1
2
3
4
8
7
6
5
CLKIN
OE
1Y0
GND
1Y3
1Y2
VDD
1Y1
TSSOP
PW PACKAGE
(TOP VIEW)
3
5
7
8
1Y0
1Y1
1Y2
1Y3
Logic
Control
2
1
OE
CLKIN
CDCV304
www.ti.com
SCAS643G –SEPTEMBER 2000–REVISED JANUARY 2011
200-MHz GENERAL-PURPOSE CLOCK BUFFER, PCI-X COMPLIANT
Check for Samples: CDCV304
1FEATURES • PCI-X Compliant
• General-Purpose and PCI-X 1:4 Clock Buffer • 8-Pin TSSOP Package
• Operating Frequency
– 0 MHz to 200 MHz General-Purpose
• Low Output Skew: <100 ps
• Distributes One Clock Input to One Bank of
Four Outputs
• Output Enable Control that Drives Outputs
Low when OE is Low
• Operates from Single 3.3-V Supply or 2.5-V
Supply
DESCRIPTION
The CDCV304 is a high-performance, low-skew, general-purpose PCI-X compliant clock buffer. It distributes one
input clock signal (CLKIN) to the output clocks (1Y[0:3]). It is specifically designed for use with PCI-X
applications. The CDCV304 operates at 3.3 V and 2.5 V and is therefore compliant to the 3.3-V PCI-X
specifications.
The CDCV304 is characterized for operation from –40°C to 85°C for automotive and industrial applications.
FUNCTIONAL BLOCK DIAGRAM
Table 1. FUNCTION TABLE
INPUTS OUTPUTS
CLKIN OE 1Y[0:3]
L L L
H L L
L H L
H H H
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2000–2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
CDCV304
SCAS643G –SEPTEMBER 2000–REVISED JANUARY 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
TERMINAL FUNCTIONS
TERMINAL I/O DESCRIPTION
NAME NO.
1Y[0:3] 3, 5, 7, 8 O Buffered output clocks
CLKIN 1 I Input reference frequency
GND 4 Power Ground
OE 2 I Output enable control
VDD 6 Power Supply
THERMAL INFORMATION(1)
THERMAL AIR FLOW (CFM)
CDCV304PW 8-PIN TSSOP UNIT
0 150 250 500
RqJA High K 149 142 138 132
RqJA Low K 230 185 170 150
RqJB High K 102.0 °C/W
RqJC High K 43.7
yJT High K 1.8
yJB High K 100.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
UNIT
Supply voltage range, VDD –0.5 V to 4.3 V
Input voltage range, VI(2) (3) –0.5 V to VDD + 0.5 V
Output voltage range, VO(2) (3) –0.5 V to VDD + 0.5 V
Input clamp current, IIK (VI< 0 or VI> VDD) ±50 mA
Output clamp current, IOK (VO< 0 or VO> VDD) ±50 mA
Continuous total output current, IO(VO= 0 to VDD) ±50 mA
Package thermal impedance, qJA: PW package 230.5°C/W
Storage temperature range Tstg –65°C to 150°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(3) This value is limited to 4.6 V maximum.
2Submit Documentation Feedback Copyright © 2000–2011, Texas Instruments Incorporated
Product Folder Link(s): CDCV304
CDCV304
www.ti.com
SCAS643G –SEPTEMBER 2000–REVISED JANUARY 2011
RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT
Supply voltage, VDD 2.3 3.6 V
Low-level input voltage, VIL 0.3 x VDD V
High-level input voltage, VIH 0.7 x VDD V
Input voltage, VI0 VDD V
VDD = 2.5 V –12
High-level output current, IOH mA
VDD = 3.3 V –24
VDD = 2.5 V 12
Low-level output current, IOL mA
VDD = 3.3 V 24
Operating free-air temperature, TA–40 85 °C
TIMING REQUIREMENTS
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fclk Clock frequency 0 200 MHz
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
VIK Input voltage VDD = 3 V, II= –18 mA –1.2 V
VDD = 2.3 V, IOH = –8 mA 1.8
VDD = 2.3 V, IOH = –16 mA 1.5
VOH High-level output voltage VDD = min to max, IOH = –1 mA VDD – 0.2 V
VDD = 3 V, IOH = –24 mA 2
VDD = 3 V, IOH = –12 mA 2.4
VDD = 2.3 V, IOL = 8 mA 0.5
VDD = 2.3 V, IOL = 16 mA 0.7
VOL Low-level output voltage VDD = min to max, IOL = 1 mA 0.2 V
VDD = 3 V, IOL = 24 mA 0.8
VDD = 3 V, IOL = 12 mA 0.55
VDD = 3 V, VO= 1 V –50
IOH High-level output current mA
VDD = 3.3 V, VO= 1.65 V –55
VDD = 3 V, VO= 2 V 60
IOL Low-level output current mA
VDD = 3.3 V, VO= 1.65 V 70
IIInput current VI= VOor VDD ±5 mA
f = 67 MHz, VDD = 2.7 V 28
IDD Dynamic current, see Figure 5 mA
f = 67 MHz, VDD = 3.6 V 37
CIInput capacitance VDD = 3.3 V, VI= 0 V or VDD 3 pF
COOutput capacitance VDD = 3.3 V, VI= 0 V or VDD 3.2 pF
(1) All typical values are with respect to nominal VDD and TA= 25°C.
