TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 D D D D D D D D D D TLC080 D, DGN OR P PACKAGE (TOP VIEW) Wide Bandwidth . . . 10 MHz High Output Drive - IOH . . . 57 mA at VDD - 1.5 - IOL . . . 55 mA at 0.5 V High Slew Rate - SR+ . . . 16 V/s - SR- . . . 19 V/s Wide Supply Range . . . 4.5 V to 16 V Supply Current . . . 1.9 mA/Channel Ultra-Low Power Shutdown Mode IDD . . . 125 A/Channel Low Input Noise Voltage . . . 8.5 nVHz Wide VICR . . . 0 to VDD - 1 Input Offset Voltage . . . 60 V Ultra-Small Packages - 8 or 10 Pin MSOP (TLC080/1/2/3) NULL IN - IN + GND 1 8 2 7 3 6 4 5 SHDN VDD OUT NULL description Introducing the first members of TI's new BiMOS general-purpose operational amplifier family--the TLC08x. The BiMOS family concept is simple: provide an upgrade path for BiFET users who are moving away from dual-supply to single-supply systems and demand higher ac and dc performance. With performance rated from 4.5 V to 16 V across commercial (0C to 70C) and an extended industrial temperature range (-40C to 125C), BiMOS suits a wide range of audio, automotive, industrial and instrumentation applications. Familiar features like offset nulling pins, and new features like MSOP PowerPAD packages and shutdown modes, enable higher levels of performance in a multitude of applications. Developed in TI's patented LBC3 BiCMOS process, the new BiMOS amplifiers combine a very high input impedance, low-noise CMOS front end with a high-drive Bipolar output stage--thus providing the optimum performance features of both. AC performance improvements over the TL08x BiFET predecessors include a bandwidth of 10 MHz (an increase of 300%) and voltage noise of 8.5 nV/Hz (an improvement of 60%). DC improvements include an ensured VICR that includes ground, a factor of 4 reduction in input offset voltage down to 1.5 mV (maximum) in the standard grade, and a power supply rejection improvement of greater than 40 dB to 130 dB. Added to this list of impressive features is the ability to drive 50-mA loads comfortably from an ultra-small-footprint MSOP PowerPAD package, which positions the TLC08x as the ideal high-performance general-purpose operational amplifier family. FAMILY PACKAGE TABLE PACKAGE TYPES NO. OF CHANNELS MSOP PDIP SOIC TSSOP TLC080 1 8 8 8 -- TLC081 1 8 8 8 -- TLC082 2 8 8 8 -- -- TLC083 2 10 14 14 -- Yes TLC084 4 -- 14 14 20 -- TLC085 4 -- 16 16 20 Yes DEVICE SHUTDOWN UNIVERSAL EVM BOARD Yes Refer to the EVM Selection Guide (Lit# SLOU060) Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments Incorporated. Copyright 1999, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 TLC080 and TLC081 AVAILABLE OPTIONS PACKAGED DEVICES TA 0C to 70C - 40C to 125C PACKAGED DEVICES SMALL OUTLINE (D) SMALL OUTLINE (DGN) SYMBOL PLASTIC DIP (P) TLC080CD TLC081CD TLC080CDGN TLC081CDGN xxTIACW xxTIACY TLC080CP TLC081CP TLC080ID TLC081ID TLC080IDGN TLC081IDGN xxTIACX xxTIACZ TLC080IP TLC081IP -- -- -- -- TLC080AID TLC081AID TLC080AIP TLC081AIP This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLC080CDR). Chip forms are tested at TA = 25C only. TLC082 and TLC083 AVAILABLE OPTIONS PACKAGED DEVICES TA 0C to 70C - 40C to 125C SMALL OUTLINE (D) SYMBOL PLASTIC DIP (N) PLASTIC DIP (P) (DGN) SYMBOL (DGQ) TLC082CD TLC083CD TLC082CDGN -- xxTIADZ -- -- TLC083CDGQ -- xxTIAEB -- TLC083CN TLC082CP -- TLC082ID TLC083ID TLC082IDGN -- xxTIAEA -- -- TLC083IDGQ -- xxTIAEC -- TLC083IN TLC082IP -- TLC082AID TLC083AID -- -- -- -- -- -- -- -- -- TLC083AIN TLC082AIP -- MSOP This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLC082CDR). Chip forms are tested at TA = 25C only. xx represents the device date code. TLC084 and TLC085 AVAILABLE OPTIONS PACKAGED DEVICES TA 0C to 70C - 40C to 125C SMALL OUTLINE (D) PLASTIC DIP (N) TSSOP (PWP) TLC084CD TLC085CD TLC084CN TLC085CN TLC084CPWP TLC085CPWP TLC084ID TLC085ID TLC084IN TLC085IN TLC084IPWP TLC085IPWP TLC084AID TLC085AID TLC084AIN TLC085AIN TLC084AIPWP TLC085AIPWP This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLC084CDR). Chip forms are tested at TA = 25C only. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 TLC08x PACKAGE PINOUTS TLC080 D, DGN OR P PACKAGE (TOP VIEW) NULL IN - IN + GND 1 8 2 7 3 6 4 5 SHDN VDD OUT NULL TLC081 D, DGN OR P PACKAGE (TOP VIEW) NULL IN - IN + GND TLC083 DGQ PACKAGE (TOP VIEW) 1OUT 1IN - 1IN+ GND 1SHDN 1 2 3 4 5 10 9 8 7 6 VDD 2OUT 2IN - 2IN+ 2SHDN 1OUT 1IN - 1IN+ GND NC 1SHDN NC TLC084 PWP PACKAGE 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 8 2 7 3 6 4 5 NC VDD OUT NULL 1OUT 1IN - 1IN + GND 1OUT 1IN - 1IN+ VDD 2IN+ 2IN - 2OUT 1/2SHDN 8 2 7 3 6 4 5 TLC084 D OR N PACKAGE (TOP VIEW) (TOP VIEW) 1 14 2 13 3 12 4 11 5 10 6 9 7 8 1OUT 1IN - 1IN+ VDD 2IN+ 2IN - 2OUT VDD 2OUT 2IN - 2IN+ NC 2SHDN NC 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VDD 2OUT 2IN - 2IN+ 4OUT 4IN - 4IN+ GND 3IN+ 3IN - 3OUT TLC085 PWP PACKAGE (TOP VIEW) (TOP VIEW) 4OUT 4IN- 4IN+ GND 3IN+ 3IN- 3OUT NC NC NC 1 TLC083 D OR N PACKAGE TLC085 D OR N PACKAGE (TOP VIEW) 1OUT 1IN- 1IN+ VDD 2IN+ 2IN- 2OUT NC NC NC 1 TLC082 D, DGN, OR P PACKAGE (TOP VIEW) 4OUT 4IN - 4IN+ GND 3IN + 3IN- 3OUT 3/4SHDN 1OUT 1IN- 1IN+ VDD 2IN+ 2IN- 2OUT 1/2SHDN NC NC 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 4OUT 4IN- 4IN+ GND 3IN+ 3IN- 3OUT 3/4SHDN NC NC NC - No internal connection POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 V Differential input voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDD Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating free-air temperature range, TA: C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0C to 70C I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 40C to 125C Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 65C to 150C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE: All voltage values, except differential voltages, are with respect to GND . DISSIPATION RATING TABLE PACKAGE JC (C/W) JA (C/W) TA 25C POWER RATING D (8) 38.3 176 710 mW D (14) 26.9 122.3 1022 mW D (16) 25.7 114.7 1090 mW DGN (8) 4.7 52.7 2.37 W DGQ (10) 4.7 52.3 2.39 W N (14, 16) 32 78 1600 mW P (8) 41 104 1200 mW PWP (20) 1.40 26.1 4.79 W recommended operating conditions Supply voltage voltage, VDD Single supply Split supply Common-mode input voltage range, VICR Operating free-air free air temperature, temperature TA 4 C-suffix I-suffix POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MIN MAX 4.5 16 2.25 8 GND 0 VDD-1 70 - 40 125 UNIT V V C TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 electrical characteristics at specified free-air temperature, VDD = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS TLC080/1/2/3 TLC080/1/2/3A VIO Input offset voltage VDD = 5 V, V VIC = 2.5, VO = 2.5, RS = 50 TLC084/5 TLC084/5A VIO Temperature coefficient of input offset voltage IIO Input offset current TA 25C MIN Input bias current VDD = 5 V V, VIC = 2.5,, VO = 2.5, RS = 50 CMRR > 70 dB, TLC08XC TLC08XI 20 Full range TLC08XC RS = 50 RS = 50 IOH = - 20 mA VIC = 2.5 V IOH = - 35 mA IOH = - 50 mA IOL = 1 mA IOL = 20 mA VOL Low-level output voltage VIC = 2.5 V IOL = 35 mA 390 Full range Short circuit output current Short-circuit IO Output current 1900 25C 390 Full range 1400 2000 1.9 V/C 50 100 Full range pA 700 3 50 100 Full range pA 700 25C 0 to 3.5 Full range 0 to 3.5 25C 4.1 Full range 3.9 25C 3.7 Full range 3.5 25C 3.4 Full range 3.2 25C 3.2 -40C to 85C V 3000 V 4.3 4 V 3.8 3.6 3 25C 0.18 Full range 25C 25C 0.25 0.35 0.35 Full range 0.39 0.45 0.43 Full range 25C IOL = 50 mA IOS 750 1000 25C 25C IOH = - 1 mA High-level output voltage 1000 UNIT 1500 25C Common-mode input voltage g range CMRR > 52 dB, VOH 60 12 1.2 TLC08XI VICR MAX Full range 25C IIB TYP 0.55 V 0.7 0.45 -40C to 85C 0.63 0.7 Sourcing 25C 100 Sinking 25C 100 VOH = 1.5 V from positive rail VOL = 0.5 V from negative rail 25C 57 25C 55 mA mA Full range is 0C to 70C for C suffix and - 40C to 125C for I suffix. If not specified, full range is - 40C to 125C. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 electrical characteristics at specified free-air temperature, VDD = 5 V (unless otherwise noted) (continued) PARAMETER TEST CONDITIONS TA MIN TYP 25C 100 120 Full range 100 MAX UNIT AVD Large-signal g g differential voltage g amplification ri(d) Differential input resistance CIC Common-mode input capacitance f = 10 kHz zo Closed-loop output impedance f = 10 kHz, AV = 10 CMRR Common mode rejection ratio Common-mode VIC = 0 to 3 V, V RS = 50 kSVR Supply y voltage g rejection j ratio (VDD /VIO) VDD = 4.5 V to 16 V,, No load VIC = VDD /2,, IDD Supply y current (per channel) VO = 2.5 2 5 V, V No load Turnon voltage level Relative to GND 25C 1.41 V Turnoff voltage level Relative to GND 25C 1.4 V Supply current in shutdown mode (per channel) (TLC080, TLC083, TLC085) 25C 125 SHDN 1.45 1 45 V V(ON) V(OFF) IDD(SHDN) VO(PP) = 3 V V, RL = 10 k 25C 1000 G 25C 22.9 pF 25C 0.25 25C 100 Full range 100 25C 95 Full range 95 25C POST OFFICE BOX 655303 Full range * DALLAS, TEXAS 75265 140 dB 130 1.8 Full range Full range is 0C to 70C for C suffix and - 40C to 125C for I suffix. If not specified, full range is - 40C to 125C. 6 dB dB 2.5 3.5 200 250 mA A TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 operating characteristics at specified free-air temperature, VDD = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS SR+ Positive slew rate at unity gain VO(PP) = 0.8 V,, RL = 10 k CL = 50 pF,, SR SR- Negative slew rate at unity gain VO(PP) = 0.8 V,, RL = 10 k CL = 50 pF,, Vn Equivalent input noise voltage In THD + N t(on) t(off) ts m TA 25C MIN TYP 10 16 Full range 9.5 25C 12.5 Full range 19 10 f = 100 Hz 25C 12 f = 1 kHz 25C 8.5 Equivalent input noise current f = 1 kHz 25C 0.6 Total harmonic distortion plus noise VO(PP) = 3 V, RL = 10 k and 250 , f = 1 kHz AV = 1 AV = 10 AV = 100 V/s nV/Hz fA /Hz 0.085% 25C 0.15 s 25C 1.3 s 25C 10 MHz Gain-bandwidth product f = 10 kHz, RL = 10 k V(STEP)PP = 1 V, AV = -1,, CL = 10 pF, RL = 10 k 0.1% V(STEP)PP = 1 V, AV = -1,, CL = 47 pF, RL = 10 k 0.1% 0.18 0.01% 0.39 RL = 10 k, CL = 50 pF RL = 10 k, CL = 0 pF RL = 10 k, CL = 50 pF RL = 10 k, CL = 0 pF Gain margin V/s 0.012% RL = 10 k Phase margin UNIT 0.002% 25C Amplifier turnon time Amplifier turnoff time Settling time MAX 0.18 0.01% 0.39 s 25C 25C 25C 32 40 2.2 dB 3.3 Full range is 0C to 70C for C suffix and - 40C to 125C for I suffix. If not specified, full range is - 40C to 125C. Disable time and enable time are defined as the interval between application of the logic signal to SHDN and the point at which the supply current has reached half its final value. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 electrical characteristics at specified free-air temperature, VDD = 12 V (unless otherwise noted) PARAMETER TEST CONDITIONS TLC080/1/2/3 TLC080/1/2/3A VIO Input offset voltage VDD = 12 V VIC = 6, VO = 6, RS = 50 TLC084/5 TLC084/5A VIO Temperature coefficient of input offset voltage IIO Input offset current TA 25C MIN Input bias current VDD = 12 V VIC = 6,, VO = 6, RS = 50 CMRR > 70 dB TLC08xC TLC08xI 20 Full range TLC08xC RS = 50 RS = 50 IOH = - 20 mA VIC = 6 V IOH = - 35 mA IOH = - 50 mA IOL = 1 mA IOL = 20 mA VOL Low-level output voltage VIC = 6 V IOL = 35 mA 390 Full range Short circuit output current Short-circuit IO Output current 25C 390 Full range 1.5 1400 V/C 50 100 Full range pA 700 25C 0 to 10.5 Full range 0 to 10.5 25C 11.1 V 11.2 11 25C 10.8 Full range 10.7 25C 10.6 Full range 10.3 25C 10.3 -40C to 85C 10.2 25C 11 10.5 0.17 Full range 25C 0.25 0.35 0.35 Full range 25C V 10.7 0.45 0.5 0.4 Full range 0.52 V 0.6 0.45 -40C to 85C 0.6 0.65 25C 150 Sinking 25C 150 VOH = 1.5 V from positive rail VOL = 0.5 V from negative rail 25C 57 25C 55 * DALLAS, TEXAS 75265 pA 700 2 Sourcing POST OFFICE BOX 655303 50 100 Full range Full range