CD74HC14M96**AO-ASTEC - TEXAS INSTRUMENTS

1. Product profile

1.1 General description

The device is designed to protect high-speed interfaces such as USB 2.0, Ethernet and

Digital Visual Interface (DVI) against ElectroStatic Discharge (ESD).

The device includes four hig h-l evel ESD protection diod e structur es for hi gh-spee d sign al

lines and is encapsulated in a leadless ultra small DFN1410-6 (SOT886) plastic package.

Special diode configuration protect s all signal lines and offers ultra low line capacitance of

only 1 pF. The rail-to-rail diodes are connected to the Zener diode which allows ESD

protection to be independent of supply voltage.

1.2 Features and benefits

System ESD protection for high-speed data lines such as USB 2.0, Ethernet and DVI

All signal lines with integrated rail-to-rail clamping diodes for downstream

ESD protection of 8 kV according to IEC 61000-4-2, level 4

Line capacitance of only 1 pF for each channel

Leadless ultra small DFN1410-6 package: 1 1.45 0.5 mm; pitch 0.5 mm

1.3 Applications

The device is designed for high-speed receiver and transmitter port protection:

Mobile phones, smartphones and handsets

TVs and monitors

DVD recorders and players

Notebooks, mother boards, graphic cards and ports

Set-top boxes and game consoles

IP4221CZ6-S

ESD protection for high-speed interfaces

Rev. 2 — 13 December 2012 Product data sheet

XSON6

Product data sheet Rev. 2 — 13 December 2012 2 of 12

NXP Semiconductors IP4221CZ6-S

ESD protection for high-speed interfaces

2. Pinning information

3. Ordering information

4. Marking

5. Limiting values

[1] All pins to ground.

Table 1. Pinning

Pin Symbol Description Simplified outline Graphic symbol

1 I/O 1 ESD protection

2 GND ground

3 I/O 2 ESD protection

4 I/O 3 ESD protection

CC supply voltage

6 I/O 4 ESD protection

Transparent

top view

456

321

001aag273

12 3

654

Table 2. Orde ring information

Type number Package

Name Description Version

IP4221CZ6-S DFN1410-6 plastic extremely thin small outline package;

no leads; 6 terminals; body 1 1.45 0.5 mm SOT886

Table 3. Marking co des

Type number Marking code

IP4221CZ6-S 1S

Ta ble 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VIinput voltage 0.5 +5.5 V

VESD electrostatic discharge

voltage IEC 61000-4-2, level 4;

contact discharge [1] 8+8kV

Tstg storage temperature 55 +125 C

Tamb ambient temperature 40 +85 C

Product data sheet Rev. 2 — 13 December 2012 3 of 12

NXP Semiconductors IP4221CZ6-S

ESD protection for high-speed interfaces

6. Characteristics

[1] This parameter is guaranteed by design.

[2] Pins 1, 3, 4 and 6 are measured to ground.

[3] All pins measured to ground (pin 2).

[4] Measured from pin 5 to pin 2.

7. Application information

7.1 USB 1.1 and 2.0 protection

Table 5. Characteristics

Tamb =25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

C(I/O-GND) input/output to ground

capacitance VI= 0 V; f = 1 MHz;

VCC =3V [1][2] -11.2pF

IRM reverse leakage current VI=3V [3][2] - - 100 nA

VBRzd Zener diode breakdown

voltage II=1mA [4] 6- 9V

VFforward voltage Itest =10mA - 0.7 - V

Each device is capable to protect USB data lines and VBUS supply.

Fig 1. Typical application for USB ESD protection

001aah371

VBUS

USB

PORT

USB 2.0/

IEEE 1394

CONTROLLER

DAT+

DAT−

GND

VBUS

USB

PORT

DAT+

DAT−

DAT+

DAT−

DAT+

DAT−

GND

Product data sheet Rev. 2 — 13 December 2012 4 of 12

NXP Semiconductors IP4221CZ6-S

ESD protection for high-speed interfaces

7.2 USB On-The-GO (OTG) protection

7.3 Universal SIM card protection

The device is capable to protect USB data lines, VBUS supply and ID pin.

Fig 2. Typical application for USB OTG ESD protection

001aag051

VBUS

DAT+

USB OTG

RECEPTACLE

CARKIT

DAT−

GND

Shld GND

mini B receptacle mini A receptacle

to phone

The device also protects VCC.

