© Semiconductor Components Industries, LLC, 2011
September, 2011 Rev. 10
1Publication Order Number:
C106/D
C106 Series
Sensitive Gate Silicon
Controlled Rectifiers
Reverse Blocking Thyristors
Glassivated PNPN devices designed for high volume consumer
applications such as temperature, light, and speed control; process and
remote control, and warning systems where reliability of operation is
important.
Features
Glassivated Surface for Reliability and Uniformity
Power Rated at Economical Prices
Practical Level Triggering and Holding Characteristics
Flat, Rugged, Thermopad Construction for Low Thermal Resistance,
High Heat Dissipation and Durability
Sensitive Gate Triggering
These are PbFree Devices
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Characteristic Symbol Max Unit
Peak Repetitive OffState Voltage (Note 1)
(Sine Wave, 5060 Hz, RGK = 1 kW,
TC = 40° to 110°C)
C106B
C106D, C106D1*
C106M, C106M1*
VDRM,
VRRM
200
400
600
V
On-State RMS Current
(180°Conduction Angles, TC = 80°C)
IT(RMS) 4.0 A
Average OnState Current
(180°Conduction Angles, TC = 80°C)
IT(AV) 2.55 A
Peak Non-Repetitive Surge Current
(1/2 Cycle, Sine Wave, 60 Hz, TJ = +25°C)
ITSM 20 A
Circuit Fusing Considerations (t = 8.3 ms) I2t 1.65 A2s
Forward Peak Gate Power
(Pulse Width v1.0 msec, TC = 80°C)
PGM 0.5 W
Forward Average Gate Power
(Pulse Width v1.0 msec, TC = 80°C)
PG(AV) 0.1 W
Forward Peak Gate Current
(Pulse Width v1.0 msec, TC = 80°C)
IGM 0.2 A
Operating Junction Temperature Range TJ40 to
+110
°C
Storage Temperature Range Tstg 40 to
+150
°C
Mounting Torque (Note 2) 6.0 in. lb.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings
apply for zero or negative gate voltage; however, positive gate voltage shall
not be applied concurrent with negative potential on the anode. Blocking
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
2. Torque rating applies with use of compression washer (B52200F006).
Mounting torque in excess of 6 in. lb. does not appreciably lower case-to-sink
thermal resistance. Anode lead and heatsink contact pad are common.
TO225AA
CASE 077
STYLE 2
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
SCRs
4 A RMS, 200 600 Volts
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K
G
A
MARKING DIAGRAM & PIN ASSIGNMENT
Y = Year
WW = Work Week
C106xx = Device Code
xx = B, D, D1, M, M1
G = PbFree Package
YWW
C106xxG
1. Cathode
2. Anode
3. Gate
C106 Series
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2
THERMAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)
Characteristic Symbol Max Unit
Thermal Resistance, JunctiontoCase RqJC 3.0 °C/W
Thermal Resistance, JunctiontoAmbient RqJA 75 °C/W
Maximum Lead Temperature for Soldering Purposes 1/8 in. from Case for 10 Seconds TL260 °C
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current
(VAK = Rated VDRM or VRRM, RGK = 1 kW)T
J = 25°C
TJ = 110°C
IDRM, IRRM
10
100
mA
mA
ON CHARACTERISTICS
Peak Forward OnState Voltage (Note 3)
(ITM = 4 A)
VTM 2.2 V
Gate Trigger Current (Continuous dc) (Note 4)
(VAK = 6 Vdc, RL = 100 W)T
J = 25°C
TJ = 40°C
IGT
15
35
200
500
mA
Peak Reverse Gate Voltage (IGR = 10 mA) VGRM 6.0 V
Gate Trigger Voltage (Continuous dc) (Note 4)
(VAK = 6 Vdc, RL = 100 W)T
J = 25°C
TJ = 40°C
VGT
0.4
0.5
0.60
0.75
0.8
1.0
V
Gate NonTrigger Voltage (Continuous dc) (Note 4)
(VAK = 12 V, RL = 100 W, TJ = 110°C)
VGD 0.2 V
Latching Current
(VAK = 12 V, IG = 20 mA, RGK = 1 kW)T
J = 25°C
TJ = 40°C
IL
0.20
0.35
5.0
7.0
mA
Holding Current (VD = 12 Vdc)
(Initiating Current = 20 mA, RGK = 1 kW)T
J = 25°C
TJ = 40°C
TJ = +110°C
IH
0.19
0.33
0.07
3.0
6.0
2.0
mA
DYNAMIC CHARACTERISTICS
Critical RateofRise of OffState Voltage
(VAK = Rated VDRM, Exponential Waveform, RGK = 1 kW,
TJ = 110°C)
