BR24G04FVM-3AGTTR - Rohm Semiconductor

Datashee

t

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protec tion against radioactive rays

. 1/33 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

www.rohm.com

TSZ22111・14・001

Serial EEPROM series Standard EEPROM

I2C BUS EEPROM (2-Wire)

BR24G04-3A

●General Description

BR24G04-3A is a serial EEPROM of I2C BUS interface method

●Features

 All controls available by 2 ports of serial cloc k(SCL) and

serial data(SDA)

 Other devices than EEPROM can be connected to the

same port, saving microcontroller port

 1.6V to 5.5V single power source action most suitable

for battery use

 1MHz action is possible (1.7V to 5.5V)

 Up to 16 bytes in page write mode

 Self-timed programming cycle

 Low current consumption

 Prevention of write mistake

 Write (write protect) function added

 Prevention of write mistake at low voltage

 More than 1 million write cycles

 More than 40 years data retent ion

 Noise filter built in SCL / SDA terminal

 Initial delivery state FFh

●BR24G04-3A

Capacity Bit Format Type Power Source

Voltage Package

4Kbit 512×8

BR24G04-3A

1.6V to 5.5V

DIP-T8

BR24G04F-3A SOP8

BR24G04FJ-3A SOP-J8

BR24G04FVT-3A TSSOP-B8

BR24G04FVJ-3A TSSOP-B8J

BR24G04FVM-3A MSOP8

BR24G04NUX-3A VSON008X2030

●Packages W(Typ.) x D(Typ.)x H(Max.)

Figure 1.

TSSOP-B8

3.00mm x 6.40mm x 1.20mm

MSOP8

2.90mm x 4.00mm x 0.90mm

SOP-J8

4.90mm x 6.00mm x 1.65mm

SOP8

5.00mm x 6.20mm x 1.71mm

DIP-T8

9.30mm x 6.50mm x 7.10mm TSSOP-B8J

3.00mm x 4.90mm x 1.10mm

V

SON008X2030

2.00mm x 3.00mm x 0.60mm

2/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Ratings Unit Remarks

Supply Voltage VCC -0.3 to +6.5 V

Power Dissipation Pd

450 (SOP8)

mW

When using at Ta=25℃ or higher 4.5mW to be reduced per 1℃.

450 (SOP-J8) When using at Ta=25℃ or higher 4.5mW to be reduced per 1℃.

330 (TSSOP-B8) When using at Ta=25℃ or higher 3.3mW to be reduced per 1℃.

310 (TSSOP-B8J) When using at Ta=25℃ or higher 3.1mW to be reduced per 1℃.

310 (MSOP8) When using at Ta=25℃ or higher 3.1mW to be reduced per 1℃.

300 (VSON008X2030) When using at Ta=25℃ or higher 3.0mW to be reduced per 1℃.

800 (DIP-T8) When using at Ta=25℃ or higher 8.0mW to be reduced per 1℃.

Storage Temperature Tstg －65 to +150 ℃

Operation Temperature Topr －40 to +85 ℃

Input Voltage /

Output Voltage ‐ -0.3 to Vcc+1.0 V The Max value of input voltage / output voltage is not over 6.5V.

When the pulse width is 50ns or less, the Min value of input voltage

/ output voltage is not under -0.8V.

Junction Temperature Tjmax 150 ℃ Junction temperature at the storag e condition

Electrostatic discharge

voltage

(human body model) VESD -4000 to +4000 V

●Memory Cell Characteristics (Ta=25℃, Vcc=1.6V to 5.5V)

Parameter Limits Unit

Min. Typ. Max

Write cycles *1 1,000,000 －－ Times

Data retention *1 40 －－ Years

*1Not 100% TESTED

●Recommended Operating Ratings

Parameter Symbol Ratings Unit

Supply voltage Vcc 1.6 to 5.5 V

Input voltage VIN 0 to Vcc

●DC Characteristics (Unless otherwise specified, Ta=-40 to +85℃, Vcc =1.6 to 5.5V)

Parameter Symbol Limits Unit Conditions

Min. Typ. Max.

Input High Voltage1 VIH1 0.7Vcc － Vcc+1.0 V 1.7V≦Vcc≦5.5V

Input Low Voltage1 VIL1 －0.3*1 － 0.3Vcc V 1.7V≦Vcc≦5.5V

Input High Voltage2 VIH2 0.8Vcc － Vcc+1.0 V 1.6V≦Vcc＜1.7V

Input Low Voltage2 VIL2 －0.3*1 － 0.2Vcc V 1.6V≦Vcc＜1.7V

Output Low Voltage1 VOL1 －－ 0.4 V

IOL=3.0mA, 2.5V≦Vcc≦5.5V (SDA)

Output Low Voltage2 VOL2 －－ 0.2 V IOL=0.7mA, 1.6V≦Vcc＜2.5V (SDA)

Input Leakage Current ILI －1 － 1 μA VIN=0 to Vcc

Output Leakage Current ILO －1 － 1 μA VOUT=0 to Vcc (SDA)

Supply Current (Write) ICC1 －－ 2.0

mA

Vcc=5.5V, fSCL=1MHz, tWR=5ms,

Byte write, Page write

Supply Current (Read) ICC2 - - 2.0 Vcc=5.5V, fSCL=1MHz

Random read, current read,

sequential read

Standby Curr ent ISB －－ 2.0 μA Vcc=5.5V, SDA, SCL=Vcc

A0, A1, A2=GND,WP=GND

*1 When the pulse width is 50ns or less, it is -0.8V.

3/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●AC Characteristics

(Unless oth erwise specified, Ta=－40 to +85℃)

Parameter Symbol

Limits

(1.6V≦Vcc＜1.7V) Limits

(1.7V≦Vcc≦5.5V) Unit

Min. Typ. Max. Min. Typ. Max.

