TA7774PG/FG/FAG TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA7774PG,TA7774FG,TA7774FAG Stepping Motor Driver IC The TA7774PG and TA7774FG/FAG are two-phase bipolar stepping motor driver ICs designed especially for 3.5- or 5.25-inch FDD head actuator drives. The ICs have a dual-bridge driver supporting the bipolar driving of induced loads, a power-saving circuit, and a standby circuit. They are ideal for achieving reduced set size and lower power consumption. TA7774PG Features z One-chip two-phase bipolar stepping motor driver z Power saving operation is available. TA7774FG z Standby operation is available. Current consumption 115 A z Built-in punch-through current restriction circuit for system reliability and noise suppression z TTL-compatible inputs INA, INB, and PS pins z High driving ability TA7774PG/FG : IO(START) 350 mA (MAX): VS1 ENABLE : IO(HOLD) 100 mA (MAX): VS2 ENABLE TA7774FAG TA7774FAG : IO(START) 100 mA (MAX): VS1 ENABLE : IO(HOLD) 50 mA (MAX): VS2 ENABLE z Typical PKG DIP16 pin, HSOP16 pin, and SSOP16 pin z GND pin = heatsink SSOP16-P-225-1.00A The following conditions apply to solderability: Weight DIP16-P-300-2.54A: 1.11 g (typ.) HSOP16-P-300-1.00: 0.50 g (typ.) SSOP16-P-225-1.00A: 0.14 g (typ.) About solderability, following conditions were confirmed * Solderability (1) Use of Sn-37Pb solder Bath * solder bath temperature: 230 * dipping time: 5 seconds * the number of times: once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature: 245 * dipping time: 5 seconds * the number of times: once * use of R-type flux 1 2009-01-06 TA7774PG/FG/FAG Block Diagram TA7774PG/FAG Note: TA7774FG Pins 2, 7, 12, and 13 of the TA7774FG are all NC; the heat fin is connected to GND. Pin Description Pin No. Symbol Functional Description 1 / (1) VS2 A Low-voltage power supply terminal 2 / (3) VCC Power voltage supply terminal for control 3 / (4) IN A A-ch forward rotation / reverse rotation signal input terminal, Truth Table 1 4 / (F) GND GND terminal 5 / (F) GND GND terminal 6 / (5) IN B B-ch forward rotation / reverse rotation signal input terminal, Truth Table 1 7 / (6) PS 8 / (8) VS2 B Standby signal input terminal, Truth Table 2 9 / (9) VS1 B High-voltage power supply terminal 10 / (10) B Output B 11 / (11) B Output B 12 / (F) GND GND terminal 13 / (F) GND GND terminal 14 / (14) A Output 15 / (15) A Output A 16 / (16) VS1 A ( ): Power saving signal input terminal High-voltage power supply terminal. TA7774FG 2 2009-01-06 TA7774PG/FG/FAG Truth Table 1 Input Output PS IN L L L H Enable VS1 L H H L Enable VS1 H L L H Enable VS2 (power saving) H H H L Enable VS2 (power saving) Truth Table 2 VS2 B L Power off (standby) H Operation Note: Apply 5 V to VS2A as a supply terminal. 3 2009-01-06 TA7774PG/FG/FAG Output Circuit Input Circuit IN A, IN B Input Circuit VS2 A or VS2 B TA7774PG/FAG TA7774FG Absolute Maximum Ratings (Ta = 25C) Characteristic Supply voltage TA7774PG TA7774FG Output current TA7774FAG Input voltage Symbol Rating VCC 7.0 VS1 17.0 VS2 VCC IO (PEAK) 400 IO (START) 350 IO (HOLD) 100 IO (PEAK) 200 IO (START) 100 IO (HOLD) 50 VIN VCC TA7774FG Note 1: IC only V mA V 1.4 (Note 1) TA7774PG Power dissipation Unit PD TA7774FAG 2.7 (Note 2) 1.4 (Note 3) W 0.78 (Note 4) Operating temperature Topr -30 to 75 C Storage temperature Tstg -55 to 150 C 4 Note 2: This value is obtained if mounting is on a 50 mm x 50 mm x 0.8 mm PCB, 60% or more of which is occupied by copper. Note 3: This value is obtained if mounting is on a 60 mm x 30 mm x 1.6 mm PCB, 50% or more of which is occupied by copper. Note 4: This value is obtained if mounting is on a 50 mm x 50 mm x 1.6 mm PCB, 40% or more of which is occupied by copper. 