1
®
FN3980.14
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
+5V Powered RS-232
Transmitters/Receivers with
0.1Microfarad External Capacitors
The HIN202-HIN213 family of RS-232 transmitters/receivers
interface circuits meet all ElA RS-232E and V.28
specifications, and are particularly suited for those
applications where ±12V is not available. They require a
single +5V power supply and feature onboard charge pump
voltage converters which generate +10V and -10V supplies
from the 5V supply The family of devices offers a wide
variety of RS-232 transmitter/receiver combinations to
accommodate various applications (see Selection Table).
The HIN206, HIN211 and HIN213 feature a low power
shutdown mode to conserve energy in battery powered
applications. In addition, the HIN213 provides two active
receivers in shutdown mode allowing for easy “wakeup”
capability.
The drivers feature true TTL/CMOS input compatibility, slew
rate-limited output, and 300Ω power-off source impedance.
The receivers can handle up to ±30V input, and have a 3kΩ
to 7kΩ input impedance. The receivers also feature
hysteresis to greatly improve noise rejection.
Applications
• Any System Requiring RS-232 Communications Port
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- Modems
Features
• Meets All RS-232E and V.28 Specifications
• Requires Only 0.1µF or Greater External Capacitors
• High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . .120kbit/s
• Two Receivers Active in Shutdown Mode (HIN213)
• Requires Only Single +5V Power Supply
• Onboard Voltage Doubler/Inverter
• Low Power Consumption (Typ) . . . . . . . . . . . . . . . . . 5mA
• Low Power Shutdown Function (Typ) . . . . . . . . . . . . .1µA
• Three-State TTL/CMOS Receiver Outputs
• Multiple Drivers
-±10V Output Swing for +5V lnput
-300Ω Power-Off Source Impedance
- Output Current Limiting
- TTL/CMOS Compatible
-30V/µs Maximum Slew Rate
• Multiple Receivers
-±30V Input Voltage Range
-3kΩ to 7kΩ Input Impedance
- 0.5V Hysteresis to Improve Noise Rejection
Selection Table
PART
NUMBER
POWER SUPPLY
VOLTAGE
NUMBER OF
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS
NUMBER OF
0.1µF
EXTERNAL
CAPACITORS
LOW POWER
SHUTDOWN/TTL
THREE-STATE
NUMBER OF
RECEIVERS
ACTIVE IN
SHUTDOWN
HIN202 +5V 2 2 4 Capacitors No/No 0
HIN206 +5V 4 3 4 Capacitors Yes/Yes 0
HIN207 +5V 5 3 4 Capacitors No/No 0
HIN208 5V 4 4 4 Capacitors No/No 0
HIN211 +5V 4 5 4 Capacitors Yes/Yes 0
HIN213 +5V 4 5 4 Capacitors Yes/Yes 2
Data Sheet August 2002
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 |Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002. All Rights Reserved
2
Ordering Information
PART NO.
TEMP.
RANGE (oC) PACKAGE PKG. NO.
HIN202CB 0 to 70 16 Ld SOIC (W) M16.3
HIN202CB-T 0 to 70 Tape and Reel
HIN202CBN 0 to 70 16 Ld SOIC (N) M16.15
HIN202CBN-T 0 to 70 Tape and Reel
HIN202CP 0 to 70 16 Ld PDIP E16.3
HIN202IB -40 to 85 16 Ld SOIC (W) M16.3
HIN202IBN -40 to 85 16 Ld SOIC (N) M16.15
HIN206CB 0 to 70 24 Ld SOIC M24.3
HIN206CB-T 0 to 70 Tape and Reel
HIN207CA 0 to 70 24 Ld SSOP M24.209
HIN207CB 0 to 70 24 Ld SOIC M24.3
HIN207CB-T 0 to 70 Tape and Reel
HIN207IB -40 to 85 24 Ld SOIC M24.3
HIN208CB 0 to 70 24 Ld SOIC M24.3
HIN208CB-T 0 to 70 Tape and Reel
HIN211CA 0 to 70 28 Ld SSOP M28.209
HIN211CA-T 0 to 70 Tape and Reel
HIN211CB 0 to 70 28 Ld SOIC M28.3
HIN211CB-T 0 to 70 Tape and Reel
HIN213CA 0 to 70 28 Ld SSOP M28.209
HIN213CA-T 0 to 70 Tape and Reel
Ordering Information (Continued)
PART NO.
