LP38859 LP38859 3A Fast-Response High-Accuracy LDO Linear Regulator with Soft-Start Literature Number: SNVS337D LP38859 3A Fast-Response High-Accuracy LDO Linear Regulator with Soft-Start General Description Features The LP38859 is a high current, fast response regulator which can maintain output voltage regulation with extremely low input to output voltage drop. Fabricated on a CMOS process, the device operates from two input voltages: VBIAS provides voltage to drive the gate of the N-MOS power transistor, while VIN is the input voltage which supplies power to the load. The use of an external bias rail allows the part to operate from ultra low VIN voltages. Unlike bipolar regulators, the CMOS architecture consumes extremely low quiescent current at any output load current. The use of an N-MOS power transistor results in wide bandwidth, yet minimum external capacitance is required to maintain loop stability. The fast transient response of this device makes it suitable for use in powering DSP, Microcontroller Core voltages and Switch Mode Power Supply post regulators. The LP38859 is available in TO-220 and TO-263 5-Lead packages. Dropout Voltage: 240 mV (typical) at 3A load current. Low Ground Pin Current: 10 mA (typical) at 3A load current. Soft-Start: Programmable Soft-Start time. Precision Output Voltage: 1.0% for TJ = 25C and 2.0% for 0C TJ +125C, across all line and load conditions Standard VOUT values of 0.8V and 1.2V Wide VBIAS Supply operating range of 3.0V to 5.5V Stable with 10F Ceramic capacitors Dropout voltage of 240 mV (typical) at 3A load current Precision Output Voltage across all line and load conditions: -- 1.0% VOUT for TJ = 25C -- 2.0% VOUT for 0C TJ +125C -- 3.0% VOUT for -40C TJ +125C Over-Temperature and Over-Current protection Available in 5 lead TO-220 and TO-263 packages Custom VOUT values between 0.8V and 1.2V are available -40C to +125C Operating Temperature Range Applications ASIC Power Supplies In: - Desktops, Notebooks, and Graphics Cards, Servers - Gaming Set Top Boxes, Printers and Copiers Server Core and I/O Supplies DSP and FPGA Power Supplies SMPS Post-Regulator Typical Application Circuit 20131201 (c) 2011 Texas Instruments Incorporated 201312 www.ti.com LP38859 3A Fast-Response High-Accuracy LDO Linear Regulator with Soft-Start October 25, 2011 LP38859 Ordering Information VOUT * Order Number Package Type Package Drawing LP38859S-0.8 TO263-5 TS5B Rail of 45 0.8V LP38859SX-0.8 TO263-5 TS5B Tape and Reel of 500 LP38859T-0.8 TO220-5 T05D Rail of 45 1.2V Supplied As LP38859S-1.2 TO263-5 TS5B Rail of 45 LP38859SX-1.2 TO263-5 TS5B Tape and Reel of 500 LP38859T-1.2 TO220-5 T05D Rail of 45 * For custom VOUT values between 0.8V and 1.2V please contact the National Semiconductor Sales Office. Connection Diagrams 20131202 20131203 TO263-5, Top View TO220-5, Top View Pin Descriptions TO220-5 and TO263-5 Packages www.ti.com Pin # Pin Symbol 1 SS Soft-Start capacitor connection. Used to slow the rise time of VOUT at turn-on. Pin Description 2 IN The unregulated voltage input pin. 3 GND Ground 4 OUT The regulated output voltage pin. 5 BIAS The supply for the internal control and reference circuitry. TAB TAB The TAB is a thermal connection that is physically attached to the backside of the die, and used as a thermal heat-sink connection. See the Application Information section for details. 2 If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Storage Temperature Range Lead Temperature Soldering, 5 seconds ESD Rating Human Body Model (Note 2) Power Dissipation (Note 3) VIN Supply Voltage (Survival) VBIAS Supply Voltage (Survival) -65C to +150C Operating Ratings -0.3V to +6.0V -0.3V to +6.0V Internally Limited -40C to +150C (Note 1) VIN Supply Voltage VBIAS Supply Voltage IOUT Junction Temperature Range (Note 3) 260C 2 kV Internally Limited -0.3V to +6.0V -0.3V to +6.0V (VOUT + VDO) to VBIAS 3.0V to 5.5V 0 mA to 3.0A -40C to +125C Electrical Characteristics Unless otherwise specified: VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 F, CBIAS = 1 F, CSS = open. Limits in standard type are for TJ = 25C only; limits in boldface type apply over the junction temperature (TJ) range of -40C to +125C. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25C, and are provided for reference purposes only. Symbol Parameter Conditions VOUT(NOM) + 1V VIN VBIAS, 3.0V VBIAS 5.5V, 10 mA IOUT 3A VOUT VOUT Accuracy MIN TYP MAX -1.0 -3.0 0.0 1.0 3.0 VOUT(NOM) + 1V VIN VBIAS, 3.0V VBIAS 5.5V, 10 mA IOUT 3.0A, Units % -2.0 0.0 2.0 0C TJ +125C Line Regulation, VIN (Note 4) VOUT(NOM) + 1V VIN VBIAS - 0.04 - %/V VOUT/VBIAS Line Regulation, VBIAS (Note 4) 3.0V VBIAS 5.5V - 0.10 - %/V VOUT/IOUT Output Voltage Load Regulation (Note 5) 10 mA IOUT 3.0A - 0.2 - %/A Dropout Voltage (Note 6) IOUT = 3.0A - 240 300 450 mV - 7.0 8.5 9.0 11 12 15 - 3.0 3.8 4.5 mA 2.20 2.00 2.45 2.70 2.90 V 60 50 150 300 350 mV - 6.2 - A LP38859-0.8 11.0 13.5 16.0 LP38859-1.2 13.5 16.0 18.5 LP38859-0.8, CSS = 10 nF - 675 - LP38859-1.2, CSS = 10 nF - 800 - VOUT/VIN VDO LP38859-0.8 IGND(IN) Quiescent Current Drawn from VIN Supply 10 mA IOUT 3.0A LP38859-1.2 10 mA IOUT 3.0A Quiescent Current Drawn from VBIAS Supply 10 mA IOUT 3.0A UVLO Under-Voltage Lock-Out Threshold VBIAS rising until device is functional UVLO(HYS) Under-Voltage Lock-Out Hysteresis VBIAS falling from UVLO threshold until device is non-functional Output Short-Circuit Current VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, VOUT = 0.0V IGND(BIAS) ISC mA Soft-Start rSS Soft-Start internal resistance tSS Soft-Start time tSS = CSS x rSS x 5 3 k s www.ti.com LP38859 VSS SoftStart Voltage (Survival) VOUT Voltage (Survival) IOUT Current (Survival) Junction Temperature Absolute Maximum Ratings (Note 1) LP38859 Symbol Parameter Conditions MIN TYP MAX VIN = VOUT(NOM) + 1V, f = 120 Hz - 80 - VIN = VOUT(NOM) + 1V, f = 1 kHz - 65 - VBIAS = VOUT(NOM) + 3V, f = 120 Hz - 58 - VBIAS = VOUT(NOM) + 3V, f = 1 kHz - 58 - Output Noise Density f = 120 Hz - 1 - Output Noise Voltage VOUT = 1.8V BW = 10 Hz - 100 kHz - 150 - BW = 300 Hz - 300 kHz - 90 - Thermal Shutdown Junction Temperature - 160 - Thermal Shutdown Hysteresis - 10 - Units AC Parameters PSRR (VIN) PSRR (VBIAS) en Ripple Rejection for VIN Input Voltage Ripple Rejection for VBIAS Voltage dB V/Hz V (rms) Thermal Parameters TSD TSD(HYS) J-A J-C Thermal Resistance, Junction to Ambient(Note 3) TO220-5 - 60 - TO263-5 - 60 - Thermal Resistance, Junction to Case(Note 3) TO220-5 - 3 - TO263-5 - 3 - C C/W Note 1: Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but does not guarantee specific performance limits. For guaranteed specifications and conditions, see the Electrical Characteristics. Note 2: The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-A114. The HBM rating for device pin 1 (SS) is 1.5 kV. Note 3: Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to ambient thermal resistance (JA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not exceed the maximum operating rating. See the Application Information section for details. Note 4: Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage. Note 5: Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from no load to full load. Note 6: Dropout voltage is defined the as input to output voltage differential (VIN - VOUT) where the input voltage is low enough to cause the output voltage to drop no more than 2% from the nominal value. www.ti.com 4 VBIAS Ground Pin Current (IGND(BIAS)) vs VBIAS VBIAS Ground Pin Current (IGND(BIAS)) vs Temperature 20131287 20131261 VIN Ground Pin Current vs Temperature Load Regulation vs Temperature 20131262 20131263 Dropout Voltage (VDO) vs Temperature Output Current Limit (ISC) vs Temperature 20131265 20131266 5 www.ti.com LP38859 Typical Performance Characteristics Unless otherwise specified: TJ = 25C, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 F Ceramic, CBIAS = 1 F Ceramic, CSS = open. LP38859 VOUT vs Temperature UVLO Thresholds vs Temperature 20131268 20131267 Soft-Start Resistor (rSS) vs Temperature Soft-Start rSS Variation vs Temperature 20131274 20131275 VOUT vs CSS, 10 nF to 47 nF VIN Line Transient Response 20131276 www.ti.com 20131277 6 LP38859 VIN Line Transient Response VBIAS Line Transient Response 20131278 20131279 VBIAS Line Transient Response Load Transient Response, COUT = 10 F Ceramic 20131280 20131281 Load Transient Response, COUT = 10 F Ceramic Load Transient Response, COUT = 100 F Ceramic 20131282 20131283 7 www.ti.com LP38859 Load Transient Response, COUT = 100 F Ceramic Load Transient Response, COUT = 100 F Tantalum 20131284 20131285 Load Transient Response, COUT = 100 F Tantalum VBIAS PSRR 20131286 20131270 VIN PSRR Output Noise 20131271 www.ti.com 20131269 