LM26NV www.ti.com SNIS151B - AUGUST 2008 - REVISED MARCH 2013 LM26NV SOT-23, 3C Accurate, Factory Preset Thermostat (LM26 without VTEMP output) Check for Samples: LM26NV FEATURES DESCRIPTION * The LM26NV is a precision, single digital-output, lowpower thermostat comprised of an internal reference, DAC, temperature sensor and comparator. Utilizing factory programming, it can be manufactured with different trip points as well as different digital output functionality. The trip point (TOS) can be preset at the factory to any temperature in the range of -55C to +110C in 1C increments. The LM26NV has one digital output (OS/OS/US/US) and one digital input (HYST). The digital output stage can be preset as either open-drain or push-pull. In addition, it can be factory programmed to be active HIGH or LOW. The digital output can be factory programmed to indicate an over temperature shutdown event (OS or OS) or an under temperature shutdown event (US or US). When preset as an overtemperature shutdown (OS), it will go LOW to indicate that the die temperature is over the internally preset TOS and go HIGH when the temperature goes below (TOS-THYST). Similarly, when preprogrammed as an undertemperature shutdown (US) it will go HIGH to indicate that the temperature is below TUS and go LOW when the temperature is above (TUS+THYST). The typical hysteresis, THYST, can be set to 2C or 10C and is controlled by the state of the HYST pin. 1 2 * * * * * * Internal Comparator with Pin Programmable 2C or 10C Hysteresis No External Components Required Open Drain or Push-Pull Digital Output; Supports CMOS Logic Levels Internal Temperature Sensor Internal Voltage Reference and DAC for TripPoint Setting Currently Available in 5-Pin SOT-23 Plastic Package Excellent Power Supply Noise Rejection APPLICATIONS * * * * * * * * Microprocessor Thermal Management Appliances Portable Battery Powered Systems Fan Control Industrial Process Control HVAC Systems Remote Temperature Sensing Electronic System Protection KEY SPECIFICATIONS * * * Power Supply Voltage: 2.7V to 5.5 V Power Supply Current: - 40A(max) - 20A(typ) Hysteresis Temperature: 2C or 10C(typ) Available parts are detailed in the ordering information. For other part options, contact a Texas Instruments Distributor or Sales Representative for information on minimum order qualification. The LM26NV is currently available in a 5-lead SOT-23 package. Table 1. Temperature Trip Point Accuracy Temperature Range LM26NV -55C to +110C 3C (max) +120C 4C (max) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2008-2013, Texas Instruments Incorporated LM26NV SNIS151B - AUGUST 2008 - REVISED MARCH 2013 www.ti.com Connection Diagram HYST 1 GND 2 NC or GND 3 5 OS, OS, US, or US 4 V+ LM26NV Figure 1. 5-Lead SOT-23 See DBV Package PIN DESCRIPTIONS Pin Number Pin Name 1 HYST Hysteresis control, digital input GND for 10C or V+ for 2C 2 GND Ground, connected to the back side of the die through lead frame. System GND 3 NC Not Connected Inside Part Ground or No Connect 4 V+ Supply input 2.7V to 5.5V with a 0.1F bypass capacitor. For PSRR information see Section Titled NOISE CONSIDERATIONS. 5 (1) OS Overtemperature Shutdown open-drain active low Controller interrupt, system or power supply shutdown; pull-up thermostat digital output resistor 10k OS Overtemperature Shutdown push-pull active high thermostat digital output Controller interrupt, system or power supply shutdown US Undertemperature Shutdown open-drain active low thermostat digital output System or power supply shutdown; pull-up resistor 10k US Undertemperature Shutdown push-pull active high thermostat digital output System or power supply shutdown (1) Function Connection Pin 5 functionality and trip point setting are programmed during LM26NV manufacture. LM26CIM5-YPE Simplified Block Diagram and Connection Diagram TOS HYST OS HYST REF GND TEMP SENSOR TOS - THYST Temp. of Leads + - NC OS V+ = 2.7V to 5.5V HYST = GND for 10C Hysteresis HYST = V+ for 2C Hysteresis The LM26CIM5-YPE has a fixed trip point of 115C. For other trip point and output function availability, please see ordering information or contact Texas Instruments. Figure 2. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright (c) 2008-2013, Texas Instruments Incorporated Product Folder Links: LM26NV LM26NV www.ti.com SNIS151B - AUGUST 2008 - REVISED MARCH 2013 Absolute Maximum Ratings (1) Input Voltage 6.0V Input Current at any pin (2) 5mA Package Input Current (2) 20mA Package Dissipation at TA = 25C (3) Soldering Information 500mW (4) SOT-23 Package Vapor Phase (60 seconds) 215C Infrared (15 seconds) 220C -65C to + 150C Storage Temperature ESD Susceptibility (5) Human Body Model 2500V Machine Model (1) (2) (3) (4) (5) 250V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V+), the current at that pin should be limited to 5mA. The 20mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5mA each. The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), JA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PD = (TJmax-TA)/JA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJmax = 150C. For this device the typical thermal resistance (JA) of the different package types when board mounted follow: See the URL "http://www.ti.com/packaging" for other recommendations and methods of soldering surface mount devices. The human body model is a 100pF capacitor discharge through a 1.5k resistor into each pin. The machine model is a 200pF capacitor discharged directly into each pin. Operating Ratings (1) TMIN TA TMAX Specified Temperature Range -55C TA +125C LM26NV Positive Supply Voltage (V+) +2.7V to +5.5V Maximum VOUT (1) +5.5V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Submit Documentation Feedback Copyright (c) 2008-2013, Texas Instruments Incorporated Product Folder Links: LM26NV 3 LM26NV SNIS151B - AUGUST 2008 - REVISED MARCH 2013 www.ti.com LM26NV Electrical Characteristics The following specifications apply for V+ = 2.7VDC to 5.5VDC, and VTEMP load current = 0A unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25C unless otherwise specified. Symbol Parameter Conditions Typical (1) LM26NV Limits (2) Units (Limits) Temperature Sensor IS Trip Point Accuracy (Includes VREF, DAC, Comparator Offset, and Temperature Sensitivity errors) -55C TA +110C 3 C (max) +120C 4 C (max) Trip Point Hysteresis HYST = GND 11 HYST = V+ 2 Supply Current C C 16 20 40 A (max) A (max) Digital Output and Input (1) (2) (3) (4) (3) V+ = +5.0V IOUT("1") Logical "1" Output Leakage Current VOUT("0") Logical "0" Output Voltage IOUT = +1.2mA and V+2.7V; IOUT = +3.2mA and V+4.5V; (4) VOUT("1") Logical "1" Push-Pull Output Voltage 0.001 1 A (max) 0.4 V (max) ISOURCE = 500A, V+ 2.7V 0.8 x V+ V (min) ISOURCE = 800A, V+4.5V V+ - 1.5 V (min) VIH HYST Input Logical "1" Threshold Voltage 0.8 x V+ V (min) VIL HYST Input Logical "0" Threshold Voltage 0.2 x V+ V (max) Typicals are at TJ = TA = 25C and represent most likely parametric norm. Limits are ensured to AOQL (Average Outgoing Quality Level). The 1A limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the current for every 15C increase in temperature. For example, the 1nA typical current at 25C would increase to 16nA at 85C. Care should be taken to include the effects of self heating when setting the maximum output load current. The power dissipation of the LM26NV would increase by 1.28mW when IOUT=3.2mA and VOUT=0.4V. With a thermal resistance of 250C/W, this power dissipation would cause an increase in the die temperature of about 0.32C due to self heating. Self heating is not included in the trip point accuracy specification. Package Type JA SOT-23, DBV 250C/W Part Number Template The series of characters labeled "xyz" in the part number LM26CIM5-xyz, describe the set point value and the function of the output. The character at "x" and "y" define the set point temperature (at which the digital output will go active). The "z" character defines the type and function of the digital output. These place holders are defined in the following tables. The place holders xy describe the set point temperature as shown in the following table. 