A1339-DS, Rev. 3
MCO-0000311
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
Figure 1: A1339 Magnetic Circuit and IC Diagram
A1339
October 15, 2018
SoC die 1
Regulator To all internal circuits
VCC_1
GND_1
PWM_1
A_1/U_1
B_1/V_1
I_1/W_1
Target
Magnet
EEPROM
CRC Error Detection/
Correction
.
Adjustable
Discon Pt
(0
o
Angle)
SPI
Interface
w/ 4-bit
CRC
SCLK_1
MOSI_1/SA1_1
MISO_1
CS_1/SA0_1
MS egment
Circular
Vertical
Hall
Temp
Sensor
ADC
BYP_1
SoC die 2
xxx_2
ADC
Data
Registers
Digital Processing
UI_DIAG
Control
UI_DIAG
(Bias Current)
WAKE_1
CW/CCW
Rotation
Angle
Compensation
PLL
Angle
Detect
Turns
Count
Field
Measurement
ZCD
Angle
Detect
DESCRIPTION
The A1339 is a 360° angle sensor IC that provides contactless
high-resolution angular position information based on magnetic
Circular Vertical Hall (CVH) technology. It has a system-on-
chip (SoC) architecture that includes: a CVH front end, digital
signal processing, and motor commutation (UVW) or encoder
outputs (A, B, I). It also includes on-chip EEPROM technology,
capable of supporting up to 100 read/write cycles, for flexible
end-of-line programming of calibration parameters. The A1339
is ideal for automotive applications requiring 0° to 360° angle
measurements, such as electronic power steering (EPS), rotary
PRNDLs, and throttle systems.
The A1339 supports customer integration into safety-critical
applications.
The A1339 is available in a dual-die 24-pin eTSSOP and a
single-die 14-pin TSSOP package. The packages are lead (Pb)
free with 100% matte-tin leadframe plating.
FEATURES AND BENEFITS
Contactless 0° to 360° angle sensor IC, for angular
position, rotational speed, and direction measurement
Capable of sensing magnet rotational speeds targeting
12b effective resolution with 900 G field
Circular Vertical Hall (CVH) technology provides a
single channel sensor system supporting operation
across a wide range of air gaps
Developed in accordance with ISO 26262:2011
requirements for hardware product development for use
in safety-critical applications
Single die version designed to meet ASIL B
requirements when integrated and used in conjunction
with the appropriate system-level control, in the
manner prescribed in the A1339 Safety Manual
Dual die version designed to meet ASIL D
requirements when integrated and used in conjunction
with the appropriate system-level control, in the
manner prescribed in the A1339 Safety Manual
High diagnostic coverage
On-chip diagnostics include logic built-in self-test
(LBIST), signal path diagnostics, and watchdogs to
support safety-critical (ASIL) applications
4-bit CRC on SPI
On-chip EEPROM for storing factory and customer
calibration parameters
Single-bit error correction, dual-bit error detection
through the use of error correction control (ECC)
PACKAGES:
Not to scale
Dual Independent SoCs
24-pin eTSSOP (Suffix LP) 14-pin TSSOP (Suffix LE)
Single SoC
Continued on next page...
2
-
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
2
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
ABSOLUTE MAXIMUM RATINGS
Characteristic Symbol Notes Rating Unit
Forward Supply Voltage VCC Not sampling angles 26.5 V
Reverse Supply Voltage VRCC Not sampling angles 18 V
All Other Pins Forward Voltage VIN 5.5 V
All Other Pins Reverse Voltage VR0.5 V
Operating Ambient Temperature [1] TAL range –40 to 150 °C
Maximum Junction Temperature TJ(max) 170 °C
Storage Temperature Tstg –65 to 170 °C
[1] Maximum operational voltage is reduced at high ambient temperatures (TA). See Operating Characteristics, footnote 2.
SELECTION GUIDE
Part Number System Die Package Packing Interface Voltage
A1339LLPTR-DD-T Dual 24-pin eTSSOP 4000 pieces per 13-in. reel 3.3 V
A1339LLETR-T Single 14-pin TSSOP 4000 pieces per 13-in. reel 3.3 V
A1339LLPTR-5-DD-T Dual 24-pin eTSSOP 4000 pieces per 13-in. reel 5 V
A1339LLETR-5-T Single 14-pin TSSOP 4000 pieces per 13-in. reel 5 V
THERMAL CHARACTERISTICS: May require derating at maximum conditions; see application information
Characteristic Symbol Test Conditions [2] Value Unit
Package Thermal Resistance RθJA
LP-24 package 69 °C/W
LE-14 package 82 °C/W
[2] Additional thermal information available on the Allegro website.
FEATURES AND BENEFITS (continued)
Supports harsh operating conditions required for automotive
and industrial applications, including direct connection to
12 V battery
Operating temperature range from –40°C to 150°C
Operating supply voltage range from 4.0 to 16.5 V
Can support ISO 7637-2 Pulse 5b up to 39 V
Low power mode and turns counter enable tracking of motor
position even when vehicle is turned off
Multiple output formats supported for ease of system
integration
ABI/UVW output provides high resolution, low latency, and
PWM for initial position
10 MHz SPI for low latency angle and diagnostic
information; enables multiple independent ICs to be
connected to the same bus
Output resolution on ABI and UVW are selectable
Multiple programming / configuration formats supported
The system can be completely controlled and programmed
over SPI, including EEPROM writes
For system with limited pins available, writing and reading
can be performed over VCC and PWM pins. This allows
configuring the EEPROM in production line for a device
with only ABI/UVW and PWM pins connected.
