Point Accuracy

Temperature Range LM26NV

−55°C to +110°C ±3°C (max)

+120°C ±4°C (max)

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

V+ = 2.7V

to 5.5V

GND

HYST OS

HYST

REF

TEMP

SENSOR

HYST = GND for 10°C Hysteresis

HYST = V+ for 2°C Hysteresis

TOS

TOS - THYST Temp. of

Leads

LM26NV

V+

NC or

GND

HYST 1

5OS, OS,

US, or US

LM26NV

SNIS151B –AUGUST 2008–REVISED MARCH 2013

www.ti.com

Connection Diagram

Figure 1. 5-Lead SOT-23

See DBV Package

PIN DESCRIPTIONS

Pin Pin Function Connection

Number Name

1 HYST Hysteresis control, digital input GND for 10°C or V+for 2°C

2 GND Ground, connected to the back side of the die System GND

through lead frame.

3 NC Not Connected Inside Part Ground or No Connect

4 V+Supply input 2.7V to 5.5V with a 0.1µF bypass capacitor. For PSRR

information see Section Titled NOISE CONSIDERATIONS.

5(1) OS Overtemperature Shutdown open-drain active low Controller interrupt, system or power supply shutdown; pull-up

thermostat digital output resistor ≥10kΩ

OS Overtemperature Shutdown push-pull active high Controller interrupt, system or power supply shutdown

thermostat digital output

US Undertemperature Shutdown open-drain active System or power supply shutdown; pull-up resistor ≥10kΩ

low thermostat digital output

US Undertemperature Shutdown push-pull active System or power supply shutdown

high thermostat digital output

(1) Pin 5 functionality and trip point setting are programmed during LM26NV manufacture.

LM26CIM5-YPE Simplified Block Diagram and Connection Diagram

The LM26CIM5-YPE has a fixed trip point of 115°C. For other trip point and output function availability, please see

ordering information or contact Texas Instruments.

Figure 2.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Product Folder Links: LM26NV

LM26NV

www.ti.com

SNIS151B –AUGUST 2008–REVISED MARCH 2013

Absolute Maximum Ratings (1)

Input Voltage 6.0V

Input Current at any pin (2) 5mA

Package Input Current(2) 20mA

Package Dissipation at TA= 25°C(3) 500mW

Soldering Information(4)

SOT-23 Package Vapor Phase (60 seconds) 215°C

Infrared (15 seconds) 220°C

Storage Temperature −65°C to + 150°C

ESD Susceptibility (5) Human Body Model 2500V

Machine Model 250V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions.

(2) When the input voltage (VI) at any pin exceeds the power supply (VI< GND or VI> V+), the current at that pin should be limited to 5mA.

The 20mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input

current of 5mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5mA each.

(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),

θJA (junction to ambient thermal resistance) and TA(ambient temperature). The maximum allowable power dissipation at any

temperature is PD= (TJmax–TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJmax =

150°C. For this device the typical thermal resistance (θJA) of the different package types when board mounted follow:

(4) See the URL ”http://www.ti.com/packaging“ for other recommendations and methods of soldering surface mount devices.

(5) The human body model is a 100pF capacitor discharge through a 1.5kΩresistor into each pin. The machine model is a 200pF capacitor

discharged directly into each pin.

Operating Ratings (1)

Specified Temperature Range TMIN ≤TA≤TMAX

LM26NV −55°C ≤TA≤+125°C

Positive Supply Voltage (V+) +2.7V to +5.5V

Maximum VOUT +5.5V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions.

Product Folder Links: LM26NV

LM26NV

SNIS151B –AUGUST 2008–REVISED MARCH 2013

www.ti.com

LM26NV Electrical Characteristics

The following specifications apply for V+= 2.7VDC to 5.5VDC, and VTEMP load current = 0µA unless otherwise specified.

Boldface limits apply for TA= TJ= TMIN to TMAX;all other limits TA= TJ= 25°C unless otherwise specified.

