© Semiconductor Components Industries, LLC, 2011
December, 2011 Rev. 13
1Publication Order Number:
NCP5662/D
NCP5662, NCV5662
Low Output Voltage,
Ultra-Fast 2.0 A Low Dropout
Linear Regulator with Enable
The NCP5662/NCV5662 is a high performance, low dropout linear
regulator designed for high power applications that require up to 2.0 A
current. It is offered in both fixed and adjustable output versions. With
output voltages as low as 0.9 V and ultrafast response times for load
transients, the NCP5662/NCV5662 also provides additional features
such as Enable and Error Flag (for the fixed output version),
increasing the utility of these devices. A thermally robust, 5 pin
D2PAK or DFN8 package, combined with an architecture that offers
low ground current (independent of load), provides for a superior
highcurrent LDO solution.
Features
UltraFast Transient Response (Settling Time: 13 ms)
Low Noise Without Bypass Capacitor (26 mVrms)
Low Ground Current Independent of Load (3.0 mA Maximum)
Fixed/Adjustable Output Voltage Versions
Enable Function
Error Flag (Fixed Output Version)
Current Limit Protection
Thermal Shutdown Protection (160°C)
0.9 V Reference Voltage for UltraLow Output Operation
Power Supply Rejection Ratio > 65 dB
NCV Prefix for Automotive and Other Applications Requiring Site
and Change Controls
These are PbFree Devices
Applications
Servers
ASIC Power Supplies
Post Regulation for Power Supplies
Constant Current Source
Networking Equipment
Gaming and STB Modules
D2PAK
DS SUFFIX
CASE 936AA
1
5
x = P or V
y = A for Adjustable Version
B for Fixed 1.5 V Version
C for Fixed 3.3 V Version
D for Fixed 1.2 V Version
E for Fixed 1.8 V Version
F for Fixed 2.5 V Version
G for Fixed 2.8 V Version
H for Fixed 3.0 V Version
A = Assembly Location
L = Wafer Lot
Y = Year
WW = Work Week
G or G= PbFree Package
MARKING DIAGRAMS AND
PIN ASSIGNMENTS
x5662DSy
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See detailed ordering and shipping information in the package
dimensions section on page 13 of this data sheet.
ORDERING INFORMATION
1
NC
DFN8
MN SUFFIX
CASE 488AF
NCP5
662y
ALYW G
G
(Note: Microdot may be in either location)
Tab = GND
Pin 1 = EN
2 = Vin
3 = GND
4 = Vout
5 = ADJ/EF
Pin 1 = EF
2 = GND
3 = N/C
4 = EN
5, 6 = Vin
7, 8 = Vout
Pin 1 = ADJ
2 = GND
3 = N/C
4 = EN
5, 6 = Vin
7 = Vout
8 = N/C
Fixed Version Adjustable Version
1
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2
Figure 1. Typical Application Schematic, Fixed
Output
Cin
REF Vout
GND
Enable
EN
ONOFF
Cout
Vin
Vin Vout
EF
NCP5662
NCV5662
Cin
Vout
GND
Enable
EN
ONOFF
Cout
Vin
Vin Vout
ADJ
NCP5662
NCV5662
Figure 2. Typical Application Schematic,
Adjustable Output
R1
R2
Error Flag
PIN FUNCTION DESCRIPTION
Pin
Adj/Fixed
D2PAK
Pin
Adj/Fixed
DFN8 Pin Name Description
1 4 EN Enable. This pin allows for on/off control of the regulator. To disable
the device, connect to Ground. If this function is not in use, connect
to Vin.
25, 6* Vin Positive Power Supply Input Voltage
3, TAB 2 GND Power Supply Ground
47, 8 Vout Regulated Output Voltage
5 1 ADJ
(Adjustable Version)
This pin is connected to the resistor divider network and programs
the output voltage.
5 1 EF
(Fixed Version)
An Error Flag is triggered when the output voltage is out of regulation
excluding transient signals that may occur. Requires a pullup resistor
f 100 kW.
3, 8 Pin 3 N/C on Fixed & ADJ Version
while Pin 8 N/C on ADJ Version only
No connection. True no connect. PCB runs allowable.
