TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
1
TOSHIBA LED Lamps
TLRV1022(T14,F), TLRMV1022(T14,F), TLSV1022(T14,F),
TLOV1022(T14,F), TLAV1022(T14,F),TLYV1022(T14,F),
TLGV1022(T14,F), TLPGV1022(T14,F)
Panel Circuit Indicator
Surface-mount devices, Pb(Lead) free
1.6 (L) × 0.8 (W) × 0.45 (H) mm
InGaAℓP LEDs
High luminous intensity and low power consumption
Suitable for backlighting
Colors: red, orange, amber, yellow, green, pure green
Standard embossed tape packing
4-mm pitch: T14 (4000/reel)
Applications: Backlighting (mobile phones, LCD displays, switching
displays)
Indicators for compact devices and battery-driven
devices etc.
Color and Material
Maximum Ratings (Ta 25°C)
Product Name Forward Current
IF (mA) Reverse Voltage
VR (V) Power Dissipation
PD (mW)
Operating
Temperature
Topr (°C)
Storage
Temperature
Tstg (°C)
TLRV1022
TLRMV1022
TLSV1022
TLOV1022
TLAV1022
TLYV1022
TLGV1022
TLPGV1022
15 4 34.5 40~100 40~100
Unit: mm
LED chip
torelance: ±0.05mm
1. Cathode
2. Anode
JEDEC ―
JEITA ―
TOSHIBA
―
Weight: 0.001 g (typ.)
Product Name Color Material
TLRV1022 Red
TLRMV1022 Red
TLSV1022 Red
TLOV1022 Orange
TLAV1022 Amber
TLYV1022 Yellow
TLGV1022 Green
TLPGV1022 Pure Green
InGaAℓP
For part availability and ordering information please call Toll Free: 800.984.5337
Website: www.marktechopto.com | Email: info@marktechopto.com
TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
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Electrical Characteristics (Ta 25°C)
Forward Voltage VF Reverse Current
IR
Product Name
Min Typ.
Max
IF Max
VR
TLRV1022 1.8 2.1
TLRMV1022 1.8 2.1
TLSV1022 2.0 2.3
TLOV1022 2.0 2.3
TLAV1022 2.0 2.3
TLYV1022 2.0 2.3
TLGV1022 2.0 2.3
TLPGV1022 2.0 2.3
5 10 4
Unit V mA A V
Optical Characteristics–1 (Ta 25°C)
Luminous Intensity IV
Product Name Min Typ.
Max
IF
TLRV1022 4.76
15
TLRMV1022 4.76
20
TLSV1022 8.5 30
TLOV1022 8.5 38
TLAV1022 8.5 25
TLYV1022 8.5 25
TLGV1022 4.76
14
TLPGV1022 1.53
3.5
5
Unit mcd mA
Optical Characteristics–2 (Ta 25°C)
Emission Spectrum
Peak Emission
Wavelength p Dominant Wavelength d
Product Name
Min Typ.
Max
Typ.
Min Typ.
Max
IF
TLRV1022 644 18 624 630 638
TLRMV1022 636 17 620 626 634
TLSV1022 623 17 607 613 621
TLOV1022 612 17 599 605 613
TLAV1022 596 13 585 592 599
TLYV1022 590 13 581 587 595
TLGV1022 574 13 565 571 576
TLPGV1022 558 11 561 566
5
Unit nm nm nm mA
Note: The visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by the IR light.
TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
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TLRV1022
Allowable forward current IF (mA)
Relative luminous intensity
Forward voltage VF (V)
IF – VF
Forward current IF (mA)
Forward current IF (mA)
IV – IF
Luminous intensity IV (mcd)
Case temperature Tc (°C)
IV – Tc
Relative luminous intensity IV
Wavelength (nm)
Relative luminous intensity – wavelength
Ambient temperature Ta (°C)
IF – Ta
1
1.4
10
100
1.6 1.8 2.0 2.2 2.4
3
5
30
50
1
1 10 100
10
100
3
5
30
50
3 5 30 50
0.1
40
1
10
20 0 20 40 60 80 100
0.3
0.5
3
5
0
0 20 40 60 80 100 120
5
10
15
20
25
30
0
580 600 620 640 660 680 700
0.2
0.4
0.6
0.8
1.0
IF 5 mA
Ta 25°C
TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
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TLRMV1022
Allowable forward current IF (mA)
Relative luminous intensity
Forward voltage VF (V)
IF – VF
Forward current IF (mA)
Forward current IF (mA)
IV – IF
Luminous intensity IV (mcd)
Case temperature Tc (°C)
IV – Tc
Relative luminous intensity IV
Wavelength (nm)
Relative luminous intensity – wavelength
Ambient temperature Ta (°C)
IF – Ta
0
0 20 40 60 80 100 120
5
10
15
20
25
30
1
1 10 100
10
100
3
5
30
50
30 50 3 5
0.1
40
1
10
20 0 20 40 60 80 100
3
5
0.3
0.5
1
1.4
10
100
1.6 1.8 2.0 2.2 2.4
3
5
30
50
0
580 600 620 640 660 680 700
0.2
0.4
0.6
0.8
1.0
IF 5 mA
Ta 25°C
TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
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TLSV1022
Allowable forward current IF (mA)
Relative luminous intensity
Forward voltage VF (V)
IF – VF
Forward current IF (mA)
Forward current IF (mA)
IV – IF
Luminous intensity IV (mcd)
Case temperature Tc (°C)
IV – Tc
Relative luminous intensity IV
Wavelength (nm)
Relative luminous intensity – wavelength
Ambient temperature Ta (°C)
IF – Ta
0
0 20 40 60 80 100 120
5
10
15
20
25
30
1
1.6
10
100
1.8 2.0 2.2 2.4 2.6
30
50
3
5
1
1 10 100
10
100
3
5
30
50
30 50 3 5
0.1
40
1
10
20 0 20 40 60 80 100
3
5
0.3
0.5
0
580 600 620 640 660 680 560
0.2
0.4
0.6
0.8
1.0
IF 5 mA
Ta 25°C
TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
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TLOV1022
Allowable forward current IF (mA)
Relative luminous intensity
Forward voltage VF (V)
IF – VF
Forward current IF (mA)
Forward current IF (mA)
IV – IF
Luminous intensity IV (mcd)
Case temperature Tc (°C)
IV – Tc
Relative luminous intensity IV
Wavelength (nm)
Relative luminous intensity – wavelength
Ambient temperature Ta (°C)
IF – Ta
0
0 20 40 60 80 100 120
5
10
15
20
25
30
1
1.6
10
100
1.8 2.0 2.2 2.4 2.6
30
50
3
5
3
1 10 100
10
100
300
5
50
30
30 50 3 5
0.1
40
1
10
20 0 20 40 60 80 100
3
5
0.3
0.5
0
540 560 580 600 620 640 660
0.2
0.4
0.6
0.8
1.0
IF 5 mA
Ta 25°C
TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
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TLAV1022
Allowable forward current IF (mA)
Relative luminous intensity
Forward voltage VF (V)
IF – VF
Forward current IF (mA)
Forward current IF (mA)
IV – IF
Luminous intensity IV (mcd)
Case temperature Tc (°C)
IV – Tc
Relative luminous intensity IV
Wavelength (nm)
Relative luminous intensity – wavelength
Ambient temperature Ta (°C)
IF – Ta
0
540 560 580 600 620 640 660
0.2
0.4
0.6
0.8
1.0
IF 5 mA
Ta 25°C
0
0 20 40 60 80 100 120
5
10
15
20
25
30
1
1.6
10
100
1.8 2.0 2.2 2.4 2.6
30
50
3
5
1
1 10 100
10
100
3
5
30
50
30 50 3 5
0.1
40
1
10
20 0 20 40 60 80 100
3
5
0.3
0.5
TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
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TLYV1022
Allowable forward current IF (mA)
Relative luminous intensity
Forward voltage VF (V)
IF – VF
Forward current IF (mA)
Forward current IF (mA)
IV – IF
Luminous intensity IV (mcd)
Case temperature Tc (°C)
IV – Tc
Relative luminous intensity IV
Wavelength (nm)
Relative luminous intensity – wavelength
Ambient temperature Ta (°C)
IF – Ta
0
0 20 40 60 80 100 120
5
10
15
20
25
30
1
1.6
10
100
1.8 2.0 2.2 2.4 2.6
30
50
3
5