LM26NV Limits

Symbol Parameter Conditions Typical(1) Units (Limits)

(2)

Temperature Sensor

Trip Point Accuracy (Includes VREF, DAC, -55°C ≤TA≤+110°C ±3 °C (max)

Comparator Offset, and Temperature +120°C ±4 °C (max)

Sensitivity errors)

Trip Point Hysteresis HYST = GND 11 °C

HYST = V+2 °C

ISSupply Current 16 20 µA (max)

40 µA (max)

Digital Output and Input

IOUT(“1”) Logical “1” Output Leakage Current (3) V+= +5.0V 0.001 1 µA (max)

VOUT(“0”) Logical “0” Output Voltage IOUT = +1.2mA and 0.4 V (max)

V+≥2.7V; IOUT = +3.2mA

and V+≥4.5V; (4)

VOUT(“1”) Logical “1” Push-Pull Output Voltage ISOURCE = 500µA, V+≥0.8 × V+V (min)

2.7V

ISOURCE = 800µA, V+≥4.5V V+−1.5 V (min)

VIH HYST Input Logical ”1“ Threshold Voltage 0.8 × V+V (min)

VIL HYST Input Logical ”0“ Threshold Voltage 0.2 × V+V (max)

(1) Typicals are at TJ= TA= 25°C and represent most likely parametric norm.

(2) Limits are ensured to AOQL (Average Outgoing Quality Level).

(3) The 1µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the

current for every 15°C increase in temperature. For example, the 1nA typical current at 25°C would increase to 16nA at 85°C.

(4) Care should be taken to include the effects of self heating when setting the maximum output load current. The power dissipation of the

LM26NV would increase by 1.28mW when IOUT=3.2mA and VOUT=0.4V. With a thermal resistance of 250°C/W, this power dissipation

would cause an increase in the die temperature of about 0.32°C due to self heating. Self heating is not included in the trip point

accuracy specification.

Package Type θJA

SOT-23, DBV 250°C/W

Part Number Template

The series of characters labeled "xyz" in the part number LM26CIM5-xyz, describe the set point value and the

function of the output. The character at "x" and "y" define the set point temperature (at which the digital output

will go active). The "z" character defines the type and function of the digital output. These place holders are

defined in the following tables.

The place holders xy describe the set point temperature as shown in the following table.

x (10x) y (1x) Temperature (°C)

A - −5

B - −4

C - −3

D - −2

E - −1

F - −0

H H 0

J J 1

K K 2

L L 3

Product Folder Links: LM26NV

LM26NV

www.ti.com

SNIS151B –AUGUST 2008–REVISED MARCH 2013

x (10x) y (1x) Temperature (°C)

N N 4

P P 5

R R 6

S S 7

T T 8

V V 9

X - 10

Y - 11

Z - 12

The value of z describes the assignment/function of the output as shown in the following table:

Open-Drain/ Push-

Active-Low/High OS/US Value of z Digital Output Function

Pull

0 0 0 E Active-Low, Open-Drain, OS output

0 0 1 F Active-Low, Open-Drain, US output

1 1 0 G Active-High, Push-Pull, OS output

1 1 1 H Active-High, Push-Pull, US output

EXAMPLE:

• The part number LM26CIM5-YPE has TOS = 115°C, and has an active-low open-drain overtemperature

shutdown output. The "Y" represents the tens value "11", the "P" represents the ones value "5", and the "E"

means that the output will be an active-low, open-drain, over-temperature output.

Many active-high open-drain and active-low push-pull options are available, please contact Texas Instruments for

more information.

Product Folder Links: LM26NV

V+NC

GND

HYST OS

HYST

REF

TEMP

SENSOR

V+

V+NC

GND

HYST US

REF

TEMP

SENSOR

V+

HYST

V+NC

GND

HYST OS

REF

TEMP

SENSOR

HYST

V+NC

GND

HYST US

HYST

REF

TEMP

SENSOR +

LM26NV

SNIS151B –AUGUST 2008–REVISED MARCH 2013

www.ti.com

FUNCTIONAL DESCRIPTION

LM26NV OPTIONS

The LM26NV can be factory programmed to have a trip point anywhere in the range of −55°C to +110°C. It is

also available in any of four output options, as indicated by the last letter in the part number.