EPAD EPAD Exposed thermal pad should be connected to ground.
*Pins 5 and 6 must be connected together externally for output current full range operation.
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Voltage
Reference
Block Vref = 0.9 V
Output
Stage
R1
R2
Vout
Cc
GND
Enable
Block
R3
R4
EN
Error
Flag
EF
Vin
Figure 3. Block Diagram, Fixed Output
Voltage
Reference
Block Vref = 0.9 V
Output
Stage
Vout
ADJ
GND
Enable
Block
R3
R4
EN
Vin
Figure 4. Block Diagram, Adjustable Output
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4
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (Note 1) Vin 18 V
Output Pin Voltage Vout 0.3 to (Vin +0.3) V
Adjust Pin Voltage VADJ 0.3 to (Vin +0.3) V
Enable Pin Voltage VEN 0.3 to (Vin +0.3) V
Error Flag Voltage VEF 0.3 to (Vin +0.3) V
Error Flag Current IEF 3.0 mA
Maximum Junction Temperature TJ(max) 150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM), Class 3A, 2000 V
Machine Model (MM), Class C, 200 V
Charge Device Model (CDM), Class IV, 2000 V.
1. Refer to Electrical Characteristics and Application Information for Safe Operating Area.
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Characteristics, D2PAK (Notes 1 and 2)
Thermal Resistance, JunctiontoAmbient
Thermal Resistance, JunctiontoCase
Thermal Reference, JunctiontoLead
RqJA
RqJC
RYJL
45
5.0
7.0
°C/W
Thermal Characteristics, DFN8 (Notes 1 and 2)
Thermal Resistance, JunctiontoAmbient
Thermal Reference, JunctiontoLead (Note 3) RqJA
RYJL
78
14
°C/W
2. As measured using a copper heat spreading area of 1 sq in copper, 1 oz copper thickness.
3. Lead 6.
OPERATING RANGES
Rating Symbol Value Unit
Operating Input Voltage (Note 1) Vin (Vout+VDO), 2 to 9 (Note 4) V
Operating Ambient Temperature Range NCP5662
NCV5662
TA40 to +85
40 to +125
°C
Storage Temperature Range Tstg 55 to +150 °C
4. Minimum Vin = (Vout + VDO) or 2 V, whichever is higher.
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ELECTRICAL CHARACTERISTICS (Vin = Vout + 1.5 V, for typical values TA = 25°C, for min/max values TA = 40°C to 85°C (NCP
version), TA = 40°C to 125°C (NCV version), Cin = Cout = 150 mF unless otherwise noted. (Note 5))
Characteristic Symbol Min Typ Max Unit
ADJUSTABLE OUTPUT VERSION
Output Noise Voltage Vn26 mVrms
Output Voltage
TA = 25°C (Vin = Vout +1.5 V to 7.0 V, Iout = 10 mA to 2.0 A)
TA = 20 to +125°C (Vin = Vout +1.5 V to 7.0 V, Iout = 10 mA to 2.0 A)
T
A = 40 to +150°C (Vin = Vout +1.5 V to 7.0 V, Iout = 10 mA to 2.0 A)
Vout
(1%)
(1.5%)
(2%)
0.9
(+1%)
(+1.5%)
(+2%)
V
Adjustable Pin Input Current IADJ 40 nA
Line Regulation (Iout = 10 mA, Vout+1.5 V < Vin < 7.0 V) REGline 0.03 %
Load Regulation (10 mA < Iout < 2.0 A) REGload 0.03 %
Dropout Voltage (Iout = 2.0 A) VDO 1.0 1.3 V
Peak Output Current Limit Iout(peak) 2.0 A
Internal Current Limitation ILIM 3.0 A
Ripple Rejection (120 Hz)
Ripple Rejection (1 kHz)
RR
70
65
dB
Ground Current
Iout = 2.0 A
Disabled State
IGND
IGND(DIS)
1.3
10
3.0
300
mA
mA
Enable Input Threshold Voltage
Voltage Increasing, On state, Logic High
Voltage Decreasing, Off state, Logic Low
VEN
1.3
0.3
V
Enable Input Current
Enable Pin Voltage = 0.3 Vmax