TEMP.
RANGE (oC) PACKAGE PKG. NO.
Pin Descriptions
PIN FUNCTION
VCC Power Supply Input 5V ±10%, (5V ±5% HIN207).
V+ Internally generated positive supply (+10V nominal).
V- Internally generated negative supply (-10V nominal).
GND Ground Lead. Connect to 0V.
C1+ External capacitor (+ terminal) is connected to this lead.
C1- External capacitor (- terminal) is connected to this lead.
C2+ External capacitor (+ terminal) is connected to this lead.
C2- External capacitor (- terminal) is connected to this lead.
TIN Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to VCC is connected to each lead.
TOUT Transmitter Outputs. These are RS-232 levels (nominally ±10V).
RIN Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected to each input.
ROUT Receiver Outputs. These are TTL/CMOS levels.
EN, EN Receiver enable Input. With EN = 5V (HIN213 EN = 0V), the receiver outputs are placed in a high impedance state.
SD, SD Shutdown Input. With SD = 5V (HIN213 SD = 0V), the charge pump is disabled, the receiver outputs are in a high impedance state
(except R4 and R5 of HIN213) and the transmitters are shut off.
NC No Connect. No connections are made to these leads.
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
3
Pinouts
HIN202 (PDIP, SOIC)
TOP VIEW
HIN206 (SOIC)
TOP VIEW
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1-
C2+
C2-
R2IN
T2OUT
VCC
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
GND
V-
T3OUT
T1OUT
T2OUT
R1IN
R1OUT
T2IN
T1IN
GND
VCC
C1+
V+
C1-
T4OUT
R2OUT
SD
EN
T4IN
R3OUT
V-
C2-
C2+
R2IN
T3IN
R3IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
VCC
+5V
2
V+
16
T1OUT
T2OUT
T1IN
T2IN
T1
T2
11
10
14
7
+5V
400kΩ
+5V
400kΩ
R1OUT R1IN
R1
1312
5kΩ
R2OUT R2IN
R2
89
5kΩ
+10V TO -10V
VOLTAGE INVERTER 0.1µF
6
V-
C2+
C2-
+
0.1µF
4
5
+5V TO 10V
VOLTAGE INVERTER
C1+
C1-
+
0.1µF
1
3
+0.1µF
+
GND
15
9
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+0.1µF
+0.1µF
+
0.1µF
7
6
2
3
18 1
19 24
10
12
11
15
V+
V-
C1+
C1-
C2+
C2-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+
0.1µF
13
14
R1OUT R1IN
R1
45
5kΩ
R2OUT R2IN
R2
2322
5kΩ
R3OUT R3IN
R3
1617
5kΩ
EN
20 21
SD
GND
8
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
4
HIN207 (SOIC, SSOP)
TOP VIEW
HIN208 (SOIC)
TOP VIEW
Pinouts (Continued)
T3OUT
T1OUT
T2OUT
R1IN
R1OUT
T2IN
T1IN
GND
VCC
C1+
V+
C1-
T4OUT
R2OUT
T5IN
T5OUT
T4IN
R3OUT
V-
C2-
C2+
R2IN
T3IN
R3IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
T2OUT
T1OUT
R2IN
R2OUT
T1IN
R1OUT
R1IN
GND
VCC
C1+
V+
C1-
T3OUT
R3OUT
T4IN
T4OUT
T3IN
R4OUT
V-
C2-
C2+
R3IN
T2IN
R4IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
9
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+0.1µF
+0.1µF
+
0.1µF
7
6
2
3
18 1
19 24
10
12
11
15
V+
V-
C1+
C1-
C2+
C2-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+
0.1µF
13
14
R1OUT R1IN
R1
45
5kΩ
R2OUT R2IN
R2
2322
5kΩ
R3OUT R3IN
R3
1617
5kΩ
T5OUT
T5IN
T5
21 20
+5V
400kΩ
GND
8
9
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+0.1µF
+0.1µF
+
0.1µF
5
18
2
1
19 24
21 20
10
12
11
15
V+
V-
C1+
C1-
C2+
C2-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+
0.1µF
13
14
R1OUT R1IN
R1
76
5kΩ
R2OUT R2IN
R2
34
5kΩ
R3OUT R3IN
R3
2322
5kΩ
R4OUT R4IN
R4
1617
5kΩ
GND
8
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
5
HIN211 (SOIC, SSOP)
TOP VIEW
HIN213 (SSOP)
TOP VIEW
NOTE: R4 and R5 active in shutdown.
