November 2011 Doc ID 018927 Rev 1 1/7
7
STPS2L60-Y
Automotive power Schottky rectifier
Features
■AEC-Q101 qualified
■Negligible switching losses
■Low forward voltage drop
■Surface mount miniature package
■Avalanche capability specified
■ECOPACK®2 compliant component
Description
This power Schottky rectifier is suited to switched
mode power supplies and high frequency DC to
DC converters for automative applications.
Packaged in SMA, this device is especially
intended for use in low voltage, high frequency
inverters and small battery chargers.
Table 1. Device summary
Symbol Value
IF(AV) 2 A
VRRM 60 V
Tj (max) 150 °C
VF(max) 0.55 V
K
A
SMA
STPS2L60AY
www.st.com
Characteristics STPS2L60-Y
2/7 Doc ID 018927 Rev 1
1 Characteristics
To evaluate the conduction losses use the following equation:
P = 0.43 x IF(AV) + 0.06 IF2(RMS)
Table 2. Absolute ratings (limiting values)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 60 V
IF(RMS) Forward rms voltage 10 A
IF(AV) Average forward current TL = 115 °C δ = 0.5 2 A
IFSM Surge non repetitive forward current tp =10 ms sinusoidal 75 A
PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 1600 W
Tstg Storage temperature range -65 to +150 °C
TjOperating junction temperature range(1)
1. condition to avoid thermal runaway for a diode on its own heatsink
-40 to +150 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
Table 3. Thermal resistance
Symbol Test conditions Value Unit
Rth(j-l) Junction-lead 25 °C/W
Table 4. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
IR(1)
1. Pulse test: tp = 380 µs, δ < 2%
Reverse leakage
current
Tj = 25 °C VR = VRRM
100 µA
Tj = 100 °C 2 10 mA
VF(1) Forward voltage drop
Tj = 25 °C IF = 2 A 0.60
V
Tj = 125 °C 0.51 0.55
Tj = 25 °C IF = 4 A 0.77
Tj = 125 °C 0.62 0.67
dPtot
dTj <1
Rth(j-a)
STPS2L60-Y Characteristics
Doc ID 018927 Rev 1 3/7
Figure 1. Average forward power dissipation
versus average forward current
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
P (W)
F(AV)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
I (A)
F(AV)
δ= 1
δ= 0.5
δ= 0.2
δ= 0.1
δ= 0.05
T
δ
=tp/T tp
I (A)
F(AV)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0 25 50 75 100 125 150
T (°C)
amb
T
δ=tp/T tp
R =100°C/W
th(j-a)
R=R
th(j-a) th(j-I)
Figure 3. Normalized avalanche power
derating versus pulse duration
Figure 4. Normalized avalanche power
derating versus junction
temperature
0.001
0.01
0.10.01 1
0.1
10 100 1000
1
t (µs)
p
P(t)
P (1µs)
ARM p
ARM
0
0.2
0.4
0.6
0.8
1
1.2
25 50 75 100 125 150
T (°C)
j
P(T
j)
P (25°C)
ARM
ARM
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values)
Figure 6. Relative variation of thermal
impedance junction to ambient
versus pulse duration
I (A)
M
0
1
2
3
4
5
6
7
8
9
10
1.E-03 1.E-02 1.E-01 1.E+00
IM
t
δ=0.5 t(s)
T =25°C
a
T =125°C
a
T =75°C
a
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
Single pulse
Z/R
th(j-l) th(j-l)
t (s)
p
Epoxy printed circuit board FR4, copper thickness: 35 µm
Characteristics STPS2L60-Y
4/7 Doc ID 018927 Rev 1
Figure 7. Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 8. Junction capacitance versus
reverse voltage applied
(typical values)
I (µA)
R
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
0 102030405060
V (V)
R
T =125°C
j
T =150°C
j
T =100°C
j
T =75°C
j
T =50°C
j
T =25°C
j
C(pF)
10
100
1000
110100
F=1MHz
V =30mV
T =25°C
OSC
j
V (V)
R
Figure 9. Forward voltage drop versus
forward current
(maximum values, low level)
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each lead
I (A)
FM
0
1
2
3
4
5
6
7
8
9
10
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
V (V)
FM
T =25°C
(maximum values)
j
T =125°C
(maximum values)
j
T =125°C
(typical values)
j
R (°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S(Cu)(cm²)
Epoxy printed circuit board FR4, copper thickness: 35 µm
STPS2L60-Y Package information
Doc ID 018927 Rev 1 5/7
2 Package information
●Epoxy meets UL94, V0
●Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11. Footprint, dimensions in mm (inches)
Table 5. SMA dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.094
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.90 0.089 0.114
E 4.80 5.35 0.189 0.211
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
E
CL
E1
D
A1
A2
b
2.63
(0.103)
5.43
(0.214)
1.4
1.64
(0.064)
1.4
(0.055) (0.055)
Ordering information STPS2L60-Y
6/7 Doc ID 018927 Rev 1
3 Ordering information
4 Revision history
Table 6. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS2L60AY S26Y SMA 0.068 g 5000 Tape and reel
Table 7. Document revision history
Date Revision Changes
02-Nov-2011 1 Initial release.
STPS2L60-Y
Doc ID 018927 Rev 1 7/7
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