Stacked dual die construction to improve die-to-die matching
for systems that require redundant sensors
Reduces magnet misalignment impact on die-to-die matching
for a given magnet diameter, relative to “side-by-side” dual
die orientation
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
3
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Table of Contents
Features and Benefits ........................................................... 1
Description .......................................................................... 1
Packages ............................................................................ 1
Simplified Block Diagram ...................................................... 1
Selection Guide ................................................................... 2
Absolute Maximum Ratings ................................................... 2
Thermal Characteristics ........................................................ 2
Pinout Diagrams and Terminal Lists ........................................ 4
Operating Characteristics ...................................................... 6
Typical Performance Characteristics ....................................... 9
Functional Description .........................................................11
Overview ........................................................................11
Angle Measurement .........................................................11
System Level Timing ........................................................11
Impact of High Speed Sensing...........................................11
Power-Up....................................................................... 15
PWM Output .................................................................. 15
Incremental Output Interface (ABI) .................................... 16
Brushless DC Motor Output (UVW) ................................... 22
Angle Hysteresis ............................................................. 24
Low Power Mode ............................................................ 25
Turns Counting and Low Power Mode ............................... 32
Transport Mode .............................................................. 33
Device Programming Interfaces ........................................... 34
Interface Structure .......................................................... 34
SPI ................................................................................ 35
Timing ........................................................................ 35
Message Frame Size ................................................... 37
Write Cycle ................................................................. 37
Read Cycle ................................................................. 37
CRC .......................................................................... 39
Manchester Interface ....................................................... 40
Concept of Manchester Communication ......................... 40
Entering Manchester Communication Mode .................... 40
Transaction Types ....................................................... 40
Controller Manchester Message Structure ...................... 41
Sensor Manchester Message Structure .......................... 42
Manchester Access Code ............................................. 42
Manchester Exit Code .................................................. 43
Manchester Read Command ........................................ 43
Manchester Read Response ......................................... 44
Manchester Read Response Delay................................ 44
CRC .......................................................................... 45
EEPROM and Shadow Memory Usage ................................. 46
Enabling EEPROM Access............................................... 46
EEPROM Write Lock ....................................................... 46
Write Transaction to EEPROM
and Other Extended Locations.......................................... 46
Read Transaction to EEPROM
and Other Extended Locations.......................................... 48
Shadow Memory Read and Write Transactions ................... 50
Primary Serial Interface Registers Reference ........................ 51
EEPROM/Shadow Memory Table ......................................... 64
Safety and Diagnostics ....................................................... 74
Built-In Self Tests ............................................................ 74
Status and Error Flags ..................................................... 74
Application Information ....................................................... 78
ESD Performance ........................................................... 78
Setting the Zero-Degree Position ...................................... 79
Magnetic Target Requirements ......................................... 79
Magnetic Misalignment .................................................... 81
I/O Structures .................................................................... 82
Package Outline Drawings .................................................. 83
APPENDIX A: Angle Error and Drift Definition .......................A-1
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
4
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
PINOUT DIAGRAMS AND TERMINAL LIST TABLES
BYP
VCC
WAKE
PWM
GND
GND
GND CS/SA0
1
2
3
4
5
6
78
9
10
11
12
13
14 I/W
B/V
A/U
MISO
MOSI/SA1
SCLK
LE 14-Pin TSSOP
LE 14-Pin TSSOP Terminal List Table
Pin Name Pin Number Function
BYP 1 External bypass capacitor terminal for internal regulator
VCC 2 Power Supply / Manchester Input
WAKE 3 External Wake-Up signal input
PWM 4 PWM Angle Output / Manchester Output
GND 5, 6, 7 Device ground terminal
CS /SA0 8
SPI: Chip Select terminal, active low input
Manchester: LSB of ID value. Tie to BYP for “1”, GND for “0”
SCLK 9 SPI Clock terminal input
MOSI/SA1 10
SPI: Master Output, Slave Input
Manchester: MSB of ID value. Tie to BYP for “1”, GND for “0”
MISO 11 SPI Master Input / Slave Output
A/U 12 Option 1: Quadrature A output signal
Option 2: U (phase 1) output signal
B/V 13 Option 1: Quadrature B output signal
Option 2: V (phase 2) output signal
I/W 14 Option 1: Quadrature I (index) output signal
Option 2: W (phase 3) output signal
Pinout Diagram
V
CC1
A1339
VCC_1
SCLK_1 PWM_1
PWM_2
A_1/U_1
A_2/U_2
WAKE_1
B_1/V_1
B_2/V_2
I_1/W_1
I_2/W_2
SCLK_2
MISO_1
MOSI_1/SA1_1
MOSI_2/SA1_2
MISO_2
BYP_1 VCC_2
GND_1
BYP_2
0.1 µF 0.1 µF
Host
Microprocessor
CS_1/SA0_1
CS_2/SA0_2
GND_2
Tachometer
(optional)
WAKE_2
Tachometer
(optional)
V
CC2
0.1 µF
0.1 µF
Figure 2: Typical Application Circuit
Both die are electrically separate, and may be operated
simultaneously using di󰀨erent Power/GND sources.
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
5
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
LP 24-Pin eTSSOP Terminal List Table
Pin Name Pin Number Function
CS_1 /SA0_1 1
SPI: Chip Select terminal, active low input (die 1)
Manchester: LSB of ID value for die 1. Tie to BYP_1 for “1”, GND_1 for “0”
SCLK_1 2 SPI Clock terminal input (die 1)
MOSI_1/SA1_1 3
SPI: Master Output, Slave Input (die 1)
Manchester: MSB of ID value for die 1. Tie to BYP_1 for “1”, GND_1 for “0”
MISO_1 4 SPI Master Input / Slave Output (die 1)
A_1/U_1 5 Option 1: Quadrature A output signal signal (die 1)
Option 2: U (phase 1) output signal (die 1)
B_1/V_1 6 Option 1: Quadrature B output signal (die 1)
Option 2: V (phase 2) output signal (die 1)
I_1/W_1 7 Option 1: Quadrature I (index) output signal (die 1)
Option 2: W (phase 3) output signal (die 1)
GND_1 8 Device ground terminal (die 1)
PWM_1 9 PWM Angle Output / Manchester Output (die 1)
WAKE_1 10 External Wake-Up signal input (die 1)
VCC_1 11 Power Supply / Manchester Input (die 1)
BYP_1 12 External bypass capacitor terminal for internal regulator (die 1)
CS_2/SA0_2 13
SPI: Chip Select terminal, active low input (die 2)
Manchester: LSB of ID value for die 2. Tie to BYP_2 for “1”, GND_2 for “0”
SCLK_2 14 SPI Clock terminal input (die 2)
MOSI_2/SA1_2 15
SPI: Master Output, Slave Input (die 2)
Manchester: MSB of ID value for die 2. Tie to BYP_2 for “1”, GND_2 for “0”
MISO_2 16 SPI Master Input / Slave Output (die 2)
A_2/U_2 17 Option 1: Quadrature A output signal (die 2)
Option 2: U (phase 1) output signal (die 2)
B_2/V_2 18 Option 1: Quadrature B output signal (die 2)
Option 2: V (phase 2) output signal (die 2)
