© Semiconductor Components Industries, LLC, 2011
September, 2011 − Rev. 21
1Publication Order Number:
LM317M/D
LM317M, NCV317MAB,
NCV317MB
500 mA Adjustable Output,
Positive Voltage Regulator
The LM317M is an adjustable three−terminal positive voltage
regulator capable of supplying in excess of 500 mA over an output
voltage range of 1.2 V to 37 V. This voltage regulator is exceptionally
easy to use and requires only two external resistors to set the output
voltage. Further, it employs internal current limiting, thermal
shutdown and safe area compensation, making it essentially blow−out
proof.
The LM317M serves a wide variety of applications including local,
on−card regulation. This device also makes an especially simple
adjustable switching regulator, a programmable output regulator, or by
connecting a fixed resistor between the adjustment and output, the
LM317M can be used as a precision current regulator.
Features
•Output Current in Excess of 500 mA
•Output Adjustable between 1.2 V and 37 V
•Internal Thermal Overload Protection
•Internal Short Circuit Current Limiting
•Output Transistor Safe−Area Compensation
•Floating Operation for High Voltage Applications
•Eliminates Stocking Many Fixed Voltages
•NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
•Pb−Free Packages are Available
Figure 1. Simplified Application
* = Cin is required if regulator is located an appreciable distance from power supply filter.
** = CO is not needed for stability, however, it does improve transient response.
Since IAdj is controlled to less than 100 mA, the error associated with this
term is negligible in most applications.
LM317M
Vin Vout
R1
240
R2
Adjust
IAdj
*
Cin
0.1mF
**
+CO
1.0mF
Vin Vout
Vout +1.25Vǒ1)R2
R1Ǔ)IAdjR2
TO−220AB
T SUFFIX
CASE 221AB
123
PIN ASSIGNMENT
1
2
3V
in
Adjust
Vout
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
123
Heatsink Surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
SOT−223
ST SUFFIX
CASE 318E
DPAK
DT SUFFIX
CASE 369C
Heatsink surface
connected to Pin 2
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3
4
See general marking information in the device marking
section on page 11 of this data sheet.
DEVICE MARKING INFORMATION
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LM317M, NCV317MAB, NCV317MB
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2
MAXIMUM RATINGS (TA = 25°C, unless otherwise noted.)
Rating Symbol Value Unit
Input−Output Voltage Differential VI−VO40 Vdc
Power Dissipation (Package Limitation) (Note 1)
Plastic Package, T Suffix, Case 221A
TA = 25°C
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Plastic Package, DT Suffix, Case 369C
TA = 25°C
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Plastic Package, ST Suffix, Case 318E
TA = 25°C
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
PD
qJA
qJC
PD
qJA
qJC
PD
qJA
qJC
Internally Limited
70
5.0
Internally Limited
92
5.0
Internally Limited
245
15
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Operating Junction Temperature Range TJ−40 to +150 °C
Storage Temperature Range Tstg −65 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Figure 25 provides thermal resistance versus PC board pad size.
ELECTRICAL CHARACTERISTICS (VI − VO = 5.0 V; IO = 0.1 A, TJ = Tlow to Thigh (Note 2), unless otherwise noted.)
