Semiconductor Components Industries, LLC, 1996
January, 2021 − Rev. 4 1Publication Order Number:
NC7SZ08/D
TinyLogic UHS Two-Input
AND Gate
NC7SZ08
Description
The NC7SZ08 is a single two−input AND gate from
ON Semiconductor’s Ultra−High Speed (UHS) series of TinyLogic.
The device is fabricated with advanced CMOS technology to achieve
ultra−high speed with high output drive while maintaining low static
power dissipation over a broad VCC operating range. The device is
specified to operate over the 1.65 V to 5.5 V VCC operating range. The
inputs and output are high impedance when VCC is 0 V. Inputs tolerate
voltages up to 5.5 V, independent of VCC operating voltage.
Features
•Ultra−High Speed: tPD = 2.7 ns (Typical) into 50 pF at 5 V VCC
•High Output Drive: ±24 mA at 3 V VCC
•Broad VCC Operating Range: 1.65 V to 5.5 V
•Matches Performance of LC X Operated at 3.3 V VCC
•Power Down High Impedance Inputs / Outputs
•Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
•Proprietary Noise / EMI Reduction Circuitry
•Ultra−Small MicroPak Packages
•Space−Saving SC−74A and SC−88A Packages
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Figure 1. Logic Symbol
Y
B&
IEEE / IEC
A
7Z08 M•
•
GG, 7Z08, Z08 = Specific Device Code
KK = 2−Digit Lot Run Traceability Code
XY = 2−Digit Date Code Format
Z = Assembly Plant Code
M = Date Code
•= Pb−Free Package
(Microdot may be in either location)
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
www.onsemi.com
SC−88A
CASE 419A−02
SIP6
CASE 127EB
UDFN6
CASE 517DP GGKK
XYZ
GGKK
XYZ
Z08 M•
•
Pin 1
Pin 1
SC−74A
CASE 318BQ
NC7SZ08
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2
Pin Configurations
A
B
VCC
GND Y
1
2
3
5
4
Figure 2. SC−88A and SC−74A (Top View)
A 1 6 VCC
B 2 5 NC
GND 3 4 Y
Figure 3. MicroPak (Top Through View)
PIN DEFINITIONS
Pin # SC−88A /
SC74A
Pin # MicroPak
Name
Description
1
1
A
Input
2
2
B
Input
3
3
GND
Ground
4
4
Y
Output
5
6
V
CC
Supply Voltage
5
NC
No Connect
FUNCTION TABLE (Y = AB)
Inputs
Output
A
B
Y
L
L
L
L
H
L
H
L
L
H
H
H
H = HIGH Logic Level
L = LOW Logic Level
NC7SZ08
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3
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
Max
Unit
V
CC
Supply Voltage
−0.5
6.5
V
V
IN
DC Input Voltage
−0.5
6.5
V
V
OUT
DC Output Voltage
−0.5
6.5
V
I
IK
DC Input Diode Current
V
IN
< 0 V
−
−50
mA
I
OK
DC Output Diode Current
V
OUT
< 0 V
−
−50
mA
I
OUT
DC Output Current
−
±
50
mA
I
CC
or I
GND
DC V
CC
or Ground Current
−
±
50
mA
T
STG
Storage Temperature Range
−65
+150
°
C
T
J
Junction Temperature Under Bias
−
+150
°
C
T
L
Junction Lead Temperature (Soldering, 10 Seconds)
−
+260
°
C
PDPower Dissipation in Still Air
SC−74A
−
390
mW
SC−88A
−
332
MicroPak−6
−
812
MicroPak2
−6
−
812
ESD
Human Body Model, JESD22−A114
−
4000
V
Charge Device Model, JESD22−C101
−
2000
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
Supply Voltage Operating
1.65
5.50
V
Supply Voltage Data Retention
1.50
5.50
V
IN
Input Voltage
0
5.5
V
V
OUT
Output Voltage
0
V
CC
V
T
A
Operating Temperature
−40
+85
°
C
tr, tfInput Rise and Fall Times
V
CC
at 1.8 V, 2.5 V
±
0.2 V
0
20
ns/V
V
CC
at 3.3 V
±
0.3 V
0
10
V
CC
at 5.0 V
±
0.5 V
0
5
qJA Thermal Resistance
SC−74A
−
320
°C/W
SC−88A
−
377
MicroPak−6
−
154
MicroPak2−6
−
154
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
NC7SZ08
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4
DC ELECTICAL CHARACTERISTICS
Symbo
l
Parameter VCC (V) Conditions
T
A
= +25
°
C
T
A
= −40 to +85
°
C
Unit
Min
Typ
Max
Min
Max
VIH HIGH Level Input Voltage
1.65 to 1.95
0.65 V
CC
−
−
0.65 V
CC
−
V
2.30 to 5.50
0.70 V
CC
−
−
0.70 V
CC
−
VIL LOW Level Input Voltage
1.65 to 1.95
−
−
0.35 V
CC
−
0.35 V
CC V
2.30 to 5.50
−
−
0.30 V
CC
−
0.30 V
CC
VOH HIGH Level Output Voltage
1.65
VIN = VIH or VIL,
IOH = −100 mA
1.55
1.65
−
1.55
−
V
1.80
1.70
1.80
−
1.70
−
2.30
2.20
2.30
−
2.20
−
3.00
2.90
3.00
−
2.90
−
4.50
4.40
4.50
−
4.40
−
1.65
I
OH
= −4 mA
1.29
1.52
−
1.29
−
2.30
I
OH
= −8 mA
1.90
2.15
−
1.90
−
3.00
I
OH
= −16 mA
2.50
2.80
−
2.40
−
3.00
I
OH
= −24 mA
2.40
2.68
−
2.30
−
4.50
I
OH
= −32 mA
3.90
4.20
−
3.80
−
VOL LOW Level Output Voltage
1.65
VIN = VIH or VIL,
IOL = 100 mA
−
0.00
0.10
−
0.10
V
1.80
−
0.00
0.10
−
0.10
2.30
−
0.00
0.10
−
0.10
3.00
−
0.00
0.10
−
0.10
4.50
−
0.00
0.10
−
0.10
1.65
I
OL
= 4 mA
−
