
 
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SCES308E − AUGUST 2001 − REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DAvailable in the Texas Instruments
NanoStarand NanoFreePackages
DSupports 5-V VCC Operation
DInputs and Open-Drain Outputs Accept
Voltages Up To 5.5 V
DMax tpd of 3.7 ns at 3.3 V
DLow Power Consumption, 10-µA Max ICC
D±24-mA Output Drive at 3.3 V
DTypical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
DTypical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
DIoff Supports Partial-Power-Down Mode
Operation
DLatch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
DESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
This dual buf fer/driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 is open
drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high
wired-AND functions. The maximum sink current is 32 mA.
ORDERING INFORMATION
TAPACKAGEORDERABLE
PART NUMBER TOP-SIDE
MARKING
NanoStar − WCSP (DSBGA)
0.17-mm Small Bump − YEA SN74LVC2G07YEAR
NanoFree − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
Reel of 3000
SN74LVC2G07YZAR
_ _ _CV_
−40
°
C to 85
°
C
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Reel of 3000 SN74LVC2G07YEPR _ _ _CV_
−40°C to 85°C
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free) SN74LVC2G07YZPR
SOT (SOT-23) − DBV Reel of 3000 SN74LVC2G07DBVR C07_
SOT (SC-70) − DCK
Reel of 3000 SN74LVC2G07DCKR
CV_
SOT (SC-70) − DCK Reel of 250 SN74LVC2G07DCKT CV_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year , month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, = Pb-free).
Copyright 2003, Texas Instruments Incorporated
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
6
5
4
1A
GND
2A
1Y
VCC
2Y
3
2
1
4
5
6
2A
GND
1A
2Y
VCC
1Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
NanoStar and NanoFree are trademarks of Texas Instruments.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
  !" # $%&" !#  '%()$!" *!"&+
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#"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*&
"&#"0  !)) '!!&"&#+
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SCES308E − AUGUST 2001 − REVISED SEPTEMBER 2003
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
description/ordering information (continued)
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
FUNCTION TABLE
(each buffer/driver)
INPUT
AOUTPUT
Y
H H
L L
logic diagram (positive logic)
1A 1Y
16
2A 2Y
34
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC −0.5 V to 6.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) −0.5 V to 6.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high-impedance or power-off state, VO
(see Note 1) −0.5 V to 6.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high or low state, VO
(see Notes 1 and 2) −0.5 V to 6.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±100 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 3): DBV package 165°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DCK package 259°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
YEA/YZA package 143°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
YEP/YZP package 123°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The value of VCC is provided in the recommended operating conditions table.
3. The package thermal impedance is calculated in accordance with JESD 51-7.

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SCES308E − AUGUST 2001 − REVISED SEPTEMBER 2003
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POST OFFICE BOX 655303 DALLAS, TEXAS 75265
recommended operating conditions (see Note 4)
MIN MAX UNIT
VCC
Supply voltage
Operating 1.65 5.5
V
VCC Supply voltage Data retention only 1.5 V
VCC = 1.65 V to 1.95 V 0.65 ×VCC
VIH
High-level input voltage
VCC = 2.3 V to 2.7 V 1.7
V
VIH High-level input voltage VCC = 3 V to 3.6 V 2V
VCC = 4.5 V to 5.5 V 0.7 ×VCC
VCC = 1.65 V to 1.95 V 0.35 ×VCC
VIL
Low-level input voltage
VCC = 2.3 V to 2.7 V 0.7
V
VIL Low-level input voltage VCC = 3 V to 3.6 V 0.8 V
VCC = 4.5 V to 5.5 V 0.3 ×VCC
VIInput voltage 0 5.5 V
VOOutput voltage 0 5.5 V
VCC = 1.65 V 4
VCC = 2.3 V 8
I
OL
Low-level output current
VCC = 3 V
16 mA
IOL
Low-level output current
VCC = 3 V 24
mA
VCC = 4.5 V 32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20
t/vInput transition rise or fall rate VCC = 3.3 V ± 0.3 V 10 ns/V
t/v
Input transition rise or fall rate
VCC = 5 V ±0.5 V 5
ns/V
TAOperating free-air temperature −40 85 °C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYPMAX UNIT
IOL = 100 mA1.65 V to 5.5 V 0.1
IOL = 4 mA 1.65 V 0.45
IOL = 8 mA 2.3 V 0.3
V
VOL IOL = 16 mA
3 V
0.4 V
IOL = 24 mA 3 V 0.55
IOL = 32 mA 4.5 V 0.55
IIA inputs VI = 5.5 V or GND 0 to 5.5 V ±5mA
Ioff VI or VO = 5.5 V 0±10 mA
ICC VI = 5.5 V or GND, IO = 0 1.65 V to 5.5 V 10 mA
ICC One input at VCC − 0.6 V, Other inputs at VCC or GND 3 V to 5.5 V 500 mA
CiVI = VCC or GND 3.3 V 3.5 pF
All typical values are at VCC = 3.3 V, TA = 25°C.