Enable Pin Voltage = 1.3 Vmin
IEN
0.5
0.5
mA
5. Performance guaranteed over specified operating conditions by design, guard banded test limits, and/or characterization, production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
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ELECTRICAL CHARACTERISTICS (Vin = Vout + 1.5 V, for typical values TA = 25°C, for min/max values TA = 40°C to 85°C (NCP
version), TA = 40°C to 125°C (NCV version), Cin = Cout = 150 mF unless otherwise noted. (Note 6))
Characteristic Symbol Min Typ Max Unit
FIXED OUTPUT VOLTAGE
Output Noise Voltage (Vout = 0.9 V) Vn26 mVrms
Output Voltage (Note 7)
TA = 25°C (Vin = Vout +1.5 V to 7.0 V, Iout = 10 mA to 2.0 A)
TA = 20 to +125°C (Vin = Vout +1.5 V to 7.0 V, Iout = 10 mA to 2.0 A)
T
A = 40 to +150°C (Vin = Vout +1.5 V to 7.0 V, Iout = 10 mA to 2.0 A)
Vout
(1%)
(1.5%)
(2%)
Vout(nom)
(+1%)
(+1.5%)
(+2%)
V
Line Regulation (Iout = 10 mA, Vout+1.5 V < Vin < 7.0 V) REGline 0.03 %
Load Regulation (10 mA < Iout < 2.0 A) REGload 0.2 %
Dropout Voltage (Iout = 2.0 A) VDO 1.0 1.3 V
Peak Output Current Limit Iout(peak) 2.0 A
Internal Current Limitation ILIM 3.0 A
Ripple Rejection (120 Hz)
Ripple Rejection (1 kHz)
RR
70
65
dB
Ground Current
Iout = 2.0 A
Disabled State
IGND
IGND(DIS)
1.3
30
3.0
300
mA
mA
Enable Input Threshold Voltage
Voltage Increasing, On state, Logic High
Voltage Decreasing, Off state, Logic Low
VEN
1.3
0.3
V
Enable Input Current
Enable Pin Voltage = 0.3 Vmax
Enable Pin Voltage = 1.3 Vmin
IEN
0.5
0.5
mA
Error Flag Voltage Threshold (Fixed Output) VEF(VT) 91 94 97 % of Vout
Error Flag Output Low Voltage Saturation (IEF = 1.0 mA) VEF(SAT) 200 mV
Error Flag Leakage IEF(leakage) 1.0 mA
Error Flag Blanking Time (Note 8) tEF 50 ms
6. Performance guaranteed over specified operating conditions by design, guard banded test limits, and/or characterization, production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
7. Fixed output voltage available at 0.9 V per request.
8. Can be disabled per customer request.
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TYPICAL CHARACTERISTICS
(Typical characteristics were measured with the same conditions as electrical characteristics, unless otherwise noted)
0.7
0.8
0.9
1.0
1.1
1.2
1.3
0 0.5 1.0 1.5 2.0
Iout, OUTPUT CURRENT (A)
VDO, DROPOUT VOLTAGE (V)
Vout = 1.5 V Fixed
Cin = 150 mF
Cout = 10 to 150 mF
TA = 25°C
TA, AMBIENT TEMPERATURE (°C)
ISC, SHORT CIRCUIT LIMIT (A)
0
0.5
1.0
1.5
2.0
2.5
50 25 0 25 50 75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
IGND, GROUND CURRENT (mA)
Figure 5. Dropout Voltage vs. Temperature
Figure 6. 1.5 V Dropout Voltage vs. Output Current
TA, AMBIENT TEMPERATURE (°C)
VDO, DROPOUT VOLTAGE (V)
0
0.2
0.4
0.6
0.8
1.2
50 25 0 25 50 75 100 125 150
1.0
2
2.25
2.5
2.75
3
3.5
50 25 0 25 50 75 100 125 15
0
3.25
3.0
3.5
0.7
0.8
0.9
1.0
1.1
1.2
1.3
0 0.5 1.0 1.5 2.0
Iout, OUTPUT CURRENT (A)
VDO, DROPOUT VOLTAGE (V)
Vout = 3.3 V Fixed
Cin = 150 mF
Cout = 10 to 150 mF
TA = 25°C
Figure 7. 3.3 V Dropout Voltage vs. Output Current
Figure 8. Ground Current vs. Temperature Figure 9. Short Circuit Current Limit vs.