Clock Frequency fSCL - - 400 －－ 1000 kHz

Data Clock “HIGH“ Period tHIGH 0.6 - - 0.3 －－ µs

Data Clock “LOW“ Period tLOW 1.2 - - 0.5 －－ µs

SDA, SCL (INPUT) Rise Time *1 tR

- - 1

－－ 0.12 µs

SDA, SCL (INPUT) Fall Time *1 tF1

- - 1

－－ 0.12 µs

SDA (OUTPUT) Fall Time *1 tF2

- - 0.12 －－ 0.12 µs

Start Condition Hold Time tHD:STA 0.6 - -

0.25 －－ µs

Start Condition Setup Time tSU:STA 0.6 - -

0.20 －－ µs

Input Data Hold Time tHD:DAT 0 - - 0 －－ ns

Input Data Setup Time tSU:DAT 100 - -

50 －－ ns

Output Data Delay Time tPD 0.1 - 0.9

0.05 － 0.45 µs

Output Data Hold Time tDH 0.1 - -

0.05 －－ µs

Stop Condition Setup Time tSU:STO 0.6 - -

0.25 －－ µs

Bus Free Time tBUF 1.2 - - 0.5 －－ µs

Write Cycle Time tWR - - 5

－－ 5 ms

Noise Spike Width (SDA, SCL) tI - - 0.05 －－ 0.05 µs

WP Hold Time tHD:WP 1.0 - - 1.0 －－ µs

WP Setup Time tSU:WP 0.1 - - 0.1 －－ µs

WP High Period tHIGH:WP 1.0 - - 1.0 －－ µs

*1 Not 100% tested

●AC Characteristics Condition

Parameter Symbol Condition Unit

Load Capacitance CL 100 pF

SDA, SCL (INPUT) Rise Time tR 20 ns

SDA, SCL (INPUT) Fall Time tF1 20 ns

Input Data Level VIL1/VIH1 0.2Vcc/0.8Vcc V

Input/Output Data Timing Reference Level - 0.3Vcc/0.7Vcc V

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Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Serial Input / Output timing

Figure 2-(e). WP timing at write cancel

Figure 2-(d). WP timing at write execution

Figure 2-(c). Write cycle timing

Figure 2-(a). Serial input / output timing

○Input read at the rise edge of SCL

○Data ou tput in sync with the fall of S C L

SCL

SDA

(入力)

SDA

(出力)

tR tF1 tHIGH

tSU:DAT tLOW tHD:DAT

tDH

tPD

tBUF

tHD:STA

70%

30%

70%

30%

70% 70%

30% 30%

70% 70%

30%

70% 70%

70%

30%

30% 30%

tF2

70% 70%

tSU:STA tHD:STA

START CONDITION

tSU:STO

STOP CONDITION

30%

70%

D0 ACK

tWRwrite data

(n-th address) START CONDITIONSTOP CONDITION

70%

DATA(1)

D0 ACK

D1

DATA(n)

ACK tWR

30%

70%

STOP CONDITION

tHD:WP

tSU:WP

30%

70%

DATA(1)

D0

D1 ACK

DATA(n)

ACK

tHIGH:WP

70% 70%

tWR

70%

(INPUT)

(OUTPUT)

Figure 2-(b). Start-stop bit timing

5/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Block Diagram

Figure 3. Block diagram

●Pin Configuration

●Pin Descriptions

Terminal

Name Input/

Output Function

A0 Input Don’t use*1

A1 Input Slave address setting*2

A2 Input Slave address setting*2

GND － Reference voltage of all input / output, 0V

SDA Input/

output Serial data input serial data output

SCL Input Serial clock input

WP Input Write protect terminal

Vcc － Connect the power source.

*1 Pins not used as device address may be set to any of ‘H’,’L’, and ‘Hi-Z’.

*2 A1 and A2 are not allowed to use as open.

4Kbit EEPROM array

9bit

* A0=Don't use

1

BR24G04-3A

A0

A1

A2

GND

Vcc

WP

SCL

SDA

2

3

4

8

7

6

5

8

7

6

5 4

3

2

1

SDA

SCL

WP

V cc

GND

A

2

A1

*A0

A

ddress

decoder

Word

address register Data

register

Control circuit

High voltage

generating circuit

Power source

voltage detection

8bit

A

CK

START STOP

6/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Typical Performance Curves

(The following values are Typ. ones)

Figure 4. Input High Voltage1,2 VIH1,2

(A1, A2, SCL, SDA, WP) Figure 5. Input Low Voltage1,2 VIL1,2

(A1, A2, SCL, SDA, WP)

Figure 6. Output Low Voltage1 VOL1

(Vcc=2.5V) Figure 7. Output Low Voltage2 VOL2

(Vcc=1.6V)

0

1

2

3

4

5

6

0123456

SUPPLY VO LT AG E: Vcc(v)

INPUT LOW VO LTAG E: V

IL1

(V)

Ta=-40℃

Ta= 25℃

Ta= 85℃

SPEC

0

1

2

3

4

5

6

0123456

SUPPLY VOLTAGE: Vcc(v)

I NPUT HIG H VOLTAG E: V

IH1

(V)

Ta=-40℃

Ta= 25℃

Ta= 85℃

SPEC

0

0.2

0.4

0.6

0.8

1

0123456

L O UTP UT CURRE NT : I

OL

(mA)

OUTPUT LOW VO LT AGE: V

OL1

(V)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

0

0.2

0.4

0.6

0.8

1

0123456

L O UTP UT CURRE NT: I

OL

(mA)

O UTPUT LOW VO LTAG E: V

OL2

(V)

Ta=-40℃

Ta= 25℃

Ta= 85℃

SPEC

7/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Typical Performance Cur ves‐Continued

Figure 8. Input Leakage Current ILI

(A1, A2, SCL, WP) Figure 9. Output Leakage Current ILO (SDA)

Figure 10. Supply Current (WRIT E ) ICC1

(fscl=1MHz) Figure 11. Supply Current (READ) ICC2

(fscl=1MHz)