2009-01-06 TA7774PG/FG/FAG Electrical Characteristics (Unless otherwise specified, Ta = 25C, VCC = 5 V, VS1 = 12 V, VS2A = 5 V) Characteristic Symbol Test Cir- cuit ICC1 Supply current 1 ICC2 ICC3 Test Condition Min Typ. Max PS: H, VS2 B: H 9 14 PS: L, VS2 B: H 8.5 13 VS2 B: L 70 90 115 2.0 VCC GND 0.8 2.0 VCC GND 0.8 VIN H Pin 3, 6 VIN L Tj = 25C VS2 B: H VPS H Input voltage VPS L VS2 BH 3.5 VCC GND 0.4 2.6 30 2.6 30 IOUT = 100 mA 0.9 IOUT = 400 mA 1.2 1.5 IOUT = 20 mA 1.6 IOUT = 100 mA 1.8 2.1 IOUT = 20 mA 0.03 IOUT = 100 mA 0.15 VSAT L3 IOUT = 400 mA 0.35 0.6 VSAT 1H1 IOUT = 100 mA 0.9 IOUT = 200 mA 1.0 1.3 IOUT = 20 mA 1.6 IOUT = 50 mA 1.7 2.0 IOUT = 20 mA 0.03 IOUT = 100 mA 0.15 IOUT = 200 mA 0.2 0.4 1.5 1.0 7 2 4.5 5.0 5.5 Tj = 25C VS2 BL IIN Input current IPS VSAT 1H1 VSAT 1H2 TA7774PG TA7774FG VSAT 2H1 VSAT 2H2 1 Pin 3, 6 Tj = 25C, VS2 B: H VIN / PS (2 V): sink current Pin 7 2 PS: L, VS2 B: H 3 PS: H, VS2 B: H 2 VSAT 1H2 VSAT 2H1 TA7774FAG Pin 8 VSAT L1 VSAT L2 Output saturation voltage Pin 7 VSAT 2H2 VS2 B: H 2 PS: L, VS2 B: H 3 PS: H, VS2 B: H 2 VS2 B: H VSAT L1 VSAT L2 VSAT L3 Diode forward voltage Delay time Operating voltage VF U VF L tpLH tpHL VCC (opr.) Recommended operating voltage 4 IF = 350 mA IN - VCC = ST Unit mA A V A V V s V VS1 (opr.) 12 V 10% VS2A (opr.) 5 V 10% Operating voltage restriction VS1 VS2A 5 2009-01-06 TA7774PG/FG/FAG TA7774PG/FG/FAG Test Circuit 1 ICC1, ICC2, ICC3, IIN A, IIN B, IPS TA7774PG/FAG 6 Item SW1 SW2 SW3 SW4 ICC1 b b a a ICC2 b b b a ICC3 b b b IIN A a a IIN B a a IPS a a TA7774FG 2009-01-06 TA7774PG/FG/FAG TA7774PG/FG/FAG Test Circuit 2 VSAT 1H1, VSAT 1H2, VSAT L2, VSAT L3 TA7774PG/FAG Note: Adjust RL to correspond to IL. Item VSAT 1H1 VSAT 1H2 VSAT L2 VSAT L3 TA7774FG SW1 SW2 SW3 SW4 a b a b c a a b a b c a b b a b d a b b a b SW5 IL (mA) a 100 a 400 b 100 b 400 a b b d b b d a c a b c d 7 2009-01-06 TA7774PG/FG/FAG TA7774PG/FG/FAG Test Circuit 3 VSAT 2H1, VSAT 2H2, VSAT L1 TA7774PG/FAG Note: Adjust RL to correspond to IL. Item VSAT 2H1 VSAT 2H2 VSAT L1 TA7774FG SW1 SW2 SW3 SW4 a b a b d a a SW5 IL (mA) a 20 a 100 b 20 a b a c b a b b d a b b a b a c a a c d 8 2009-01-06 TA7774PG/FG/FAG Test Circuit 4 VF U, VF L Measuring Method ITEM SW1 SW2 TA7774PG/FG/FAG a VF U b c e d a VF L e b c d TA7774PG/FAG TA7774FG Timing Chart (two-phase excitation) 9 2009-01-06 TA7774PG/FG/FAG TA7774FG TA7774PG No heatsink Mounting on a PCB of 50 mm x 50 mm x 0.8 mm, 50% or more of which is occupied by copper Power Dissipation Power Dissipation Mounting on a PCB of 50 mm x 50 mm x 0.8 mm, 60% or more of which is occupied by copper No heatsink Ambient Temperature Ambient Temperature TA7774FAG Mounting on a PCB of 50 mm x 50 mm x 1.6 mm, 40% or more of which is occupied by copper Power Dissipation PD (W) Thermal resistance Rth(j-a)=160C/W Ambient Temperature Ta (C) 10 2009-01-06 TA7774PG/FG/FAG Application Circuit TA7774PG/FG/FAG TA7774PG/FAG TA7774FG Note 1: Connect the VS2A pin to the lower supply voltage (5 V). Note 2: Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting between contiguous pins. 11 2009-01-06 TA7774PG/FG/FAG Package Dimensions DIP16-P-300-2.54A Unit: mm Weight: 1.11 g (typ.) 12 2009-01-06 TA7774PG/FG/FAG Package Dimensions HSOP16-P-300-1.00 Unit: mm Weight: 0.50 g (typ.) 13 2009-01-06 TA7774PG/FG/FAG SSOP16-P-225-1.00A Unit: mm Weight: 0.14 g (typ.) 14 2009-01-06 TA7774PG/FG/FAG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 15 2009-01-06 TA7774PG/FG/FAG Points to remember on handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 16 2009-01-06 TA7774PG/FG/FAG RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application that Product will be used with or for. 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