Output Pin Options Block Diagrams

The "E" in "LM26CIM5 - _ _ E " indicates that the digital The "F" in "LM26CIM5 - _ _ F " indicates that the digital

output is Active-Low Open-Drain output is Active-Low Open-Drain

and will trip as temperature is rising (OS) and will trip as temperature is falling (US)

Figure 3. LM26CIM5 - _ _ E Figure 4. LM26CIM5 - _ _ F

The "G" in "LM26CIM5 - _ _G " indicates that the digital The "H" in "LM26CIM5 - _ _H" indicates that the digital

output is Active-High Push-Pull output is Active-High Push-Pull

and will trip as temperature is rising (OS) and will trip as temperature is falling (US)

Figure 5. LM26CIM5 - _ _G Figure 6. LM26CIM5 - _ _H

Applications Hints

NOISE CONSIDERATIONS

The LM26NV has excellent power supply noise rejection. Listed below is a variety of signals used to test the

LM26NV power supply rejection. False triggering of the output was not observed when these signals where

coupled into the V+ pin of the LM26NV.

• Square Wave 400kHz, 1Vp-p

• Square Wave 2kHz, 200mVp-p

• Sine Wave 100Hz to 1MHz, 200mVp-p

Testing was done while maintaining the temperature of the LM26NV one degree centigrade way from the trip

point with the output not activated.

Product Folder Links: LM26NV

12V

System Fan

Sanyo Denki

109R0612T4H12

LM26NV

V+

GND

HYST OS

10k

+5V

0.1 PF

TJ = TA + 4JA(V+IQ + VDOIDO)

LM26NV

www.ti.com

SNIS151B –AUGUST 2008–REVISED MARCH 2013

MOUNTING CONSIDERATIONS

The LM26NV can be applied easily in the same way as other integrated-circuit temperature sensors. It can be

glued or cemented to a surface. The temperature that the LM26NV is sensing will be within about +0.06°C of the

surface temperature to which the LM26NV's leads are attached to.

This presumes that the ambient air temperature is almost the same as the surface temperature; if the air

temperature were much higher or lower than the surface temperature, the actual temperature measured would

be at an intermediate temperature between the surface temperature and the air temperature.

To ensure good thermal conductivity, the backside of the LM26NV die is directly attached to the GND pin (pin 2).

The temperatures of the lands and traces to the other leads of the LM26NV will also affect the temperature that

is being sensed.

Alternatively, the LM26NV can be mounted inside a sealed-end metal tube, and can then be dipped into a bath

or screwed into a threaded hole in a tank. As with any IC, the LM26NV and accompanying wiring and circuits

must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate

at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal

and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM26NV or its connections.

The junction to ambient thermal resistance (θJA) is the parameter used to calculate the rise of a part's junction

temperature due to its power dissipation. For the LM26NV the equation used to calculate the rise in the die

junction temperature is as follows:

where

• TAis the ambient temperature

• V+is the power supply voltage

• IQis the quiescent current

• VDO is the voltage on the digital output

• IDO is the load current on the digital output (1)

Table 2 summarizes the thermal resistance for different conditions and the rise in die temperature of the LM26NV

and a 10k pull-up resistor on an open-drain digital output with a 5.5V power supply.

Table 2. Thermal resistance (θJA) and temperature rise due to self heating (TJ−TA)

SOT-23 SOT-23

no heat sink small heat sink

θJA TJ−TAθJA TJ−TA

(°C/W) (°C) (°C/W) (°C)

Still Air 250 0.11 TBD TBD

Moving Air TBD TBD TBD TBD

Typical Applications

The fan's control pin has an internal pull-up. The 10 kOhm pull-down sets a slow fan speed. When the output of the

LM26NV goes low, the fan will speed up.

Figure 7. Two Speed Fan Speed Control

Product Folder Links: LM26NV

5V Fan

MC05J3

Comair-Rotron

LM26NV

V+

GND

HYST OS

100k

NDS356P

IC1

LM3886

47k

20k 1k

THERMALLY COUPLED

+28V

-28V-

Audio

Input

3.3 PF

1N4001

0.1 PF

10 PF

Vout

12V

TOYO

USTF802512HW

LM26NV

V+

GND

HYST

0.1

1N4001

(1k)

5V Fan

MC05J3

Comair-Rotron

LM26NV

V+

GND

HYST OS

0.1

NDS356P

1N4001

(100k)

LM26NV

SNIS151B –AUGUST 2008–REVISED MARCH 2013

www.ti.com

The LM26NV switches the fan on when the measured temperature exceeds the trip temperature.