0

0.2

0.4

0.6

0.8

1

1.2

0123456

SUPPLY VO LT AG E: Vcc(v)

INPUT LEAKAGE CURRENT : I

LI

(µA)

Ta=-40℃

Ta= 25℃

Ta= 85℃

SPEC

0

0.2

0.4

0.6

0.8

1

1.2

0123456

SUPPLY VOLTAGE: Vcc(v )

OUTPUT LEAKAGE CURRENT: I

LO

(µA)

Ta=-40℃

Ta= 25℃

Ta= 85℃

SPEC

0

0.5

1

1.5

2

2.5

0123456

S UPP LY VOLT AG E: Vcc ( v)

S UP P LY CURRENT ( WRITE) : Ic c 1(mA )

Ta=-40℃

Ta= 25℃

Ta= 85℃

SPEC

0

0.5

1

1.5

2

2.5

0123456

SUPPLY VOLTAGE: Vcc(v)

SUPPLY CURRENT (READ) : I cc2(mA)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

8/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Typical Performance Cur ves‐Continued

Figure 12. Standby Current ISB Figure 13. Clock Frequenc y fSCL

Figure 14. Data Clock High Period tHIGH Figure 15. Data Clock Low Period tLOW

0.1

1

10

100

1000

10000

0123456

SUPPLY VO LTAGE: Vcc ( v)

SCL FREQUENCY: fscl( k Hz)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

0

0.5

1

1.5

2

2.5

0123456

SUPPLY VO LTAGE: Vc c(v)

S TANDB Y CURRE NT: I

SB

(µA)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

0

0.1

0.2

0.3

0.4

0123456

SUPPLY VOLTAGE: Vcc(v)

DATA CLK H TIME : t

HIGH

(µs)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

0

0.1

0.2

0.3

0.4

0.5

0.6

0123456

SUPPLY VOLTAGE: Vcc(v)

DATA CLK L TIME : t

LOW

(µs)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

9/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Typical Performance Cur ves‐Continued

Figure 17. Start Condition Hold Time tHD:STA

Figure 16. SDA (OUTPUT) Fall Time tF2

Figure 18. Start Condition Setup Time tSU:STA Figure 19. Input Data Hold Time tHD:DAT ( HIGH)

0

0.05

0.1

0.15

0.2

0.25

0.3

0123456

SUPPLY VO LTAGE: Vcc ( v)

START CONDITION HOLD TIME: t

HD:STA

(µs)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

0

0.02

0.04

0.06

0.08

0.1

0.12

0.14

0123456

SUPPLY VO LTAGE: Vcc ( v)

SDA (O UTPUT) FALL T IME: t

F2

(µs)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

-0.05

0

0.05

0.1

0.15

0.2

0.25

0.3

0123456

SUPPLY VOLTAGE: Vcc(v)

ST ART CONDI TION SETUP TIME: t

SU:STA

(µs)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

-150

-100

-50

0

50

0123456

SUPPLY VOLTAGE: Vc c (v)

INPUT DATA HOLD TIME: t

HD:DAT

(ns)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

10/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Typical Performance Cur ves‐Continued

Figure 20. Input Data Hold Time tHD:DAT(LOW) Figure 21. Input Data Setup Time tSU:DAT(HIGH)

Figure 22. Input Data Setup Time tSU:DAT(LOW) Figure 23. ‘L’ Output Data Delay Time tPD0

-150

-100

-50

0

50

0123456

SUPPLY VO LTAGE: Vcc(v)

INPUT DAT A HO L D TIME : t

HD:DAT

(ns)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

0

10

20

30

40

50

60

0123456

SUPPLY VO LTAGE: Vcc(v)

INPUT DATA SET UP TIME: t

SU:DAT

(ns)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

0

10

20

30

40

50

60

0123456

SUPPLY VOLTAGE: Vcc(v)

INPUT DATA SET UP TIME: t

SU:DAT

(ns)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

0

0.1

0.2

0.3

0.4

0.5

0123456

SUPPLY VOLTAGE: Vcc(v)

OUT PUT DA TA DE LAY TIME: t

PD

(µs)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

11/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Typical Performance Cur ves‐Continued

Figure 26. BUS Free Time tBUF

Figure 24. ‘H’ Output Data Delay Time tPD1 Figure 25. Stop Condition Setup Time tSU:STO

Figure 27. Write Cycle Time tWR

0

0.1

0.2

0.3

0.4

0.5

0123456

SUPPLY VO LT AGE: Vcc (v)

OUTPUT DATA DELAY TIME: t

PD

(µs)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

0

0.05

0.1

0.15

0.2

0.25

0.3

0123456

SUPPLY VOLTAGE: Vcc ( v)

S TOP CONDITION SET UP TIME: t

SU:STO

(µs)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

0

0.1

0.2

0.3

0.4

0.5

0.6

0123456

SUPPLY VOLT AGE: Vcc( v)

BUS OPEN TIME

BEF ORE TRANSMI SS ION: t

BUF

(µs)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

0

1

2

3

4

5

6

0123456

SUPPLY VOLTAGE: Vcc(v)

INTERNAL WRITING

CY CL E T IME: tWR(ms)

Ta=-40℃

Ta= 25℃

Ta= 85℃

SPEC

12/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

Figure 31. Noise Spike Width tI (SDA L)

Figure 30. Noise Spike Width tI (SDA H)

Figure 29. Noise Spike Width tI (SC

L

L)

Figure 28. Noise Spike Width tI (SC

L

H)

●Typical Performance Cur ves‐Continued

0

0.05

0.1

0.15

0.2

0.25

0.3

0123456

SUPPLY VOLTAGE: Vcc(v)

NOIS E RE DUCTION

EFECTIVE TIME: t

I

(SCL L)(µs)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

0

0.05

0.1

0.15

0.2

0.25

0.3

0123456

SUPPLY VOLTAGE: Vcc(v)