Characteristics Figure Symbol
LM317M / LM317MB/NCV317MB
Unit
Min Typ Max
Line Regulation (Note 3) (TA = 25°C, 3.0 V ≤ VI − VO ≤ 40 V) 3 Regline −0.01 0.04 %/V
Load Regulation (Note 3)
TA = 25°C, 10 mA ≤ IO ≤ 0.5 A
VO ≤ 5.0 V
VO ≥ 5.0 V
4 Regload
−
−
5.0
0.1
25
0.5
mV
% VO
Adjustment Pin Current 5 IAdj −50 100 mA
Adjustment Pin Current Change
2.5 V ≤ VI − VO ≤ 40 V, 10 mA ≤ IL ≤ 0.5 A, PD ≤ Pmax
3, 4 DIAdj −0.2 5.0 mA
Reference Voltage
3.0 V ≤VI − VO ≤ 40 V, 10 mA ≤ IL ≤ 0.5 A, PD ≤ Pmax
5 Vref 1.20 1.25 1.30 V
Line Regulation 3.0 V ≤VI−VO ≤ 40 V (Note 3) 3 Regline −0.02 0.07 %/V
Load Regulation 10 mA ≤IO ≤0.5 A (Note 3)
VO ≤5.0 V
VO ≥ 5.0 V
4 Regload
−
−
20
0.3
70
1.5
mV
% VO
Temperature Stability (Tlow ≤TJ ≤Thigh) 5 TS−0.7 −% VO
Minimum Load Current to Maintain Regulation (VI − VO = 40 V) 5 ILmin −3.5 10 mA
Maximum Output Current
VI − VO ≤ 15 V, PD ≤ Pmax
VI − VO = 40 V, PD ≤Pmax, TA = 25°C
5 Imax 0.5
0.15
0.9
0.25
−
−
A
RMS Noise, % of VO (TA = 25°C, 10 Hz ≤f ≤10 kHz) −N−0.003 −% VO
Ripple Rejection, VO = 10 V, f = 120 Hz (Note 4)
Without CAdj
CAdj = 10 mF
6 RR
−
66
65
80
−
−
dB
Thermal Shutdown (Note 5) − − − 180 −°C
Long−Term Stability, TJ = Thigh (Note 6)
TA= 25°C for End−point Measurements
5 S −0.3 1.0 %/1.0
kHrs.
2. Tlow to Thigh = 0° to +125°C for LM317M Tlow to Thigh = −40° to +125°C for LM317MB, NCV317MB.
3. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account
separately. Pulse testing with low duty cycle is used.
4. CAdj, when used, is connected between the adjustment pin and ground.
5. Thermal characteristics are not subject to production test.
6. Since Long−Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average
stability from lot−to−lot.
LM317M, NCV317MAB, NCV317MB
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ELECTRICAL CHARACTERISTICS (VI − VO = 5.0 V; IO = 0.1 A, TJ = Tlow to Thigh (Note 7), unless otherwise noted.)
Characteristics Figure Symbol
LM317MA / LM317MAB/NCV317MAB
Unit
Min Typ Max
Line Regulation (Note 8) (TA = 25°C, 3.0 V ≤ VI − VO ≤ 40 V) 3 Regline −0.01 0.04 %/V
Load Regulation (Note 8)
TA = 25°C, 10 mA ≤ IO ≤ 0.5 A
VO ≤ 5.0 V
VO ≥ 5.0 V
4 Regload
−
−
5.0
0.1
25
0.5
mV
% VO
Adjustment Pin Current 5 IAdj −50 100 mA
Adjustment Pin Current Change
2.5 V ≤ VI − VO ≤ 40 V, 10 mA ≤ IL ≤ 0.5 A, PD ≤ Pmax
3, 4 DIAdj −0.2 5.0 mA
Reference Voltage
3.0 V ≤VI − VO ≤ 40 V, 10 mA ≤ IL ≤ 0.5 A, PD ≤ Pmax
5 Vref 1.225 1.250 1.275 V
Line Regulation (Note 8)
3.0 V ≤VI−VO ≤ 40 V
3 Regline −0.02 0.07 %/V
Load Regulation (Note 8)
10 mA ≤IO ≤0.5 A
VO ≤5.0 V
VO ≥ 5.0 V
4 Regload
−
−
20
0.3
70
1.5
mV
% VO
Temperature Stability (Tlow ≤TJ ≤Thigh) 5 TS−0.7 −% VO
Minimum Load Current to Maintain Regulation (VI − VO = 40 V) 5 ILmin −3.5 10 mA
Maximum Output Current
VI − VO ≤ 15 V, PD ≤ Pmax
VI − VO = 40 V, PD ≤Pmax, TA = 25°C
5 Imax 0.5
0.15
0.9
0.25
−
−
A
RMS Noise, % of VO (TA = 25°C, 10 Hz ≤f ≤10 kHz) −N− − − % VO
Ripple Rejection, VO = 10 V, f = 120 Hz (Note 9)
Without CAdj
CAdj = 10 mF
6 RR
−
66
65
80
−
−
dB
Thermal Shutdown (Note 10) − − − 180 −°C
Long−Term Stability, TJ = Thigh (Note 11)
TA= 25°C for End−point Measurements
5 S −0.3 1.0 %/1.0
kHrs.