I_2/W_2 19 Option 1: Quadrature I (index) output signal (die 2)
Option 2: W (phase 3) output signal (die 2)
GND_2 20 Device ground terminal (die 2)
PWM_2 21 PWM Angle Output / Manchester Output (die 2)
WAKE_2 22 External Wake-Up signal input (die 2)
VCC_2 23 Power Supply / Manchester Input (die 2)
BYP_2 24 External bypass capacitor terminal for internal regulator (die 2)
PAD PAD Exposed pad for thermal dissipation
Pinout Diagram
CS_1/SA0_1
SCLK_1
MOSI_1/SA1_1
MISO_1
A_1/U_1
B_1/V_1
I_1/W_1
GND_1
PWM_1
WAKE_1
VCC_1
BYP_1
1
2
3
4
5
6
7
8
9
10
11
12 13
14
15
16
17
18
19
20
21
22
23
24 BYP_2
VCC_2
WAKE_2
PWM_2
GND_2
I_2/W_2
B_2/V_2
A_2/U_2
MISO_2
MOSI_2/SA1_2
SCLK_2
CS_2/SA0_2
PAD
LP 24-Pin eTSSOP
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
6
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
OPERATING CHARACTERISTICS: Valid over the full operating voltage and ambient temperature ranges, unless otherwise noted
Characteristics Symbol Test Conditions Min. Typ. Max. Unit
[1]
ELECTRICAL CHARACTERISTICS
Supply Voltage [2] VCC Customer supply 4.0 16.5 V
Supply Current ICC
One die, in Normal power mode and sampling
angles 17 19 mA
Low Power Mode Average Supply
Current ICC(AVG_LP) VCC = 16 V, TA = 25°C, 98 ms sleep time, one die 98 µA
Low Power Mode Sleep Current ICC(LP_SLEEP)
Current consumption with IC in “sleep” state of
Low Power Mode; VCC = 16 V, TA = 25°C, one die 82 µA
Low Power Mode Wake Current ICC(LP_WAKE)
Current consumption with IC in “wake” state of
Low Power Mode; VCC = 16 V, TA = 25°C, one die 9.0 mA
Transport Mode Supply Current ICC(TRANS)
A1339 in Transport mode, VCC = 16 V,
TA = 25°C, sampling disabled, one die 60 µA
Undervoltage Flag Threshold [3] VUVD dV/dt = 1 V/ms, A1339 sampling enabled, TA = 25°C 3.6 3.9 V
Supply Zener Clamp Voltage VZSUP ICC = ICC(AWAKE) + 3 mA, TA = 25°C 26.5 V
Reverse Battery Current IRCC VRCC = 18 V, TA = 25°C 5 mA
Power-On Time
[4][5] tPO Power-on diagnostics disabled 15 20 ms
tPO_D Power-on time; CVH self-test and LBIST enabled 45 50 ms
Bypass Pin Output Voltage
[6] VBYP
TA = 25°C, CBYP = 0.1 µF, 3.3 V interface 2.97 3.3 3.63 V
TA = 25°C, CBYP = 0.1 µF, 5.0 V interface enabled
and VCC ≥ 5.0 V 4.0 5.0 5.5 V
SPI AND ABI (UVW) ELECTRICAL SPECIFICATIONS (3.3 V INTERFACE)
Digital Input High Voltage VIH MOSI, SCLK, CS pins 2.8 3.63 V
Digital Input Low Voltage VIL MOSI, SCLK, CS pins 0.5 V
Output High Voltage VOH MISO, ABI/UVW pins, CL = 20 pF 2.93 3.3 3.63 V
Output Low Voltage VOL MISO, ABI/UVW pins, CL = 20 pF 0.3 V
SPI AND ABI (UVW) ELECTRICAL SPECIFICATIONS (5.0 V INTERFACE)
Digital Input High Voltage VIH MOSI, SCLK, CS pins 3.75 5.5 V
Digital Input Low Voltage VIL MOSI, SCLK, CS pins 0.5 V
Output High Voltage VOH MISO, ABI/UVW pins, CL = 20 pF, VCC5.0 V 4 5 5.5 V
Output Low Voltage VOL MISO, ABI/UVW pins, CL = 20 pF 0.3 V
SPI INTERFACE SPECIFICATIONS
SPI Clock Frequency
[5] fSCLK MISO pins, CL = 20 pF 0.1 10 MHz
SPI Clock Duty Cycle
[5] DfSCLK SPICLKDC 40 - 60 %
SPI Frame Rate
[5] tSPI 5.8 588 kHz
Chip Select to First SCLK Edge
[5] tCS Time from CS going low to SCLK falling edge 50 ns
Chip Select Idle Time [5] tCS_IDLE Time CS must be high between SPI message frames 200 ns
Data Output Valid Time
[5] tDAV Data output valid after SCLK falling edge 30 ns
MOSI Setup Time
[5] tSU Input setup time before SCLK rising edge 25 ns
MOSI Hold Time
[5] tHD Input hold time after SCLK rising edge 50 ns
SCLK to CS Hold Time
[5] tCHD Hold SCLK high time before CS rising edge 5 ns
Load Capacitance
[5] CLLoading on digital output (MISO) pin 20 pF
Continued on the next page…
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
7
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
OPERATING CHARACTERISTICS (continued): Valid over the full operating voltage and ambient temperature ranges, unless otherwise noted
Characteristics Symbol Test Conditions Min. Typ. Max. Unit
[1]
PWM INTERFACE SPECIFICATIONS
PWM Carrier Frequency fPWM
PWM Frequency Min Setting 98 Hz
PWM Programmable Options (7 bits) 128 options
PWM Frequency Max Setting 3.125 kHz
PWM Output Low Clamp DPWM(min) Corresponding to digital angle of 0x000 5 %
PWM Output High Clamp DPWM(max) Corresponding to digital angle of 0xFFF 95 %
INCREMENTAL OUTPUT, ABI (UVW) SPECIFICATIONS [5]
ABI and UVW Output Angular
Hysteresis [5] hysANG Programmable via EEPROM (6 bits) 0 1.38 degrees
AB Channel Resolution [5] RESAB
Programmable via EEPROM, 4 bit field.
Specified in pulses per revolution, PPR 1 2048 PPR
AB Quadrature Resolution [5] RESAB_INT
Equal to 4 × RESAB, specified in counts per
revolution, CPR 4 8192 CPR
UVW Pole Pairs [5] Npole
DC commutation signals. Programmable via
EEPROM, 4-bit field. 1 16 pole pairs
MANCHESTER INTERFACE SPECIFICATIONS
Manchester High Voltage [7] VMAN(H) Applied to VCC line 7.3 8 VCC(max) V
Manchester Low Voltage [7] VMAN(L) Applied to VCC line VCC(min) 5 5.7 V
Manchester Bit Rate [5] fMAN
Line state changes once or twice per bit;
maximum speed is usually limited by VCC line
capacitance
2.2 100 kbit/s
WAKE Pin Input Specifications [5]
WAKE Pin High Threshold
Voltage Range VWAKE(HITH) Programmable via EEPROM, TA = 25°C 300 650 mV
WAKE Pin Hysteresis VWAKE(HYS) Programmable via EEPROM, TA = 25°C 50 400 mV
WAKE Pin Input Resistance RWAKE –1–
BUILT-IN SELF TEST
Logic BIST Time tLBIST
Configurable to run on power-up or on user request.
Runs in parallel with CVH self-test (if enabled). 30 ms
Circular Vertical Hall Self-Test Time tCVHST
Configurable to run on power-up or on user request.
Runs in parallel with LBIST (if enabled). 30 ms
Continued on the next page…
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
8
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
OPERATING CHARACTERISTICS (continued): Valid over the full operating voltage and ambient temperature ranges, unless otherwise noted
Characteristics Symbol Test Conditions Min. Typ. Max. Unit
[1]
MAGNETIC CHARACTERISTICS
Magnetic Field B Range of input field 1200 G
ANGLE CHARACTERISTICS
Output
[8] RESANGLE Both 12 and 15 bit angle values are available via SPI 12/15 bit
Angle Refresh Rate
[9] tANG ORATE = 0 1.0 µs
Response Time [5] tRESPONSE
Angular Latency; valid for ABI or UVW interface;
ORATE = 0 10 µs
Angle Error ERRANG
TA = 25°C, ideal magnet alignment, B = 300 G,
target rpm = 0 –1.0 ±0.4 +1.0 degrees
TA = 150°C, ideal magnet alignment, B = 300 G,
target rpm = 0 –1.3 ±0.6 +1.3 degrees
Temperature Drift ANGLEDRIFT
TA = 150°C, B = 300 G, angle change from 25°C –1.4 1.4 degrees
TA = –40°C, B = 300 G, angle change from 25°C 0.9 degrees
Angle Noise [10] NANG
TA = 25°C, B = 300 G, no internal filtering,
target rpm = 0, 3 sigma noise ±0.19 degrees
TA = 150°C, no internal filtering, B = 300 G,
target rpm = 0, 3 sigma noise ±0.25 degrees
Effective Resolution [11] B = 300 G, TA = 25°C 12.5 bits
Angle Drift Over Lifetime [12] ANGLEDrift_Life
B = 300 G, average maximum drift observed
following AEC-Q100 qualification testing 0.5 degrees
[1] 1 G (gauss) = 0.1 mT (millitesla).
[2] Maximum operational voltage is reduced at high ambient temperatures (TA). See plots below.
16.5
4
-40 150
Maximum Operating VCC (V)
Ambient Temperature, TA (°C)
TSSOP-14 Thermal Derating Curve
144°C
12.84 V
16.5
4
-40 150
Maximum Operating VCC (V)
Ambient Temperature, TA (°C)
eTSSOP-24 Thermal Derating Curve
148°C
15.26 V
[3] Undervoltage flag indicates VCC level below expected operational range. Degraded sensor accuracy may result.
[4] During the power-on phase, the A1339 SPI transactions will be valid within ≈ 300 µs of power on (with no self-tests). Angle reading requires full tPO
to stabilize.
[5] Parameter is not guaranteed at final test. Determined by design.
[6] The output voltage specification is to aid in PCB design. The pin is not intended to drive any external circuitry. The specifications indicate the peak
capacitor charging and discharging currents to be expected during normal operation.
[7] Tested at wafer probe only.
[8] RESANGLE represents the number of bits of data available for reading from the die registers.
[9] The rate at which a new angle reading will be ready.
[10] This value represents 3-sigma or three times the standard deviation of the measured samples.
[11] Effective Resolution is calculated using the formula below:
log
22
(360) – log ( )
n
i
i =1
1
n
where σ is the Standard Deviation based on thirty averaged measurements taken at each of the 32 angular positions, I = 11.25, 22.5, … 360.
