SMF12AT1G - ON Semiconductor

August, 2012 − Rev. 6

1Publication Order Number:

SMF5.0AT1/D

SMF5.0AT1G Series,

SZSMF5.0AT1G Series

200 W Transient

Voltage Suppressor

SOD-123 Flat Lead Package

The SMF5.0AT1G Series is designed to protect voltage sensitive

components from high voltage, high energy transients. Excellent

clamping capability, high surge capability, low zener impedance and

fast response time. Because of its small size, it is ideal for use in

cellular phones, portable devices, business machines, power supplies

and many other industrial/consumer applications.

Features

•Stand−off Voltage: 5 − 58 Volts

•Peak Power − 200 Watts @ 1 ms (SMF5.0A − SMF58A)

•Low Leakage

•Response Time is Typically < 1 ns

•ESD Rating of Class 3 (> 16 kV) per Human Body Model

•ESD Rating of Level 4 (8 kV Contact Discharge) per IEC61000−4−2

•EFT (Electrical Fast Transients) Rating of 40 A per IEC61000−4−4

•Low Profile − Maximum Height of 1.0 mm

•Small Footprint − Footprint Area of 8.45 mm2

•Supplied in 8 mm Tape and Reel − 3,000 Units per Reel

•Cathode Indicated by Polarity Band

•Lead Orientation in Tape: Cathode Lead to Sprocket Holes

•SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

•Pb−Free Packages are Available*

Mechanical Characteristics:

CASE: Void-free, transfer-molded, thermosetting plastic

Epoxy Meets UL 94 V−0

LEAD FINISH: 100% Matte Sn (Tin)

MOUNTING POSITION: Any

QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 1 Requirements

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

PLASTIC SURFACE MOUNT

ZENER OVERVOLTAGE

TRANSIENT SUPPRESSOR

5 − 58 VOLTS

200 WATT PEAK POWER

Device Package Shipping†

ORDERING INFORMATION

1: CATHODE

2: ANODE

http://onsemi.com

SOD−123FL

CASE 498

PLASTIC

MARKING DIAGRAM

CATHODE

ANODE

See specific marking information in the device marking

column of the Electrical Characteristics table on page 3 of

this data sheet.

DEVICE MARKING INFORMATION

SMFxxxAT1G SOD−123FL

(Pb−Free)

3,000 /

Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

xx = Device Code (Refer to page 3)

M = Date Code

G= Pb−Free Package

(Note: Microdot may be in either location)

xx M G

SZSMFxxxAT1G SOD−123FL

(Pb−Free)

3,000 /

Tape & Reel

Uni−Directional TVS

IPP

VRWM

VCVBR

SMF5.0AT1G Series, SZSMF5.0AT1G Series

http://onsemi.com

MAXIMUM RATINGS

Rating Symbol Value Unit

Maximum Ppk Dissipation (PW−10/1000 ms) (Note 1) SMF5.0A − SMF58A Ppk 200 W

Maximum Ppk Dissipation @ TA = 25°C, (PW−8/20 ms) (Note 2) Ppk 1000 W

DC Power Dissipation

@ TA = 25°C (Note 3)

Derate above 25°C

Thermal Resistance, Junction−to−Ambient (Note 3)

°PD°

RqJA

385

4.0

325

°mW

mW/°C

°C/W

Thermal Resistance, Junction−to−Lead (Note 3) RqJcathode 26 °C/W

Operating and Storage Temperature Range TJ, Tstg −55 to +150 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Non−repetitive current pulse at TA = 25°C, per waveform of Figure 2.

2. Non−repetitive current pulse at TA = 25°C, per waveform of Figure 3.

3. Mounted with recommended minimum pad size, DC board FR−4.

ELECTRICAL CHARACTERISTICS (TA = 25°C unless

otherwise noted, VF = 3.5 V Max. @ IF (Note 4) = 12 A)

Symbol Parameter

IPP Maximum Reverse Peak Pulse Current

VCClamping Voltage @ IPP

VRWM Working Peak Reverse Voltage

IRMaximum Reverse Leakage Current @ VRWM

VBR Breakdown Voltage @ IT

ITTest Current

IFForward Current

VFForward Voltage @ IF

4. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms,

duty cycle = 4 pulses per minute maximum.

SMF5.0AT1G Series, SZSMF5.0AT1G Series

http://onsemi.com

ELECTRICAL CHARACTERISTICS (TL = 30°C unless otherwise noted, VF = 1.25 Volts @ 200 mA)

Device* Marking

VRWM (V) VBR @ IT (V) (Note 6) ITIR @ VRWM VC(Max) IPP(Max) (A)

(Note 5) Min Nom Max (mA) (mA) (V) (Note 7)