4 x (10x) y (1x) Temperature (C) A - -5 B - -4 C - -3 D - -2 E - -1 F - -0 H H 0 J J 1 K K 2 L L 3 Submit Documentation Feedback Copyright (c) 2008-2013, Texas Instruments Incorporated Product Folder Links: LM26NV LM26NV www.ti.com SNIS151B - AUGUST 2008 - REVISED MARCH 2013 x (10x) y (1x) Temperature (C) N N 4 P P 5 R R 6 S S 7 T T 8 V V 9 X - 10 Y - 11 Z - 12 The value of z describes the assignment/function of the output as shown in the following table: Active-Low/High Open-Drain/ PushPull OS/US Value of z 0 0 0 E Active-Low, Open-Drain, OS output 0 0 1 F Active-Low, Open-Drain, US output 1 1 0 G Active-High, Push-Pull, OS output 1 1 1 H Active-High, Push-Pull, US output Digital Output Function EXAMPLE: * The part number LM26CIM5-YPE has TOS = 115C, and has an active-low open-drain overtemperature shutdown output. The "Y" represents the tens value "11", the "P" represents the ones value "5", and the "E" means that the output will be an active-low, open-drain, over-temperature output. Many active-high open-drain and active-low push-pull options are available, please contact Texas Instruments for more information. Submit Documentation Feedback Copyright (c) 2008-2013, Texas Instruments Incorporated Product Folder Links: LM26NV 5 LM26NV SNIS151B - AUGUST 2008 - REVISED MARCH 2013 www.ti.com FUNCTIONAL DESCRIPTION LM26NV OPTIONS The LM26NV can be factory programmed to have a trip point anywhere in the range of -55C to +110C. It is also available in any of four output options, as indicated by the last letter in the part number. Output Pin Options Block Diagrams HYST OS HYST US HYST HYST REF GND TEMP SENSOR REF + GND TEMP SENSOR - NC V+ The "E" in "LM26CIM5 - _ _ E " indicates that the digital output is Active-Low Open-Drain and will trip as temperature is rising (OS) NC V+ The "F" in "LM26CIM5 - _ _ F " indicates that the digital output is Active-Low Open-Drain and will trip as temperature is falling (US) Figure 3. LM26CIM5 - _ _ E Figure 4. LM26CIM5 - _ _ F V+ HYST + OS V+ HYST HYST REF GND TEMP SENSOR US HYST REF + GND TEMP SENSOR - NC V+ The "G" in "LM26CIM5 - _ _G " indicates that the digital output is Active-High Push-Pull and will trip as temperature is rising (OS) + NC V+ The "H" in "LM26CIM5 - _ _H" indicates that the digital output is Active-High Push-Pull and will trip as temperature is falling (US) Figure 5. LM26CIM5 - _ _G Figure 6. LM26CIM5 - _ _H Applications Hints NOISE CONSIDERATIONS The LM26NV has excellent power supply noise rejection. Listed below is a variety of signals used to test the LM26NV power supply rejection. False triggering of the output was not observed when these signals where coupled into the V+ pin of the LM26NV. * Square Wave 400kHz, 1Vp-p * Square Wave 2kHz, 200mVp-p * Sine Wave 100Hz to 1MHz, 200mVp-p Testing was done while maintaining the temperature of the LM26NV one degree centigrade way from the trip point with the output not activated. 6 Submit Documentation Feedback Copyright (c) 2008-2013, Texas Instruments Incorporated Product Folder Links: LM26NV LM26NV www.ti.com SNIS151B - AUGUST 2008 - REVISED MARCH 2013 MOUNTING CONSIDERATIONS The LM26NV can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface. The temperature that the LM26NV is sensing will be within about +0.06C of the surface temperature to which the LM26NV's leads are attached to. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature measured would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity, the backside of the LM26NV die is directly attached to the GND pin (pin 2). The temperatures of the lands and traces to the other leads of the LM26NV will also affect the temperature that is being sensed. Alternatively, the LM26NV can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM26NV and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM26NV or its connections. The junction to ambient thermal resistance (JA) is the parameter used to calculate the rise of a part's junction temperature due to its power dissipation. For the LM26NV the equation used to calculate the rise in the die junction temperature is as follows: + TJ = TA + 4JA(V IQ + VDOIDO) where * * * * * TA is the ambient temperature V+ is the power supply voltage IQ is the quiescent current VDO is the voltage on the digital output IDO is the load current on the digital output (1) Table 2 summarizes the thermal resistance for different conditions and the rise in die temperature of the LM26NV and a 10k pull-up resistor on an open-drain digital output with a 5.5V power supply. Table 2. Thermal resistance (JA) and temperature rise due to self heating (TJ-TA) SOT-23 no heat sink SOT-23 small