Pinouts (Continued)
T3OUT
T1OUT
T2OUT
R2IN
R2OUT
T2IN
T1IN
R1OUT
R1IN
GND
VCC
C1+
V+
C1-
T4OUT
R3OUT
SD
EN
R4IN
T4IN
R5OUT
R5IN
V-
C2-
C2+
R3IN
R4OUT
T3IN
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
T3OUT
T1OUT
T2OUT
R2IN
R2OUT
T2IN
T1IN
R1OUT
R1IN
GND
VCC
C1+
V+
C1-
T4OUT
R3OUT
SD
EN
R4IN
T4IN
R5OUT
R5IN
V-
C2-
C2+
R3IN
R4OUT
T3IN
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
11
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T1IN
T2IN
T3IN
T1
T2
T3
+5V
+0.1µF
+0.1µF
+
0.1µF
7
6
2
3
20 1
12
14
13
17
V+
V-
C1+
C1-
C2+
C2-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+
0.1µF
15
16
R1OUT R1IN
R1
9
5kΩ
R2OUT R2IN
R2
45
5kΩ
R3OUT R3IN
R3
2726
5kΩ
R4OUT R4IN
R4
2322
5kΩ
R5OUT R5IN
R5
1819
5kΩ
EN
24
8
T4OUT
T4IN
T4
21 28
+5V
400kΩ
SD
25
GND
10
11
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T1IN
T2IN
T3IN
T1
T2
T3
+5V
+0.1µF
+0.1µF
+
0.1µF
7
6
2
3
20 1
12
14
13
17
V+
V-
C1+
C1-
C2+
C2-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+
0.1µF
15
16
R1OUT R1IN
R1
9
5kΩ
R2OUT R2IN
R2
45
5kΩ
R3OUT R3IN
R3
2726
5kΩ
R4OUT R4IN
R4
2322
5kΩ
R5OUT R5IN
R5
1819
5kΩ
EN
24
8
T4OUT
T4IN
T4
21 28
+5V
400kΩ
25 SD
GND
10
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
6
Absolute Maximum Ratings Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) <VCC < 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . (VCC -0.3V) <V+ < 12V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V)
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V)
ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Temperature Range
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
HIN2XXIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Thermal Resistance (Typical, Note 1) θJA (oC/W)
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 90
16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . . 110
16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . . 100
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75
24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 135
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 100
Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
(SOIC and SSOP - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications Test Conditions: VCC = +5V ±10%, (VCC = +5V ±5%, HIN207); C1-C4 = 0.1µF;
TA = Operating Temperature Range
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
SUPPLY CURRENTS
Power Supply Current, ICC No Load,
TA = 25oC
HIN202 - 8 15 mA
HIN206 - HIN213 - 11 20 mA
Shutdown Supply Current, ICC(SD) TA = 25oC HIN206, HIN211 - 1 10 µA
HIN213 - 15 50 µA
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, VlL TIN, EN, SD, EN, SD --0.8V
Input Logic High, VlH TIN 2.0 - - V
EN, SD, EN, SD 2.4 - - V
Transmitter Input Pullup Current, IPTIN = 0V - 15 200 µA
TTL/CMOS Receiver Output Voltage Low, VOL IOUT = 1.6mA
(HIN202, IOUT = 3.2mA)
-0.10.4V
TTL/CMOS Receiver Output Voltage High, VOH IOUT = -1mA 3.5 4.6 - V
TTL/CMOS Receiver Output Leakage EN = VCC, EN = 0, 0V < ROUT < VCC -0.05±10 µA
RECEIVER INPUTS
RS-232 Input Voltage Range, VIN -30 - +30 V
Receiver Input Impedance, RIN TA = 25oC, VIN = ±3V 3.0 5.0 7.0 kΩ
Receiver Input Low Threshold, VIN (H-L) VCC = 5V,
TA = 25oC
Active Mode 0.8 1.2 - V
Shutdown Mode