NOISE REDUCTION

EFECT IVE TIME: t

I

(SCL H)(µs)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

0

0.05

0.1

0.15

0.2

0.25

0.3

0123456

SUPPLY VO LT AGE: Vcc ( v)

NOISE RE DUCTION

EFECTIVE TI ME: t

I

(SDA L)(µs)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

0

0.05

0.1

0.15

0.2

0.25

0.3

0123456

SUPPLY VOLTAGE: Vcc(v)

NOISE REDUCTION

EFECTIVE TIME: t

I

(SDA H)(µs)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

13/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

Figure 34. WP High Time tHIGH:WP

Figure 33. WP Setup Time tSU:WP

Figure 32. WP Hold Time tHD:WP

●Typical Performance Cur ves‐Continued

0

0.2

0.4

0.6

0.8

1

1.2

0123456

SUPPLY VO LTAGE: Vcc ( v)

WP DATA HOLD TIME: t

HD:WP

(µs)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

-0.3

-0.2

-0.1

0

0.1

0.2

0123456

SUPPLY VOLTAGE: Vc c(v)

WP DATA SET UP TIME: t

SU:WP

(µs)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

0

0.2

0.4

0.6

0.8

1

1.2

0123456

SUPPLY VOLTAGE: Vcc(v)

WP EFECTIVE TIME: t

HIGH:WP

( µs)

SPEC

Ta=-40℃

Ta= 25℃

Ta= 85℃

14/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Timing Chart

○I2C BUS data communication

I2C BUS data communication starts by start condition input, and ends by stop condition input. Data is always 8bit long, and

acknowledge is al ways required after each byte. I2C BUS carries out data transmission with plural devic es connected by 2

communication lines of serial data (SDA) and serial clock (SCL).

Among devices, there are “master” that generates clock and control communication start and end, and “slave” that is

controlled by address peculiar to devices. EEPROM becomes “slave”. And the device that outputs data to bus during data

communication is called “trans mitter”, and the device that receives data is called “receiver”.

○Start condition (Start bit recognition)

・Before executing each command, start condition (start bit) where SDA goes from 'HIGH' down to 'LOW' when SCL is

'HIGH' is necessary.

・This IC always detects whether SDA and SCL are in start condition (start bit) or not, therefore, unless this confdition is

satisfied, any command is executed.

○Stop condition (stop bit recongnition)

・Each command can be ended b y SDA rising from 'LOW' to 'HIGH' when stop condition (stop bit), namely, SCL is 'HIGH'

○Acknowledge (ACK) signal

・This acknowledge (ACK) signal is a software rule to show whether data transfer has been made normally or not. In

master and slave, the device (μ-COM at slave address input of write command, read command, and this IC at data

output of read command) at the transmitter (sending) side releas es the bus after output of 8bit data.

・The device (this IC at slave address input of write command, read command, and μ-COM at data output of read

command) at the receiver (receiving) side s ets SDA 'LOW' during 9 clock cycles, and outputs acknowledge si gnal (ACK

signal) showing that it has received the 8bit data.

・This IC, after recognizing start condition and slave address (8bit), outputs acknowledge signal (ACK signal) 'LOW' .

・Each write action outputs acknowledge signal (ACK signal) 'LOW', at receiving 8bit data (word address and write data).

・Each read action outputs 8bit data (read d ata), and detec ts ackno wledge sig nal (A CK signa l) 'LOW '. W hen ack no wledge

signal (ACK signal) is detected, and stop condition is not sent from the master (μ-COM) side, this IC continues data

output. When acknowledge s ignal (ACK signal) is not detected, this IC stops data transfer, and recogni zes stop cindition

(stop bit), and ends read action. And this IC gets in status.

○Device addressing

・Output slave address after start condition from master.

・The significant 4 bits of slave address are used for reco gnizing a device type.

The device code of this IC is fixed to '1010' .

・Next slave addresses (A1,A2--- devic e address) are for selecting dev ices, and plural ones can be u sed on a same bus

according to the number of device addresses.

・ The most insignificant bit (R/W --- READ / WRITE) of slave address is used for designating write or read action, and is

as shown below.

Setting R / W

―― to 0 ------- write (setting 0 to word address setting of random read)

Setting R / W

―― to 1 ------- read

Type Slave address Maximum number of

Connected buses

BR24G04-3A 1 0 1 0 A2 A1 P0 R/W

―― 4

P0 is page select bits.

89 89 89

S P

condition condition

ACK STOPACKDATA DATAADDRES

S

START R/W ACK

1-7

SDA

SCL 1-7 1-7

Figure 35. Data transfer timing

15/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Write Command

○Write cycl e

・Arbitrary data is written to EEPROM. When to write only 1 byte, byte write is normally used, and when to write continuous

data of 2 bytes or more, simultaneous write is possible by page write cycle. Up to 16 arbitrary bytes can be written.

・During internal write execution, all input commands are ignored, therefore ACK is not sent back.

・Data is written to the address designated by word address (n-th address)

・By issuing stop bit after 8bit data input, write to memory cell inside starts.

・When internal write is started, command is not accepted for tWR (5ms at maximum).

・By page write cycle, data up to 16 bytes can be written in bulk.

And when data of the maximum bytes or higher is sent, data from the first byte is overwritten.

(Refer to "Internal address increment")

・As for page write command of BR24G04-3A after page select bit ’P0’ of slave address are designated arbitrarily, by

continuing data input of 2 bytes or more, the address of insignificant 4 bits is incremented internally, and data up to 16

bytes can be written.