8 LP38859 Block Diagram 20131205 9 www.ti.com LP38859 SUPPLY SEQUENCING There is no requirement for the order that VIN or VBIAS are applied or removed. One practical limitation is that the Soft-Start circuit starts charging CSS when VBIAS rises above the UVLO threshold. If the application of VIN is delayed beyond this point the benefits of Soft-Start will be compromised. In any case, the output voltage cannot be guaranteed until both VIN and VBIAS are within the range of guaranteed operating values. If used in a dual-supply system where the regulator output load is returned to a negative supply, the output pin must be diode clamped to ground. A Schottky diode is recommended for this diode clamp. Application Information EXTERNAL CAPACITORS To assure regulator stability, input and output capacitors are required as shown in the Typical Application Circuit. Output Capacitor A minimum output capacitance of 10 F, ceramic, is required for stability. The amount of output capacitance can be increased without limit. The output capacitor must be located less than 1 cm from the output pin of the IC and returned to the device ground pin with a clean analog ground. Only high quality ceramic types such as X5R or X7R should be used, as the Z5U and Y5F types do not provide sufficient capacitance over temperature. Tantalum capacitors will also provide stable operation across the entire operating temperature range. However, the effects of ESR may provide variations in the output voltage during fast load transients. Using the minimum recommended 10 F ceramic capacitor at the output will allow unlimited capacitance, Tantalum and/or Aluminum, to be added in parallel. REVERSE VOLTAGE A reverse voltage condition will exist when the voltage at the output pin is higher than the voltage at the input pin. Typically this will happen when VIN is abruptly taken low and COUT continues to hold a sufficient charge such that the input to output voltage becomes reversed. The NMOS pass element, by design, contains no body diode. This means that, as long as the gate of the pass element is not driven, there will not be any reverse current flow through the pass element during a reverse voltage event. The gate of the pass element is not driven when VBIAS is below the UVLO threshold. When VBIAS is above the UVLO threshold the control circuitry is active and will attempt to regulate the output voltage. Since the input voltage is less than the output voltage the control circuit will drive the gate of the pass element to the full VBIAS potential when the output voltage begins to fall. In this condition, reverse current will flow from the output pin to the input pin , limited only by the RDS(ON) of the pass element and the output to input voltage differential. This condition is outside the guaranteed operating range and should be avoided. Input Capacitor The input capacitor must be at least 10 F, but can be increased without limit. It's purpose is to provide a low source impedance for the regulator input. A ceramic capacitor, X5R or X7R, is recommended. Tantalum capacitors may also be used at the input pin. There is no specific ESR limitation on the input capacitor (the lower, the better). Aluminum electrolytic capacitors can be used, but are not recommended as their ESR increases very quickly at cold temperatures. They are not recommended for any application where the ambient temperature falls below 0C. Bias Capacitor The capacitor on the bias pin must be at least 1 F, and can be any good quality capacitor (ceramic is recommended). SOFT-START The LP38859 incorporates a Soft-Start function that reduces the start-up current surge into the output capacitor (COUT) by allowing VOUT to rise slowly to the final value. This is accomplished by controlling VREF at the SS pin. The soft-start timing capacitor (CSS) is internally held to ground until VBIAS rises above the Under-Voltage Lock-Out threshold (ULVO). VREF will rise at an RC rate defined by the internal resistance of the SS pin (rSS), and the external capacitor connected to the SS pin. This allows the output voltage to rise in a controlled manner until steady-state regulation is achieved. Typically, five time constants are recommended to assure that the output voltage is sufficiently close to the final steady-state value. During the soft-start time the output current can rise