HIN213 R4 and R5
0.6 1.5 - V
Receiver Input High Threshold, VIN (L-H) VCC = 5V,
TA = 25oC
Active Mode - 1.7 2.4 V
Shutdown Mode
HIN213 R4 and R5
-1.52.4V
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
7
Receiver Input Hysteresis, VHYST VCC = 5V
No Hysteresis in Shutdown Mode
0.2 0.5 1.0 V
TIMING CHARACTERISTICS
Baud Rate 1 Transmitter
Switching
RL = 3kΩ120 - - kbps
Output Enable Time, tEN HIN206, HIN211, HIN213 - 400 - ns
Output Disable Time, tDIS HIN206, HIN211, HIN213 - 200 - ns
Transmitter, Receiver Propagation Delay, tPD HIN213 SD = 0V, R4, R5 - 0.5 40 µs
HIN213 SD = VCC, R1 - R5 - 0.5 10 µs
HIN202 - HIN211 - 0.5 10 µs
Transition Region Slew Rate, SRTRL = 3kΩ, CL = 2500pF Measured from
+3V to -3V or -3V to +3V, 1 Transmitter
Switching (Note 2)
3-30V/µs
TRANSMITTER OUTPUTS
Output Voltage Swing, TOUT Transmitter Outputs, 3kΩ to Ground ±5±9±10 V
Output Resistance, ROUT VCC = V+ = V- = 0V, VOUT = ±2V 300 - - Ω
RS-232 Output Short Circuit Current, ISC TOUT Shorted to GND - ±10 - mA
NOTE:
2. Guaranteed by design.
Electrical Specifications Test Conditions: VCC = +5V ±10%, (VCC = +5V ±5%, HIN207); C1-C4 = 0.1µF;
TA = Operating Temperature Range (Continued)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
+
-C1
+
-C3 +
-C2 +
-C4
S1 S2 S5 S6
S3 S4 S7 S8
VCC GND
RC
OSCILLATOR
VCC
GND
V+ = 2VCC
GND
V- = - (V+)
C1+
C1-C2-
C2+
VOLTAGE INVERTER
VOLTAGE DOUBLER
FIGURE 1. CHARGE PUMP
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
8
Detailed Description
The HIN202 thru HIN213 family of RS-232
transmitters/receivers are powered by a single +5V power
supply feature low power consumption, and meet all ElA
RS232C and V.28 specifications. The circuit is divided into
three sections: The charge pump, transmitter, and receiver.
Charge Pump
An equivalent circuit of the charge pump is illustrated in
Figure 1. The charge pump contains two sections: the
voltage doubler and the voltage inverter. Each section is
driven by a two phase, internally generated clock to
generate +10V and -10V. The nominal clock frequency is
125kHz. During phase one of the clock, capacitor C1 is
charged to VCC . During phase two, the voltage on C1 is
added to VCC, producing a signal across C3 equal to twice
VCC. During phase two, C2 is also charged to 2VCC, and
then during phase one, it is inverted with respect to ground
to produce a signal across C4 equal to -2VCC. The charge
pump accepts input voltages up to 5.5V. The output
impedance of the voltage doubler section (V+) is
approximately 200Ω, and the output impedance of the
voltage inverter section (V-) is approximately 450Ω. A typical
application uses 0.1µF capacitors for C1-C4, however, the
value is not critical. Increasing the values of C1 and C2 will
lower the output impedance of the voltage doubler and
inverter, increasing the values of the reservoir capacitors, C3
and C4, lowers the ripple on the V+ and V- supplies.
During shutdown mode (HIN206 and HIN211, SD = VCC,
HIN213, SD = 0V) the charge pump is turned off, V+ is
pulled down to VCC, V- is pulled up to GND, and the supply
current is reduced to less than 10µA. The transmitter outputs
are disabled and the receiver outputs (except for HIN213, R4
and R5) are placed in the high impedance state.