[12] Maximum observed angle drift following AEC-Q100 stress was 1.37 degrees.
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
9
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 3: Peak Angle Error over Temperature
(300 G)
-40 -20 0 100 120 140
Ambient Temperature in °C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
Angle Error in degrees
Mean
±3 Sigma
20 40 60 80
Figure 4: Maximum Absolute Drift from 25°C Reading
(300 G)
Ambient Temperature in °C
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
Angle Drift in degrees
Mean
±3 Sigma
-40 -20 0 100 120 14020 40 60 80
Figure 5: Peak Angle Error Distributions over
Temperature (300 G)
Figure 6: Angle Drift from 25°C (300 G)
0 0.5 1 1.5
Angle Error in degrees
0
2
4
6
8
10
12
Frequency
150°C
25°C
-40°C
0 0.5 1 1.5
Angle Drift in Degrees
0
1
2
3
4
5
6
7
8
Frequency
150°C
-40°C
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
10
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Figure 7: Noise Performance over
Temperature (3 Sigma, 300 G)
Figure 8: ICC over Temperature (VCC = 16.0 V)
Figure 9: Noise Distribution over Temperature
(3 Sigma, 300 G)
Figure 10: ICC Distribution over Temperature
(VCC = 16.0 V)
-40 -20 0 100 120 140
Ambient Temperature in °C
0
0.05
0.1
0.15
0.2
0.25
0.3
Noise in degrees
Mean
±3 Sigma
20 40 60 80
Ambient Temperature in °C
14
15
16
17
18
19
CC
Mean
±3 Sigma
-40 -20 0 100 120 14020 40 60 80
0 0.1 0.2 0.3
Noise in degrees
0
1
2
3
4
5
6
7
8
Frequency (%)
150°C
25°C
-40°C
15 16 17 18
ICC in mA
0
1
2
3
4
5
6
7
Count (%)
150°C
25°C
-40°C
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
11
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
FUNCTIONAL DESCRIPTION
Overview
The A1339 is a rotary position Hall-sensor-based device in
a surface-mount package, providing solid-state consistency,
reliability, and supporting a wide variety of automotive
applications. The Hall-sensor-based device measures the direction
of the magnetic field vector through 360° in the x-y plane
(parallel to the branded face of the device) and computes an angle
measurement based on the actual physical reading, as well as any
internal parameters that have been set by the user. The output is
used by the host microcontroller to provide a single channel of
target data.
This device is an advanced, programmable system-on-chip (SoC).
Each integrated circuit includes a Circular Vertical Hall (CVH)
analog front end, a high-speed sampling A-to-D converter, digital
filtering, digital signal processing (which includes two separate
signal paths), SPI, PWM, motor commutation outputs (UVW), and
encoder outputs (A, B, I).
Offset, filtering, and diagnostic adjustment options are available in
the A1339. These options can be configured in onboard EEPROM,
providing a wide range of sensing solutions in the same device.
Device performance can be optimized by enabling individual func-
tions or disabling them in EEPROM to minimize latency.
Angle Measurement
The IC features two digital signal paths. The main signal path
uses a PLL to generate high resolution, low latency angle read-
ings. A secondary, lower power signal path (referred to as the
“ZCD path”) is used for turns counting, magnetic field measure-
ment, and diagnostic comparison.
The A1339 can monitor the angular position of a rotating magnet
at speeds up to and beyond 20,000 rpm.
The A1339 has a typical refresh rate of 1 MHz.
Angle is represented as either a 12- or 15-bit value, based on the
register address accessed.
12 Bit Angle Value; Serial register 0x20
15 14 13 12 11 109876543210
0 EF UV P angle(11:0)
15 Bit Angle Value; Serial Register 0x32
15 14 13 12 11 109876543210
0 angle(14:0)
When reading the 12-bit angle value, 3 additional status bits are
provided with each packet: a general error flag (EF), undervolt-
age flag (UV), and a parity bit (P).
PWM output is always resolved to a 12-bit angle value. ABI/
UVW operates on a 15-bit angle representation.
The zero degree position may be adjusted by writing to
EEPROM.
The sensor readout is processed in various steps. These are
detailed in Figure 13.
System Level Timing
Internal registers are updated with a new angle value every
tANG. Due to signal path delay, the angle is tRESPONSE old at
each update. In other words, tRESPONSE is the delay from time of
magnet sampling until generation of a processed angle value. SPI,
which is asynchronously clocked, results in a varying latency
depending on sampling frequency and SCLK speed. The values
which are presented to the user are latched on the first SCLK
edge of the SPI response frame. This results in a variable age of
the angle data, ranging from tRESPONSE + tSPI to tRESPONSE + tANG
+ tSPI, where tSPI is the length of a read response packet, and tANG
is the update rate of the angle register.
Similar to SPI, when using the PWM output, the output packet is
not synchronized with the internal update rate of the sensor. The
angle is latched at the beginning of the carrier frequency period
(effectively at the rising edge of the PWM output). Because of
this, the age of the angle value, once read by the system micro-
controller, may be up to tRESPONSE + tANG + 1/fPWM.
Figure 12 shows the update rate and the signal delay of the differ-
ent angle output paths depending on sensor settings.
The value of the “angle_zcd” (low power signal path) register is
updated approximately every 32 µs. The field strength reading
(register 0x2A) is updated approximately every 128 µs.
Impact of High Speed Sensing
Due to signal path latency, the angle information is delayed by
tRESPONSE. This delay equates to a greater angle value as the
rotational velocity increases (i.e. a magnet rotating at 20,000 rpm
traverses twice as much angular distance in a fixed time period as a
magnet rotating at 10,000 rpm), and is referred to as angular lag.
The lag is directly proportional to rpm, and may be compensated
for externally, if the velocity is known.
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
12
Allegro MicroSystems, LLC
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Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Angular lag can be expressed using the following equation:
Ang_Lag = rpm × 6 × tRESPONSE
1,000,000
where rpm represents the rotational velocity of the magnet,
Angle_Lag is expressed in degrees, and tRESPONSE is in µs.
Figure 11 depicts the typical angular lag over rpm.
0
0.5
1
1.5
2
2.5
3
3.5
010,000 20,000 30,000 40,000 50,000 60,000
Angle Lag(degrees)
RPM
Figure 11: Angle Lag vs. RPM (10 µs Response Time)
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
13
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
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Latency: 10 + (2“orate” – 1) µs
Rate: 1 µs × 2“orate”
Latency: 10 µs
Rate: 1 µs
Latency: 0 µs
Rate: 1 µs
CVH
PLL + processing
Latency 15 µs
Rate 1 µs
PWM pin
Latency ≤ 1 PWM cycles of (98...3125 Hz)
Rate (98...3125 Hz)
ABI / UVW pins
Latency ~ ns (push/pull output)
Rate can be limited by “slew_rate”
Latency: 10 + (2
“orate”
– 1) µs
Rate: 1 µs × 2
“orate”
Latency = f
PWM
-1
+ 10 µs + (2
“orate”
– 1) µs
Rate = f
PWM
-1
New data rate = max of [f
PWM
-1
and 2
“orate”
µs]
SPI bus
Latency ≤ 1 µs · 2
orate
+ 16/f
SPI
(f
SPI,max
= 10 MHz)
Rate 16/f
SPI
Latency ≤ 10 µs + 2
“orate”
µs + 16/f
SPI
Rate = 16/f
SPI
New data rate = max of [16/f
SPI
and 2
“orate”
] µs
µC
Op�onal Angle averaging
Reduce rate by 2“orate” �mes
0 ≤ “orate” ≤ 12
Figure 12: Update Rate and Signal Delay
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
14
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
CVH
Filter & PLL angle
measurement logic
ΣΔ-ADC
Accumulate angle changes into 21-bit
value, resoluon 4096 counts/360°
(relave to start-up angle)
Oset adjust
(“zero_oset)
Angle hysteresis
(“hysteresis”)
“phe”=0
180° rotaon
(“rd”)
PWM pin
(“pen”,“pwm_band”,“pwm_freq”,“peo”,“pes”)
ABI / UVW pins
(“uvw”,“ioe”,“plh”,“wdh”,“index_mode”,“inv”,
abi_slew_me”,“resoluon_pairs”)
“ahe”=0
“angle” and “angle_15“ output register
“angle_hys” output register
“angle_zcd” output register
“turnsoutput register
resoluon 4 or 180°
PLL path (full power only)
ZCD path
(low power and full power)
Mixed origin data
Angle averaging
(“orate”)
Rotaon direcon
(“ro”)
Rotaon direcon
(“ro”)
Take 15 MSB
of Angle change
“gauss” output register
Field strength
measurement
Filter and ZCD angle
measurement logic
Take 13 MSB
of Angle change
Figure 13: Angle Measurement – Sensor Readout Steps
Names in quotes correspond to EEPROM or serial register elds.