Copyright © 2000–2011, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): CDCV304
CDCV304
SCAS643G –SEPTEMBER 2000–REVISED JANUARY 2011
www.ti.com
SWITCHING CHARACTERISTICS
VDD = 2.5 V ± 10%, CL= 10 pF (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
tPLH Low-to-high propagation delay 2 2.9 4.5
See Figure 1 and Figure 2 ns
tPHL High-to-low propagation delay 2 3 4.5
tsk(o) Output skew(2) See Figure 3 50 150 ps
trOutput rise slew rate 1.5 2.2 4 V/ns
tfOutput fall slew rate 1.5 2.2 4 V/ns
(1) All typical values are with respect to nominal VDD.
(2) The tsk(o) specification is only valid for equal loading of all outputs.
SWITCHING CHARACTERISTICS
VDD = 3.3 V ± 10%, CL= 10 pF (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
tPLH Low-to-high propagation delay 1.8 2.4 3
See Figure 1 and Figure 2 ns
tPHL High-to-low propagation delay 1.8 2.5 3
tsk(o) Output skew(2) 50 100 ps
12 kHz to 5 MHz, fout = 30.72 MHz 63
tjitter Additive phase jitter from input to output 1Y0 fs rms
12 kHz to 20 MHz, fout = 125 MHz 56
tsk(p) Pulse skew VIH = VDD, VIL = 0 V 150 ps
tsk(pr) Process skew 0.2 0.3 ns
tsk(pp) Part-to-part skew 0.25 0.4 ns
66 MHz 6
thigh Clock high time, see Figure 4 ns
140 MHz 3
66 MHz 6
tlow Clock low time, see Figure 4 ns
140 MHz 3
trOutput rise slew rate(3) VO= 0.4 V to 2 V 1.5 2.7 4 V/ns
tfOutput fall slew rate(3) VO= 2 V to 0.4 V 1.5 2.7 4 V/ns
(1) All typical values are with respect to nominal VDD.
(2) The tsk(o) specification is only valid for equal loading of all outputs.
(3) This symbol is according to PCI-X terminology.
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Product Folder Link(s): CDCV304
140 Ω
Yn
VDD
10 pF
140 Ω
0.6 VDD
1Y0 − 1Y3
50% VDD
0.2 VDD
tf
VOL
VOH
tr
CLKIN 0 V
VDD
tPHL
50% VDD
tPLH
0.6 VDD
50% VDD
0.2 VDD
50% VDD
Any Y
Any Y
tsk(0)
50% VDD
thigh
VIH(Min)
Vtest
VIL(Max)
tlow
tcyc
0.4 VDD
Peak to Peak (Minimum)
0.2 VDD
0.6 VDD
PARAMETER VALUE UNIT
VIH(Min)
VIL(Max)
Vtest
0.5 VDD
0.35 VDD
0.4 VDD
V
V
V
CDCV304
www.ti.com
SCAS643G –SEPTEMBER 2000–REVISED JANUARY 2011
PARAMETER MEASUREMENT INFORMATION
Figure 1. Test Load Circuit
Figure 2. Voltage Waveforms Propagation Delay (tpd) Measurements
Figure 3. Output Skew
A. All parameters in Figure 4 are according to PCI-X 1.0 specifications.
Figure 4. Clock Waveform
Copyright © 2000–2011, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): CDCV304
CDCV304
SCAS643G –SEPTEMBER 2000–REVISED JANUARY 2011
www.ti.com
REVISION HISTORY
Changes from Revision F (April 2009) to Revision G Page
• Added yJT and yJB specs to the Thermal Information Table and changed RqJB and RqJC specs from 65 and 69
°C/W respectively. ................................................................................................................................................................. 2
6Submit Documentation Feedback Copyright © 2000–2011, Texas Instruments Incorporated
Product Folder Link(s): CDCV304
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
CDCV304PW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CKV304
CDCV304PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CKV304
CDCV304PWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CKV304
CDCV304PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 CKV304
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 2
OTHER QUALIFIED VERSIONS OF CDCV304 :
•Enhanced Product: CDCV304-EP
NOTE: Qualified Version Definitions:
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
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