to the built-in current limit. INPUT VOLTAGE The input voltage (VIN) is the high current external voltage rail that will be regulated down to a lower voltage, which is applied to the load. The input voltage must be at least VOUT + VDO, and no higher than whatever values is used for VBIAS. BIAS VOLTAGE The bias voltage (V BIAS) is a low current external voltage rail required to bias the control circuitry and provide gate drive for the N-FET pass transistor. The bias voltage must be in the range of 3.0V to 5.5V to ensure proper operation of the device. UNDER VOLTAGE LOCKOUT The bias voltage is monitored by a circuit which prevents the device from functioning when the bias voltage is below the Under-Voltage Lock-Out (UVLO) threshold of approximately 2.45V. As the bias voltage rises above the UVLO threshold the device control circuitry becomes active. There is approximately 150 mV of hysteresis built into the UVLO threshold to provide noise immunity. When the bias voltage is between the UVLO threshold and the Minimum Operating Rating value of 3.0V the device will be functional, but the operating parameters will not be within the guaranteed limits. www.ti.com Soft-Start Time = CSS x rSS x 5 (1) Since the VOUT rise will be exponential, not linear, the in-rush current will peak during the first time constant (), and VOUT will require four additional time constants (4) to reach the final value (5) . After achieving normal operation, should VBIAS fall below the ULVO threshold the device output will be disabled and the Soft-Start capacitor (CSS) discharge circuit will become active. The CSS discharge circuit will remain active until VBIAS falls to 500 mV (typical). When VBIAS falls below 500 mV (typ- 10 The second part is the power that is dissipated in the bias and control circuitry, and can be determined with the formula: PD(BIAS) = VBIAS x IGND(BIAS) (3) where IGND(BIAS) is the portion of the operating ground current of the device that is related to VBIAS. The third part is the power that is dissipated in portions of the output stage circuitry, and can be determined with the formula: PD(IN) = VIN x IGND(IN) (4) where IGND(IN) is the portion of the operating ground current of the device that is related to VIN. The total power dissipation is then: PD = PD(PASS) + PD(BIAS) + PD(IN) (5) The maximum allowable junction temperature rise (TJ) depends on the maximum anticipated ambient temperature (TA) for the application, and the maximum allowable operating junction temperature (TJ(MAX)) . (6) The maximum allowable value for junction to ambient Thermal Resistance, JA, can be calculated using the formula: (7) Heat-Sinking The TO-220 Package The TO220-5 package has a JA rating of 60C/W and a JC rating of 3C/W. These ratings are for the package only, no additional heat-sinking, and with no airflow. If the needed JA, as calculated above, is greater than or equal to 60C/W then no additional heat-sinking is required since the package can safely dissipate the heat and not exceed the operating TJ(MAX). If the needed JA is less than 60C/W then additional heat-sinking is needed. The thermal resistance of a TO-220 package can be reduced by attaching it to a heat sink or a copper plane on a PC board. If a copper plane is to be used, the values of JA will be same as shown in next section for TO-263 package. The heat-sink to be used in the application should have a heat-sink to ambient thermal resistance, HA: 20131223 FIGURE 1. Typical CSS vs COUT Values The CSS capacitor must be connected to a clean ground path back to the device ground pin. No components, other than CSS, should be connected to the SS pin, as there could be adverse effects to VOUT. If the Soft-Start function is not needed the SS pin should be left open, although some minimal capacitance value is always recommended. POWER DISSIPATION AND HEAT-SINKING Additional copper area for heat-sinking may be required depending on the maximum device dissipation (PD) and the maximum anticipated ambient temperature (TA) for the device. Under all possible conditions, the junction temperature must be within the range specified under operating conditions. The total power dissipation of the device is the sum of three different points of dissipation in the device. The first part is the power that is dissipated in the NMOS pass element, and can be determined with