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
15
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Power-Up
Upon applying power to the A1339, the device automatically runs
through an initialization routine. The purpose of this initialization
is to ensure that the device comes up in the same predictable
operating condition every power cycle. This initialization routine
takes time to complete, which is referred to as Power-On Time,
tPO. Regardless of the state of the device before a power cycle,
the device will re-power with the shadow memory contents
copied from the EEPROM anew, and serial registers in their
default states. For example, on every power-up, the device will
power with the “zero_offset” that was stored in the EEPROM.
The extended write access field “write_adr” will be set back to its
default value, zero.
PWM Output
The A1339 provides a pulse-width-modulated open-drain output,
with the duty cycle (DC) proportional to measured angle. The PWM
duty cycle is clamped at 5% and 95% for diagnostics purposes. A 5%
DC corresponds to 0°; a 95% DC corresponds to 360°.
0T
D = 5%
0
360
D = 50% D = 95%
Magnetic Field Angle (°)
PWM Waveform (V)
1T
D
1T
D
2T
D
4T
D
3T
D
0T
D
5T
t
pulse(5)
T
period
D
6T
D
7T
D
8T
D
(x)
= t
pulse(x)
/
T
period
D
9T
D
10T
CLAMP_HIGH
CLAMP_LOW
2T 3T 4T 5T 6T 7T 8T 9T 10T 11T Time
Figure 14: PWM Mode Outputs a Duty-Cycle
Proportional To Sensed Angle
Within each cycle, the output is high for the first 5% and low
for the last 5% of the period. The middle 90% of the period is a
linear interpolation of the angle as sampled the start of the PWM
period.
5 % LOW
5 % HIGH
5 % LOW
5 % HIGH
5 % LOW
5 % HIGH
5 % LOW
5 % HIGH
5 % LOW
5 % HIGH
5 % LOW
5 % HIGH
PWM Period
PWM Period
(0 Degrees)
120
Degrees
240 Degrees360 Degrees
PWM Period
PWM Period
Figure 15: Pulse-Width Modulation (PWM) Examples
The angle is represented in 12-bit resolution and can never reach
360°. The maximum duty cycle high period is:
DutyCycleMax (%) = (4095 / 4096) × 90 + 5 .
PWM CARRIER FREQUENCY
The PWM carrier frequency is controlled via two EEPROM
fields, both of which are found in the PWS row.
PWM_FREQ
PWM_BAND
Together, these two fields allow 128 different PWM carrier fre-
quencies to be selected.
Table 1: PWM Carrier Frequencies in Hz
PWM_BAND
01234567
PWM_FREQ
03125 2778 2273 1667 1087 641 352 185
13101 2740 2222 1613 1042 610 333 175
23077 2703 2174 1563 1000 581 316 166
33053 2667 2128 1515 962 556 301 157
43030 2632 2083 1471 926 532 287 150
53008 2597 2041 1429 893 510 275 143
62985 2564 2000 1389 862 490 263 137
72963 2532 1961 1351 833 472 253 131
82941 2500 1923 1316 806 455 243 126
92920 2469 1887 1282 781 439 234 121
10 2899 2439 1852 1250 758 424 225 116
11 2878 2410 1818 1220 735 410 217 112
12 2857 2381 1786 1190 714 397 210 108
13 2837 2353 1754 1163 694 385 203 105
14 2817 2326 1724 1136 676 373 197 101
15 2797 2299 1695 1111 658 362 191 98
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
16
Allegro MicroSystems, LLC
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Manchester, NH 03103-3353 U.S.A.
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Incremental Output Interface (ABI)
The A1339 offers an incremental output mode in the form of
quadrature A/B and Index outputs to emulate an optical or
mechanical encoder. The A and B signals toggle with a 50%
duty cycle (relative to angular distance, not necessarily time) at
a frequency of 2N cycles per magnetic revolution, giving a cycle
resolution of (360 / 2N) degrees per cycle. B is offset from A by
¼ of the cycle period. The “I” signal is an index pulse that occurs
once per revolution to mark the zero (0) angle position. One revo-
lution is shown below:
Angle → 0 +R +2R +3R
A
B
I
-3R -2R -R 0
Increase angle – B edge precedes A edge
Decreasing angle – A edge precedes B edge
One full magnetic rotation (360 magnetic degrees)
Figure 16: One Full Magnetic Revolution
Since A and B are offset by ¼ of a cycle, they are in quadrature
and together have four unique states per cycle. Each state rep-
resents R = [360 ÷ (4 × 2N)] degrees of the full revolution. This
angular distance is the quadrature resolution of the encoder. The
order in which the states change, or the order of the edge transi-
tions from A to B, allow the direction of rotation to be deter-
mined. If a given B edge (rising/falling) precedes the following
A edge, the angle is increasing from the perspective of the
electrical (sensor) angle and the angle position should be incre-
mented by the quadrature resolution (R) at each state transition.
Conversely, if a given A edge precedes the following B edge,
the angle is decreasing from the perspective of the electrical
(sensor) angle and the angle position should be decremented by
the quadrature resolution (R) at each state transition. The angle
position accumulator wraps each revolution back to 0.
The quadrature states are designated as Q1 through Q4 in the fol-
lowing diagrams, and are defined as follows:
State Name A B
Q1 0 0
Q2 0 1
Q3 1 1
Q4 1 0
Note that the A/B progression is a grey coding sequence where
only one signal transitions at a time. The state progression must
be as follows to be valid:
Increasing angle: Q1 → Q2 → Q3 → Q4 → Q1 → Q2 → Q3 → Q4
Decreasing angle: Q4 → Q3 → Q2 → Q1 → Q4 → Q3 → Q2 → Q1
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
17
Allegro MicroSystems, LLC
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The duration of one cycle is referred to as 360 electrical degrees,
or 360e. One half of a cycle is therefore 180e and one quarter of
a cycle (one quadrature state, or R degrees) is 90e. This is the ter-
minology used to express variance from perfect signal behavior.
Ideally the A and B cycle would be as shown below for a constant
velocity:
A
Cycle = 360e
Q2
90e
Q1
90e
Q3
90e
Q4
90e
B
Figure 17: Electrical Cycle
In reality, the edge rate of the A and B signals, and the switching
threshold of the receiver I/Os, will affect the quadrature periods:
Q1
75e
Q4
90e
Q2
90e
Q3
105e
Cycle = 360e
A
B
Figure 18: Electrical Cycle
Here, an exaggeration of the switching thresholds shows that Q4
and Q2, which are fall-fall and rise-rise, have the expected 90e
period, whereas Q1 is less than expected and Q3 is greater than
expected due to imbalance in switching thresholds.
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
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Allegro MicroSystems, LLC
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ABI RESOLUTION
The A1339 supports the following ABI output resolutions. This is set via
the “resolution_pairs” field in EEPROM and shadow (EEPROM 0x19,
bits 3:0).