heat sink JA (C/W) TJ-TA (C) JA (C/W) TJ-TA (C) Still Air 250 0.11 TBD TBD Moving Air TBD TBD TBD TBD Typical Applications System Fan Sanyo Denki 109R0612T4H12 HYST OS GND NC V+ +5V 12V 10k LM26NV 0.1 PF The fan's control pin has an internal pull-up. The 10 kOhm pull-down sets a slow fan speed. When the output of the LM26NV goes low, the fan will speed up. Figure 7. Two Speed Fan Speed Control Submit Documentation Feedback Copyright (c) 2008-2013, Texas Instruments Incorporated Product Folder Links: LM26NV 7 LM26NV SNIS151B - AUGUST 2008 - REVISED MARCH 2013 www.ti.com 5V HYST OS GND NC V+ NDS356P R1 (100k) LM26NV 0.1 1N4001 5V 5V Fan MC05J3 Comair-Rotron The LM26NV switches the fan on when the measured temperature exceeds the trip temperature. Figure 8. Fan High Side Drive 12V 1N4001 Vout HYST OS GND NC V+ TOYO USTF802512HW R1 (1k) LM26NV 5V 0.1 The LM26LV sinks causes the switch to sink the fan current when the measured temperature exceeds the trip temperature. Figure 9. Fan Low Side Drive 5V THERMALLY COUPLED LM26NV +28V 8: HYST + - GND NC OS NDS356P V+ 100k IC1 -28V LM3886 20k 1k 47k 3.3 PF Audio Input 0.1 PF 1N4001 5V 5V Fan MC05J3 Comair-Rotron 10 PF By thermally coupling the LM26NV to the audio power amplifier, the LM26NV safeguards the amplifier from overheating, turning on the fan when it temperature exceeds the trip temperature. Figure 10. Audio Power Amplifier Thermal Protection 8 Submit Documentation Feedback Copyright (c) 2008-2013, Texas Instruments Incorporated Product Folder Links: LM26NV LM26NV www.ti.com SNIS151B - AUGUST 2008 - REVISED MARCH 2013 5V HYST OS GND NC V+ Heater Supply R1 (10k) LM26NV Heater 0.1 5V When the measured temperature is below the trip temperature of the LM26NV, the OS output will be high, causing the switch and relay to close. When the temperature exceeds the trip point, OS goes low and shuts off the relay and heater. Figure 11. Simple Thermostat Submit Documentation Feedback Copyright (c) 2008-2013, Texas Instruments Incorporated Product Folder Links: LM26NV 9 LM26NV SNIS151B - AUGUST 2008 - REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision A (March 2013) to Revision B * 10 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 9 Submit Documentation Feedback Copyright (c) 2008-2013, Texas Instruments Incorporated Product Folder Links: LM26NV PACKAGE OPTION ADDENDUM www.ti.com 5-Feb-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM26CIM5-YPE/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TYPE LM26CIM5X-YPE/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TYPE (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 5-Feb-2014 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 3-Aug-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LM26CIM5-YPE/NOPB SOT-23 DBV 5 1000 179.0 8.4 LM26CIM5X-YPE/NOPB SOT-23 DBV 5 3000 179.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 3.2 3.2 1.4 4.0 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 3-Aug-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM26CIM5-YPE/NOPB SOT-23 DBV 5 1000 203.0 203.0 35.0 LM26CIM5X-YPE/NOPB SOT-23 DBV 5 3000 203.0 203.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 1.75 1.45 PIN 1 INDEX AREA 1 0.1 C B A 5 2X 0.95 1.9 1.45 MAX 3.05 2.75 1.9 2 4 0.5 5X 0.3 0.2 3 (1.1) C A B 0.15 TYP 0.00 0.25 GAGE PLANE 8 TYP 0 0.22 TYP 0.08 0.6 TYP 0.3 SEATING PLANE 4214839/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. www.ti.com EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MIN ARROUND 0.07 MAX ARROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214839/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X(0.95) 4 3 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 1.75 1.45 PIN 1 INDEX AREA 1 0.1 C B A 5 2X 0.95 1.9 1.45 MAX 3.05 2.75 1.9 2 4 0.5 5X 0.3 0.2 3 (1.1) C A B 0.15 TYP 0.00 0.25 GAGE PLANE 8 TYP 0 0.22 TYP 0.08 0.6 TYP 0.3 SEATING PLANE 4214839/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. www.ti.com EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MIN ARROUND 0.07 MAX ARROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214839/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X(0.95) 4 3 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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