the formula: PD(PASS) = (VIN - VOUT) x IOUT (8) where JA is the required total thermal resistance from the junction to the ambient air, CH is the thermal resistance from the case to the surface of the heart-sink, and JC is the thermal resistance from the junction to the surface of the case. For this equation, JC is about 3C/W for a TO-220 package. The value for CH depends on method of attachment, insulator, etc. CH varies between 1.5C/W to 2.5C/W. Consult the heat-sink manufacturer datasheet for details and recommendations. (2) 11 www.ti.com LP38859 ical), the CSS discharge circuit will cease to function due to a lack of sufficient biasing to the control circuitry. Since VREF appears on the SS pin, any leakage through CSS will cause VREF to fall, and thus affect VOUT. A leakage of 50 nA (about 10 M) through CSS will cause VOUT to be approximately 0.1% lower than nominal, while a leakage of 500 nA (about 1 M) will cause VOUT to be approximately 1% lower than nominal. Typical ceramic capacitors will have a factor of 10X difference in leakage between 25C and 85C, so the maximum ambient temperature must be included in the capacitor selection process. Typical CSS values will be in the range of 1 nF to 100 nF, providing typical Soft-Start times in the range of 70 s to 7 ms (5). Values less than 1 nF can be used, but the Soft-Start effect will be minimal. Values larger than 100 nF will provide soft-start, but may not be fully discharged if VBIAS falls from the UVLO threshold to less than 500 mV in less than 100 s. Figure 1 shows the relationship between the COUT value and a typical CSS value. LP38859 Figure 2 shows that increasing the copper area beyond 1 square inch produces very little improvement. The minimum value for JA for the TO-263 package mounted to a PCB is 32C/W. Figure 3 shows the maximum allowable power dissipation for TO-263 packages for different ambient temperatures, assuming JA is 35C/W and the maximum junction temperature is 125C. Heat-Sinking The TO-263 Package The TO-263 package has a JA rating of 60C/W, and a JC rating of 3C/W. These ratings are for the package only, no additional heat-sinking, and with no airflow. The TO-263 package uses the copper plane on the PCB as a heat-sink. The tab of this package is soldered to the copper plane for heat sinking. shows a curve for the JA of TO-263 package for different copper area sizes, using a typical PCB with 1 ounce copper and no solder mask over the copper area for heat-sinking. 20131226 FIGURE 3. Maximum power dissipation vs ambient temperature for the TO-263 package 20131225 FIGURE 2. JA vs Copper (1 Ounce) Area for the TO-263 package www.ti.com 12 LP38859 Physical Dimensions inches (millimeters) unless otherwise noted TO-220 5-Lead, Stagger Bend Package (TO220-5) NS Package Number TO5D TO-263 5-Lead, Molded, Surface Mount Package (TO263-5) NS Package Number TS5B 13 www.ti.com LP38859 3A Fast-Response High-Accuracy LDO Linear Regulator with Soft-Start Notes TI/NATIONAL INTERIM IMPORTANT NOTICE Texas Instruments has purchased National Semiconductor. As of Monday, September 26th, and until further notice, products sold or advertised under the National Semiconductor name or logo, and information, support and interactions concerning such products, remain subject to the preexisting National Semiconductor standard terms and conditions of sale, terms of use of website, and Notices (and/or terms previously agreed in writing with National Semiconductor, where applicable) and are not subject to any differing terms and notices applicable to other TI components, sales or websites. To the extent information on official TI and National websites and business social networking media, etc., pertains to both TI and National-branded products, both companies' instructions, warnings and limitations in the above-referenced terms of use apply. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP(R) Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionicsdefense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com www.ti.com/wireless-apps RF/IF and ZigBee(R) Solutions www.ti.com/lprf Wireless TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright(c) 2011 Texas Instruments Incorporated www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP(R) Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2011, Texas Instruments Incorporated