Transmitters
The transmitters are TTL/CMOS compatible inverters which
translate the inputs to RS-232 outputs. The input logic
threshold is about 26% of VCC, or 1.3V for VCC = 5V. A logic
1 at the input results in a voltage of between -5V and V- at
the output, and a logic 0 results in a voltage between +5V
and (V+ - 0.6V). Each transmitter input has an internal
400kΩ pullup resistor so any unused input can be left
unconnected and its output remains in its low state. The
output voltage swing meets the RS-232C specifications of
±5V minimum with the worst case conditions of: all
transmitters driving 3kΩ minimum load impedance, VCC =
4.5V, and maximum allowable operating temperature. The
transmitters have an internally limited output slew rate which
is less than 30V/µs. The outputs are short circuit protected
and can be shorted to ground indefinitely. The powered
down output impedance is a minimum of 300Ω with ±2V
applied to the outputs and VCC = 0V.
Receivers
The receiver inputs accept up to ±30V while presenting the
required 3kΩ to 7kΩ input impedance even if the power is off
(VCC = 0V). The receivers have a typical input threshold of
1.3V which is within the ±3V limits, known as the transition
region, of the RS-232 specifications. The receiver output is
0V to VCC. The output will be low whenever the input is
greater than 2.4V and high whenever the input is floating or
driven between +0.8V and -30V. The receivers feature 0.5V
hysteresis (except during shutdown) to improve noise
rejection. The receiver Enable line (EN on HIN206 and
HIN211, EN on HIN213) when unasserted, disables the
receiver outputs, placing them in the high impedance mode.
The receiver outputs are also placed in the high impedance
state when in shutdown mode (except HIN213 R4 and R5).
HIN213 Operation in Shutdown
The HIN213 features two receivers, R4 and R5, which
remain active in shutdown mode. During normal operation
the receivers propagation delay is typically 0.5µs. This
propagation delay may increase slightly during shutdown.
When entering shut down mode, receivers R4 and R5 are
not valid for 80µs after SD = VIL. When exiting shutdown
mode, all receiver outputs will be invalid until the charge
pump circuitry reaches normal operating voltage. This is
typically less than 2ms when using 0.1µF capacitors.
TOUT
V- < VTOUT < V+
300Ω
400kΩ
TXIN
GND < TXIN < VCC
V-
V+
VCC
FIGURE 2. TRANSMITTER
ROUT
GND < VROUT < VCC
5kΩ
RXIN
-30V < RXIN < +30V
GND
VCC
FIGURE 3. RECEIVER
TIN
VOL
VOL
tPLH
tPHL
AVERAGE PROPAGATION DELAY =tPHL + tPLH
2
OR
RIN
TOUT
OR
ROUT
FIGURE 4. PROPAGATION DELAY DEFINITION
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
9
Application Information
The HIN2XX may be used for all RS-232 data terminal and
communication links. It is particularly useful in applications
where ±12V power supplies are not available for
conventional RS-232 interface circuits. The applications
presented represent typical interface configurations.
A simple duplex RS-232 port with CTS/RTS handshaking is
illustrated in Figure 9. Fixed output signals such as DTR
(data terminal ready) and DSRS (data signaling rate select)
is generated by driving them through a 5kW resistor
connected to V+.
In applications requiring four RS-232 inputs and outputs
(Figure 10), note that each circuit requires two charge pump
capacitors (C1 and C2) but can share common reservoir
capacitors (C3 and C4). The benefit of sharing common
reservoir capacitors is the elimination of two capacitors and
the reduction of the charge pump source impedance which
effectively increases the output swing of the transmitters.