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SCES308E − AUGUST 2001 − REVISED SEPTEMBER 2003
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 1.8 V
± 0.15 V VCC = 2.5 V
± 0.2 V VCC = 3.3 V
± 0.3 V VCC = 5 V
± 0.5 V
UNIT
PARAMETER
(INPUT)
(OUTPUT)
MIN MAX MIN MAX MIN MAX MIN MAX
UNIT
tpd AY1.5 8.6 1 4.4 1 3.7 1 2.9 ns
operating characteristics, TA = 25°C
PARAMETER
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V
UNIT
PARAMETER
TYP TYP TYP TYP
UNIT
Cpd Power dissipation capacitance f = 10 MHz 3 3 4 4 pF

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SCES308E − AUGUST 2001 − REVISED SEPTEMBER 2003
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POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
(OPEN DRAIN)
VM
th
tsu
From Output
Under Test CL
(see Note A)
LOAD CIRCUIT
S1
V
LOAD
Open
GND
RL
RL
Data Input
Timing Input VI
0 V
VI
0 V
0 V
tw
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VI
0 V
Input
Output
Waveform 1
S1 at VLOAD
(see Note B)
Output
Waveform 2
S1 at VLOAD
(see Note B)
VOL
tPZL
tPZH
tPLZ
tPHZ
VLOAD/2
0 V
VOL + V
VLOAD/2 − V
0 V
VI
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
N
OTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 .
D. The outputs are measured one at a time with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at VM.
G. tPLZ is measured at VOL + V.
H. All parameters and waveforms are not applicable to all devices.
Output
Control
VMVM
VMVM
VMVM
VM
VMVM
VM
VM
VM
VI
VM
VM
1.8 V ±0.15 V
2.5 V ±0.2 V
3.3 V ±0.3 V
5 V ±0.5 V
1 k
500
500
500
VCC RL
2 × VCC
2 × VCC
6 V
2 × VCC
VLOAD CL
30 pF
30 pF
50 pF
50 pF
0.15 V
0.15 V
0.3 V
0.3 V
V
VCC
VCC
3 V
VCC
VI
VCC/2
VCC/2
1.5 V
VCC/2
VM
tr/tf
2 ns
2 ns
2.5 ns
2.5 ns
INPUT
tPZL (see Notes E and F)
tPLZ (see Notes E and G)
tPHZ/tPZH
VLOAD
VLOAD
VLOAD
TEST S1
VLOAD/2
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74LVC2G07DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DBVRE4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKRE4 ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKT ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKTE4 ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07YEAR ACTIVE WCSP YEA 6 3000 TBD SNPB Level-1-260C-UNLIM
SN74LVC2G07YEPR ACTIVE WCSP YEP 6 3000 TBD SNPB Level-1-260C-UNLIM
SN74LVC2G07YZAR ACTIVE WCSP YZA 6 3000 Pb-Free
(RoHS) SNAGCU Level-1-260C-UNLIM
SN74LVC2G07YZPR ACTIVE WCSP YZP 6 3000 Pb-Free
(RoHS) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 4-Oct-2005
Addendum-Page 1
MECHANICAL DATA
MPDS114 – FEBRUARY 2002
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DCK (R-PDSO-G6) PLASTIC SMALL-OUTLINE PACKAGE
0,15
Gage Plane
0,10
M
0,10
0,65
0°–8°0,46
0,26
0,13 NOM
4093553-3/D 01/02
0,15
0,30
1,40
1,10 2,40
1,80
46
2,15
1,85
1 3
1,10
0,80 0,10
0,00
Seating Plane
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-203
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