Figure 36. Byte write cycle

Figure 37. Page write cycle

A1 A2 WA

7 D7 1 1 0 0

W

R

I

T

E

S

T

A

R

T

R

/

W

S

T

O

P

WORD

ADDRESS DATA

SLAVE

ADDRESS

P0 WA

0 D0

A

C

K

SDA

LINE

A

C

K

A

C

K

A1A2 WA

7 D7 1 1 0 0

W

R

I

T

E

S

T

A

R

T

R

/

W

S

T

O

P

WORD

ADDRESS

(

n

)

DATA(n)

SLAVE

ADDRESS

P0 WA

0 D0

A

C

K

SDA

LINE

A

C

K

A

C

K

DATA

(

n+15

)

D0

A

C

K

16/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

○Notes on write cycle continuous input

The maximum page numbers of BR24G04-3 A are 16 bytes. Any bytes below these can be written.

1 page=16bytes, but the page write cycle time is 5ms at maximum for 16byte bulk write.

It does not stand 5ms at maximum × 16byte=80ms(Max.)

○Internal address increment

Page write mode

○Write protect (WP) terminal

・Write protect (WP) function

When WP terminal is set Vcc (H level), data rewrite of all addresses is prohibited. When it is set GND (L level), data

rewrite of all address is ena ble d. Be sure to c onn ect this ter minal t o Vcc or GND, or contr ol it to H lev el or L level. Do not

use it open.

In the case of use it as an ROM, it is recommended to connect it to pull up or Vcc.

At extremely low voltage at power ON / OFF, by setting the WP terminal 'H', mistake write can be prevented.

For example, when it is started from address 0Eh,

therefore, increment is made as below,

0Eh→0Fh→00h→01h･･･ which ple ase note.

※0Eh･･･0E in hexadecimal, therefore, 00001110 becomes a

binary number.

WA7 WA4 WA3 WA2 WA1 WA0

0 00000

0 00001

0 00010

0 01110

0 01111

0 00000

Increment

0Eh

Significant bit is fixed.

No dig i t up

17/33

Datasheet

BR24G04-3A

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TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Read Command

○Read cycle

Data of EEPROM is read. In read cycle, there are random read cycle and current read cycle.

Random read cycle is a command to read d ata by designat ing address, and is used generally.

Current read cycle is a command to read d ata of internal add ress register without d esign ating addr ess, and is used when

to verify just after write cycle. In both the read cycles, sequential read cycle is available, and the next address data can

be read in succession.

・In random read cycle, data of designated word address can be re ad.

・When the command just before current read cycle is random read cycle, current read cycle (each including sequential

read cycle), data of incremented last read address (n)-th address, i.e., data of the (n+1)-th address is output.

・When ACK signal 'LOW' after D0 is detect ed, an d stop c ondition is not sent from master (μ-COM) side, the n ext addres s

data can be read in succession.

・Read cycle is end ed by stop condition where 'H' is input to ACK signal after D0 and SDA signal is started at SCL signal

'H' .

・When 'H' is not input to ACK signal after D0, sequential read gets in, and the next data is output.

Therefore, read command cycle cann ot be ended. W hen to end read command c ycle, be sure input stop conditi on to input

'H' to ACK signal after D0, and to start SDA at SCL signal 'H'.

・Sequential read is ended by stop condition where ' H' is input to ACK signal after arbitrary D0 and SDA is started at SCL

signal 'H'.

Figure 38. Random read cycle

Figure 40. Sequential read cycle (in the cas e of current read cycle)

W

R

I

T

E

S

T

A

R

T

R

/

W

A

C

K

S

T

O

P

WORD

AD DRESS(n)

SDA

LINE

A

C

K

A

C

K

DATA(n)

A

C

K

SLAVE

ADDRESS

10 0 1 P0 A1 A2 WA

7 P0 D0

SLAVE

ADDRESS

10 0 1A1 A2

S

T

A

R

T

D7

R

/

W

R

E

A

D

WA

0

S

T

A

R

T

S

T

O

P

SDA

LINE

A

C

K

DATA(n)

A

C

K

SLAVE

ADD R ES S

10 0 1 P0 A1A2 D0D7

R

/

W

R

E

A

D

Figure 39. Current read cycle

R

E

A

D

S

T

A

R

T

R

/

W

A

C

K

S

T

O

P

DATA(n)

SDA

LINE

A

C

K

A

C

K

DATA(n+x)

A

C

K

SLAVE

ADDRESS

10 0

1P0

A1

A2 D0D7 D0 D7

18/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Software Reset

Software reset is executed when to avoid malfunction after power on, and to reset during command input. Software reset

has several kinds, and 3 kinds of them are sho wn in the figure be low. (Refer to Figure 41-(a), Figure 41- (b), Figure 41-(c))

In dummy clock input area, release the SDA bus ('H' by pull up). In dummy clock area, ACK output and read data '0' (both

'L' level) may be output from EEPROM, therefore, if 'H' is input forcibly, output may conflict and over current may flow,

leading to instantaneous power failure of system power source or influ ence upon devices.

●Acknowledge Polling

During internal write e xecution, all i nput commands are ignored, therefore ACK is not sent back. During int ernal automatic

write execution after write cycle input, next command (slave address) is sent, and if the first ACK signal sends back 'L' , then

it means end of write action, while if it sends back 'H', it means now in writing. By use of acknowledge polling, next

command can be executed without waiting for tWR = 5ms.

When to write continuously, R/W = 0, when to carry out current read cyc le after write, slave ad dress R/ W = 1 is sent, and if

ACK signal sends back 'L', then execute word address input and data output and so forth.

Figure 41-(a). Dummy clock x 14 + START + START + command input

※Start command from START input.

Figure 41-(b). START + dummy clock x 9 + START + command input

Normal command

1 2 13 14

SCL

Dummy clock x 14 Start x 2

Normal command

SDA

SCL 2 1 8 9

Dummy clock x 9 Start

Start

Normal command

SDA

Figure 41-(c). START x 9 + command input

Normal command

St art x 9

SCL 1 2 3 8 9 7 Normal command

SDA

Slave

address

Word

address

…

S

T

A

R

T

First write command

A

C

K

H

A

C

K

L

Slave

address

Slave

address

Slave

address Data

Write command

During internal write,

ACK = HIGH is sent back.