V 2000 Full range is 0C to 70C for C suffix and - 40C to 125C for I suffix. If not specified, full range is - 40C to 125C. 8 1900 3000 25C IOL = 50 mA IOS 750 1000 25C 25C IOH = - 1 mA High-level output voltage 1000 UNIT 1500 25C Common-mode input voltage g range CMRR > 52 dB VOH 60 12 1.2 TLC08xI VICR MAX Full range 25C IIB TYP mA mA TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 electrical characteristics at specified free-air temperature, VDD = 12 V (unless otherwise noted) (continued) PARAMETER TEST CONDITIONS TA MIN TYP 25C 120 140 Full range 120 MAX UNIT AVD Large-signal g g differential voltage g amplification ri(d) Differential input resistance CIC Common-mode input capacitance f = 10 kHz zo Closed-loop output impedance f = 10 kHz, AV = 10 CMRR Common mode rejection ratio Common-mode VIC = 0 to 10 V V, RS = 50 kSVR Supply y voltage g rejection j ratio (VDD /VIO) VDD = 4.5 V to 16 V,, No load VIC = VDD /2,, IDD Supply y current (per channel) VO = 7 7.5 5V V, No load Turnon voltage level Relative to GND 25C 1.39 V Turnoff voltage level Relative to GND 25C 1.38 V Supply current in shutdown mode (TLC080, (TLC080 TLC083, TLC083 TLC085) (per channel) 25C 125 SHDN 1.45 1 45 V V(ON) V(OFF) IDD(SHDN) VO(PP) = 8 V V, RL = 10 k dB 25C 1000 G 25C 21.6 pF 25C 0.25 25C 100 Full range 100 25C 95 Full range 95 25C 140 130 1.9 Full range Full range dB dB 2.9 3.5 200 mA A 250 Full range is 0C to 70C for C suffix and - 40C to 125C for I suffix. If not specified, full range is - 40C to 125C. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 9 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 operating characteristics at specified free-air temperature, VDD = 12 V (unless otherwise noted) PARAMETER TEST CONDITIONS SR+ Positive slew rate at unity gain VO(PP) = 2 V,, RL = 10 k CL = 50 pF,, SR SR- Negative slew rate at unity gain VO(PP) = 2 V,, RL = 10 k CL = 50 pF,, Vn Equivalent input noise voltage In THD + N t(on) t(off) ts m TA 25C MIN TYP 10 16 Full range 9.5 25C 12.5 Full range 19 10 f = 100 Hz 25C 14 f = 1 kHz 25C 8.5 Equivalent input noise current f = 1 kHz 25C 0.6 Total harmonic distortion plus noise VO(PP) = 8 V, RL = 10 k and 250 , f = 1 kHz AV = 1 AV = 10 AV = 100 V/s nV/Hz fA /Hz 0.022% 25C 0.47 s 25C 2.5 s 25C 10 MHz Gain-bandwidth product f = 10 kHz, RL = 10 k V(STEP)PP = 1 V, AV = -1,, CL = 10 pF, RL = 10 k 0.1% V(STEP)PP = 1 V, AV = -1,, CL = 47 pF, RL = 10 k 0.1% 0.17 0.01% 0.29 RL = 10 k, CL = 50 pF RL = 10 k, CL = 0 pF RL = 10 k, CL = 50 pF RL = 10 k, CL = 0 pF Gain margin V/s 0.005% RL = 10 k Phase margin UNIT 0.002% 25C Amplifier turnon time Amplifier turnoff time Settling time MAX 0.17 0.01% 0.22 s 25C 25C 25C 37 42 3.1 dB 4 Full range is 0C to 70C for C suffix and - 40C to 125C for I suffix. If not specified, full range is - 40C to 125C. Disable time and enable time are defined as the interval between application of the logic signal to SHDN and the point at which the supply current has reached half its final value. 10 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 TYPICAL CHARACTERISTICS Table of Graphs FIGURE VIO IIO Input offset voltage vs Common-mode input voltage 1, 2 Input offset current vs Free-air temperature 3, 4 IIB VOH Input bias current vs Free-air temperature 3, 4 High-level output voltage vs High-level output current 5, 7 VOL Zo Low-level output voltage vs Low-level output current 6, 8 Output impedance vs Frequency 9 IDD PSRR Supply current vs Supply voltage 10 Power supply rejection ratio vs Frequency 11 CMRR Common-mode rejection ratio vs Frequency 12 Vn VO(PP) Equivalent input noise voltage vs Frequency 13 Peak-to-peak output voltage vs Frequency 14, 15 Crosstalk vs Frequency 16 Differential voltage gain vs Frequency 17, 18 Phase vs Frequency 17, 18 Phase margin vs Load capacitance 19, 20 Gain margin vs Load capacitance 21, 22 Gain-bandwidth product vs Supply voltage SR Slew rate vs Supply voltage vs Free-air temperature 24 25, 26 THD + N Total harmonic distortion plus noise vs Frequency 27, 28 vs Peak-to-peak output voltage 29, 30 Large-signal follower pulse response vs Time 31, 32 Small-signal follower pulse response vs Time 33 Large-signal inverting pulse response vs Time 34, 35 Small-signal inverting pulse response vs Time Shutdown forward isolation vs Frequency 37, 38 Shutdown reverse isolation vs Frequency 39, 40 m Shutdown supply current 23 36 vs Supply voltage 41 vs Free-air temperature 42 Shutdown pulse 43, 44 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 11 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 TYPICAL CHARACTERISTICS INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE 1500 VDD = 5 V TA = 25 C 600 400 200 0 -200 -400 1100 900 700 500 300 100 -100 -300 -600 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -500 0 VICR - Common-Mode Input Voltage - V 1 2 3 4 8 9 10 11 12 IIO -20 -40 -60 -80 -100 IIB -120 VDD= 12V -140 IIO -50 -100 -55 -40 -25 -10 5 20 35 50 65 80 95 110 125 4.5 TA= 70C TA= 25C 4.0 TA= -40C 3.5 TA= 125C 3.0 2.5 11.0 TA= -40C TA= 25C 10.0 9.5 VDD=12 V 9.0 0.8 0.7 0.6 TA= 70C TA= 25C 0.5 TA= 125C 0.4 TA= -40C 0.3 0.2 0.1 5 10 15 20 25 30 35 40 45 50 IOH - High-Level Output Current - mA 0 5 10 15 20 25 30 35 40 45 50 IOL - Low-Level Output Current - mA Figure 5 Figure 6 LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT OUTPUT IMPEDANCE vs FREQUENCY 1000 0.9 0.8 TA= 125C 0.7 0.6 TA= 25C 0.5 TA= 70C 0.4 0.3 TA= -40C 0.2 0.1 100 VDD=5 & 12 V TA = 25C 10 AV = 100 1 AV = 1 0.10 AV = 10 VDD=12 V 0.0 10 15 20 25 30 35 40 45 50 IOH - High-Level Output Current - mA VDD=5 V 0.9 0 0 VOL - Low-Level Output Voltage - V TA= 125C TA= 70C LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 1.0 1.0 Figure 7 0 TA - Free-Air Temperature - C 2.0 12.0 5 IIB 50 Figure 3 VDD=5 V HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT 0 100 5.0 -160 -55 -40 -25 -10 5 20 35 50 65 80 95 110 125 