1
1 10 100
10
100
3
5
30
50
30 50 3 5
0.1
40
1
10
20 0 20 40 60 80 100
3
5
0.3
0.5
0
540 560 580 600 620 640 660
0.2
0.4
0.6
0.8
1.0
IF 5 mA
Ta 25°C
TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
9
TLGV1022
Allowable forward current IF (mA)
Relative luminous intensity
Forward voltage VF (V)
IF – VF
Forward current IF (mA)
Forward current IF (mA)
IV – IF
Luminous intensity IV (mcd)
Case temperature Tc (°C)
IV – Tc
Relative luminous intensity IV
Wavelength (nm)
Relative luminous intensity – wavelength
Ambient temperature Ta (°C)
IF – Ta
0
0 20 40 60 80 100 120
5
10
15
20
25
30
1
1.6
10
100
1.8 2.0 2.2 2.4 2.6
30
50
3
5
1
1 10 100
10
100
3
5
30
50
30 50 3 5
0.1
40
1
10
20 0 20 40 60 80 100
3
5
0.3
0.5
0
540 560 580 600 620
0.2
0.4
0.6
0.8
1.0
IF 5 mA
Ta 25°C
TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
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TLPGV1022
Allowable forward current IF (mA)
Relative luminous intensity
Forward voltage VF (V)
IF – VF
Forward current IF (mA)
Forward current IF (mA)
IV – IF
Luminous intensity IV (mcd)
Case temperature Tc (°C)
IV – Tc
Relative luminous intensity IV
Wavelength (nm)
Relative luminous intensity – wavelength
Ambient temperature Ta (°C)
IF – Ta
0
520 540 560 580 600
0.2
0.4
0.6
0.8
1.0
IF 5 mA
Ta 25°C
0
0 20 40 60 80 100 120
5
10
15
20
25
30
1
1.6
10
100
1.8 2.0 2.2 2.4 2.6
30
50
3
5
0.1
40
1
10
20 0 20 40 60 80 100
3
5
0.3
0.5
1
1 10 100
10
3
5
30
3 5 30 50
TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
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Radiation Pattern
Vertical to polarity
Horizontal to polarity
30
0
60
90° 90
30
60
1.0 0.8 0.6 0.4 0.2 0
80
70
50
40
20
10
70
80
50
40
20
10
30
0
60
90° 90
30
60
1.0 0.8 0.6 0.4 0.2 0
80
70
50
40
20
10
70
80
50
40
20
10
TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
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Packaging
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5C~30C
Humidity: 90% (max)
2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of
5°C to 30°C/70% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 605°C, for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
5. If the packing material of laminate would be broken, the air tightness would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
Reflow soldering
First reflow soldering
First reflow soldering should be performed within 168 h after opening the package under the above
“Recommendable temperature profile for Pb-free soldering” profile( recommendable storage condition is 5~30C
with temperature and 70% RH max).
Second reflow soldering
Second reflow soldering should be performed within 168 h after the first reflow under the above
profile( recommendable storage condition is 5~30C with temperature and 70% RH max).
Do not perform flow soldering nor soldering dip .
Please make any necessary soldering corrections by hand.
(only once at each soldering point)
Soldering iron : 25 W
Temperature : 300C or less
Time : within 3 s (for each lead)
Note: This product‘s leads are Pb-free, and Pb-free soldering is required. However if it is mounted with Pb
solder, recommendable temperature profile is the above “temperature profile for Pb soldering”.
60~120 s
10 s max
230C min 〜
240C max
4C/s max
140~160C
4C/s max
Time (s)
Package surface
temperature (C)
Temperature profile (Pb soldering)
Time (s)
Package surface
temperature (C)
Recommended Temperature profile for Pb-free soldering
150~180C
4C/s max
5 s max
260C max
4C/s max
30~50 s
230C
60~120 s
(See Note)
TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
13
Recommended soldering pattern
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES : (made by ASAHI GLASS)
KAO CLEAN TROUGH 750H : (made by KAO)
PINE ALPHA ST-100S : (made by ARAKAWA CHEMICAL)
TOSHIBA TECHNOCARE : (made by GE TOSHIBA SILICONES)
(FRW-17, FRW-1, FRV-100)
Precaution when mounting
Do not apply force to the plastic part of the LED under high-temperature conditions.