Typical Performance Curves
FIGURE 5. V- SUPPLY VOLTAGE vs VCC FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD
12
10
8
6
4
2
03.5 4.0 4.5 6.0
VCC
V- SUPPLY VOLTAGE (V)
5.0 5.53.0
0.1µF
35
|ILOAD| (mA)
V+ (VCC = 4V)
V+ (VCC = 5V)
V- (VCC = 5V)
V- (VCC = 4V)
TA = 25oC
TRANSMITTER OUTPUTS
OPEN CIRCUIT
302520151050
SUPPLY VOLTAGE (|V|)
0
12
10
8
6
4
2
Test Circuits (HIN202)
FIGURE 7. GENERAL TEST CIRCUIT FIGURE 8. POWER-OFF SOURCE RESISTANCE
CONFIGURATION
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1-
C2+
C2-
V-
R2IN
T2OUT
VCC
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
GND
+4.5V TO
+5.5V INPUT
3kΩ
T1 OUTPUT
RS-232 ±30V INPUT
TTL/CMOS OUTPUT
TTL/CMOS INPUT
TTL/CMOS INPUT
TTL/CMOS OUTPUT
+
-
0.1µF
C3
+
-
0.1µF
C1
+
-
0.1µF
C2
+
-
0.1µF C4
3kΩ
OUTPUT
RS-232
±30V INPUT
T2
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1-
C2+
C2-
V-
R2IN
T2OUT
VCC
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
GND
T2OUT
T1OUT
VIN = ±2V A
ROUT = VIN/I
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
10
-
+
-
+
-
+
CTR (20) DATA
TERMINAL READY
DSRS (24) DATA
SIGNALING RATE
RS-232
INPUTS AND OUTPUTS
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
CTS (5) CLEAR TO SEND
SIGNAL GROUND (7)15
8
13
7
14
16
-
+
6
R2 R1
T2
T1
9
12
10
11
4
5
3
1
HIN202
C1
0.1µF
C2
0.1µF
TD
RTS
RD
CTS
SELECT
+5V
INPUTS
OUTPUTS
TTL/CMOS
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS HANDSHAKING
-
+
RS-232
INPUTS AND OUTPUTS
DTR (20) DATA TERMINAL READY
DSRS (24) DATA SIGNALING RATE SELECT
DCD (8) DATA CARRIER DETECT
R1 (22) RING INDICATOR
SIGNAL GROUND (7)15
8
13
7
14
2
-
+
4
R2 R1
T2
T1
9
12
10
11
3
1
HIN202
C1
0.1µF
DTR
DSRS
DCD
R1
+5V
INPUTS
OUTPUTS
TTL/CMOS
-
+
-
+
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
CTS (5) CLEAR TO SEND
8
13
7
14
15
R2 R1
T2
T1
9
12
10
11
4
5
3
1
HIN202
C1
0.1µF
C2
0.1µF
TD
RTS
RD
CTS
INPUTS
OUTPUTS
TTL/CMOS
-
+
5
C2
0.1µF
16
C3
0.2µF
6
26
V- V+
-
+
C4
0.2µF
16 VCC
VCC
FIGURE 10. COMBINING TWO HIN202s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
11
Die Characteristics
DIE DIMENSIONS:
160 mils x 140 mils
METALLIZATION:
Type: Al
Thickness: 10kÅ ±1kÅ
SUBSTRATE POTENTIAL
V+
PASSIVATION:
Type: Nitride over Silox
Nitride Thickness: 8kÅ
Silox Thickness: 7kÅ
TRANSISTOR COUNT:
238
PROCESS:
CMOS Metal Gate
Metallization Mask Layout
HIN211
T3OUT
T1OUT
T2OUT
R2IN
R2OUT T2IN T1IN R1OUT R1IN GND
VCC
C1+
V+
C1-
C2+
C2-
V-
R5IN
R5OUT
T3IN
T4IN
R4OUT
R4IN
ENSHD
T4OUT
R3IN
R3OUT
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
12
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in JE-
DEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and are measured with the leads constrained to be perpendic-
ular to datum .
