© 2009 Microchip Technology Inc. DS80267C-page 1
PIC18F2480/2580/4480/4580
Clarifications/Corrections to the Data
Sheet
In the PIC18F2480/2580/4480/4580 Device Data
Sheet (D S39637C), the f ollowin g clarifi cations and cor-
rections should be noted. Any silicon issues related to
this device will reported in a separate silicon errata.
Please check the Microchip web site for any existing
issues.
1. Module: Enhanced Capture/Compare
PWM (ECCP1)
The following note has been added to the end of
Section 16.4.6 “Programmable Dead-Band
Delay”.
2. Module: Master Synchronous Serial P ort
(MSSP) – Serial Peripheral
Interface (SPI)
The following note has been added to the end of
Section 17.3.3 “Enabling SPI I/O”.
Note: If the dead-band delay value is increased
after the dead-band time ha s elapsed, that
new value takes effect immediately. This
happens even if the PWM pulse is high
and can appear to be a glitch.
Dead-band values must be changed
during the dead-band time or before
ECCP is active.
Note: When the module is enabled and in
Master mode (CKE, SSPSTAT<6> = 1), a
small glitch of approximately half a TCY
may be seen on the SCK pin. To resolve
this, keep the SCK pin as an input while
setting SPEN. Then, configure the SCK
pin as an outpu t (TRISC< 3> = 0).
PIC18F2480/2580/4480/4580 Data Sheet Errata
PIC18F2480/2580/4480/4580
DS80267C-page 2 © 2009 Microchip Technology Inc.
3. Module: Electrical Characteristics (DC
Supply Voltage)
Note 2 is added to Section 27.1 “DC Character-
istics: Supply Voltage” pertaining to parameter
D005.
27.1 DC Characteristi cs: Supply Voltage
PIC18F2480/2580/4480/4580 (Industrial, Extended)
PIC18LF2480/2580/4480/4580 (Industrial)
PIC18LF2480/2580/4480/4580
(Industrial) Stand ard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
PIC18F2480/2580/4480/4580
(Industrial, Extended)
Stand ard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Symbol Characteristic Min Typ Max Units Conditions
VDD Supply Voltage
D001 PIC18LF2X80/4X80 2.0 5.5 V
PIC18F2X80/4X80 4.2 5.5 V
D002 VDR RAM Data Retention
Voltage(1) 1.5 V
D003 VPOR VDD Start Voltage
to ensure internal
Power-on Reset signal
0.7 V See section on Power-on Reset for details
D004 SVDD VDD Rise Rate
to ensure internal
Power-on Reset signal
0.05 V/ms See section on Power-on Reset for details
VBOR Brown-out Reset Voltage
D005 PIC18LF2X80/4X80
BORV1:BORV0 = 11 2.00 2.05 2.16 V
BORV1:BORV0 = 10 2.65 2.79 2.93 V
D005 All Devices
BORV1:BORV0 = 01(2) 4.11 4.33 4.55 V
BORV1:BORV0 = 00 4.36 4.59 4.82 V
Legend: Shading of rows is to assist in readability of the table.
Note 1: This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM data.
2: With BOR enabled, full-speed operation (FOSC = 40 MHz) is supported until a BOR occurs . This is valid, although VDD
may be below the minimum voltage for this frequency.
© 2009 Microchip Technology Inc. DS80267C-page 3
PIC18F2480/2580/4480/4580
REVISION HISTORY
Rev A Document (03/2006)
Origina l v ers ion of th is doc um en t. In clu des D ata Sheet
Clarification issue 1 (Flash Program Memory – Erase
Block), 2 (Flash Program Memory – Pointer Boundar-
ies), 3 (Figure 6-2: Table Write Operation), 4
(Section 6.2.4 Table Pointer Boundaries) 5 (Section 6.5
Writing to Flash Program Memory) 6 (Section 6.5.1
Flash Program Memory Write Sequence) and 7
(Example 6-3: Writing to Flash Program Memory).
Rev B Document (11/2007)
Removed Data Sheet Clarification issues 1-7 (Flash
Program Memory) and added new issues 1 (ECCP1)
and 2 (MSSP – SPI).
Rev C Document (2/2009)
Added Data Sheet Clarification issue 3 (Electrical
Characteristics – DC Supply Voltage).
PIC18F2480/2580/4480/4580
DS80267C-page 4 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS80267C-page 5
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Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
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Company are registered trademarks of Microchip Technology
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ECONOMONITOR, FanSense, In-Circuit Serial
Prog ra m ming , ICSP, ICE PIC, Min d i , M iWi , MPA SM, MPL A B
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
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© 2009, Microchip Technology Incorporated, Printed in the
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Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that it s family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS80267C-page 6 © 2009 Microchip Technology Inc.
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