7. Tlow to Thigh = 0° to +125°C for LM317MA Tlow to Thigh = −40° to +125°C for LM317MAB, NCV317MAB.
8. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account
separately. Pulse testing with low duty cycle is used.
9. CAdj, when used, is connected between the adjustment pin and ground.
10.Thermal characteristics are not subject to production test.
11. Since Long−Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average
stability from lot−to−lot.
LM317M, NCV317MAB, NCV317MB
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Figure 2. Representative Schematic Diagram
18k
6.8V
6.8V
350
300 300 300 3.0k 300 70
200k
1.2560
50
130
8.67k 500
400
2.4k
12.8k
Vout
5.1k
6.3V 2.0k 6.0k
Adjust
Vin
180 180 10
pF 10
pF
*Pulse Testing Required:
1% Duty Cycle is suggested.
Line Regulation (%/V) = VOH - VOL x 100
*
VCC
VIH
VIL Vin Vout
VOH
VOL
RL
+
1.0mF
CO
240
1%
R1
Adjust
R2
1%
Cin 0.1mF
LM317M
IAdj
Figure 3. Line Regulation and DIAdj/Line Test Circuit
VOL
LM317M, NCV317MAB, NCV317MB
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*Pulse Testing Required:
1% Duty Cycle is suggested.
Load Regulation (mV) = VO (min Load) -VO (max Load)
Load Regulation (% VO) = VO (min Load) - VO (max Load) X 100
VO (min Load)
VO (max Load)
LM317M
Cin 0.1mF
Adjust
R2
1%
CO1.0mF
+
*
RL
(max Load) RL
(min Load)
Vout
R1
240
1%
Vin Vin
IAdj
IL
Figure 4. Load Regulation and DIAdj/Load Test Circuit
VO (min Load)
*Pulse Testing Required:
1% Duty Cycle is suggested.
LM317M
Vin Vout
Adjust
R1240
1%
+
1mF
CO
RL
Cin
R2
1%
To Calculate R2:
Vout = ISET R2 + 1.250 V
Assume ISET = 5.25 mA
IL
IAdj
ISET
Vref
VO
VI
0.1mF
Figure 5. Standard Test Circuit
LM317M
Vin Vout Vout = 10 V
RL
Cin 0.1mF
Adjust R1240
1%
D1 *
1N4002
CO
+
1.0mF
24V
14V
R21.65K
1% CAdj 10mF
+
*D1 Discharges CAdj if Output is Shorted to Ground.