To avoid damaging the LED plastic do not apply friction using hard materials.
In installing PCB in a product set after LEDs are assembled on, ensure that other components do not contact
with the device.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The
method of classification is as below. (However, this method does not apply to products whose
electrical/optical characteristics differ from standard Toshiba specifications)
(1) Tape Type: T14 (4-mm pitch)
(2) Example
2. Handling precautions
Tape material protected against static electricity. However, static electricity may occur depending on
quantity of charged static electricity and a device may attach to a tape, or a device may be unstable when
peeling a tape cover.
(a) Since tape materials may accumulate an electrostatic charge, use an ionizer to neutralize the ambient
air.
(b) For transport and temporary storage of devices, use containers (boxes and bags) and jigs that are
made of anti-static materials or of materials which dissipate electrostatic charge.
0.7 0.9
0.8
(Unit: mm)
2.3
0.3
0.25
(T14,F)
TLRV1022
Pb-free product
Toshiba product No.
Tape type
TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
14
3. Tape dimensions
(Unit: mm)
Item Symbol
Value Tolerance
Item Symbol
Value Tolerance
Width W 8.0 0.2
B1 1.85 0.05
Carrier tape
Thickness
t1 0.2 0.05
Length B 1.3 0.05
Diameter
D0 1.55 0.1
A 0.9 0.05
Pitch P0 4.0 0.1
Width A1 0.35 0.05
Feed hole
Position E 1.75 0.1
Depth t2 0.52 0.05
Vertical
Direction (1)
P1 4.0 0.1
Cavity
Diameter of
mark hole
D1 0.5 0.05
Vertical
Direction (2)
P2 2.0 0.1
Distance
form center
line Horizontal
Direction F 3.5 0.1
P0
D0
X’
B
B1
W
P2
D1
P1
Y
Y’
X
E
F
X’
X
A1
A
Y
t1
Y’
t2
Polarity
TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
15
4. Reel dimensions
Unit: mm
5. Leader and trailer section of tape
Note 1: Empty trailer section
Note 2: Empty leader section
2 0.5
13 0.5
21 0.8
11.4 1
9 0.3
60
180
0
4
(Note 1)
Leading part 190 mm (min)
40 mm or more
(Note 2)
40 mm or more
TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
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6. Packing display
(1) Packing quantity
Reel 4,000 pcs
Carton 20,000 pcs
(2) Package form: Each reel is sealed in an aluminum pack with silica gel.
7. Label format
(1) Example: TLSV1022 (T14,F)
P/N:
TYPE TLSV1022
ADD.C (T14,F) QTY 4000 pcs
NOTE Lot Number SEAL DATE:
Lead(Pb) free
(RANK SYMBOL)
*Y380xxxxxxxxxxxxxxxxx*
TOSHIBA
* See below to decipher the Lot Number.
(2) Label location
* Lot Number includes following information.
Example) 4 8 4 F 1 K … Packaged in June 10th, 2004
a b c d e
a: Domestic ID
b: Last one letter of A.D .…0(AD2000)，1(AD2001)，2(AD2002)，〜9(AD2009) Repeat for each decade.
c: Month …A(Jan)，B(Feb)，C(Mar)，D(Apr)，〜L(Dec)
d: Decade of a month …1(Beginning)，2(Middle)，3(Last)
e: Date …A(1st)，B(2nd)，C(3rd)，〜J(9th)，K(10th)，L(31st) (“I” is an exception.)
Tape reel direction
Label position
Label position
Reel
Carton
The aluminum package in which the reel is supplied also has a copy of the label
attached to center of one side.
2D barcode
for
TSB
use
TL(RV,RMV,SV,OV,AV,YV,GV,PGV)1022(T14,F)
2004-12-17
17
The information contained herein is subject to change without notice.
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break,
cut, crush or dissolve chemically.
030619EAC
RESTRICTIONS ON PRODUCT USE