SMF5.0AG KE 5 6.4 6.7 7 10 400 9.2 21.7

SMF6.0AG KG 6 6.67 7.02 7.37 10 400 10.3 19.4

SMF6.5AG KK 6.5 7.22 7.6 7.98 10 250 11.2 17.9

SMF7.0AG KM 7 7.78 8.2 8.6 10 100 12 16.7

SMF7.5AG KP 7.5 8.33 8.77 9.21 1 50 12.9 15.5

SMF8.0AG KR 8 8.89 9.36 9.83 1 25 13.6 14.7

SMF9.0AG KV 9 10 10.55 11.1 1 5 15.4 13.0

SMF10AG KX 10 11.1 11.7 12.3 1 2.5 17 11.8

SMF11AG KZ 11 12.2 12.85 13.5 1 2.5 18.2 11.0

SMF12AG LE 12 13.3 14 14.7 1 2.5 19.9 10.1

SMF13AG LG 13 14.4 15.15 15.9 1 1 21.5 9.3

SMF14AG LK 14 15.6 16.4 17.2 1 1 23.2 8.6

SMF15AG LM 15 16.7 17.6 18.5 1 1 24.4 8.2

SMF18AG LT 18 20 21 22.1 1 1 29.2 6.8

SMF20AG LV 20 22.2 23.35 24.5 1 1 32.4 6.2

SMF22AG LX 22 24.4 25.6 26.9 1 1 35.5 5.6

SMF24AG LZ 24 26.7 28.1 29.5 1 1 38.9 5.1

SMF26AG ME 26 28.9 30.4 31.9 1 1 42.1 4.8

SMF28AG MG 28 31.1 32.8 34.4 1 1 45.4 4.4

SMF30AG MK 30 33.3 35.1 36.8 1 1 48.4 4.1

SMF33AG MM 33 36.7 38.7 40.6 1 1 53.3 3.8

SMF36AG MP 36 40 42.1 44.2 1 1 58.1 3.4

SMF48AG MX 48 53.3 56.1 58.9 1 1 77.4 2.6

SMF51AG MZ 51 56.7 59.7 62.7 1 1 82.4 2.4

SMF58AG NG 58 64.4 67.8 71.2 1 1 93.6 2.1

5. A transient suppressor is normally selected according to the Working Peak Reverse Voltage (VRWM) which should be equal to or greater

than the DC or continuous peak operating voltage level.

6. VBR measured at pulse test current IT at ambient temperature of 25°C.

7. Surge current waveform per Figure 2 and derate per Figure 3.

*Include SZ-prefix devices where applicable.

SMF5.0AT1G Series, SZSMF5.0AT1G Series

http://onsemi.com

, PULSE WIDTH (ms)

100

1000

10,000

1.0 10 100

01234

100

t, TIME (ms)

VALUE (%)

HALF VALUE −IRSM

PEAK VALUE − IRSM

TYPICAL PROTECTION CIRCUIT

Vin VL

Zin

LOAD

PULSE WIDTH (tP) IS DEFINED

AS THAT POINT WHERE THE PEAK

CURRENT DECAYS TO 50%

OF IRSM.

Figure 1. Pulse Rating Curve Figure 2. 10 X 1000 ms Pulse Waveform

1000 10,000

Figure 3. 8 X 20 ms Pulse Waveform

, PEAK POWER (WATTS)

tr≤ 10 ms

100

00 25 50 75 100 125 150

TA, AMBIENT TEMPERATURE (°C)

120

140

160

Figure 4. Pulse Derating Curve

PEAK PULSE DERATING IN % OF

PEAK POWER OR CURRENT @ TA = 25°C

100

0020406080

t, TIME (ms)

% OF PEAK PULSE CURRENT

PULSE WIDTH (tP) IS DEFINED

AS THAT POINT WHERE THE

PEAK CURRENT DECAY = 8 ms

PEAK VALUE IRSM @ 8 ms

HALF VALUE IRSM/2 @ 20 ms

SMF5.0AT1G Series, SZSMF5.0AT1G Series

http://onsemi.com

1.2

1.0

0.8

0.6

0.4

0.2

−55 25 85 150

T, TEMPERATURE (°C)

V , TYPICAL FORWARD VOLTAGE (VOLTS)

25 50 75 100 125 175

T, TEMPERATURE (°C)

P , MAXIMUM POWER DISSIPATION (m

150

1000

100

1 10 1000

WORKING PEAK REVERSE VOLTAGE (VOLTS)

C, CAPACITANCE (pF)

MEASURED @ 50% VRWM

MEASURED @ ZERO BIAS

Figure 5. Typical Derating Factor for Duty Cycle

DERATING FACTOR

1 ms

10 ms

0.7

0.5

0.3

0.05

0.1

0.2

0.01

0.02

0.03

0.07

100 ms

0.1 0.2 0.5 2 5 10 501 20 100

D, DUTY CYCLE (%)

PULSE WIDTH

10 ms

Figure 6. Steady State Power Derating

Figure 7. Forward Voltage Figure 8. Capacitance versus Working Peak

Reverse Voltage

100

350

300

250

200

150

400

100

SMF5.0AT1G Series, SZSMF5.0AT1G Series

http://onsemi.com

PACKAGE DIMENSIONS

SOD−123FL

CASE 498

ISSUE B

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.

4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION

OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.

POLARITY INDICATOR

OPTIONAL AS NEEDED

DIM

MIN NOM MAX MIN

MILLIMETERS

0.90 0.95 1.00 0.035

INCHES

A1 0.00 0.05 0.10 0.000

b0.70 0.90 1.10 0.028

c0.10 0.15 0.20 0.004

D1.50 1.65 1.80 0.059

E2.50 2.70 2.90 0.098

L0.55 0.75 0.95 0.022

0.037 0.039

0.002 0.004

0.035 0.043

0.006 0.008

0.065 0.071

0.106 0.114

0.030 0.037

NOM MAX

3.40 3.60 3.80 0.134 0.142 0.150

− −

0°8°0°8°

ÉÉÉÉ

inches

0.91

0.036

1.22

0.048

2.36

0.093

4.19

0.165

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

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copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC

reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any

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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications

and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC

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SMF5.0AT1/D

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