S6Y4.320 PBYR1635 PBYR1640 PBYR1645 SCHOTTKYBARRIER RECTIFIER DIODES Low-leakage platinum-barrier rectifier diodes in plastic envelopes, featuring low forward voltage drop, low capacitance, and absence of stored charge. They are intended for use in switched-mode power supplies and high-frequency circuits in general, where both low conduction losses and zero switching losses are important. They can also withstand reverse voltage transients and have guaranteed reverse avalanche surge capability. The series consists of normal polarity (cathode to mounting-base) types, QUICK REFERENCE DATA Repetitive peak reverse voltage VRRM max. Average forward current lE(Ay) max. Forward voltage Ve < Junction temperature Tj max. MECHANICAL DATA Fig.1 TO-220AC. | J } Y 3.5 max 5.1 not tinned | _. max |. 4 | 4 13.5 4.32! | be min max (2x) k al | | elileog max (2x) ~~! 508 I Net mass: 2 g. PBYR1635 | 1640 | 1645 35 | 40 | 45 V 16 0.57 V 150 oc Dimensions in mm. _ _ 1.3 > Y . 5.9 mounting min base } (see note} a 15.8 max | > |. 0.6 ~~ +24 M0724 Note: the exposed metal mounting base is directly connected to the cathode. Accessories supplied on request: see data sheets Mounting instructions and accessories for TO-220 envelopes. January 1989 75PBYR1635 PBYR1640 PBYR1645 RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134). Voltages PBYR1635 | 1640 | 1645 Repetitive peak reverse voltage VRRM max. 35 40 45 Vv Crest working reverse voltage VRWM max. 35 40 45 V Continuous reverse voltage VR max. 35 40 45 V a Currents Average forward current square wave; 6 = 0.5; up to Tmb = 125 C (note 1) IF (AV) max. 16 A Repetitive peak forward current (note 1) ty = 25 us; 6 = 0.5; Tmb = 125 C lERM max. 32 A Non-repetitive peak forward current half sinewave; Tj = 125 C prior to surge; with reapplied VRWwM max t=10ms lesm max. 135 A t=8.3ms lESmM max. 150 A i? for fusing (t=10ms) 7 max. 93 As Reverse surge current tp = 2 us; 6 = 0.001 IRRM max. 1.0 A tp = 100 us IRSM max. 1.0 A Temperatures Storage temperature T stg 65 to +175 oC Junction temperature Tj max. 150 oC CHARACTERISTICS Forward voltage (note 2) {p=16A; Tj=125 o Ve < 0.57 V Ip=16A; Tj= 25 C VE < 0.63 V Reverse current VrR=VRWM max: Tj}=125 9 ip < 40 mA VR=VRWM max: Tj= 25 C Ip < 0.2 mA Notes: 1. At rated reverse voltage Vp. 2. Measured under pulse conditions to avoid excessive dissipation. 758 January 1989Schottky-barrier rectifier diodes THERMAL RESISTANCE PBYR1635 PBYR1640 PBYR1645 From junction to mounting base Reh j-mb = 1.5 K/W Influence of mounting method 1. Heatsink-mounted with clip (see mounting instructions) Thermal resistance from mounting base to heatsink a. with heatsink compound Rth mb-h = 0.5 KAN b. with heatsink compound and 0.06mm maximum mica insulator Rth mb-h = 1.4 K/W c. with heatsink compound and 0.1mm maximum mica insulator (56369) Rth mb-h = 2.2 K/W d. with heatsink compound and 0.25mm maximum alumina insulator (56367) Rth mb-h = 0.8 K/W e. without heatsink compound Rth mb-h = 1.4 KAW 2. Free air operation The quoted value of Rt j-4 should be used only when no leads of other dissipating components run to the same tie point. Thermal resistance from junction to ambient in free air: mounted on a printed circuit board at any device lead length and with copper laminate on the board Rth j-a MOUNTING INSTRUCTIONS 1. 2. The leads should not be bent less than 2.4mm from the seal, and should be supported during bending. The bend radius must be no less than 1.0mm. 3. Mounting by means of a spring clip is the best mounting method because it offers: a, a good thermal contact under the crystal area and slightly lower Rth mb-h values than does screw mounting. b. safe isolation for mains operation. However, if a screw is used, it should be M3 cross-recess pan head. Care should be taken to avoid damage to the plastic body. 4. For good thermal contact heatsink compound should be used between mounting base and heatsink. Values of Rth mb-h given for mounting with heatsink compound refer to the use of a metallic-oxide loaded compound. Ordinary silicone grease is not recommended. 5. Rivet mounting (only possible for non-insulated mounting). Devices may be rivetted to flat heatsinks: such a process must neither deform the mounting tab, nor enlarge the mounting hole. 60 K/W The device may be soldered directly into the circuit, but the maximum permissible temperature of the soldering iron or bath is 275 C; the heat source must not be in contact with the joint for more than 5 seconds. Soldered joints must be at least 4.7mm from the seal. January 1989 759PBYR1635 PBYR1640 PBYR1645 SQUARE-WAVE OPERATION M3192 Fig.2 Forward current power rating; V heed Loud le(av) = !eRMs) XV. 0 10 20 30 IF(AV) (A) SINUSOIDAL OPERATION 15 M3193 Fig.3 Forward current power rating; Pr a= form factor = !-(RMs)/IF(AV) (W) 10 0 10 If(avy(A) 20 760 January 1989PBYR1635 Schottky-barrier rectifier diodes PBYR1640 PBYR1645 M1209 M3194 . Tj = 150C I a (may p 125C 10 103 104 1071 10 10-2 1 10 Va(V) 102 0 50 %VRWM ~~ 100 Fig.4 Typical junction capacitance Fig.S Typical values. at f= 1 MHz; Tj = 25 to 125 9%. Fig.6 Typical forward voltage. 0 0.5 1 Ve (Vv) 1.5 January 1989 7