TA7774PG/FG/FAG
2009-01-06
1
TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic
TA7774PG,TA7774FG,TA7774FAG
Stepping Motor Driver IC
The TA7774PG and TA7774FG/FAG are two-phase bipolar stepping
motor driver ICs designed especially for 3.5- or 5.25-inch FDD head
actuator drives.
The ICs have a dual-bridge driver supporting the bipolar driving of
induced loads, a power-saving circuit, and a standby circuit. They
are ideal for achieving reduced set size and lower power
consumption.
Features
z One-chip two-phase bipolar stepping motor driver
z Power saving operation is available.
z Standby operation is available.
Current consumption ≤ 115 μA
z Built-in punch-through current restriction circuit for system
reliability and noise suppression
z TTL-compatible inputs INA, INB, and PS pins
z High driving ability
TA7774PG/FG
: IO(START) 350 mA (MAX): VS1 ENABLE
: IO(HOLD) 100 mA (MAX): VS2 ENABLE
TA7774FAG
: IO(START) 100 mA (MAX): VS1 ENABLE
: IO(HOLD) 50 mA (MAX): VS2 ENABLE
z Typical PKG DIP16 pin, HSOP16 pin, and SSOP16 pin
z GND pin = heatsink
Weight
DIP16-P-300-2.54A: 1.11 g (typ.)
HSOP16-P-300-1.00: 0.50 g (typ.)
SSOP16-P-225-1.00A: 0.14 g (typ.)
The following conditions apply to solderability:
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature: 230℃
· dipping time: 5 seconds
· the number of times: once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature: 245℃
· dipping time: 5 seconds
· the number of times: once
· use of R-type flux
TA7774PG
TA7774FG
TA7774FAG
SSOP16-P-225-1.00A
TA7774PG/FG/FAG
2009-01-06
2
Block Diagram
Note: Pins 2, 7, 12, and 13 of the TA7774FG are all NC; the heat fin is connected to GND.
Pin Description
Pin No. Symbol Functional Description
1 / (1) VS2 A Low-voltage power supply terminal
2 / (3) VCC Power voltage supply terminal for control
3 / (4) IN A A-ch forward rotation / reverse rotation signal input terminal, Truth Table 1
4 / (F) GND GND terminal
5 / (F) GND GND terminal
6 / (5) IN B B-ch forward rotation / reverse rotation signal input terminal, Truth Table 1
7 / (6) PS Power saving signal input terminal
8 / (8) VS2 B Standby signal input terminal, Truth Table 2
9 / (9) VS1 B High-voltage power supply terminal
10 / (10)
φ
B Output B
11 / (11)
φ
B Output B
12 / (F) GND GND terminal
13 / (F) GND GND terminal
14 / (14)
φ
A Output
Α
15 / (15)
φ
A Output A
16 / (16) VS1 A High-voltage power supply terminal.
( ): TA7774FG
TA7774PG/FAG TA7774FG
TA7774PG/FG/FAG
2009-01-06
3
Truth Table 1
Input Output
PS IN
φ φ
L L L H Enable VS1
L H H L Enable VS1
H L L H Enable VS2 (power saving)
H H H L Enable VS2 (power saving)
Truth Table 2
VS2 B
L Power off (standby)
H Operation
Note: Apply 5 V to VS2A as a supply terminal.
TA7774PG/FG/FAG
2009-01-06
4
Output Circuit
Input Circuit IN A, IN B Input Circuit
VS2 A or VS2 B
Absolute Maximum Ratings (Ta = 25°C)
Characteristic Symbol Rating Unit
VCC 7.0
VS1 17.0
Supply voltage
VS2 ≤VCC
V
IO (PEAK) ±400
IO (START) ±350
TA7774PG
TA7774FG
IO (HOLD) ±100
IO (PEAK) ±200
IO (START) ±100
Output current
TA7774FAG
IO (HOLD) ±50
mA
Input voltage VIN ≤VCC V
1.4 (Note 1)
TA7774PG
2.7 (Note 2)
TA7774FG 1.4 (Note 3)
Power dissipation
TA7774FAG
PD
0.78 (Note 4)
W
Operating temperature Topr −30 to 75 °C
Storage temperature Tstg −55 to 150 °C
Note 1: IC only
Note 2: This value is obtained if
mounting is on a 50 mm
× 50 mm × 0.8 mm PCB,
60% or more of which is
occupied by copper.