Figure 8. Fan High Side Drive

The LM26LV sinks causes the switch to sink the fan current when the measured temperature exceeds the trip

temperature.

Figure 9. Fan Low Side Drive

By thermally coupling the LM26NV to the audio power amplifier, the LM26NV safeguards the amplifier from

overheating, turning on the fan when it temperature exceeds the trip temperature.

Figure 10. Audio Power Amplifier Thermal Protection

Product Folder Links: LM26NV

LM26NV

V+

Heater

Supply

GND

HYST

(10k)

0.1

LM26NV

www.ti.com

SNIS151B –AUGUST 2008–REVISED MARCH 2013

When the measured temperature is below the trip temperature of the LM26NV, the OS output will be high, causing

the switch and relay to close. When the temperature exceeds the trip point, OS goes low and shuts off the relay and

heater.

Figure 11. Simple Thermostat

Product Folder Links: LM26NV

LM26NV

SNIS151B –AUGUST 2008–REVISED MARCH 2013

www.ti.com

REVISION HISTORY

Changes from Revision A (March 2013) to Revision B Page

• Changed layout of National Data Sheet to TI format ............................................................................................................ 9

Product Folder Links: LM26NV

PACKAGE OPTION ADDENDUM

www.ti.com 5-Feb-2014

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM26CIM5-YPE/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TYPE

LM26CIM5X-YPE/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TYPE

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

PACKAGE OPTION ADDENDUM

www.ti.com 5-Feb-2014

Addendum-Page 2

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM26CIM5-YPE/NOPB SOT-23 DBV 5 1000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-YPE/NOPB SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Aug-2017

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM26CIM5-YPE/NOPB SOT-23 DBV 5 1000 203.0 203.0 35.0

LM26CIM5X-YPE/NOPB SOT-23 DBV 5 3000 203.0 203.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Aug-2017

Pack Materials-Page 2

www.ti.com

PACKAGE OUTLINE

TYP

0.22

0.08

0.25

3.0

2.6

2X 0.95

1.9

1.45 MAX

TYP

0.15

0.00

5X 0.5

0.3

TYP

0.6

0.3

TYP

1.9

3.05

2.75

1.75

1.45

(1.1)

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Refernce JEDEC MO-178.

0.2 C A B

INDEX AREA

PIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ARROUND 0.07 MIN

ARROUND

5X (1.1)

5X (0.6)

(2.6)

(1.9)

2X (0.95)

(R0.05) TYP

4214839/C 04/2017

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

NOTES: (continued)

4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

PKG

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED METAL

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

EXPOSED METAL

www.ti.com

EXAMPLE STENCIL DESIGN

(2.6)

(1.9)

2X(0.95)

5X (1.1)

5X (0.6)

(R0.05) TYP

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

7. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:15X

SYMM

PKG

www.ti.com

PACKAGE OUTLINE

TYP

0.22

0.08

0.25

3.0

2.6

2X 0.95

1.9

1.45 MAX

TYP

0.15

0.00

5X 0.5

0.3

TYP

0.6

0.3

TYP

1.9

3.05

2.75

1.75

1.45

(1.1)

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Refernce JEDEC MO-178.

0.2 C A B

INDEX AREA

PIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ARROUND 0.07 MIN

ARROUND

5X (1.1)

5X (0.6)

(2.6)

(1.9)

2X (0.95)

(R0.05) TYP

4214839/C 04/2017

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

NOTES: (continued)

4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

PKG

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED METAL

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

EXPOSED METAL

www.ti.com

EXAMPLE STENCIL DESIGN

(2.6)

(1.9)

2X(0.95)

5X (1.1)

5X (0.6)

(R0.05) TYP

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

7. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:15X

SYMM

PKG

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