**CAdj provides an AC ground to the adjust pin.
f = 120 Hz
VO
**
Figure 6. Ripple Rejection Test Circuit
LM317M, NCV317MAB, NCV317MB
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Iout, OUTPUT CURRENT (A)
IB, QUIESCENT CURRENT (mA)
Vin-Vout, INPUT-OUTPUT VOLTAGE
DIFFERENTIAL (V)
Figure 7. Load Regulation Figure 8. Ripple Rejection
Figure 9. Current Limit Figure 10. Dropout Voltage
Figure 11. Minimum Operating Current Figure 12. Ripple Rejection versus Frequency
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
-50 -25 0 25 50 75 100 125 150
ΔVout
TJ, JUNCTION TEMPERATURE (°C)
, OUTPUT VOLTAGE CHANGE (%)
Vin = 45 V
Vout = 5.0 V
IL = 5.0 mA to 40 mA
Vin = 10 V
Vout = 5.0 V
IL = 5.0 mA to 100 mA
80
70
60
50
RR, RIPPLE REJECTION (dB)
-50 -25 0 25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
IL = 100 mA
f = 120 Hz
Vout = 10 V
Vin = 14 V to 24 V
-50 -25 0 25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
2.5
2.0
1.5
1.0
0.5
IL = 500 mA
1.0
0.80
0.60
0.40
0.20
00 1020304050
Vin-Vout, INPUT-OUTPUT VOLTAGE DIFFERENTIAL (V)
TJ = 25°C
TJ = 125°C
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0 10 203040
Vin-Vout, INPUT-OUTPUT VOLTAGE DIFFERENTIAL (Vdc)
100
90
80
70
60
50
40
30
20
10
10 100 1.0 k 10 k 100 k 1.0 M
f, FREQUENCY (Hz)
RR, RIPPLE REJECTION (dB)
IL = 40 mA
Vin = 5.0 V ± 1.0 VPP
Vout = 1.25 V
90
Without CAdj = 10 mF
Without CAdj
IL = 100 mA
TJ = 25°C
TJ = 125°C
LM317M, NCV317MAB, NCV317MB
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Vout , OUTPUT VOLTAGEΔ
DEVIATION (V)
Vout , OUTPUT VOLTAGEΔ
DEVIATION (V)
Vin, INPUT VOLTAGEΔ
CHANGE (V)
Vout , OUTPUT VOLTAGE CHANGE (%)Δ
IAdj, ADJUSTMENT PIN CURRENT ( A)μ
ref
V , REFERENCE VOLTAGE (V)
CL = 0.3 mF; CAdj = 10 mF
Figure 13. Temperature Stability Figure 14. Adjustment Pin Current
Figure 15. Line Regulation Figure 16. Output Noise
Figure 17. Line Transient Response
0 10203040
t, TIME (ms)
CL = 1.0 mF
CL = 0
Vin
Vout = 10 V
IL = 50 mA
TJ = 25°C
010203040
t, TIME (ms)
I
CURRENT (A)
L, LOAD
CL = 1.0 mF; CAdj = 10 mF
Vin = 15 V
Vout = 10 V
INL = 50 mA
TJ = 25°C
IL
-50 -25 0 25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Vin = 4.2 V
Vout = Vref
IL = 5.0 mA
-50 -25 0 25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Vin = 6.25 V
Vout = Vref
 IL = 10 mA
IL = 100 mA
-50 -25 0 25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Vin = 4.25 V to 41.25 V
Vout = Vref
IL = 5.0 mA
-50 -25 0 25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Bandwidth 100 Hz to 10 kHz
Figure 18. Load Transient Response
1.5
1.0
0.5
0
-0.5
-1.0
-1.5
1.0
0.5
0
3.0
2.0
1.0
0
-1.0
-2.0
-3.0
1.5
1.0
0.5
0
1.260
1.250
1.240
1.230
1.220
80
70
65
60
55
50
45
40
35
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
10
8.0
6.0
4.0
NOISE VOLTAGE ( V)μ
LM317M, NCV317MAB, NCV317MB
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APPLICATIONS INFORMATION
Basic Circuit Operation
The LM317M is a three−terminal floating regulator. In
operation, the LM317M develops and maintains a nominal
1.25 V reference (Vref) between its output and adjustment
terminals. This reference voltage is converted to a
programming current (IPROG) by R1 (see Figure 19), and this
constant current flows through R2 to ground. The regulated
output voltage is given by:
Vout +Vref ǒ1)R2
R1Ǔ)IAdj R2
Since the current from the terminal (IAdj) represents an
error term in the equation, the LM317M was designed to
control IAdj to less than 100 mA and keep it constant. To do
this, all quiescent operating current is returned to the output
terminal. This imposes the requirement for a minimum load
current. If the load current is less than this minimum, the
output voltage will rise.