Note 3: This value is obtained if
mounting is on a 60 mm
× 30 mm × 1.6 mm PCB,
50% or more of which is
occupied by copper.
Note 4: This value is obtained if
mounting is on a 50 mm
× 50 mm × 1.6 mm PCB,
40% or more of which is
occupied by copper.
TA7774PG/FAG TA7774FG
TA7774PG/FG/FAG
2009-01-06
5
Electrical Characteristics
(Unless otherwise specified, Ta = 25°C, VCC = 5 V, VS1 = 12 V, VS2A = 5 V)
Characteristic Symbol
Test
Cir−
cuit
Test Condition Min Typ. Max Unit
ICC1 PS: H, VS2 B: H ― 9 14
ICC2 PS: L, VS2 B: H ― 8.5 13
mA
Supply current
ICC3
1
VS2 B: L 70 90 115 μA
VIN H 2.0 ― VCC
VIN L
Pin 3, 6
GND ― 0.8
VPS H 2.0 ― VCC
VPS L
Tj = 25°C
VS2 B: H
Pin 7
GND ― 0.8
VS2 BH 3.5 ― VCC
Input voltage
VS2 BL
―
Tj = 25°C Pin 8
GND ― 0.4
V
IIN Pin 3, 6 ― 2.6 30
Input current
IPS
1 Tj = 25°C, VS2 B: H
VIN / PS (2 V): sink current Pin 7 ― 2.6 30
μA
VSAT 1H1 IOUT = 100 mA ― 0.9 ―
VSAT 1H2
2 PS: L, VS2 B: H
IOUT = 400 mA ― 1.2 1.5
VSAT 2H1 IOUT = 20 mA ― 1.6 ―
VSAT 2H2
3 PS: H, VS2 B: H
IOUT = 100 mA ― 1.8 2.1
VSAT L1 IOUT = 20 mA ― 0.03 ―
VSAT L2 IOUT = 100 mA ― 0.15 ―
TA7774PG
TA7774FG
VSAT L3
2 VS2 B: H
IOUT = 400 mA ― 0.35 0.6
VSAT 1H1 IOUT = 100 mA ― 0.9 ―
VSAT 1H2
2 PS: L, VS2 B: H
IOUT = 200 mA ― 1.0 1.3
VSAT 2H1 IOUT = 20 mA ― 1.6 ―
VSAT 2H2
3 PS: H, VS2 B: H
IOUT = 50 mA ― 1.7 2.0
VSAT L1 IOUT = 20 mA ― 0.03 ―
VSAT L2 IOUT = 100 mA ― 0.15 ―
Output
saturation
voltage
TA7774FAG
VSAT L3
2 VS2 B: H
IOUT = 200 mA ― 0.2 0.4
V
VF U ― 1.5 ―
Diode forward voltage
VF L
4 IF = 350 mA
― 1.0 ―
V
tpLH ― 7 ―
Delay time
tpHL
― IN −
φ
― 2 ―
μs
Operating voltage VCC (opr.) ― V
CC = ST 4.5 5.0 5.5 V
Recommended operating voltage VS1 (opr.) 12 V ± 10%
VS2A (opr.) 5 V ± 10%
Operating voltage restriction VS1 ≥ VS2A
TA7774PG/FG/FAG
2009-01-06
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Test Circuit 1 ICC1, ICC2, ICC3, IIN A, IIN B, IPS
Item SW1 SW2 SW3 SW4
ICC1 b b a a
ICC2 b b b a
ICC3 b b ― b
IIN A a ― ― a
IIN B ― a ― a
IPS ― ― a a
TA7774PG/FG/FAG
TA7774PG/FAG TA7774FG
TA7774PG/FG/FAG
2009-01-06
7
Test Circuit 2 VSAT 1H1, VSAT 1H2, VSAT L2, VSAT L3
Note: Adjust RL to correspond to IL.