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA-C-
C
L
E
eA
C
eB
eC
-B-
E1
INDEX 12 3 N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
-A-
0.010 (0.25) C AMBS
E16.3 (JEDEC MS-001-BB ISSUE D)
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.210 - 5.33 4
A1 0.015 - 0.39 - 4
A2 0.115 0.195 2.93 4.95 -
B 0.014 0.022 0.356 0.558 -
B1 0.045 0.070 1.15 1.77 8, 10
C 0.008 0.014 0.204 0.355 -
D 0.735 0.775 18.66 19.68 5
D1 0.005 - 0.13 - 5
E 0.300 0.325 7.62 8.25 6
E1 0.240 0.280 6.10 7.11 5
e 0.100 BSC 2.54 BSC -
eA0.300 BSC 7.62 BSC 6
eB- 0.430 - 10.92 7
L 0.115 0.150 2.93 3.81 4
N16 169
Rev. 0 12/93
13
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA
E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H
µ
0.25(0.010) BM M
α
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0532 0.0688 1.35 1.75 -
A1 0.0040 0.0098 0.10 0.25 -
B 0.013 0.020 0.33 0.51 9
C 0.0075 0.0098 0.19 0.25 -
D 0.3859 0.3937 9.80 10.00 3
E 0.1497 0.1574 3.80 4.00 4
e 0.050 BSC 1.27 BSC -
H 0.2284 0.2440 5.80 6.20 -
h 0.0099 0.0196 0.25 0.50 5
L 0.016 0.050 0.40 1.27 6
N16 167
α0o8o0o8o-
Rev. 0 12/93
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
14
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA
E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H
µ
0.25(0.010) BM M
α
M16.3 (JEDEC MS-013-AA ISSUE C)
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.0200 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 -
D 0.3977 0.4133 10.10 10.50 3
E 0.2914 0.2992 7.40 7.60 4
e 0.050 BSC 1.27 BSC -
H 0.394 0.419 10.00 10.65 -
h 0.010 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N16 167
α0o8o0o8o-
Rev. 0 12/93
15
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H
µ
0.25(0.010) BM M
α
M24.3 (JEDEC MS-013-AD ISSUE C)
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.020 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 -
D 0.5985 0.6141 15.20 15.60 3
E 0.2914 0.2992 7.40 7.60 4
e 0.05 BSC 1.27 BSC -
H 0.394 0.419 10.00 10.65 -
h 0.010 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N24 247
α0o8o0o8o-
Rev. 0 12/93
16
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm
(0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-
sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H
µ
0.25(0.010) BM M
α
0.25
0.010
GAUGE
PLANE
A2
M24.209 (JEDEC MO-150-AG ISSUE B)
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.078 - 2.00 -
A1 0.002 - 0.05 - -
A2 0.065 0.072 1.65 1.85 -
B 0.009 0.014 0.22 0.38 9
C 0.004 0.009 0.09 0.25 -
D 0.312 0.334 7.90 8.50 3
E 0.197 0.220 5.00 5.60 4
e 0.026 BSC 0.65 BSC -
H 0.292 0.322 7.40 8.20 -
L 0.022 0.037 0.55 0.95 6
N24 247
α0o8o0o8o-
Rev. 1 3/95
17
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
INDEX
AREA
E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H
µ
0.25(0.010) BM M
α
M28.3 (JEDEC MS-013-AE ISSUE C)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.0200 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 -
D 0.6969 0.7125 17.70 18.10 3
E 0.2914 0.2992 7.40 7.60 4
e 0.05 BSC 1.27 BSC -
H 0.394 0.419 10.00 10.65 -
h 0.01 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N28 287
α0o8o0o8o-
Rev. 0 12/93
18
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reli-
able. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch)
per side.
5. The chamfer on the body is optional. If it is not present, a visual in-
dex feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dam-
bar protrusion shall be 0.13mm (0.005 inch) total in excess of “B”
dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H
µ
0.25(0.010) BM M
α
0.25
0.010
GAUGE
PLANE
A2
M28.209 (JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.078 - 2.00 -
A1 0.002 - 0.05 - -
A2 0.065 0.072 1.65 1.85 -
B 0.009 0.014 0.22 0.38 9
C 0.004 0.009 0.09 0.25 -
D 0.390 0.413 9.90 10.50 3
E 0.197 0.220 5.00 5.60 4
e 0.026 BSC 0.65 BSC -
H 0.292 0.322 7.40 8.20 -
L 0.022 0.037 0.55 0.95 6
N28 287
α0o8o0o8o-
Rev. 1 3/95