After completion of internal write,

ACK=LOW is sent back, so input

next word address and data in

succession.

tWR

Second write command

S

T

A

R

T

S

T

A

R

T

S

T

A

R

T

S

T

A

R

T

S

T

O

P

S

T

O

P

A

C

K

H

A

C

K

H

A

C

K

L

A

C

K

L

Figure 42. Case to continuously write by acknowledge polling

19/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●WP Valid Timing (Write Cancel)

WP is usually fixed to 'H' or 'L', but when WP is used to cancel write cycle and so forth, pay attention to the following WP

valid timing. During write cycl e execution, in cancel valid area, by setting WP= 'H', write cycle can be cancelled. In both byte

write cycle and page write cycle, the area from the first start condition of command to the rise of clock to taken in D0 of

data(in page write cycle, the first byte data) is cancel invalid area.

WP input in this area becomes don't care. The area from the rise of SCL to take in D0 to input the stop condition is cancel

valid area. And, after execution of forced end by WP, standby status gets in.

●Command Cancel by Start Condition and Stop Condition

During command input, by continuously inputting start condition and stop condition, command ca n be cancelled. (Figure 44)

However, in ACK output area and during data read, SDA bus may output 'L', and in this case, start condition and stop

condition cannot be input, so reset is not available. Therefore, execute software reset. And when command is cancelled b y

start, stop condition, during random read c ycle, sequential read cycle, or current read cycle, internal s etting address is not

determined, therefore, it is not possible to carry out current read cycle in succession. When to carry out read cycle in

succession, carry out random read cycle.

・Rise of D0 taken clock

SCL

D0 ACK

Enlarged view

SCL

SDA ACK D0

・Rise of SDA

SDA

WP

WP cancel invalid area WP cancel valid area

Data is not written.

Figure 43. WP valid timing

Slave

address D7 D6 D5 D4 D3 D2 D1 D0 Data tWR

SDA D1

S

T

A

R

T

A

C

K

L

A

C

K

L

A

C

K

L

A

C

K

L

S

T

O

P

Word

address

Figure 44. Case of cancel by start, stop condition during slave address input

SCL

SDA 1 1 0 0

Start condition Stop condition

Enlarged view

WP cancel invalid area

20/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●I/O Peripheral Circuit

○Pull up resistance of SDA terminal

SDA is NMOS open drai n, so requires pull up resistance. As for this resistance value (RPU), select an appropriate value to

this resistance value from microcontroller VIL, IL, and VOL-IOL characteristics of this IC. If RPU is large, action frequency is

limited. The smaller the RPU, the larger the supply current.

○Maximum value of RPU

The maximum value of RPU is determined by the following factors.

①SDA rise time to be determined b y the c apacitance (CBUS) of bus line of RPU and SDA should be tR or below.

And AC timing should be satisfied even when SDA rise time is late.

②The bus electric potential A to be determined by input leak total (IL) of device connected to bus at output of 'H' to

SDA bus and RPU should sufficiently secure the input 'H' level (VIH) of microcontroller and EEPROM including

recommended noise margin 0.2Vcc.

VCC－ILRPU－0.2 VCC ≧ VIH

∴RPU ≦0.8VCC－VIH

IL

Ex.) VCC =3V IL=10μA VIH=0.7 VCC

from②

≦30 ［kΩ］

RPU ≦0.8×3－0.7×3

10×10-6

○ Minimum value of RPU

The minimum value of RPU is determined by the following factors.

When IC outputs LOW, it should be satisfied that VOLMAX=0.4V and IOLMAX=3mA.

②VOLMAX=0.4V should secure the input 'L' level (VIL) of microcontroller and EEPROM including recommended

noise margin 0.1Vcc.

VOLMAX ≦ VIL－0.1 VCC

Ex.) VCC =3V, VOL=0.4V, IOL=3mA, microcontroller, EEPROM VIL=0.3Vcc

And VOL=0.4［V］

VIL=0.3×3

=0.9［V］

Therefore, the condition ② is satisfied.

○Pull up resistance of SCL terminal

When SCL control is made at CMOS output port, there is no need, but in the case there is timing where SCL becomes

'Hi-Z', add a pull up resistance. As for the pull up resistance, one of several kΩ to several ten kΩ is recommended in

consideration of drive perform ance of output port of microcontroller.

IOL

RPU ≧VCC－VOL

IOL

∴

VCC－VO

L

RPU ≦

≧867 ［Ω］

RPU ≧3－0.4

3×10 -3

from①

Microcontroller

RPU

A SDA terminal

IL IL

Bus line

capacity

CBUS

Figure 45. I/O circuit diagram

EEPROM

21/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Cautions on Microcontroller Connection

○RS In I2C BUS, it is recommended that SDA por t is of open drain in put/outp ut. However, when to use CMOS input / output of

tri state to SDA port, insert a series resistance Rs between the pull up resistance Rpu and the SDA terminal of EEPROM.

This is controls over current that occurs when PMOS of the microcontroller and NMOS of EEPROM are turned ON

simultaneously. Rs also plays the role of protection of SDA terminal against surge. Therefore, even when SDA port is

open drain input/output, Rs can be used.

○Maximum value of Rs

The maximum value of Rs is determin ed by the following relations.

①SDA rise time to be determined b y the c apacity (CBUS) of bus line of Rpu and SDA should b e tR or bel ow.

And AC timing should be satisfied even when SDA rise time is late.

②The bus electric potential A to be determined by Rpu and Rs the moment when EEPROM outputs 'L' to SDA bus

sufficiently secure the input 'L' level (VIL) of microcontroller including recommended noise margin 0.1Vcc.

○Minimum value of Rs

The minimum value of Rs is determin ed by over current at bus collision. When over current flows, noises in power source

line, and instantaneous power failure of power source may occur. When allowable over current is defined as I, the

following relation must be satisfied. Determi ne the allowable current in consideration of impedance of p ower source line

in set and so forth. Set the over current to EEPROM 10mA or below.