Item SW1 SW2 SW3 SW4 SW5 IL (mA)
a ― a
b ― b
― a d
VSAT 1H1
― b
b
c
a 100
a ― a
b ― b
― a d
VSAT 1H2
― b
b
c
a 400
a ― b
b ― a
― a c
VSAT L2
― b
―
d
b 100
a ― b
b ― a
― a c
VSAT L3
― b
b
d
b 400
TA7774PG/FG/FAG
TA7774PG/FAG TA7774FG
TA7774PG/FG/FAG
2009-01-06
8
Test Circuit 3 VSAT 2H1, VSAT 2H2, VSAT L1
Note: Adjust RL to correspond to IL.
Item SW1 SW2 SW3 SW4 SW5 IL (mA)
a ― a
b ― b
― a c
VSAT 2H1
― b
a
d
a 20
a ― a
b ― b
― a c
VSAT 2H2
― b
a
d
a 100
a ― b
b ― a
― a c
VSAT L1
― b
a
d
b 20
TA7774PG/FG/FAG
TA7774PG/FAG TA7774FG
TA7774PG/FG/FAG
2009-01-06
9
Test Circuit 4 VF U, VF L
Measuring Method
Timing Chart (two-phase excitation)
ITEM SW1 SW2
a
b
c
VF U
d
e
a
b
c
VF L e
d
TA7774PG/FG/FAG
TA7774PG/FAG TA7774FG
TA7774PG/FG/FAG
2009-01-06
10
TA7774PG TA7774FG
Mounting on a PCB of 50 mm
x 50 mm x 0.8 mm, 60% or
more of which is occupied by
copper
Mounting on a PCB of 50 mm x
50 mm x 0.8 mm, 50% or more of
which is occupied by coppe
r
TA7774FAG
Thermal resistance
Rth(j-a)=160°C/W
Mounting on a PCB of 50 mm
x 50 mm x 1.6 mm, 40% or
more of which is occupied by
copper
Ambient Temperature Ta (°C)
Power Dissipation PD (W)
No heatsink
Ambient Temperature
Power Dissipation
No heatsink
Power Dissipation
Ambient Temperature
TA7774PG/FG/FAG
2009-01-06
11
Application Circuit
Note 1: Connect the VS2A pin to the lower supply voltage (5 V).
Note 2: Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be
destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or
by short-circuiting between contiguous pins.
TA7774PG/FG/FAG
TA7774PG/FAG TA7774FG
TA7774PG/FG/FAG
2009-01-06
12
Package Dimensions
DIP16−P−300−2.54A Unit: mm
Weight: 1.11 g (typ.)
TA7774PG/FG/FAG
2009-01-06
13
Package Dimensions
HSOP16−P−300−1.00 Unit: mm
Weight: 0.50 g (typ.)
TA7774PG/FG/FAG
2009-01-06
14
SSOP16−P−225−1.00A
Weight: 0.14 g (typ.)
Unit: mm
TA7774PG/FG/FAG
2009-01-06
15
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified
for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for
explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case
of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location,
are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into
the design to prevent device malfunction or breakdown caused by the current resulting from the
inrush current at power ON or the negative current resulting from the back electromotive force at
power OFF. IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is
unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause
injury, smoke or ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
TA7774PG/FG/FAG
2009-01-06
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Points to remember on handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown.
In addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in
system design.
TA7774PG/FG/FAG
2009-01-06
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