dv/dt 8.0 V/ms
3. Pulse Test: Pulse Width 2.0 ms, Duty Cycle 2%.
4. RGK is not included in measurement.
C106 Series
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3
+ Current
+ Voltage
VTM
IDRM at VDRM
IH
Symbol Parameter
VDRM Peak Repetitive Off State Forward Voltage
IDRM Peak Forward Blocking Current
VRRM Peak Repetitive Off State Reverse Voltage
IRRM Peak Reverse Blocking Current
VTM Peak On State Voltage
IHHolding Current
Voltage Current Characteristic of SCR
Anode +
on state
Reverse Blocking Region
(off state)
Reverse Avalanche Region
Anode
Forward Blocking Region
IRRM at VRRM
(off state)
DC
DC
JUNCTION TEMPERATURE 110°C
100
10
20
30
40
70
110
90
3.6
80
0 .4 .8 1.61.2 2.0 2.4 3.2
60
4.0
IT(AV) AVERAGE ON‐STATE CURRENT (AMPERES)
HALF SINE WAVE
RESISTIVE OR INDUCTIVE LOAD.
50 to 400 Hz
50
6
4
2
0
8
0
10
2.8 3.6.4 .8 1.61.2 2.0 2.4 3.2 4.02.6
IT(AV) AVERAGE ON‐STATE CURRENT (AMPERES)
HALF SINE WAVE
RESISTIVE OR INDUCTIVE LOAD
50 TO 400Hz.
C°T , CASE TEMPERATURE ( C)
P , AVERAGE ON‐STATE POWER DISSIPATION (WATTS)
(AV)
Figure 1. Average Current Derating Figure 2. Maximum OnState Power Dissipation
C106 Series
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4
1
100
95-40 -25 -10 205355080
10
110
TJ, JUNCTION TEMPERATURE (°C)
65
GT mI
Figure 3. Typical Gate Trigger Current versus
Junction Temperature
Figure 4. Typical Holding Current versus
Junction Temperature
0.9
0.2
0.3
0.4
0.7
1.0
0.8
95-45 -25 -10 205355080
0.6
110
TJ, JUNCTION TEMPERATURE (°C)
0.5
65
GT
V
Figure 5. Typical Gate Trigger Voltage versus
Junction Temperature
Figure 6. Typical Latching Current versus
Junction Temperature
, GATE TRIGGER CURRENT ( A)
10
1000
95-40 -25 -10 205355080
100
110
TJ, JUNCTION TEMPERATURE (°C)
65
HmI, HOLDING CURRENT ( A)
10
1000
95-40 -25 -10 205355080
100
110
TJ, JUNCTION TEMPERATURE (°C)
65
LmI, LATCHING CURRENT ( A)
, GATE TRIGGER VOLTAGE (V)
C106 Series
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5
The dimensional diagrams below compare the critical dimensions of the ON Semiconductor C-106 package with
competitive devices. It has been demonstrated that the smaller dimensions of the ON Semiconductor package make it
compatible in most lead-mount and chassis-mount applications. The user is advised to compare all critical dimensions for
mounting compatibility.
ON Semiconductor C-106 Package Competitive C-106 Package
.315
____
.285
.105
____
.095
.054
____
.046
.420
____
.400
.400
____
.360
.385
____
.365
.135
____
.115
.520
____
.480
.127
____
.123 DIA
.105
____
.095 .190
____
.170
.026
____
.019
.025
____
.035
.295
____
.305
.148
____
.158
.115
____
.130
_
.015
____
.025
.050
____
.095
.145
____
.155
5 TYP
.425
____
.435
.575
____
.655
.020
____
.026
123
.045
____
.055
.095
____
.105
.040
.094 BSC
PACKAGE INTERCHANGEABILITY
ORDERING INFORMATION
Device Package Shipping
C106BG TO225AA
(PbFree)
500 Units / Box
C106DG TO225AA
(PbFree)
500 Units / Box
C106D1G* TO225AA
(PbFree)
500 Units / Box
C106MG TO225AA
(PbFree)
500 Units / Box
C106M1G* TO225AA
(PbFree)
500 Units / Box
*D1 signifies European equivalent for D suffix and M1 signifies European equivalent for M suffix.
C106 Series
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6
PACKAGE DIMENSIONS
TO225
CASE 7709
ISSUE Z
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 077-01 THRU -08 OBSOLETE, NEW STANDARD
077-09.
STYLE 2:
PIN 1. CATHODE
2. ANODE
3. GATE
B
AM
K
FC
Q
H
V
G
S
D
J
R
U
132
2 PL
M
A
M
0.25 (0.010) B M
M
A
M
0.25 (0.010) B M
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.425 0.435 10.80 11.04
B0.295 0.305 7.50 7.74
C0.095 0.105 2.42 2.66
D0.020 0.026 0.51 0.66
F0.115 0.130 2.93 3.30
G0.094 BSC 2.39 BSC
H0.050 0.095 1.27 2.41
J0.015 0.025 0.39 0.63
K0.575 0.655 14.61 16.63
M5 TYP 5 TYP
Q0.148 0.158 3.76 4.01
R0.045 0.065 1.15 1.65
S0.025 0.035 0.64 0.88
U0.145 0.155 3.69 3.93
V0.040 --- 1.02 ---
__
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81357733850
C106/D
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