RPU

Microcontroller

RS

EEPROM

Figure 46. I/O circuit diagram Figure 47. Input / output collision timing

A

CK

'L' output of EEPROM

'H' output of microcontroller

Over current flows to SDA line by 'H'

output of microcontroller and 'L'

output of EEPROM.

SCL

SDA

Microcontroller EEPROM

'L'output

R

S

R

PU

'H' output

Over current I

Figure 49. I/O circuit diagram

≦1.67［kΩ］

≦0.3×3－0.4－0.1×3 ×20×103

1.1×3－0.3×3

RS

×R

PU

1.1VCC-VIL

Ex.）VCC=3V　VIL=0.3VCC　VOL=0.4V　RPU=20kΩ

∴RS≦VIL－VOL－0.1VCC

(VCC－VOL)×RS+V

OL+0.1VCC≦VIL

RPU+RS

V

CC

R

S

V

CC

I

≧300［Ω］

∴

Ex.) VCC=3V, I=10mA

R

S

≧3

10×10

-3

≦I

R

S

≧

RPU

Micro controller

RS

EEPROM

IOL

A

Bus line

capacity

CBUS

VOL

VCC

VIL

Figure 48. I/O Circuit Diagram

22/33

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BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●I/O Equivalence Circuit

○Input (A2,A1,SCL, WP) ○Input / output (SDA)

●Power-up / Down Conditions

At power on, in IC internal circuit and set, Vcc rises through unstable low voltage area, and IC inside is not completely reset,

and malfunction may occur. To prevent this, functions of POR circuit and LVCC circuit are equipped. To assure the action,

observe the following conditions at power on.

1. Set SDA = 'H' and SCL ='L' or 'H’

2. Start power source so as to satisfy the recommended conditions of tR, tOFF, and Vbot for operating POR circuit.

tOFF

tR

Vbot

0

VCC

3. Set SDA and SCL so as not to become 'Hi-Z'.

When the above conditions 1 and 2 cannot be observed, take the following countermeasur es.

a) In the case when the above condition 1 c annot be observed. When SDA becomes 'L' at power on .

→Control SCL and SDA as shown below, to make SCL and SDA, 'H' and 'H'.

b) In the case when the above condition 2 cannot be observed.

→After power source becomes stable, execute software reset(P18).

ｃ) In the case when the above conditions 1 and 2 cannot be observed.

→Carry out a), and then carry out b).

●Low Voltage Malfunction Preve ntion Func tion

LVCC circuit prevents data rewrite action at low power, and preve nts wrong write. At LVCC voltage (Typ. =1.2V) or below, it

prevent data rewrite.

●Noise Countermeasures

○Bypass capacitor

When noise or surge gets in the po wer source line, malfun ction ma y occu r, therefore, for removing these, it is recommende d

to attach a by pass capacitor (0.1μF) between IC Vcc and GND. At that moment, attach it as close to IC as possible.

And, it is also recommended to attach a bypass capacitor bet ween board V cc and GND.

Figure 52. Rise waveform diagram

tLOW

tSU:DAT tDH

A

fter Vcc becomes stable

SCL

VCC

SDA

tSU:DAT

A

ft er Vcc becomes stable

Recommended conditions of tR, tOFF,Vbot

tR tOFF Vbot

10ms or belo

w

10ms or larger 0.3V or below

100 or below 10ms or larger 0.2V or below

Figure 50. Input pin circuit diagram Figure 51. Input / output pin circuit diagram

Figure 53. When SCL= 'H' and SDA= 'L' Figure 54. When SCL='L' and SDA= 'L'

23/33

Datasheet

BR24G04-3A

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TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Operational Notes

(1) Described numeric values and data are design representative values, and the values a r e not guaranteed.

(2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further

sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin in

consideration of static characteristics and transition characteristics an d fluctuations of external parts and our LSI.

(3) Absolute maximum ratings

If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded, LSI

may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of fear

exceeding the absolute maxi mum ratings, take physical safety countermeasur es such as fuses, and see to it that conditions

exceeding the absol ute maximum ratings should not be im pressed to LSI.

(4) GND electric potential

Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is lower than that of

GND terminal.

(5) Terminal design

In consideration of permissible loss in actual use condition, carry out heat design with sufficient margin.

(6) Terminal to terminal shortcircuit and wrong packaging

When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may

destruct LSI. And in the case of shortcircuit between LSI terminals and terminals and power source, terminal and GND owing

to foreign matter, LSI may be destructed.

(7) Use in a strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently.

24/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Part Numbering

B R 2 4 G 0 4 x x x - 3 A x x x x

Lineup

Capacity Package Orderable Part Number Remark

Type Quantity

4K

DIP-T8 Tube of 2000 BR24G04 -3A Not Halogen free 100% Sn

SOP8 Reel of 2500 BR24G04F -3AGTE2 Halogen free 100% Sn

SOP-J8 BR24G04FJ -3AGTE2 Halogen free 100% Sn

TSSOP-B8 Reel of 3000 BR24G04FVT -3AGE2 Halogen free 100% Sn

TSSOP-B8J Reel of 2500 BR24G04FVJ -3AGTE2 Halogen free 100 % Sn

MSOP8 Reel of 3000 BR24G04FVM -3AGTTR Halogen free 100% Sn

VSON008X2030 Reel of 4 000 BR24G04NUX -3ATTR Halogen free 100% Sn

BUS type

24 : I2C

Operating temperature/

Operating Voltage

-40℃ to +85℃ / 1.6V to 5.5V

Package

Blank

FJ

FVJ

NUX

: DIP-T8

: SOP-J8

: TSSOP-B8J

: VSON008X2030

F

FVT

FVM

: SOP8

: TSSOP-B8

: MSOP8

Capacity

04=4K

Process code

Revision

G : Halogen free

Blank : Not Halogen free

As an exception, VSON008X2030 package will be Halogen free with “Blank”

T : 100% Sn

Blank : 100% Sn

Packaging and forming specification

E2 : Embossed tape and reel

(SOP8, SOP-J8, TSSOP-B8, TSSOP-B8J)

TR : Embossed tape and reel

(MSOP8, VSON008X2030)

None : Tube

(DIP-T8)

25/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Physical Dimensions Tape and Reel Information

∗

Order quantity needs to be multiple of the minimum quantity.