10.5 150 VOL - Low-Level Output Voltage - V 0 11.5 200 HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT V OH - High-Level Output Voltage - V I IB / I IO - Input Bias and Input Offset Current - pA INPUT BIAS CURRENT AND INPUT OFFSET CURRENT vs FREE-AIR TEMPERATURE Figure 4 V OH - High-Level Output Voltage - V 7 VDD = 5 V 250 Figure 2 TA - Free-Air Temperature - C 12 6 300 VICR - Common-Mode Input Voltage - V Figure 1 20 5 Z o - Output Impedance - 800 VDD = 12 V TA = 25 C 1300 V IO - Input Offset Voltage - V V IO - Input Offset Voltage - V 1000 INPUT BIAS CURRENT AND INPUT OFFSET CURRENT vs FREE-AIR TEMPERATURE I IB / I IO - Input Bias and Input Offset Current - pA INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE 0 5 10 15 20 25 30 35 40 45 50 IOL - Low-Level Output Current - mA Figure 8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 0.01 100 1k 10k 100k f - Frequency - Hz Figure 9 1M 10M TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 TYPICAL CHARACTERISTICS SUPPLY CURRENT vs SUPPLY VOLTAGE TA= 25C TA= -40C 1.8 TA= 125C 1.6 TA= 70C 1.4 AV = 1 SHDN = VDD Per Channel 1.2 1 4 5 6 140 120 VDD = 12 V 100 80 60 40 VDD = 5 V 20 0 7 8 9 10 11 12 13 14 15 VDD - Supply Voltage - V 0 10 100 V O(PP) - Peak-to-Peak Output Voltage - V 25 20 VDD = 12 V 10 VDD = 5 V 5 0 10 100 1k 1M 10M 100 80 60 40 20 0 100 10k VDD=12 V 8 6 VDD=5 V 4 THD+N < =5% RL=600 TA = 25C 2 0 100k 10k 100k 1M f - Frequency - Hz f - Frequency - Hz Figure 13 10k 100k f - Frequency - Hz 1M 10M PEAK-TO-PEAK OUTPUT VOLTAGE vs FREQUENCY 12 10 1k Figure 12 PEAK-TO-PEAK OUTPUT VOLTAGE vs FREQUENCY 10M Figure 14 12 10 VDD=12 V 8 6 VDD=5 V 4 2 0 10k THD+N < =5% RL=10 k TA = 25C 100k 1M f - Frequency - Hz 10M Figure 15 CROSSTALK vs FREQUENCY 0 -20 -40 Crosstalk - dB Hz V n - Equivalent Input Noise Voltage - nV/ 30 15 100k VDD = 5 & 12 V TA= 25C 120 Figure 11 EQUIVALENT INPUT NOISE VOLTAGE vs FREQUENCY 35 10k 140 f - Frequency - Hz Figure 10 40 1k V O(PP) - Peak-to-Peak Output Voltage - V I DD - Supply Current - mA 2.0 CMRR - Common-Mode Rejection Ratio - dB PSRR - Power Supply Rejection Ratio - dB 2.4 2.2 COMMON-MODE REJECTION RATIO vs FREQUENCY POWER SUPPLY REJECTION RATIO vs FREQUENCY VDD= 5V and 12 V AV = 1 RL = 10 k VI(PP) = 2V For All Channels -60 -80 -100 -120 -140 -160 10 100 1k 10k 100k f - Frequency - Hz Figure 16 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 13 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 TYPICAL CHARACTERISTICS A VD - Different Voltage Gain - dB 70 60 -45 Gain Phase -90 30 -135 20 Phase - 50 40 10 0 -10 -20 1k VDD= 2.5V RL = 10 k CL = 0pF TA = 25C 100k 10k -180 1M 70 Gain 60 Phase 40 20 -135 10 0 -10 VDD = 6V RL = 10 k CL = 0pF TA = 25C PHASE MARGIN vs LOAD CAPACITANCE 25 Rnull = 50 Rnull = 20 VDD = 5 V RL = 10 k TA = 25C 30 Rnull = 100 25 Rnull = 20 15 VDD = 12 V RL = 10 k TA = 25C 10 5 0 10 Rnull = 50 1.5 1 VDD = 5 V RL = 10 k TA = 25C Rnull = 20 0 10 100 100 CL - Load Capacitance - pF Figure 19 Figure 20 Figure 21 GAIN BANDWIDTH PRODUCT vs SUPPLY VOLTAGE Rnull = 0 3 Rnull = 50 Rnull = 20 1.5 VDD = 12 V RL = 10k TA= 25C 0 10 100 CL - Load Capacitance - pF Figure 22 22 CL=11 pF 9.9 9.8 20 9.7 RL = 10 k 9.6 9.5 9.4 RL = 600 9.3 RL=600 & 10 k CL = 50pF AV = 1 21 TA=25C SR - Slew Rate - V/ s GBWP - Gain Bandwidth Product - MHz 3.5 2 SLEW RATE vs SUPPLY VOLTAGE 10.0 Rnull = 100 4 m - Phase Margin - dB 2 CL - Load Capacitance - pF 5 0.5 2.5 CL - Load Capacitance - pF 4.5 1 Rnull = 100 3 0.5 0 10 100 GAIN MARGIN vs LOAD CAPACITANCE 2.5 Rnull = 50 20 Rnull = 0 3.5 G - Gain Margin - dB m - Phase Margin m - Phase Margin 4 Rnull = 0 40 35 5 14 GAIN MARGIN vs LOAD CAPACITANCE 45 30 10 -225 100M 10M Figure 18 Rnull = 0 Rnull = 100 15 1M f - Frequency - Hz PHASE MARGIN vs LOAD CAPACITANCE 20 -180 100k 10k Figure 17 35 -90 30 f - Frequency - Hz 40 -45 50 -20 1k -225 100M 10M 0 80 0 80 A VD - Different Voltage Gain - dB DIFFERENTIAL VOLTAGE GAIN AND PHASE vs FREQUENCY Phase - DIFFERENTIAL VOLTAGE GAIN AND PHASE vs FREQUENCY 19 17 16 Slew Rate + 15 9.2 14 9.1 13 9.0 Slew Rate - 18 12 4 5 6 7 8 9 10 11 12 13 14 15 16 VDD - Supply Voltage - V Figure 23 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 4 5 6 7 8 9 10 11 12 13 14 15 16 VDD - Supply Voltage - V Figure 24 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 TYPICAL CHARACTERISTICS SLEW RATE vs FREE-AIR TEMPERATURE Slew Rate - 20 SR - Slew Rate - V/ s 15 Slew Rate + 10 15 Slew Rate + 10 VDD = 12 V RL=600 & 10 k CL = 50pF AV = 1 5 5 0 -55 -35 -15 5 25 45 65 85 105 125 TA - Free-Air Temperature - C 0 -55 -35 -15 5 25 45 65 85 105 125 TA - Free-Air Temperature - C Figure 25 0.1 Total Harmonic Distortion + Noise - % VDD = 12 V VO(PP) = 8 V RL = 10 k AV=100 0.01 AV=10 AV=1 10k 1k AV=1 0.001 100 1k 100k 10k 100k f - Frequency - Hz Figure 27 TOTAL HARMONIC DISTORTION PLUS NOISE vs PEAK-TO-PEAK OUTPUT VOLTAGE 10 10 VDD = 5 V AV = 1 f = 1 kHz 1 RL = 250 0.1 RL = 600 0.01 RL = 10 k 0.001 0.0001 0.25 0.75 1.25 1.75 2.25 2.75 3.25 3.75 VDD = 12 V AV = 1 f = 1 kHz 1 RL = 250 0.1 RL = 600 0.01 0.001 RL = 10 k 0.0001 0.5 2.5 4.5 6.5 8.5 10.5 VO(PP) - Peak-to-Peak Output Voltage - V VO(PP) - Peak-to-Peak Output Voltage - V Figure 28 Figure 29 Figure 30 LARGE SIGNAL FOLLOWER PULSE RESPONSE vs TIME LARGE SIGNAL FOLLOWER PULSE RESPONSE vs TIME SMALL SIGNAL FOLLOWER PULSE RESPONSE vs TIME VI (1 V/Div) VI (5 V/Div) VO (500 mV/Div) VDD = 5 V RL = 600 & 10 k CL = 8 pF TA = 25C 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 VI(100mV/Div) V O - Output Voltage - V V O - Output Voltage - V V O - Output Voltage - V AV=10 0.01 TOTAL HARMONIC DISTORTION PLUS NOISE vs PEAK-TO-PEAK OUTPUT VOLTAGE f - Frequency - Hz 0 AV=100 0.1 Figure 26 TOTAL HARMONIC DISTORTION PLUS NOISE vs FREQUENCY 0.001 100 VDD = 5 V VO(PP) = 2 V RL = 10 k Total Harmonic Distortion + Noise - % 20 SR - Slew Rate - V/ s 1 25 VDD = 5 V RL=600 & 10 k Slew Rate - CL = 50pF AV = 1 Total Harmonic Distortion + Noise - % 25 Total Harmonic Distortion + Noise - % TOTAL HARMONIC DISTORTION PLUS NOISE vs FREQUENCY SLEW RATE vs FREE-AIR TEMPERATURE VO (2 V/Div) VDD = 12 V RL = 600 & 10 k CL = 8 pF TA = 25C 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 t - Time - s t - Time - s Figure 31 Figure 32 POST OFFICE BOX 655303 2 * DALLAS, TEXAS 75265 VO(50mV/Div) VDD = 5 &12V RL = 600 &10 k CL = 8 pF TA = 25C 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.10 t - Time - s Figure 33 15 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 TYPICAL CHARACTERISTICS LARGE SIGNAL INVERTING PULSE RESPONSE vs TIME LARGE SIGNAL INVERTING PULSE RESPONSE vs TIME VI (5 V/div) VDD = 5 V RL = 600 & 10 k CL = 8 pF TA = 25C VI (100 mV/div) V O - Output Voltage - V V O - Output Voltage - V VI (2 V/div) V O - Output Voltage - V SMALL SIGNAL INVERTING PULSE RESPONSE vs TIME VDD = 12 V RL = 600 & 10 k CL = 8 pF TA = 25C VDD = 5 & 12 V RL = 600 & 10 k CL = 8 pF TA = 25C VO (50 mV/Div) VO (2 V/Div) VO (500 mV/Div) 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 0 2 0.2 0.4 0.6 0.8 Figure 35 Figure 36 SHUTDOWN FORWARD ISOLATION vs FREQUENCY 100 RL = 600 80 60 RL = 10 k 40 140 VDD = 12 V CL= 0 pF TA = 25C VI(PP)=0.1, 8, 12 120 100 80 RL = 600 60 RL = 10 k 40 20 10k 100k 1M f - Frequency - Hz 10M I DD(SHDN) - Shutdown Supply Current - A VDD = 12 V CL= 0 pF TA = 25C VI(PP)=0.1, 8, 12 100 RL = 600 60 RL = 10 k 40 20 1k 10k 100k 1M f - Frequency - Hz Figure 40 80 RL = 600 60 RL = 10 k 40 1k 10k 100k 1M f - Frequency - Hz 10M 100 100M 10M 100M 136 Shutdown On RL = open VIN = VDD/2 134 132 130 128 126 124 122 120 118 4 5 6 7 8 9 10 11 12 13 14 15 16 VDD - Supply Voltage - V Figure 41 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1k 10k 100k 1M f - Frequency - Hz 10M 100M Figure 39 SHUTDOWN SUPPLY CURRENT vs SUPPLY VOLTAGE 140 80 100 Figure 38 SHUTDOWN REVERSE ISOLATION vs FREQUENCY 120 VDD = 5 V CL= 0 pF TA = 25C VI(PP)=0.1, 2.5, and 5 120 20 100 100M Figure 37 Sutdown Reverse Isolation - dB Sutdown Reverse Isolation - dB Sutdown Forward Isolation - dB Sutdown Forward Isolation - dB 120 1 SHUTDOWN REVERSE ISOLATION vs FREQUENCY 140 VDD = 5 V CL= 0 pF TA = 25C VI(PP)=0.1, 2.5, and 5 1k 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Figure 34 20 16 0 2 t - Time - s 140 100 1.2 1.4 1.6 1.8 t - Time - s SHUTDOWN FORWARD ISOLATION vs FREQUENCY 100 1 t - Time - s SHUTDOWN SUPPLY CURRENT vs FREE-AIR TEMPERATURE I DD(SHDN) - Shutdown Supply Current - A 0 180 AV = 1 VIN=VDD/2 160 140 VDD=12 V 120 VDD=5 V 100 80 60 -55 -25 5 35 65 95 TA - Free-Air Temperature - C Figure 42 125 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 TYPICAL CHARACTERISTICS SHUTDOWN PULSE SHUTDOWN PULSE 5.5 4 Shutdown Pulse I DD - Supply Current - mA 5.0 4.5 4.0 2 VDD = 5 V CL= 8 pF TA = 25C 3.5 3.0 2.5 0 IDD RL = 10 k 2.0 1.5 -2 IDD RL = 600 1.0 6 5.5 SD Off Shutdown Pulse - V I DD - Supply Current - mA 6.0 6 -4 SD Off 5.0 4 Shutdown Pulse 4.5 4.0 2 VDD = 12 V CL= 8 pF TA = 25C 3.5 3.0 2.5 0 IDD RL = 10 k 2.0 1.5 -2 IDD RL = 600 1.0 Shutdown Pulse - V 6.0 -4 0.5 0.5 0.0 0.0 -6 0 10 20 30 40 50 t - Time - s 60 70 -6 0 80 10 20 30 40 50 t - Time - s 60 70 80 Figure 44 Figure 43 PARAMETER MEASUREMENT INFORMATION Rnull _ + RL CL Figure 45 APPLICATION INFORMATION input offset voltage null circuit The TLC080 and TLC081 has an input offset nulling function. Refer to Figure 46 for the diagram. - IN - OUT + IN + N2 N1 100 k R1 VDD - NOTE A: If R1 = 5.6 k for offset voltage adjustment of 10 mV. If R1 = 20 k for offset voltage adjustment of 3 mV. Figure 46. Input Offset Voltage Null Circuit POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 17 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 APPLICATION INFORMATION driving a capacitive load When the amplifier is configured in this manner, capacitive loading directly on the output will decrease the device's phase margin leading to high frequency ringing or oscillations. Therefore, for capacitive loads of greater than 10 pF, it is recommended that a resistor be placed in series (RNULL) with the output of the amplifier, as shown in Figure 47. A minimum value of 20 should work well for most applications. RF RG RNULL _ Input Output + CLOAD Figure 47. Driving a Capacitive Load offset voltage The output offset voltage, (VOO) is the sum of the input offset voltage (VIO) and both input bias currents (IIB) times the corresponding gains. The following schematic and formula can be used to calculate the output offset voltage: RF IIB- RG + - VI VO + RS IIB+ V OO + VIO 1 ) R R F G " IIB) RS 1 ) R R F G " IIB- RF Figure 48. Output Offset Voltage Model 18 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 APPLICATION INFORMATION high speed CMOS input amplifiers The TLC08x is a family of high-speed low-noise CMOS input operational amplifiers and has an input capacitance of the order of 20 pF. Any resistor used in the feedback path adds a pole in the transfer function equivalent to the input capacitance multiplied by the combination of source resistance and feedback resistance. For example, a gain of -10, source resistance of 1 k and a feedback resistance of 10 k adds an additional pole at approximately 8 MHz. This is more apparent with CMOS amplifiers than bipolar amplifiers due to their greater input capacitance. This is of little consequence on slower CMOS amplifiers, as this pole normally occurs at frequencies above their unity-gain bandwidth. However, the TLC08x with its 10-MHz bandwidth means that this pole normally occurs at frequencies where there is on the order of 5dB gain left and the phase shift adds considerably. The effect of this pole is the strongest with large feedback resistances at small closed loop gains. As the feedback resistance is increased, the gain peaking increases at a lower frequency and the 180_ phase shift crossover