Since the LM317M is a floating regulator, it is only the
voltage differential across the circuit which is important to
performance, and operation at high voltages with respect to
ground is possible.
+
Vref
Adjust
Vin Vout
LM317M
R1
IPROG
Vout
R2
IAdj
Vref = 1.25 V Typical
Figure 19. Basic Circuit Configuration
Load Regulation
The LM317M is capable of providing extremely good
load regulation, but a few precautions are needed to obtain
maximum performance. For best performance, the
programming resistor (R1) should be connected as close to
the regulator as possible to minimize line drops which
effectively appear in series with the reference, thereby
degrading regulation. The ground end of R2 can be returned
near the load ground to provide remote ground sensing and
improve load regulation.
External Capacitors
A 0.1 mF disc or 1.0 mF tantalum input bypass capacitor
(Cin) is recommended to reduce the sensitivity to input line
impedance.
The adjustment terminal may be bypassed to ground to
improve ripple rejection. This capacitor (CAdj) prevents
ripple from being amplified as the output voltage is
increased. A 10 mF capacitor should improve ripple
rejection about 15 dB at 120 Hz in a 10 V application.
Although the LM317M is stable with no output
capacitance, like any feedback circuit, certain values of
external capacitance can cause excessive ringing. An output
capacitance (CO) in the form of a 1.0 mF tantalum or 25 mF
aluminum electrolytic capacitor on the output swamps this
effect and insures stability.
Protection Diodes
When external capacitors are used with any IC regulator
it is sometimes necessary to add protection diodes to prevent
the capacitors from discharging through low current points
into the regulator.
Figure 20 shows the LM317M with the recommended
protection diodes for output voltages in excess of 25 V or
high capacitance values (CO > 25 mF, CAdj > 5.0 mF). Diode
D1 prevents CO from discharging thru the IC during an input
short circuit. Diode D2 protects against capacitor CAdj
discharging through the IC during an output short circuit.
The combination of diodes D1 and D2 prevents CAdj from
discharging through the IC during an input short circuit.
D1
Vin
Cin
1N4002
LM317M
Vout
R1
+
CO
D2
R2CAdj
1N4002
Adjust
Vout
Figure 20. Voltage Regulator with
Protection Diodes
LM317M, NCV317MAB, NCV317MB
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Figure 21. Adjustable Current Limiter Figure 22. 5 V Electronic Shutdown Regulator
Figure 23. Slow Turn−On Regulator Figure 24. Current Regulator
Vref
+25V
Vin
LM317M
Vout R1VO
1.25k
Adjust
IO
D2
1N914
1N5314
R2
500
* To provide current limiting of IO
to the system ground, the source of
the current limiting diode must be tied to
 a negative voltage below -7.25 V.
R2 ≥Vref
R1 =
VSS*
D1
1N914
VO < POV + 1.25 V + VSS
ILmin - IP < IO < 500 mA - IP
As shown O < IO < 495 mA
+
10mF
Vin
Vout
240 1N4001
LM317M
Adjust
MPS2907
R2
50k
Vin
D1
1N4002
Vout
120
Adjust
720
+
1.0mF
MPS2222
1.0k
TTL
Control
LM317M
Minimum Vout = 1.25 V
D1 protects the device during an input short circuit.