Temperature
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TYPICAL CHARACTERISTICS
0 0.5 1.0 1.5 2.0
Iout, OUTPUT CURRENT (A)
Vout, OUTPUT VOLTAGE (V)
1.55
1.53
1.51
1.49
1.47
1.45
Vin = 3.3 V
Iout = 2.0 A maximum
Cin = 150 mF
Cout = 1.0 to 150 mF
TA = 25°C
1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0
Vin, INPUT VOLTAGE (V)
Vout, OUTPUT VOLTAGE (V)
Figure 10. 1.5 V Output Voltage vs. Input Voltage
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Iout = 10 mA
Cin = 150 mF
Cout = 1.0 to 150 mF
TA = 25°C
0 0.5 1.0 1.5 2.0
Iout, OUTPUT CURRENT (A)
Vout, OUTPUT VOLTAGE (V)
3.35
3.33
3.31
3.29
3.27
3.25
Vin = 5.1 V
Iout = 2.0 A maximum
Cin = 150 mF
Cout = 1.0 to 150 mF
TA = 25°C
0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0
Vin, INPUT VOLTAGE (V)
Vout, OUTPUT VOLTAGE (V)
Figure 11. 3.3 V Output Voltage vs. Input Voltage
3.0
2.6
2.2
1.8
1.4
1.0
0.6
0.2
0
Iout = 10 mA
Cin = 150 mF
Cout = 1.0 to 150 mF
TA = 25°C
Figure 12. 1.5 V Output Voltage vs. Output Load
Current
Figure 13. 3.3 V Output Voltage vs. Output Load
Current
1.0
3.4
3.34
3.32
3.30
3.28
3.26
0
10
20
30
40
50
60
70
80
100
0 1.0 10 100 1000
Figure 14. Output Current vs. InputOutput
Voltage Differential
Iout = 1.0 A
Iout = 10 mA
F, FREQUENCY (kHz)
RR, RIPPLE REJECTION (dB)
Vin = 4.0 V
Vout = 0.9 V
Cin = 0 mF
Cout = 1.0 mF
TA = 25°C
90
Figure 15. Ripple Rejection vs. Frequency
OUTPUT CURRENT (A)
INPUTOUTPUT VOLTAGE DIFFERENTIAL (V)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
TA = 25°C
L = 25 mm Copper
201610201412468
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TYPICAL CHARACTERISTICS
0
10
20
30
40
50
60
70
80
100
F, FREQUENCY (kHz)
NOISE DENSITY (nVrms/ǨHz)
90
0
10
20
30
40
50
60
70
80
100
F, FREQUENCY (kHz)
NOISE DENSITY (nVrms/ǨHz)
90
Start 1.0 kHz Stop 100 kHz Start 1.0 kHz Stop 100 kHz
Vin = 12 V
Vout = 0.9 V
Iout = 10 mA
Cin = 150 mF
Cout = 150 mF
TA = 25°C
Vin = 3.3 V
Vout = 0.9 V
Iout = 2.36 A
Cin = 150 mF
Cout = 150 mF
TA = 25°C
Figure 16. Noise Density vs. Frequency Figure 17. Noise Density vs. Frequency
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TYPICAL CHARACTERISTICS
1.0 A/Div
Iout
50 mV/Div
Vout
Iout = 2.0 A to 10 mA
Vin = 3.3 V
Vout = 1.5 V Fixed
Cin = 150 mF
Cout = 150 mF
TA = 25°C
TIME (1.0 ms/Div)
Vin = 3.3 V
Vout = 1.5 V Fixed
Cin = 150 mF
Cout = 150 mF
TA = 25°C
TIME (100 ns/Div)
Vin = 3.3 V
Vout = 1.5 V Fixed
Cin = 150 mF
Cout = 150 mF
TA = 25°C
Iout = 10 mA to 2.0 A
TIME (1.0 ms/Div)
Figure 18. Load Transient Response Figure 19. Load Transient Response
Figure 20. Load Transient Response Figure 21. Load Transient Response
Vin = 3.3 V
Vout = 1.5 V Fixed
Cin = 150 mF
Cout = 150 mF
TA = 25°C
Iout = 10 mA to 2.0 A
TIME (100 ns/Div)
1.0 A/Div 20 mV/Div
Iout Vout
1.0 A/Div 20 mV/Div
Iout Vout
1.0 A/Div 50 mV/Div
Iout Vout
Iout = 2.0 A to 10 mA
1.0 A/Div
Iout
50 mV/Div
Vout
Vin = 4.0 V
Vout = 0.9 V
Cin = 150 mF
Cout = 10 mF
TA = 25°C
TIME (200 ns/Div)
Figure 22. Load Transient Response Figure 23. Load Transient Response
Vin = 4.0 V
Vout = 0.9 V
Cin = 150 mF
Cout = 10 mF
TA = 25°C
Iout = 10 mA to 2.0 A
TIME (200 ns/Div)
1.0 A/Div 20 mV/Div
Iout Vout
Iout = 2.0 A to 10 mA
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APPLICATION INFORMATION