TubeContainer

Quantity

Direction of feed 2000pcs

Direction of products is fixed in a container tube

(Unit : mm)

DIP-T8

0°−15°

7.62

0.3±0.1

9.3±0.3

6.5±0.3

85

14

0.51Min.

3.4±0.3

3.2±0.2

2.54 0.5±0.1

26/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

()

Direction of feed

Reel 1pin

(Unit : mm)

SOP8

0.9±0.15

0.3MIN

4

°

+

6

°

−

4

°

0.17 +0.1

-

0.05

0.595

6

43

8

2

5

1

7

5.0±0.2

6.2±0.3

4.4±0.2

(MAX 5.35 include BURR)

1.27

0.11

0.42±0.1

1.5±0.1

S

0.1 S

27/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

()

Direction of feed

Reel 1pin

(Unit : mm)

SOP-J8

4°+6°

−4°

0.2±0.1

0.45MIN

234

5678

1

4.9±0.2

0.545

3.9±0.2

6.0±0.3

(MAX 5.25 include BURR)

0.42±0.1

1.27

0.175

1.375±0.1

0.1 S

S

28/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

Direction of feed

Reel ∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

E2

()

1pin

(Unit : mm)

TSSOP-B8

0.08 S

0.08 M

4 ± 4

234

8765

1

1.0±0.05

1PIN MARK

0.525

0.245+0.05

−0.04

0.65

0.145+0.05

−0.03

0.1±0.05

1.2MAX

3.0±0.1

4.4±0.1

6.4±0.2

0.5±0.15

1.0±0.2

(MAX 3.35 include BURR)

S

29/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

Direction of feed

Reel ∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

()

1pin

(Unit : mm)

TSSOP-B8J

0.08 M

0.08 S

S

4 ± 4

(MAX 3.35 include BURR)

578

1234

6

3.0±0.1

1PIN MARK

0.95±0.2

0.65

4.9±0.2

3.0±0.1

0.45±0.15

0.85±0.05

0.145

0.1±0.05

0.32

0.525

1.1MAX

+0.05

−0.03

+0.05

−0.04

30/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

Direction of feed

Reel ∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

TR

()

1pin

(Unit : mm)

MSOP8

0.08 S

S

4.0±0.2

8

3

2.8±0.1

1

6

2.9±0.1

0.475

4

57

(MAX 3.25 include BURR)

2

1PIN MARK

0.9MAX

0.75±0.05

0.65

0.08±0.05

0.22 +0.05

−0.04

0.6±0.2

0.29±0.15

0.145 +0.05

−0.03

4°

+6°

−4°

31/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

4000pcs

TR

()

Direction of feed

Reel 1pin

(Unit : mm)

VSON008X2030

5

1

8

4

1.4±0.1

0.25

1.5±0.1

0.5

0.3±0.1

0.25 +0.05

−0.04

C0.25

0.6MAX

(0.12)

0.02+0.03

−0.02 3.0±0.1

2.0±0.1

1PIN MARK

0.08 S

S

32/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Marking Diagrams (TOP VIEW)

SOP8(TOP VIEW)

4G04A

Part Number Marking

LOT Numbe

r

1PIN MARK

SOP-J8(TOP VIEW)

4G04A

Part Number Marking

LOT Number

1PIN MARK

TSSOP-B8J(TOP VIEW)

4A3

Part Number Marking

LOT Number

1PIN MARK

4G0

VSON008X2030 (TOP VIEW)

4A3

Part Number Marking

LOT Number

1PIN MARK

4G0

MSOP8(TOP VIEW)

4GC Part Number Marking

LOT Number

1PIN MARK

A

TSSOP-B8(TOP VIEW)

4G04

A

Part Number Marking

LOT Number

1PIN MARK

DIP-T8 (TOP VIEW)

BR24G04A

Part Number Marking

LOT Number

33/33

Datasheet

BR24G04-3A

www.rohm.co

TSZ22111・15・001 TSZ02201-0R2R0G100560-1-2

27.Aug.2014 REV.003

●Revision History

Date Revision Changes

26.Dec.2012 001 New Release

31.May.2013 002 P1 Change format of package line-up table and change title.

P.2 Add VESD in Absolute Maximum Ratings

P.5 Add directions in Pi n Descriptions

27.Aug.2014 003 P. 3 Modified tSU:STA (0.25->0.20)

P.24 Update Part Numbering. Add Lineup Table

Datasheet

Notice – GE Rev.002

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinar y elec tronic eq uipm ents (such as AV equipment ,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred b y you or third parti es arising from the use of an y ROHM’s Prod ucts for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which

a failure or malfunction of our Products may cause. T he following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-produci ng comp onents, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding nor mal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending o n Ambient temper ature (Ta). When us ed in se aled area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in an y way responsible or liable for failure induced under dev iant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlor ine, bromin e, etc.) flux is used, the residue of flux ma y negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specificati on

Datasheet

Notice – GE Rev.002

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own indepe ndent verificati on and judgme nt in the use of such information

contained in this document. ROHM shall n ot be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please t ake special care under dry con dition (e.g. Grounding of human body / equipment / sol der iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperatur e / humidity control).

Precaution for Storage / Transportati on

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, sold erability of products out of recommende d storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommen de d storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a hum idity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products pl ease dispose them properly using a n authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including b ut not limited to, the developm ent of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or

concerning such information.