point also moves down in frequency, decreasing the phase margin. For the TLC08x, the maximum feedback resistor recommended is 5 k, larger resistances can be used but a capacitor in parallel with the feedback resistor is recommended to counter the effects of the input capacitance pole. The TLC083 with a 1-V step response has an 80% overshoot with a natural frequency of 3.5 MHz when configured as a unity gain buffer and with a 10-k feedback resistor. By adding a 10-pF capacitor in parallel with the feedback resistor, the overshoot is reduced to 40% and eliminates the natural frequency, resulting in a much faster settling time (see Figure 49). The 10-pF capacitor was chosen for convenience only. 2 VIN V O - Output Voltage - V 1 0 With CF = 10 pF 1.5 -1 V I - Input Voltage - V Load capacitance had little effect on these measurements due to the excellent output drive capability of the TLC08x. 10 pF 10 k _ 1 0.5 VOUT 0 + IN VDD = 5 V AV = +1 RF = 10 k RL = 600 CL = 22 pF 50 600 22 pF -0.5 0 0.2 0.4 0.6 0.8 t - Time - s 1 1.2 1.4 1.6 Figure 49. 1-V Step Response POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 19 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 APPLICATION INFORMATION general configurations When receiving low-level signals, limiting the bandwidth of the incoming signals into the system is often required. The simplest way to accomplish this is to place an RC filter at the noninverting terminal of the amplifer (see Figure 50). RG RF - VO + VI R1 V O V I C1 + 1 ) RRF G 1 f -3dB 1 + 2pR1C1 ) sR1C1 1 Figure 50. Single-Pole Low-Pass Filter If even more attenuation is needed, a multiple pole filter is required. The Sallen-Key filter can be used for this task. For best results, the amplifier should have a bandwidth that is 8 to 10 times the filter frequency bandwidth. Failure to do this can result in phase shift of the amplifier. C1 + _ VI R1 R1 = R2 = R C1 = C2 = C Q = Peaking Factor (Butterworth Q = 0.707) R2 f C2 RG RF RG = Figure 51. 2-Pole Low-Pass Sallen-Key Filter 20 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 -3dB + 2p1RC ( RF 1 2- Q ) TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 APPLICATION INFORMATION shutdown function Three members of the TLC08x family (TLC080/3/5) have a shutdown terminal (SHDN) for conserving battery life in portable applications. When the shutdown terminal is tied low, the supply current is reduced to 16 nA/channel, the amplifier is disabled, and the outputs are placed in a high-impedance mode. To enable the amplifier, the shutdown terminal can either be left floating or pulled high. When the shutdown terminal is left floating, care should be taken to ensure that parasitic leakage current at the shutdown terminal does not inadvertently place the operational amplifier into shutdown. The shutdown terminal threshold is always referenced to VDD/2. Therefore, when operating the device with split supply voltages (e.g. 2.5 V), the shutdown terminal needs to be pulled to VDD- (not GND) to disable the operational amplifier. The amplifier's output with a shutdown pulse is shown in Figures 43 and 44. The amplifier is powered with a single 5-V supply and is configured as noninverting with a gain of 5. The amplifier turnon and turnoff times are measured from the 50% point of the shutdown pulse to the 50% point of the output waveform. The times for the single, dual, and quad are listed in the data tables. Figures 37, 38, 39, and 40 show the amplifier's forward and reverse isolation in shutdown. The operational amplifier is configured as a voltage follower (AV = 1). The isolation performance is plotted across frequency using 0.1 VPP, 2.5 VPP, and 5 VPP input signals at 2.5 V supplies and 0.1 VPP, 8 VPP, and 12 VPP input signals at 6 V supplies. circuit layout considerations To achieve the levels of high performance of the TLC08x, follow proper printed-circuit board design techniques. A general set of guidelines is given in the following. D D D D D Ground planes - It is highly recommended that a ground plane be used on the board to provide all components with a low inductive ground connection. However, in the areas of the amplifier inputs and output, the ground plane can be removed to minimize the stray capacitance. Proper power supply decoupling - Use a 6.8-F tantalum capacitor in parallel with a 0.1-F ceramic capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers depending on the application, but a 0.1-F ceramic capacitor should always be used on the supply terminal of every amplifier. In addition, the 0.1-F capacitor should be placed as close as possible to the supply terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less effective. The designer should strive for distances of less than 0.1 inches between the device power terminals and the ceramic capacitors. Sockets - Sockets can be used but are not recommended. The additional lead inductance in the socket pins will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board is the best implementation. Short trace runs/compact part placements - Optimum high performance is achieved when stray series inductance has been minimized. To realize this, the circuit layout should be made as compact as possible, thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of the amplifier. Its length should be kept as short as possible. This will help to minimize stray capacitance at the input of the amplifier. Surface-mount passive components - Using surface-mount passive components is recommended for high performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be kept as short as possible. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 21 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 APPLICATION INFORMATION general PowerPAD design considerations The TLC08x is available in a thermally-enhanced PowerPAD family of packages. These packages are constructed using a downset leadframe upon which the die is mounted [see Figure 52(a) and Figure 52(b)]. This arrangement results in the lead frame being exposed as a thermal pad on the underside of the package [see Figure 52(c)]. Because this thermal pad has direct thermal contact with the die, excellent thermal performance can be achieved by providing a good thermal path away from the thermal pad. The PowerPAD package allows for both assembly and thermal management in one manufacturing operation. During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be soldered to a copper area underneath the package. Through the use of thermal paths within this copper area, heat can be conducted away from the package into either a ground plane or other heat dissipating device. The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of surface mount with the, heretofore, awkward mechanical methods of heatsinking. DIE Side View (a) Thermal Pad DIE End View (b) Bottom View (c) NOTE B: The thermal pad is electrically isolated from all terminals in the package. Figure 52. Views of Thermally Enhanced DGN Package Although there are many ways to properly heatsink the PowerPAD package, the following steps illustrate the recommended approach. Thermal Pad Area Quad Single or Dual 68 mils x 70 mils) with 5 vias (Via diameter = 13 mils Figure 53. PowerPAD PCB Etch and Via Pattern PowerPAD is a trademark of Texas Instruments Incorporated. 22 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 78 mils x 94 mils) with 9 vias (Via diameter = 13 mils) TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 APPLICATION INFORMATION general PowerPAD design considerations (continued) 1. Prepare the PCB with a top side etch pattern as shown in Figure 53. There should be etch for the leads as well as etch for the thermal pad. 2. Place five holes (dual) or nine holes (quad) in the area of the thermal pad. These holes should be 13 mils in diameter. Keep them small so that solder wicking through the holes is not a problem during reflow. 3. Additional vias may be placed anywhere along the thermal plane outside of the thermal pad area. This helps dissipate the heat generated by the TLC08x IC. These additional vias may be larger than the 13-mil diameter vias directly under the thermal pad. They can be larger because they are not in the thermal pad area to be soldered so that wicking is not a problem. 4. Connect all holes to the internal ground plane. 5. When connecting these holes to the ground plane, do not use the typical web or spoke via connection methodology. Web connections have a high thermal resistance connection that is useful for slowing the heat transfer during soldering operations. This makes the soldering of vias that have plane connections easier. In this application, however, low thermal resistance is desired for the most efficient heat transfer. Therefore, the holes under the TLC08x PowerPAD package should make their connection to the internal ground plane with a complete connection around the entire circumference of the plated-through hole. 6. The top-side solder mask should leave the terminals of the package and the thermal pad area with its five holes (dual) or nine holes (quad) exposed. The bottom-side solder mask should cover the five or nine holes of the thermal pad area. This prevents solder from being pulled away from the thermal pad area during the reflow process. 7. Apply solder paste to the exposed thermal pad area and all of the IC terminals. 8. With these preparatory steps in place, the TLC08x IC is simply placed in position and run through the solder reflow operation as any standard surface-mount component. This results in a part that is properly installed. For a given JA, the maximum power dissipation is shown in Figure 54 and is calculated by the following formula: P Where: + D T -T MAX A q JA PD = Maximum power dissipation of TLC08x IC (watts) TMAX = Absolute maximum junction temperature (150C) TA = Free-ambient air temperature (C) JA = JC + CA JC = Thermal coefficient from junction to case CA = Thermal coefficient from case to ambient air (C/W) POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 23 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 APPLICATION INFORMATION general PowerPAD design considerations (continued) MAXIMUM POWER DISSIPATION vs FREE-AIR TEMPERATURE Maximum Power Dissipation - W 7 6 5 4 3 2 PWP Package Low-K Test PCB JA = 29.7C/W DGN Package Low-K Test PCB JA = 52.3C/W TJ = 150C SOT-23 Package Low-K Test PCB JA = 324C/W PDIP Package Low-K Test PCB JA = 104C/W SOIC Package Low-K Test PCB JA = 176C/W 1 0 -55 -40 -25 -10 5 20 35 50 65 80 95 110 125 TA - Free-Air Temperature - C NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB. Figure 54. Maximum Power Dissipation vs Free-Air Temperature The next consideration is the package constraints. The two sources of heat within an amplifier are quiescent power and output power. The designer should never forget about the quiescent heat generated within the device, especially muti-amplifier devices. Because these devices have linear output stages (Class A-B), most of the heat dissipation is at low output voltages with high output currents. The other key factor when dealing with power dissipation is how the devices are mounted on the PCB. The PowerPAD devices are extremely useful for heat dissipation. But, the device should always be soldered to a copper plane to fully use the heat dissipation properties of the PowerPAD. The SOIC package, on the other hand, is highly dependent on how it is mounted on the PCB. As more trace and copper area is placed around the device, JA decreases and the heat dissipation capability increases. The currents and voltages shown in these graphs are for the total package. For the dual or quad amplifier packages, the sum of the RMS output currents and voltages should be used to choose the proper package. 