The NCP5662 is a high performance low dropout 2.0 A
linear regulator suitable for high power applications,
featuring an ultrafast response time and low noise without
a bypass capacitor. It is offered in both fixed and adjustable
output versions with voltages as low as 0.9 V. Additional
features, such as Enable and Error Flag (fixed output
version) increase the utility of the NCP5662. It is thermally
robust and includes the safety features necessary during a
fault condition, which provide for an attractive high current
LDO solution for server, ASIC power supplies, networking
equipment applications, and many others.
Input Capacitor
The recommended input capacitor value is a 150 mF
OSCON with an Equivalent Series Resistance (ESR) of
50 mW. It is especially required if the power source is
located more than a few inches from the NCP5662. This
capacitor will reduce device sensitivity and enhance the
output transient response time. The PCB layout is very
important and in order to obtain the optimal solution, the Vin
and GND traces should be sufficiently wide to minimize
noise and unstable operation.
Output Capacitor
Proper output capacitor selection is required to maintain
stability. The NCP5662 is guaranteed to be stable at an
output capacitance of, Cout > 10 mF with an ESR between
50 mW and 300 mW over the output current range of 10 mA
to 2.0 A. For PCB layout considerations, place the
recommended ceramic capacitor close to the output pin and
keep the leads short. This should help ensure ultrafast
transient response times.
Adjustable Output Operation
The application circuit for the adjustable output version is
shown in Figure 2. The reference voltage is 0.9 V and the
adjustable pin current is typically 40 nA. A resistor divider
network, R1 and R2, is calculated using the following
formula:
R1 +R2 ǒVout
Vref *1Ǔ
Cin Cout
Input Output
NCP5662
Enable
ON
OFF
Vin Vout
EN ADJ
Vout = 0.9 V
GND
Figure 24. To achieve the minimum output voltage,
ADJ to Vout has to be connected together
Current Limit Operation
As the peak output current increases beyond its limitation,
the device is internally clampled to 3.0 A, thus causing the
output voltage to decrease and go out of regulation. This
allows the device never to exceed the maximum power
dissipation.
Error Flag Operation
The Error Flag pin on the NCP5662 will produce a logic
Low when it drops below the nominal output voltage. Refer
to the electrical characteristics for the threshold values at
which point the Error Flag goes Low. When the NCP5662
is above the nominal output voltage, the Error Flag will
remain at logic High.
The external pullup resistor needs to be connected
between Vin and the Error Flag pin. A resistor of
approximately 100 kW is recommended to minimize the
current consumption. No pullup resistor is required if the
Error Flag output is not being used.
Thermal Consideration
The maximum package power dissipation is:
PD+
TJ(max) *TA
RqJA
The bipolar process employed for this IC is fully
characterized and rated for reliable 18 V operation. To avoid
damaging the part or degrading it’s reliability, power
dissipation transients should be limited to under 30 W for
D2PAK. For opencircuit to shortcircuit transient,
PDTransient = Vin(operating max) * ISC.