Fig 3. Typical application for universal SIM card ESD prot ection

001aag052

I/O

CLOCK

RESET

GND

SIM

Product data sheet Rev. 2 — 13 December 2012 5 of 12

NXP Semiconductors IP4221CZ6-S

ESD protection for high-speed interfaces

7.4 IEEE 1394a/b protection

Fig 4. Typical application for IEEE 1394a/b ESD protection

001aag050

1 MΩ

56 Ω

56 Ω56 Ω

56 Ω

5 kΩ1 nF 10 nF

220 pF

TPB+

TPB−

TPA+

IEEE 1394

PHYSICAL

LAYER

TPA−

BUS PWR

TPB+

GND

Shld2

TPB−

TPA+

TPA−

PWR

Shld1

1394

CONNECTOR

TPBIAS

Product data sheet Rev. 2 — 13 December 2012 6 of 12

NXP Semiconductors IP4221CZ6-S

ESD protection for high-speed interfaces

7.5 Gigabit Ethernet transceiver protection

Fig 5. Typical application for gigabit Ethernet transceiver ESD protection

001aag053

TPOPD

TPOND

TPOPC

TPONC

GIGABIT

ETHERNET

TRANSCEIVER

QUAD

TRANSFORMER RJ45

TPOPB

TPONB

TPOPA

TPONA

Product data sheet Rev. 2 — 13 December 2012 7 of 12

NXP Semiconductors IP4221CZ6-S

ESD protection for high-speed interfaces

7.6 Universal microSD/TransFlash and SD memory card protection

8. Package outline

Fig 6. Typical application for universal microSD/TransFlash and SD memory card ESD

protection

001aag054

DAT3/CD

CMD

CLK

VCC

GND

TRANSFLASH

DAT2

DAT1

DAT0

Fig 7. Package outline DFN1410-6 (SOT886)

04-07-22Dimensions in mm

0.25

0.17

0.40

0.32 0.35

0.27

0.5

0.6

1.05

0.95

1.5

1.4 0.5

0.50

max 0.04

max

Product data sheet Rev. 2 — 13 December 2012 8 of 12

NXP Semiconductors IP4221CZ6-S

ESD protection for high-speed interfaces

9. Packing information

[1] For further information and the availability of packing methods, see Section 13.

[2] T1: normal taping

[3] T4: reverse taping

10. Soldering

Ta ble 6. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code. [1]

Type number Package Description Packing quantity

5000

IP4221CZ6-S DFN1410-6

(SOT886) 4 mm pitch, 8 mm tape and reel; T1 [2] -115

4 mm pitch, 8 mm tape and reel; T4 [3] -132

Fig 8. Reflow soldering footprint DFN1410-6 (SOT886)

sot886_fr

solder resist

occupied area

solder paste = solderland

Dimensions in mm

0.425

(6×)

1.250

0.675

1.700

0.325

(6×)

0.270

(6×)

0.370

(6×)

0.500

Product data sheet Rev. 2 — 13 December 2012 9 of 12

NXP Semiconductors IP4221CZ6-S

ESD protection for high-speed interfaces

11. Revision history

Table 7. Revision history

Document ID Release date Data sheet status Change notice Supersedes

IP4221CZ6-S v. 2 20121213 Product data sheet - IP4221CZ6-S v. 1

Modifications: •Section 1 “Product profile”: updated

•Section 4 “Marking”: added

•Section 5 “Limiting values”: Tamb added

•Recommended operating conditions: removed

•Table 5 “Characteristics”: updated

•Section 7 “Application information”: updated

•Section 8 “Package outline”: drawing replaced with minimized package outline drawing

•Section 10 “Soldering”: updated

•Section 12 “Legal information”: updated

IP4221CZ6-S v. 1 20080429 Product data sheet - -

Product data sheet Rev. 2 — 13 December 2012 10 of 12

NXP Semiconductors IP4221CZ6-S

ESD protection for high-speed interfaces

12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond tho se described in the

Product data sheet.

12.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect , incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconduct ors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, lif e-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe propert y or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Develop ment This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 2 — 13 December 2012 11 of 12

NXP Semiconductors IP4221CZ6-S

ESD protection for high-speed interfaces

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in au tomotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and st andards, customer

(a) shall use the product without NXP Semicond uctors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed produ ct cl aims resulting from custome r design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

12.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors IP4221CZ6-S

ESD protection for high-speed interfaces

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 13 December 2012

Document identifier: IP4221CZ6-S

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

14. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Application information. . . . . . . . . . . . . . . . . . . 3

7.1 USB 1.1 and 2.0 protection . . . . . . . . . . . . . . . 3

7.2 USB On-The-GO (OTG) protection . . . . . . . . . 4

7.3 Universal SIM card protection. . . . . . . . . . . . . . 4

7.4 IEEE 1394a/b protection. . . . . . . . . . . . . . . . . . 5

7.5 Gigabit Ethernet transceiver protection . . . . . . 6

7.6 Universal microSD/TransFlash and SD memory

card protection . . . . . . . . . . . . . . . . . . . . . . . . . 7

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

9 Packing information . . . . . . . . . . . . . . . . . . . . . 8

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13 Contact information. . . . . . . . . . . . . . . . . . . . . 11

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12