0.80
0.24
−
0.24
2.30
I
OL
= 8 mA
−
0.10
0.30
−
0.30
3.00
I
OL
= 16 mA
−
0.15
0.40
−
0.40
3.00
I
OL
= 24 mA
−
0.22
0.55
−
0.55
4.50
I
OL
= 32 mA
−
0.22
0.55
−
0.55
I
IN
Input Leakage Current
1.65 to 5.50
V
IN
= 5.5 V, GND
−
−
±
1
−
±
10
m
A
I
OFF
Power Off Leakage Current
0
V
IN
or V
OUT
= 5.5 V
−
−
1
−
10
m
A
I
CC
Quiescent Supply Current
1.65 to 5.50
V
IN
= 5.5 V, GND
−
−
2
−
20
m
A
NC7SZ08
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5
AC ELECTRICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
T
A
= +25
°
C
T
A
= −40 to +85
°
C
Unit
Min
Typ
Max
Min
Max
tPLH, tPHL Propagation Delay
(Figure 4, 5)
1.65
CL = 15 pF,
RL = 1 MW
−
6.3
12.0
−
12.7
ns
1.80
−
5.2
10.0
−
10.5
2.50
±
0.20
−
3.4
7.0
−
7.5
3.30
±
0.30
−
2.6
4.7
−
5.0
5.00
±
0.50
−
2.2
4.1
−
4.4
3.30
±
0.30
CL = 50 pF,
RL = 500 W
−
3.3
5.2
−
5.5
5.00
±
0.50
−
2.7
4.5
−
4.8
C
IN
Input Capacitance
0.00
−
4
−
−
−
pF
CPD Power Dissipation Capacitance
(Note 2) (Figure 6)
3.30
−
20
−
−
−
pF
5.00
−
25
−
−
−
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
Figure 4. AC Test Circuit Figure 5. AC Waveforms
A
VCC
Figure 6. ICCD Test Circuit
VCC
CL*R
L
INPUT OUTPUT
INPUT
NOTE:
3. CL includes load and stray capacitance.
4. Input PRR = 10 MHz tw = 500 ns.
NOTE:
5. Input = A C Waveform; tr = t f = 1.8 ns;
PRR = 10 MHz; Duty Cycle = 50%.
NC7SZ08
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6
ORDERING INFORMATION
Part Number
Top Mark
Packages
Shipping†
NC7SZ08M5X
7Z08
SC−74A
3000 / Tape & Reel
NC7SZ08P5X
Z08
SC−88A
3000 / Tape & Reel
NC7SZ08L6X
GG
SIP6, MicroPak
5000 / Tape & Reel
NC7SZ08FHX
GG
UDFN6, MicroPak2
5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other
countries.
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON13590G
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
SIP6 1.45X1.0
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
SC−74A
CASE 318BQ
ISSUE B
DATE 18 JAN 2018
SCALE 2:1
GENERIC
MARKING DIAGRAM*
1
5
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM MIN MAX
MILLIMETERS
D
E1
A0.90 1.10
b0.25 0.50
e0.95 BSC
A1 0.01 0.10
c0.10 0.26
L0.20 0.60
M0 10
E2.50 3.00
123
54
E
D
E1
b
A
c
__
0.20
5X
CAB
CSEATING
PLANE
L
M
DETAIL A
TOP VIEW
SIDE VIEW
A
B
END VIEW
1.35 1.65
2.85 3.15
2.40
0.70
5X
DIMENSIONS: MILLIMETERS
RECOMMENDED
0.95
PITCH
1.00
5X
e
A1
0.05
DETAIL A
XXX MG
G
XXX = Specific Device Code
M = Date Code
G= Pb−Free Package
(Note: Microdot may be in either location)
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON66279G
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
SC−74A
© Semiconductor Components Industries, LLC, 2018 www.onsemi.com
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
1.80 2.200.071 0.087
INCHES
B1.15 1.350.045 0.053
C0.80 1.100.031 0.043
D0.10 0.300.004 0.012
G0.65 BSC0.026 BSC
H--- 0.10---0.004
J0.10 0.250.004 0.010
K0.10 0.300.004 0.012
N0.20 REF0.008 REF
S2.00 2.200.079 0.087
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
B0.2 (0.008) MM
12 3
45
A
G
S
D 5 PL
H
C
N
J
K
−B−
STYLE 3:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
STYLE 4:
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
XXXMG
G
XXX = Specific Device Code
M = Date Code
G= Pb−Free Package
GENERIC MARKING
DIAGRAM*
STYLE 8:
PIN 1. CATHODE
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
DATE 17 JAN 2013
SCALE 2:1
(Note: Microdot may be in either location)
ǒmm
inchesǓ
SCALE 20:1
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
SOLDER FOOTPRINT
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASB42984B
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
SC−88A (SC−70−5/SOT−353)
© Semiconductor Components Industries, LLC, 2018 www.onsemi.com
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DATE 31 AUG 2016
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON13593G
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
UDFN6 1.0X1.0, 0.35P
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
www.onsemi.com
1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
TECHNICAL SUPPORT
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Phone: 011 421 33 790 2910
LITERATURE FULFILLMENT:
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For additional information, please contact your local Sales Representative
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