Table 2: ABI Output Resolution
EEPROM
Resolution
Field
Cycle
Resolution
(Bits = N)
Quadrature
Resolution
(Bits = 4 × N)
Cycles per
Revolution
(A or B)
Quadrature
States per
Revolution
Cycle Resolution
(Degrees)
Quadrature
Resolution (R)
(Degrees)
0 Factory Use Only
1 Factory Use Only
2 Factory Use Only
311 13 2048 8192 0.176 0.044
4 10 12 1024 4096 0.352 0.088
5 9 11 512 2048 0.703 0.176
6 8 10 256 1024 1.406 0.352
7 7 9 128 512 2.813 0.703
8 6 8 64 256 5.625 1.406
9 5 7 32 128 11.250 2.813
10 4 6 16 64 22.500 5.625
11 3 5 8 32 45.000 11.250
12 2 4 4 16 90.000 22.5
13 1 3 2 8 180.0 45.0
14 0 2 1 4 360.0 90.0
15 n/a n/a n/a n/a n/a n/a
ABI INVERSION
The logic levels of the ABI pins may inverted by setting the ABI.inv bit
within EEPROM. This also applies if using the UVW output logic.
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
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Allegro MicroSystems, LLC
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INDEX PULSE
The index pulse I (or Z in some descriptions) marks the absolute zero
(0) position of the encoder. Under rotation, this allows the receiver to
synchronize to a known mechanical/magnetic position, and then use the
incremental A/B signals to keep track of the absolute position. To sup-
port a range of ABI receivers, the ‘I’ pulse has four widths, defined by
the INDEX_MODE EEPROM field, as shown below:
A
B
A=0
Q1
A=+R
Q2
A=-R
Q4
A=-2R
Q3
True Zero to 360 Disconnuity
INDEX_MODE 0
INDEX_MODE 1
INDEX_MODE 2
INDEX_MODE 3
Figure 19: Index Pulse
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
20
Allegro MicroSystems, LLC
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The edge of the index pulse corresponding to the “Zero” position, as
observed by the sensor, will change based on rotation direction, as
shown in Figure 20.
With the magnet rotating such that the observed angle is increasing, the
0° position will be indicated by the rising edge of the Index pulse. If the
magnet is rotated in the opposite direction (or the RO bit is changed in
EEPROM) to produce a decreasing angle value, the 0° position will be
represented by the falling edge of the Index pulse.
The ABI resolution and I pulse mode selection (described above) deter-
mine the width of the Index pulse and the corresponding shift in zero
position indication.
-4R -3R -2R -R 0 R +2R +3R +4R
+4R +3R +2R +R 0 -R -2R -3R -4R
9 bit AB resoluon
11 bit quad resoluon
R = ~0.176 degrees
RO bit = 0
0xFF80
to
0xFF9F
0xFFA0
to
0xFFBF
0xFFC0
to
0xFFDF
0xFFE0
to
0xFFFF
Ideal view as seen on scope, trigger
on rising edge of I pulse
A
B
I
Clockwise Rotaon
16 Bit PLL
Angle
(hex)
0x0000
to
0x001F
0x0020
to
0x003F
0x0040
to
0x005F
0x0060
to
0x007F
0x0080
to
0x009F
0xFF9F
to
0xFF80
9 bit AB resoluon
11 bit quad resoluon
R = ~0.176 degrees
RO bit = 0
Counter Clockwise Rotaon
16 Bit PLL
Angle
(hex)
0x009F
to
0x0080
0x007F
to
0x0060
0x005F
to
0x0040
Ideal view as seen on scope, trigger
on rising edge of I pulse
A
B
I
0x003F
to
0x0020
0x001F
to
0x000
0xFFFF
to
0xFFE0
0xFFDF
to
0xFFC0
0xFFBF
to
0xFFA0
Scope Trigger
Sensor "Zero" and
Ideal Mechanical "Zero"
Scope Trigger
Sensor "Zero" and
Ideal Mechanical "Zero"
Figure 20: Index Pulse Corresponding to “Zero” Position
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
21
Allegro MicroSystems, LLC
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SLEW RATE LIMITING FOR ABI
Slew rate limiting is enabled when the “abi_slew_limit” field is non-
zero. This option separates the sample update rate from the ABI output
rate, and can be used to control two circumstances:
The angle sample does not monotonically increase or decrease at the
quadrature resolution, thereby “skipping” one or more quadrature
states. In this case, the slew rate limiting logic transitions the ABI
signals in the required valid sequence, at the slew rate, until the
ABI output “catches up” with the angle samples, at which point the
normal sample rate output resumes. This skipping will most likely
occur either at very low velocities, if the noise is high, or at very
high velocities when the angle changes more than the quadrature
resolution in one angle sample period.
The ABI receiver at the host end cannot reliably detect edge
transitions that are spaced at the sample rate of 1 µs. The slew limit
time can be set greater than the nominal angle sample update period,
providing the velocity of the angle rotation would not on average
require ABI transitions greater than the angle sample rate.
In both cases, the ABI output will correctly track the rotation position;
however, the speed of the ABI edges will be accomplished at the slew
rate limit set in EEPROM. Whenever slew rate limiting occurs, the SRW
flag in the WARN serial register will assert informing the system of the
occurrence.
A
B
Q4 Q2 Q4 Q2 Q3
X X + 2R° X 2R°
Q1
X +
Actual
Bad AB
A
B
X
X +
X 2R°X +
Output X + 2R°
X +
X
Q4 Q1 Q3Q1
Good AB
Q2 Q1 Q4 Q1 Q2
Without Slew Rate Liming
With Slew Rate Liming
X X + 2R° X 2R°X +
Actual
Slew
Time
Figure 21: Slew Rate Limiting
Precision, High Speed, Hall-Effect Angle Sensor IC
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A1339
22
Allegro MicroSystems, LLC
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Brushless DC Motor Output (UVW)
The A1339 offers U, V, and W signals for stator commutation of
brushless DC (BLDC) motors. The device is mode-selectable for
1 to 16 pole-pairs. The BLDC signals (U, V, and W), are gener-
ated based on the quantity of pole-pairs and on angle information
from the angle sensor. The U, V, and W outputs switch when the
measured mechanical angle crosses the value where a change
should occur. If hysteresis is used, then the output update method
is different. The output behavior when hysteresis is enabled is
described in the Angle Hysteresis section. Figure 22 and Figure
23 below show the UVW waveforms for three and five pole-pair
BLDC motors.
U
V
0 120 240 0 120 240 0 120 240 0
0 150 300 90 30240 180 330 120 270 21060 0
0 30 60 90 150120 180 210 240 270 330300 0
0 040 80 120 160 200 240 280 320
W
Electrical
Angle
Mechanical
Angle
Electrical
Angle
Mechanical
Angle
U
V
W
Figure 22: U, V, W Outputs for Three Pole-Pair BLDC Motor
U
V
0 120 240 0 120 240 0 120 240 0
0 150 300 90 30240 180 330 120 270 21060 0
0 30 60 90 150120 180 210 240 270 330300 0
0 040 80 120 160 200 240 280 320
W
Electrical
Angle
Mechanical
Angle
Electrical
Angle
Mechanical
Angle
U
V
W
Figure 23: U, V, W Outputs for Five Pole-Pair BLDC Motor
Precision, High Speed, Hall-Effect Angle Sensor IC
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A1339
23
Allegro MicroSystems, LLC
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Table 3: UVW Pole Pair Settings
Quantity of Poles
(“resolution_pairs”)
Quantity of
Pole-Pairs
Conversion from Electrical
Degrees to Mechanical Degrees
Electrical (°) Mechanical (°)
0000 1 90 90
0001 2 90 45
0010 3 90 30
0011 4 90 22.5
0100 5 90 18
0101 6 90 15
0110 7 90 12.857…
0111 8 90 11.25
1000 9 90 10
1001 10 90 9
1010 11 90 8.1818…
1011 12 90 7.5
1100 13 90 6.9231…
1101 14 90 6.4286…
1110 15 90 6
1111 16 90 5.625
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
24
Allegro MicroSystems, LLC
955 Perimeter Road
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Angle Hysteresis
Hysteresis can be applied to the compensated angle to moderate
jitter in the angle output due to noise or mechanical vibration.
