Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 4
1Publication Order Number:
NUP4304MR6/D
NUP4304MR6,
SZNUP4304MR6
Low Capacitance Diode
Array for ESD Protection in
Four Data Lines
NUP4304MR6 is a micro−integrated device designed to provide
protection for sensitive components from possible harmful electrical
transients; for example, ESD (electrostatic discharge).
Features
Low Capacitance (1.5 pF Maximum Between I/O Lines)
Single Package Integration Design
Provides ESD Protection for JEDEC Standards JESD22
Machine Model = Class C
Human Body Model = Class 3B
Protection for IEC61000−4−2 (Level 4)
8.0 kV (Contact)
15 kV (Air)
Ensures Data Line Speed and Integrity
Fewer Components and Less Board Space
Direct the Transient to Either Positive Side or to the Ground
Applications
USB 1.1 and 2.0 Data Line Protection
T1/E1 Secondary IC Protection
T3/E3 Secondary IC Protection
HDSL, IDSL Secondary IC Protection
Video Line Protection
Microcontroller Input Protection
Base Stations
I2C Bus Protection
AEC−Q101 Qualified and PPAP Capable
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
This is a Pb−Free Device*
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device Package Shipping†
ORDERING INFORMATION
MARKING DIAGRAM
TSOP−6
CASE 318F
http://onsemi.com
LG MG
G
6 I/O
5 VN
4 I/O
I/O 1
VP 2
1/O 3
PIN CONFIGURATION
AND SCHEMATIC
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
NUP4304MR6T1G TSOP−6
(Pb−Free)
3,000 /
Tape & Reel
LG = Specific Device Code
M = Date Code
G= Pb−Free Package
(Note: Microdot may be in either location)
SZNUP4304MR6T1G TSOP−6
(Pb−Free)
3,000 /
Tape & Reel
NUP4304MR6, SZNUP4304MR6
http://onsemi.com
2
MAXIMUM RATINGS (Each Diode) (TJ = 25C unless otherwise noted)
Rating Symbol Value Unit
Reverse Voltage VR70 Vdc
Forward Current IF200 mAdc
Peak Forward Surge Current IFM(surge) 500 mAdc
Repetitive Peak Reverse Voltage VRRM 70 V
Average Rectified Forward Current (Note 1) (averaged over any 20 ms period) IF(AV) 715 mA
Repetitive Peak Forward Current IFRM 450 mA
Non−Repetitive Peak Forward Current
t = 1.0 ms
t = 1.0 ms
t = 1.0 S
IFSM 2.0
1.0
0.5
A
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. FR−5 = 1.0 0.75 0.062 in.
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance Junction−to−Ambient RqJA 556 C/W
Lead Solder Temperature
Maximum 10 Seconds Duration
TL260
C
Junction Temperature TJ−40 to +150 C
Storage Temperature Tstg −55 to +150 C
ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted) (Each Diode)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I(BR) = 100 mA)
V(BR) 70 − −
Vdc
Reverse Voltage Leakage Current
(VR = 70 Vdc)
(VR = 25 Vdc, TJ = 150C)
(VR = 70 Vdc, TJ = 150C)
IR
−
−
−
−
−
−
2.5
30
50
mAdc
Capacitance (between I/O pins)
(VR = 0 V, f = 1.0 MHz)
CD
−0.8 1.5
pF
Capacitance (between I/O pin and ground)
(VR = 0 V, f = 1.0 MHz)
CD
−1.6 3
pF
Forward Voltage
(IF = 1.0 mAdc)
(IF = 10 mAdc)
(IF = 50 mAdc)
(IF = 150 mAdc)
VF
−
−
−
−
−
−
−
−
715
855
1000
1250
mVdc
1. FR−5 = 1.0 0.75 0.062 in.
2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.