LM317M
Vin
R1R2
Adjust IAdj
Iout
5.0 mA < Iout < 500 mA
Vout
Ioutmax = Vref + IAdj ^1.25 V
R1 + R2
Vout
Vout
Vin
IDSS
IOmax + IDSS
R1 + R2
40
50
60
70
80
90
100
0
0.4
0.8
1.2
1.6
2.0
2.4
010203025155.0
L, LENGTH OF COPPER (mm)
PD(max) for TA = 50°C
Minimum
Size Pad
L
L
ÎÎÎ
ÎÎÎ
ÎÎÎ
Free Air
Mounted
Vertically
RqJA
2.0 oz. Copper
Figure 25. DPAK Thermal Resistance and Maximum
Power Dissipation versus PCB Copper Length
Figure 26. SOT−223 Thermal Resistance and Maximum
Power Dissipation versus PCB Copper Length
40
80
120
160
200
240
280
0.35
0.42
0.50
0.63
0.83
1.25
2.50
010203025155.0
L, LENGTH OF COPPER (mm)
PD(max) for TA = 50°C
Minimum
Size Pad
L
L
Free Air
Mounted
Vertically
RqJA
2.0 oz. Copper
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
R , THERMAL RESISTANCE,
JAθJUNCTION-TO-AIR ( C/W)°
LM317M, NCV317MAB, NCV317MB
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ORDERING INFORMATION
Device
Output Voltage
Tolerance
Operating Temperature
Range Package Shipping†
LM317MABDT
2%
TJ = −40°C to 125°C
DPAK 75 Units / Rail
LM317MABDTG DPAK
(Pb−Free)
75 Units / Rail
LM317MABDTRK DPAK 2500 / Tape & Reel
LM317MABDTRKG DPAK
(Pb−Free)
2500 / Tape & Reel
LM317MABT TO−220 50 Units / Rail
LM317MABTG TO−220
(Pb−Free)
50 Units / Rail
NCV317MABDTRKG* DPAK
(Pb−Free)
2500 / Tape & Reel
LM317MADTRK
TJ = 0°C to 125°C
DPAK 2500 / Tape & Reel
LM317MADTRKG DPAK
(Pb−Free)
2500 / Tape & Reel
LM317MBDT
4%
TJ = −40°C to 125°C
DPAK 75 Units / Rail
LM317MBDTG DPAK
(Pb−Free)
75 Units / Rail
LM317MBDTRK DPAK 2500 / Tape & Reel
LM317MBDTRKG DPAK
(Pb−Free)
2500 / Tape & Reel
LM317MBSTT3 SOT−223 4000 / Tape & Reel
LM317MBSTT3G SOT−223
(Pb−Free)
4000 / Tape & Reel
LM317MBT TO−220 50 Units / Rail
LM317MBTG TO−220
(Pb−Free)
50 Units / Rail
NCV317MBDTG* DPAK
(Pb−Free)
75 Units / Rail
NCV317MBDTRK* DPAK 2500 / Tape & Reel
NCV317MBDTRKG* DPAK
(Pb−Free)
2500 / Tape & Reel
NCV317MBSTT3G* SOT−223
(Pb−Free)
4000 / Tape & Reel
LM317MDT
TJ = 0°C to 125°C
DPAK 75 Units / Rail
LM317MDTG DPAK
(Pb−Free)
75 Units / Rail
LM317MDTRK DPAK 2500 / Tape & Reel
LM317MDTRKG DPAK
(Pb−Free)
2500 / Tape & Reel
LM317MSTT3 SOT−223 4000 / Tape & Reel
LM317MSTT3G SOT−223
(Pb−Free)
4000 / Tape & Reel
LM317MT TO−220 50 Units / Rail
LM317MTG TO−220
(Pb−Free)
50 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
*NCV devices: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and
change controls.
LM317M, NCV317MAB, NCV317MB
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MARKING DIAGRAMS
317ABG
ALYWW
DPAK
DT SUFFIX
CASE 369C
317MBG
ALYWW
317MG
ALYWW
TO−220
T SUFFIX
CASE 221A
317MAG
ALYWW
SOT−223
ST SUFFIX
CASE 318E
AYW
317MB G
G
A = Assembly Location
L, WL = Wafer Lot
Y = Year
WW, W = Work Week
G or G= Pb−Free Package
(Note: Microdot may be in either location)
LM
317MT
AWLYWWG
LM
317MBT
AWLYWWG
LM
317MABT
AWLYWWG
AYW
317M G
G
LM317M, NCV317MAB, NCV317MB
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PACKAGE DIMENSIONS
TO−220, SINGLE GAUGE
CASE 221AB−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND
LEAD IRREGULARITIES ARE ALLOWED.