In the A1339, the hysteresis field (ANG.hysteresis) defines the
width of an angle window at 14-bit resolution. Mathematically,
the width of this window is:
HYSTERESIS × (360 / 16384) degrees ,
HYSTERESIS is a 6-bit wide EEPROM field, allowing a range
of 0 to 1.384 degrees of hysteresis to be applied.
The hysteresis-compensated angle can be routed to the ABI or
UVW interface by setting the AHE bit in EEPROM to a 1 (bit
12 of address 0x19). On the SPI or Manchester interface, the
hysteresis-compensated angle can be read via an alternate register
(HANG.angle_hys) at 12-bit resolution.
The effect of the hysteresis is shown in Figure 24. The current
angle position as measured by the sensor is at the “head” of
the hysteresis window. As long as the sensor (electrical) angle
advances in the same direction of rotation, the output angle will
be the sensor angle, minimizing latency. If the sensor angle
reverses direction, the output angle is held static until the sensor
angle exits the hysteresis window in either direction. If the exit
is in the opposite direction of rotation where the “head” was, the
head flips to the opposite end of the hysteresis window and that
becomes the new reference direction. The current direction of
rotation, or “head” for the purposes of hysteresis, is viewable via
the STA.rot bit, where 0 is increasing angle direction and 1 is in
decreasing angle direction.
This behavior has the following consequences:
1. If the hysteresis window is greater than the output resolution,
the output angle will skip consecutive resolution steps.
2. If there is jitter due to noise or mechanical vibration, especially
at a static angle position or very slow rotation, the angle will
tend to bias to one side of the window, depending on the direc-
tion of rotation as the angular velocity approaches zero (i.e.,
towards the current “head”) rather than to the average position
of the jitter.
2.32.22.1
Rotaon
2.01.9 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.11.81.7
Hysteresis
Hysteresis
Hysteresis
Hysteresis
Hysteresis
Hysteresis
Hysteresis
Rotaon
Rotaon
2.7
2.8
2.9
2.9
2.9
2.9
2.9
3.0
3.0
3.0
3.0
3.0
2.5
2.4
2.3
2.3
2.3
Rotaon
Rotaon
Rotaon
Rotaon
Rotaon
Rotaon
Rotaon
Electrical Angle
TIME
OUTPUT ANGLE
Hysteresis
Hysteresis
Hysteresis
Hysteresis
Hysteresis
Hysteresis
Hysteresis
Hysteresis
Hysteresis
Hysteresis
Hysteresis
Sensor angle posion
Window of hysteresis
Sensor angle and output angle the same
Output angle
Direcon of rotaon as seen by the hysteresis logic
Angle Jump
Figure 24: E󰀨ect of Hysteresis
Note: The rotation direction resets to 0, or increasing angle direction. At power-up or exiting low power mode, or after LBIST, the hysteresis window will always
be behind the initial angle position, so if hysteresis is enabled a decreasing angle direction of rotation will not register until the hysteresis window is past.
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
25
Allegro MicroSystems, LLC
955 Perimeter Road
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Low Power Mode
Low Power Mode (LPM) is an automatic duty cycling between a
reduced-power angle sampling “wake” state and a minimal power
“sleep” state. Low power mode is only entered if a set of condi-
tions is met (this is shown graphically in Figure 26):
The SPI pins have to be low, AND
The change of the magnetic field angle has to be below the
programmed threshold, AND
The WAKE pin voltage must be below the WAKE pin falling
threshold, AND
Low Power Mode is enabled
In Low Power Mode (LPM), the IC does not provide angle read-
ings over the SPI, Manchester, ABI/UVW, or the PWM inter-
faces, the majority of the analog and digital circuitry are powered
down, and the sensor IC periodically cycles between two differ-
ent states. For most of the time, the sensor IC is held in a lower
power quiescent current “sleep” state (ICC ≈ 75 µA). In this state,
power is removed from the analog transducer and no angle mea-
surements take place.
Periodically, the sensor IC will enter an “awake” state to monitor
the magnet position via a reduced power signal path and update
the turns count (ICC ≈ 8 mA). The sleep time of the Low Power
Mode operation can be adjusted by the user, based on the applica-
tion, by programming on-chip EEPROM memory.
In case the change of angle between successive samples is larger
than a set threshold, the sensor will stay in its “wake” state to
prevent missing a potential rotation.
STATE TRANSITIONS WITHIN LOW POWER MODE
The SPI input pins are used as the primary arbiter of low power
mode. When all three pins inputs (MOSI, SCLK, CSN) are pulled
low for at least 64 µs, the sensor enters a semi-low power state in
which the PLL and some other logic are disabled (including SPI
and Manchester), the I/O regulator is turned off, and the PWM
pin is tristate. Only the low power angle sensing path is enabled
in order to update the turns counter and measure angular velocity.
This state is called the “wake” state.
In the “wake” state, the velocity and WAKE pin are monitored.
Once the velocity is below the threshold set in the EEPROM and
the WAKE pin is below the low threshold level, the sensor enters
“sleep”. The low frequency oscillator remains on, with a coun-
ter for the sleep period (“lpm_cycle_time”) and logic to detect
SPI/WAKE pin going high active. Expiration of the counter or
assertion of the WAKE pin signal transitions the sensor from the
“sleep” state to the “wake” state to update the turns counter and
measure the velocity based on change in angle from the previous
“wake” state. If the velocity exceeds the threshold, the sensor
remains awake and updating the turns counter.
The SPI pins must change from their all-zeros state to resume
normal mode operation; this will be followed by a settle time for
the PLL to lock before angle output and temperature update is
resumed.
All decisions about entering the “sleep” state are made at the
end of the “lpm_cycle_time”, which runs continuously no matter
what state the sensor is in. Therefore the sensor only can enter
“sleep” on those time boundaries.
AVERAGE CURRENT CONSUMPTION IN LPM
Assuming the sensor is moving between the two LPM states in
a periodic manner, the effective current draw observed from the
system is the average of the two different current consumptions,
weighted by the time of each state.
ICC(AVGlp) =
tLPsleep
ttotal
× ILPsleep +
tLPwake
ttotal
× ILPwake
where:
ttotal = tLPsleep + tLPwake
tLPwake = 160 μs
The wake state time (tLPwake) is fixed by Allegro at 160 µs (typi-
cal value). This is the amount of time the sensor requires to take
an accurate “snapshot” of the magnetic position.
The amount of time the sensor spends in “sleep” mode is pro-
grammable via EEPROM, between 8.192 and 524 ms.
Figure 25 depicts the typical LPM ICC over different Sleep times.
