SN54BCT760, SN74BCT760
OCTAL BUFFERS/DRIVERS
WITH OPEN-COLLECTOR OUTPUTS
SCBS034B – JULY 1989 – REVISED NOVEMBER 1993
Copyright 1993, Texas Instruments Incorporated
2–1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
•Open-Collector Version of ′BCT244
•Open-Collector Outputs Drive Bus Lines or
Buffer Memory Address Registers
•ESD Protection Exceeds 2000 V Per
MIL-STD-883C Method 3015
•Packages Options Include Plastic
Small-Outline (DW) Packages, Ceramic
Chip Carriers (FK) and Flatpacks (W), and
Standard Plastic and Ceramic 300-mil DIPs
(J, N)
description
These octal buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters.
The ′BCT760 is organized as two 4-bit buffers/line
drivers with separate output-enable (OE) inputs.
When OE is low, the device passes data from the
A inputs to the Y outputs. When OE is high, the
outputs are in the high-impedance state.
The SN54BCT760 is characterized for operation
over the full military temperature range of –55°C
to 125°C. The SN74BCT760 is characterized for
operation from 0°C to 70°C.
FUNCTION TABLE
(each buffer)
INPUTS OUTPUT
OE AY
L H H
LLL
H X H
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
SN54BCT760 ...J OR W PACKAGE
SN74BCT760 . . . DW OR N PACKAGE
(TOP VIEW)
3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
1Y1
2A4
1Y2
2A3
1Y3
1A2
2Y3
1A3
2Y2
1A4
SN54BCT760 . . . FK PACKAGE
(TOP VIEW)
2Y4
1A1
1OE
1Y4
2A2 2OE
2Y1
GND
2A1 VCC
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SN54BCT760, SN74BCT760
OCTAL BUFFERS/DRIVERS
WITH OPEN-COLLECTOR OUTPUTS
SCBS034B – JULY 1989 – REVISED NOVEMBER 1993
2–2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic symbol†logic diagram (positive logic)
1
2
4
6
8
19
11
13
15
17 3
5
7
9
12
14
16
18
1A1
1A2
1A3
1A4
1Y1
2A1
2A2
2A3
2A4
2Y1
1Y2
1Y3
1Y4
2Y2
2Y3
2Y4
2OE
1OE
2
1A1 4
1A2 6
1A3 8
1A4
EN
1
1Y1
18
1Y2
16
1Y3
14
1Y4
12
11
2A1 13
2A2 15
2A3 17
2A4
EN
19
2Y1
9
2Y2
7
2Y3
5
2Y4
3
1OE
2OE
†This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC – 0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) – 0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input current range, II –30 mA to 5 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the disabled or power-off state, VO– 0.5 V to 5.5 V. . . . . . . . . . . . . . .
Voltage range applied to any output in the high state, VO – 0.5 V to VCC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current into any output in the low state: SN54BCT760 96 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74BCT760 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range: SN54BCT760 – 55°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74BCT760 0°C to 70°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range – 65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
‡Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTE 1: The negative input voltage rating may be exceeded if the input clamp current rating is observed.
SN54BCT760, SN74BCT760
OCTAL BUFFERS/DRIVERS
WITH OPEN-COLLECTOR OUTPUTS
SCBS034B – JULY 1989 – REVISED NOVEMBER 1993
2–3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions
SN54BCT760 SN74BCT760
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
VOH High-level output voltage 5.5 5.5 V
IIK Input clamp current –18 –18 mA
IOL Low-level output current 48 64 mA
TAOperating free-air temperature –55 125 0 70 °C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
SN54BCT760 SN74BCT760
UNIT
PARAMETER
TEST
CONDITIONS
MIN TYP†MAX MIN TYP†MAX
UNIT
VIK VCC = 4.5 V, II = –18 mA –1.2 –1.2 V
VOL
VCC =45V
IOL = 48 mA 0.38 0.55
V
V
OL
V
CC =
4
.
5
V
IOL = 64 mA 0.42 0.55
V
IIVCC = 5.5 V, VI = 7 V 0.1 0.1 mA
IIH VCC = 5.5 V, VI = 2.7 V 20 20 µA
IIL VCC = 5.5 V, VI = 0.5 V –1 –1 mA
IOH VCC = 4.5 V, VOH = 5.5 V 0.1 0.1 mA
Outputs high 21 33 21 33
ICC VCC = 5.5 V, Outputs open Outputs low 48 76 48 76 mA
OE disabled 6 10 6 10
CiVCC = 5 V, VI = 2.5 V or 0.5 V 6 6 pF
CoVCC = 5 V, VI = 2.5 V or 0.5 V 10 10 pF
†All typical values are at VCC = 5 V, TA = 25°C.
switching characteristics (see Note 2)
PARAMETER FROM
(
INPUT
)
TO
(
OUTPUT
)
VCC = 5 V,
CL = 50 pF,
RL = 500 Ω,
TA = 25°C
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500 Ω,
TA = MIN to MAX‡UNIT
(INPUT)
(OUTPUT)
′BCT760 SN54BCT760 SN74BCT760
MIN TYP MAX MIN MAX MIN MAX
tPLH
Any A
Y
6.3 8 9.5 6.3 11.1 6.3 10
ns
tPHL
A
ny
A
Y
2.1 4.3 6.5 2.1 7.7 2.1 7.2
ns
tPLH
OE
Y
8.6 13 15.2 8.6 18.7 8.6 17.5
ns
tPHL
OE
Y
3.2 6.2 8.9 3.2 10.4 3.2 9.9
ns
‡For conditions shown as MIN or MAX, use the appropriate values specified under recommended operating conditions.
NOTE 2: Load circuits and voltage waveforms are shown in Section 1.
SN54BCT760, SN74BCT760
OCTAL BUFFERS/DRIVERS
WITH OPEN-COLLECTOR OUTPUTS
SCBS034B – JULY 1989 – REVISED NOVEMBER 1993
2–4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-9093801M2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-9093801MRA ACTIVE CDIP J 20 1 TBD Call TI Call TI
5962-9093801MSA ACTIVE CFP W 20 1 TBD Call TI Call TI
SN54BCT760J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SN74BCT760DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT760DWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT760DWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT760DWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT760DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT760DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT760N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74BCT760NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74BCT760NSR ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT760NSRE4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT760NSRG4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54BCT760FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54BCT760J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SNJ54BCT760W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 2
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54BCT760, SN74BCT760 :
•Catalog: SN74BCT760
•Enhanced Product: SN74BCT760-EP, SN74BCT760-EP
•Military: SN54BCT760
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74BCT760DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
SN74BCT760NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74BCT760DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74BCT760NSR SO NS 20 2000 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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