4. PRODUCT SHIPPED PRIOR TO 2008 HAD DIMENSIONS
S = 0.045 - 0.055 INCHES (1.143 - 1.397 MM)
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.570 0.620 14.48 15.75
B0.380 0.405 9.66 10.28
C0.160 0.190 4.07 4.82
D0.025 0.035 0.64 0.88
F0.142 0.147 3.61 3.73
G0.095 0.105 2.42 2.66
H0.110 0.155 2.80 3.93
J0.018 0.025 0.46 0.64
K0.500 0.562 12.70 14.27
L0.045 0.060 1.15 1.52
N0.190 0.210 4.83 5.33
Q0.100 0.120 2.54 3.04
R0.080 0.110 2.04 2.79
S0.020 0.024 0.508 0.61
T0.235 0.255 5.97 6.47
U0.000 0.050 0.00 1.27
V0.045 --- 1.15 ---
Z--- 0.080 --- 2.04
B
Q
H
Z
L
V
G
N
A
K
F
123
4
D
SEATING
PLANE
−T−
C
S
T
U
R
J
LM317M, NCV317MAB, NCV317MB
http://onsemi.com
13
PACKAGE DIMENSIONS
DPAK
DT SUFFIX
CASE 369C−01
ISSUE D
b
D
E
b3
L3
L4
b2
eM
0.005 (0.13) C
c2
A
c
C
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
D0.235 0.245 5.97 6.22
E0.250 0.265 6.35 6.73
A0.086 0.094 2.18 2.38
b0.025 0.035 0.63 0.89
c2 0.018 0.024 0.46 0.61
b2 0.030 0.045 0.76 1.14
c0.018 0.024 0.46 0.61
e0.090 BSC 2.29 BSC
b3 0.180 0.215 4.57 5.46
L4 −−− 0.040 −−− 1.01
L0.055 0.070 1.40 1.78
L3 0.035 0.050 0.89 1.27
Z0.155 −−− 3.93 −−−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
12 3
4
5.80
0.228
2.58
0.102
1.60
0.063
6.20
0.244
3.00
0.118
6.17
0.243
ǒmm
inchesǓ
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
H0.370 0.410 9.40 10.41
A1 0.000 0.005 0.00 0.13
L1 0.108 REF 2.74 REF
L2 0.020 BSC 0.51 BSC
A1
H
DETAIL A
SEATING
PLANE
A
B
C
L1
L
H
L2 GAUGE
PLANE
DETAIL A
ROTATED 90 CW5
LM317M, NCV317MAB, NCV317MB
http://onsemi.com
14
PACKAGE DIMENSIONS
SOT−223 (TO−261)
ST SUFFIX
CASE 318E−04
ISSUE N
1.5
0.059 ǒmm
inchesǓ
SCALE 6:1
3.8
0.15
2.0
0.079
6.3
0.248
2.3
0.091
2.3
0.091
2.0
0.079
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
A1
b1
D
E
b
e
e1
4
123
0.08 (0003)
A
L1
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
HE
DIM
A
MIN NOM MAX MIN
MILLIMETERS
1.50 1.63 1.75 0.060
INCHES
A1 0.02 0.06 0.10 0.001
b0.60 0.75 0.89 0.024
b1 2.90 3.06 3.20 0.115
c0.24 0.29 0.35 0.009
D6.30 6.50 6.70 0.249
E3.30 3.50 3.70 0.130
e2.20 2.30 2.40 0.087
0.85 0.94 1.05 0.033
0.064 0.068
0.002 0.004
0.030 0.035
0.121 0.126
0.012 0.014
0.256 0.263
0.138 0.145
0.091 0.094
0.037 0.041
NOM MAX
L1 1.50 1.75 2.00 0.060
6.70 7.00 7.30 0.264
0.069 0.078
0.276 0.287
HE
− −
e1
0°10°0°10°
q
q
L
L0.20 −−− −−− 0.008 −−− −−−
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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LM317M/D
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