NUP4304MR6, SZNUP4304MR6
http://onsemi.com
3
100
0.2 0.4
VF, FORWARD VOLTAGE (VOLTS)
0.6 0.8 1.0 1.2
10
1.0
0.1
TA = 85C
10
0
VR, REVERSE VOLTAGE (VOLTS)
1.0
0.1
0.01
0.001
10 20 30 40 50
1.75
0
VR, REVERSE VOLTAGE (VOLTS)
1.5
1.25
1.0
0.75
CD, DIODE CAPACITANCE (pF)
2468
IF, FORWARD CURRENT (mA)
Figure 1. Forward Voltage
Figure 2. Leakage Current
Figure 3. Capacitance
TA = -40C
TA = 25C
TA = 150C
TA = 125C
TA = 85C
TA = 55C
TA = 25C
IR, REVERSE CURRENT (A)
Curves Applicable to Each Cathode
NUP4304MR6, SZNUP4304MR6
http://onsemi.com
4
APPLICATIONS INFORMATION
The NUP4304MR6 is a low capacitance diode array
designed to protect sensitive electronics such as
communications systems, computers, and computer
peripherals against damage due to ESD events or transient
overvoltage conditions. Because of its low capacitance, it
can be used on high speed I/O data lines. The integrated
design of the NUP4304MR6 offers surge rated, low
capacitance steering diodes integrated in a single package
(TSOP−6). If a transient condition occurs, the steering
diodes will drive the transient to the positive rail of the
power supply or to ground.
NUP4304MR6 Configuration Options
The NUP4304MR6 is able to protect up to four data lines
against transient overvoltage conditions by driving them to
a fixed reference point for clamping purposes. The steering
diodes will be forward biased whenever the voltage on the
protected line exceeds the reference voltage (Vf or Vcc+Vf).
The diodes will force the transient current to bypass the
sensitive circuit.
Data lines are connected at pins 1, 3, 4 and 6. The negative
reference is connected at pin 5. This pin must be connected
directly to ground by using a ground plane to minimize the
PCB’s ground inductance. It is very important to reduce the
PCB trace lengths as much as possible to minimize parasitic
inductance.
Option 1
Protection of four data lines using Vcc as reference.
6
5
4
1
2
3
I/O 1
I/O 2
I/O 3
I/O 4
VCC
For this configuration, connect pin 2 directly to the
positive supply rail (Vcc), the data lines are referenced to the
supply voltage. Biasing of the steering diodes reduces their
capacitance.
Option 2
Protection of four data lines and the supply rail using VCC
as a reference and an external TVS diode.
I/O 1
I/O 2
I/O 3
I/O 4
6
5
4
1
2
3
VCC
If additional protection of the supply rail is desired, an
external TVS diode may be added across VCC and ground.
This will prevent overvoltage conditions on the supply rail
protecting the supply and other circuits connected to it.
Option 3
Protection of four data lines with bias and power supply
isolation resistor.
I/O 1
I/O 2
I/O 3
I/O 4
6
5
4
1
2
3
VCC
10 k
The NUP4304MR6 can be isolated from the power supply
by connecting a series resistor between pin 2 and VCC. A
10 kW resistor is recommended for this application. This
will maintain bias on the internal steering diodes, reducing
their capacitance.
NUP4304MR6, SZNUP4304MR6
http://onsemi.com
5
Option 4
Protection of four data lines without biasing of the internal
steering diodes.
I/O 1
I/O 2
I/O 3
I/O 4
6
5
4
1
2
3
In applications lacking a positive supply reference an
external TVS diode may be used as a reference. For these
applications, the TVS is connected between pin 2 and the
ground plane. The steering diodes will conduct whenever
the voltage on the protected line exceeds their forward
voltage plus the working voltage of the TVS diode (Vc=Vf
+ VTVS). In this case, the effective capacitance of the
steering diodes will be higher than if a bias was applied.
D1
D2
D3
D4
D5
D6
D7
D8
5
NUP4304MR6 Equivalent Circuit
2
1346
NUP4304MR6, SZNUP4304MR6
http://onsemi.com
6
PACKAGE DIMENSIONS
TSOP−6
CASE 318F−05
ISSUE M
23
456
D
1
e
b
E
A1
A
0.05 (0.002)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. 318F−01, −02, −03 OBSOLETE. NEW
STANDARD 318F−04.
C
L
HE
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.90 1.00 1.10 0.035
INCHES
A1 0.01 0.06 0.10 0.001
b0.25 0.37 0.50 0.010
c0.10 0.18 0.26 0.004
D2.90 3.00 3.10 0.114
E1.30 1.50 1.70 0.051
e0.85 0.95 1.05 0.034
0.20 0.40 0.60 0.008
0.039 0.043
0.002 0.004
0.015 0.020
0.007 0.010
0.118 0.122
0.059 0.067
0.037 0.041
0.016 0.024
NOM MAX
2.50 2.75 3.00 0.099 0.108 0.118
HE
− −
L
010010
q
q
0.7
0.028
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.95
0.037
ǒmm
inchesǓ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NUP4304MR6/D
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