24 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 APPLICATION INFORMATION macromodel information Macromodel information provided was derived using Microsim Parts , the model generation software used with Microsim PSpice . The Boyle macromodel (see Note 1) and subcircuit in Figure 55 are generated using the TLC08x typical electrical and operating characteristics at TA = 25C. Using this information, output simulations of the following key parameters can be generated to a tolerance of 20% (in most cases): D D D D D D Maximum positive output voltage swing Maximum negative output voltage swing Slew rate Quiescent power dissipation Input bias current Open-loop voltage amplification D D D D D D Unity-gain frequency Common-mode rejection ratio Phase margin DC output resistance AC output resistance Short-circuit output current limit NOTE 1: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, "Macromodeling of Integrated Circuit Operational Amplifiers," IEEE Journal of Solid-State Circuits, SC-9, 353 (1974). PSpice and Parts are trademarks of MicroSim Corporation. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 25 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 APPLICATION INFORMATION 99 3 VDD 9 RSS + 10 J1 DP VC J2 IN + 11 RD1 VAD DC 12 C1 R2 - 53 HLIM - C2 6 - + + GCM GA - RD2 - RO1 DE 5 + VE *DEVICE=TLC08X, OPAMP,NPN,INT*DEVICE=TLC08X, +OPAMP,NPN,INT * TLC08X operational amplifier "macromodel" subcircuit * created using Parts release 8.0 on 07/02/99 at 13:14 * Parts is a MicroSim product. * * connections: non-inverting input * inverting input * positive power supply * negative power supply * output * .subckt TLC08X 1 2 3 4 5 * c1 11 12 4.6015E-12 c2 6 7 8.0000E-12 cee 10 99 993.10E-15 dc 5 53 dy de 54 5 dy dlp 90 91 dx dln 92 90 dx dp 4 3 dx egnd 99 0 poly(2) (3,0) (4,0) 0 .5 .5 fb 7 99 poly(5) vb vc ve vlp vln 0 13.984E6 -1E3 1E3 +14E6 -14E6 ga 6 0 11 12 402.12E-6 gcm 0 6 10 99 1.5735E-6 OUT iee 10 4 dc 130.40E-6 ioff 0 6 dc 1.235E-6 hlim 90 0 vlim 1K q1 11 2 13 qx1 q2 12 1 14 qx2 r2 6 9 100.00E3 rc1 3 11 2.4868E3 rc2 3 12 2.4868E3 re1 13 10 2.0901E3 re2 14 10 2.0901E3 ree 10 99 1.5337E6 ro1 8 5 10 ro2 7 99 10 rp 3 4 3.0495E3 vb 9 0 dc 0 vc 3 53 dc 1.5537 ve 54 4 dc .84373 vlim 7 8 dc 0 vlp 91 0 dc 117.60 vln 0 92 dc 117.60 .model dx D(Is=800.00E-18) .model dy D(Is=800.00E-18 Rs=1m Cjo=10p) .model qx1 NPN(Is=800.00E-18 Bf=407.50E6) .model qx2 NPN(Is=800.0000E-18 Bf=407.50E6) .ends *$ Figure 55. Boyle Macromodel and Subcircuit 26 - VLIM 8 54 4 - 7 60 + - + DLP 91 + VLP 90 RO2 VB IN - GND 92 FB - + ISS RP 2 1 DLN EGND + POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 VLN TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 MECHANICAL DATA D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PIN SHOWN 0.050 (1,27) 0.020 (0,51) 0.014 (0,35) 14 0.010 (0,25) M 8 0.008 (0,20) NOM 0.244 (6,20) 0.228 (5,80) 0.157 (4,00) 0.150 (3,81) Gage Plane 0.010 (0,25) 1 7 0- 8 A 0.044 (1,12) 0.016 (0,40) Seating Plane 0.069 (1,75) MAX 0.010 (0,25) 0.004 (0,10) PINS ** 0.004 (0,10) 8 14 16 A MAX 0.197 (5,00) 0.344 (8,75) 0.394 (10,00) A MIN 0.189 (4,80) 0.337 (8,55) 0.386 (9,80) DIM 4040047 / D 10/96 NOTES: B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15). Falls within JEDEC MS-012 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 27 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 MECHANICAL INFORMATION DGN (S-PDSO-G8) PowerPAD PLASTIC SMALL-OUTLINE PACKAGE 0,38 0,25 0,65 8 0,25 M 5 Thermal Pad (See Note D) 0,15 NOM 3,05 2,95 4,98 4,78 Gage Plane 0,25 1 0- 6 4 3,05 2,95 0,69 0,41 Seating Plane 1,07 MAX 0,15 0,05 0,10 4073271/A 04/98 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions include mold flash or protrusions. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. E. Falls within JEDEC MO-187 PowerPAD is a trademark of Texas Instruments Incorporated. 28 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 MECHANICAL INFORMATION DGQ (S-PDSO-G10) PowerPAD PLASTIC SMALL-OUTLINE PACKAGE 0,27 0,17 0,50 10 0,25 M 6 Thermal Pad (See Note D) 0,15 NOM 4,98 4,78 3,05 2,95 Gage Plane 0,25 1 0- 6 5 3,05 2,95 0,69 0,41 Seating Plane 1,07 MAX 0,15 0,05 0,10 4073273/A 04/98 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. PowerPAD is a trademark of Texas Instruments Incorporated. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 29 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 MECHANICAL INFORMATION N (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE 16 PIN SHOWN PINS ** 14 16 18 20 A MAX 0.775 (19,69) 0.775 (19,69) 0.920 (23.37) 0.975 (24,77) A MIN 0.745 (18,92) 0.745 (18,92) 0.850 (21.59) 0.940 (23,88) DIM A 16 9 0.260 (6,60) 0.240 (6,10) 1 8 0.070 (1,78) MAX 0.035 (0,89) MAX 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) M 0- 15 0.010 (0,25) NOM 14/18 PIN ONLY 4040049/C 08/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 (20 pin package is shorter then MS-001.) 30 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 MECHANICAL INFORMATION P (R-PDIP-T8) PLASTIC DUAL-IN-LINE PACKAGE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0- 15 0.010 (0,25) M 0.010 (0,25) NOM 4040082 / B 03/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 31 TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA FAMILY OF WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS SLOS254B - JUNE 1999 - REVISED NOVEMBER 1999 MECHANICAL INFORMATION PWP (R-PDSO-G**) PowerPAD PLASTIC SMALL-OUTLINE 20 PINS SHOWN 0,30 0,19 0,65 20 0,10 M 11 Thermal Pad (See Note D) 4,50 4,30 0,15 NOM 6,60 6,20 Gage Plane 1 10 0,25 A 0- 8 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 14 16 20 24 28 A MAX 5,10 5,10 6,60 7,90 9,80 A MIN 4,90 4,90 6,40 7,70 9,60 DIM 4073225/F 10/98 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusions. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. E. 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