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Figure 25. DFN8 Thermal Resistance vs. Copper Area
COPPER AREA (mm2)
7006005004003002001000
390
340
290
240
190
140
90
40
qJA (°C/W)
1 oz Copper
2 oz Copper
Figure 26. Test Board used for Evaluation
NCP5662 Evaluation Board
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ORDERING INFORMATION
Device Nominal Output Voltage Package Shipping
NCP5662DSADJR4G Adj
(PbFree)
D2PAK 800/Tape & Reel
NCP5662DS12R4G Fixed, 1.2 V
(PbFree)
NCP5662DS15R4G Fixed, 1.5 V
(PbFree)
NCP5662DS18R4G Fixed, 1.8 V
(PbFree)
NCP5662DS25R4G Fixed, 2.5 V
(PbFree)
NCP5662DS28R4G Fixed, 2.8 V
(PbFree)
NCP5662DS30R4G Fixed, 3.0 V
(PbFree)
NCP5662DS33R4G Fixed, 3.3 V
(PbFree)
NCV5662DSADJR4G Adj
(PbFree)
NCV5662DS15R4G Fixed, 1.5 V
(PbFree)
NCP5662MNADJR2G Adj
(PbFree)
DFN8 3000/Tape & Reel
NCP5662MN15R2G Fixed, 1.5 V
(PbFree)
NCP5662MN33R2G Fixed, 3.3 V
(PbFree)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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14
PACKAGE DIMENSIONS
0.067 BSC
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.396 0.406 10.05 10.31
B0.330 0.340 8.38 8.64
C0.170 0.180 4.31 4.57
D0.026 0.035 0.66 0.91
E0.045 0.055 1.14 1.40
G1.70 BSC
H0.539 0.579 13.69 14.71
K0.055 0.066 1.40 1.68
L0.000 0.010 0.00 0.25
M0.098 0.108 2.49 2.74
N0.017 0.023 0.43 0.58
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. PACKAGE OUTLINE EXCLUSIVE OF MOLD
FLASH AND METAL BURR.
4. PACKAGE OUTLINE EXCLUSIVE OF
PLATING THICKNESS.
5. FOOT LENGTH MEASURED AT INTERCEPT
POINT BETWEEN DATUM A AND LEAD
SURFACE.
C
E
P
N
M
W
R
L
A
A
B
H
K
D5 PL
G
12345
S
U
V
P0.058 0.078 1.47 1.98
R0 8
S0.095 0.105 2.41 2.67
U
U1
V
__
0 8
__
U1
V1
V1
W0.010 0.25
0.296 0.304 7.52 7.72
0.265 0.272 6.72 6.92
0.296 0.300 7.53 7.63
0.040 0.044 1.01 1.11
8.38
0.33
1.016
0.04
16.02
0.63
10.66
0.42
3.05
0.12
1.702
0.067
SCALE 3:1 ǒmm
inchesǓ
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
D
2
PAK 5LEAD
CASE 936AA
ISSUE B
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PACKAGE DIMENSIONS
8 PIN DFN, 4x4
CASE 488AF
ISSUE C
ÉÉÉ
ÉÉÉ
ÉÉÉ
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. DETAILS A AND B SHOW OPTIONAL
CONSTRUCTIONS FOR TERMINALS.
DIM MIN MAX
MILLIMETERS
A0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b0.25 0.35
D4.00 BSC
D2 1.91 2.21
E4.00 BSC
E2 2.09 2.39
e0.80 BSC
K0.20 −−−
L0.30 0.50
D
B
E
C0.15
A
C0.15
2X
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Ç
ÇÇ
Ç
Ç
ÇÇ
Ç
Ç
C
A
(A3)
A1
8X
SEATING
PLANE
C0.08
C0.10
Ç
Ç
ÇÇ
Ç
Ç
e
8X L
K
E2
D2
b
NOTE 3
14
58
8X
0.10 C
0.05 C
AB
PIN ONE
REFERENCE
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8X
0.63
2.21
2.39
8X
0.80
PITCH
4.30
0.35
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
ÉÉ
ÉÉ
ÇÇ
A1
A3
L
ÇÇ
ÉÉ
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
L1 −−− 0.15
DETAIL B
NOTE 4
DETAIL A
DIMENSIONS: MILLIMETERS
PACKAGE
OUTLINE
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NCP5662/D
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