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
26
Allegro MicroSystems, LLC
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0 100 150 200 250 300 350 400 450 500
Sleep Time (ms)
80
100
120
140
160
180
200
Average I
CC
(µA)
Average I
CC
vs. Low Power Mode Sleep Time
50
Figure 25: Typical Average Low Power Mode Current Consumption; TA = 25°C, VCC = 16 V
Precision, High Speed, Hall-Effect Angle Sensor IC
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A1339
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Allegro MicroSystems, LLC
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LPC.tpmd == 0, AND
SCK < VIL for 64 µs, AND
< VIL for 64 µs, AND
MOSI < VIL for 64 µs, AND
specialcode for
transport mode is set
SCK > VIL, OR
CS > VIL, OR
MOSI > VIL
( Angle change during
“lpm_cycle_me” <
“lpm_wake_threshold”) , AND
SCK, , MOSI < VIL, AND
WAKE pin < threshold
( (“lpm_cycle_me”
mer expired) OR
(WAKE pin > threshold) )
AND
SCK, , MOSI < VIL
SCK, CSB, MOSI < VIL
AND
( (Angle change over
“lpm_cycle_me” >
“lpm_wake_threshold”) OR
(WAKE pin > threshold) )
SCK > VIL, OR
> VIL, OR
MOSI > VIL
SCK > VIL, OR
> VIL, OR
MOSI > VIL
Low power mode
“Sleep” state
“Wake” state
Full power mode
Power-on
reset
Transport
mode
( ( LPC.tpmd == 1 ) OR (“specialcode for
transport mode not set) ) ) AND
LPC.lpmd == 0, AND
SCK < VIL for 64 µs, AND
< VIL for 64 µs, AND
MOSI < VIL for 64 µs
CS
CS
CS
CS
CS
CS
Figure 26: Low Power Mode Flowchart
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
28
Allegro MicroSystems, LLC
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When using the default settings, the diagram can be simplified to the one below (Figure 27):
SCK < VIL for 64 µs, AND
< VIL for 64 µs, AND
MOSI < VIL for 64 µs, AND
“special” code for
transport mode is set
SCK > VIL, OR
> VIL, OR
MOSI > VIL
speed < 100 RPM
AND
SCK, CS, MOSI < VIL
( (100 ms mer expired)
AND
SCK, , MOSI < VIL
SCK, , MOSI < VIL
AND
( ( speed > 100 RPM ) OR
(WAKE pin > threshold) )
SCK > VIL, OR
> VIL, OR
MOSI > VIL
SCK > VIL, OR
> VIL, OR
MOSI > VIL
Low power mode
“Sleep” state
“Wake” state
Full power mode
Power-on
reset
Transport
mode
“special” code for transport
mode not set, AND
SCK < VIL for 64 µs, AND
< VIL for 64 µs, AND
MOSI < VIL for 64 µs
OR
(WAKE pin > threshold) )
CS
CS
CS
CS
CS
CS
CS
Figure 27: Simplied Low Power Flowchart, Default Settings
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
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Allegro MicroSystems, LLC
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WAKE Pin
The A1339 also offers a WAKE input pin. This pin is intended to
bring the sensor out of its sleep state in the special case where the
motor acceleration is too high and the system cannot afford to wait
for the entire Sleep time to expire. This is illustrated in Figure 26 and
Figure 27. When the voltage threshold on the WAKE pin exceeds
VWAKE(HITH), the IC will enter the “wake” state of LPM and track
turns. It is important to emphasize that during this state (with the
WAKE pin high) the sensor is kept in the “Wake” state of LPM. The
IC does not produce angles, but instead tracks turns at a faster rate
than otherwise would be accomplished during typical LPM operation
(i.e. alternating between Sleep and WAKE states). This pin is usually
connected to a filtered version of the back-EMF voltage signal from
the motor being used. This allows fast feedback from the motor to the
Turns-Count circuit, in the case of high acceleration events. A symbolic
waveform representation of the back EMF for a Star 3-phase motor, as
well as a sample filtering circuit, are shown below.
0 60 120 180 240 300 360
4
2
0
–2
–4
–6 Rotor Position (Deg. Elect.)
Back-EMF (V)
1
2
3
Back-EMF Frequency and Amplitude α motor RPM.
(Motor BEMF frequency and amplitude are both proportional to motor RPM.)
Figure 28: Back EMF of Star, 3-Phase Motor
1
2
3Zener Diode
(for protection)
To WAKE Pin
Schottky
Diodes
3-Phase “Star”
Motor Winding
Figure 29: Sample Filtering Circuit
Precision, High Speed, Hall-Effect Angle Sensor IC
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A1339
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Allegro MicroSystems, LLC
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This rectified voltage is based
on simulating BEMF signals
for a motor running at ~100 RPM.
V1
SINE(0 0.6 9 0 0 0)
SINE(0 0.6 9 0 0 120)
SINE(0 0.6 9 0 0 240)
V2
V3
D1
BAT46WJ
D2
BAT46WJ
R1
1 kΩ
R2
1 kΩ
R3
1 kΩ
R7
20 kΩ
R6
20 kΩ
R5
20 kΩ
R4
20 kΩ
D4
MBR0540
D5
MBR0540
D6
MBR0540
D3
BAT46WJ
Figure 30: SPICE Simulation Example for
Filtered BEMF Signal
Precision, High Speed, Hall-Effect Angle Sensor IC
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A1339
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Allegro MicroSystems, LLC
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The A1339 features a programmable threshold and programmable hys-
teresis for the the WAKE pin. Rising and corresponding falling thresh-
olds are set via the WP_HYS and WP_THRES fields in EEPROM. The
following table provides a list of combinations.
Table 4: Nominal WAKE Pin Threshold Levels
WP_THRES WP_HYS Threshold (rising)
(mV)
Hysteresis Voltage
(mV)
Threshold (falling)
(mV)
Bit2 Bit1 Bit0 Bit1 Bit0
0 0 0 0 0 300 50 250
0 0 0 0 1 300 150 150
0 0 0 1 0 300 300 100
0 0 0 1 1 300 400 100
0 0 1 0 0 350 50 300
0 0 1 0 1 350 150 200
0 0 1 1 0 350 300 100
0 0 1 1 1 350 400 100
0 1 0 0 0 400 50 350
0 1 0 0 1 400 150 250
0 1 0 1 0 400 300 100
0 1 0 1 1 400 400 100
0 1 1 0 0 450 50 400
0 1 1 0 1 450 150 300
0 1 1 1 0 450 300 150
0 1 1 1 1 450 400 100
1 0 0 0 0 500 50 450
1 0 0 0 1 500 150 350
1 0 0 1 0 500 300 200
1 0 0 1 1 500 400 100
1 0 1 0 0 550 50 500
1 0 1 0 1 550 150 400
1 0 1 1 0 550 300 250
1 0 1 1 1 550 400 150
1 1 0 0 0 600 50 550
1 1 0 0 1 600 150 450
1 1 0 1 0 600 300 300
1 1 0 1 1 600 400 200
1 1 1 0 0 650 50 600
1 1 1 0 1 650 150 500
1 1 1 1 0 650 300 350
1 1 1 1 1 650 400 250
Precision, High Speed, Hall-Effect Angle Sensor IC
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A1339
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Allegro MicroSystems, LLC
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Turns Counting and Low Power Mode
Certain automotive angle sensing applications require the ability to track
angular position, even in key-off conditions. In the key-off state, most
voltage regulators in the vehicle are not operational. Therefore, sensors
that must operate in the key-off state are often powered directly from the
car battery (12 V). Examples of such applications include:
Seat-belt passive safety systems
EPS motor position
Often, these motor and seat-belt systems are geared down so that mul-
tiple angle sensor rotations need to be counted by the angle sensor IC.
For this reason, the A1339 includes a circuit that counts the rotational
turns of a magnet. When sensor ICs are connected to the car battery, they
must also have low-power modes that enable efficient battery usage.
Very often, a sensor IC must track the turns-count (TCs) of the magnet
even when the vehicle is in the key-off state. The A1339 monitors and
keeps track of TCs, even when set to Low Power Mode. This will ensure
that the system can accurately and consistently track steering wheel posi-
tion or seat-belt extension when using the A1339 in a key-on or key-off
mode. Traditionally, this key-off requirement is achieved by a combina-
tion of relatively complex mechanical and electronic components. The
A1339 can reduce system-level complexity and eliminate many system
components by performing both the absolute angle measurement and the
tracking of TCs, while maintaining low battery power consumption at
vehicle key-off.
The A1339 uses a low power signal path measurement to determine and
keep track of turns counts, to within the specified Turns Count resolu-
tion. The design minimizes the amount of logic that is drawing power
during the low-power awake periods, allowing for efficient turns count
tracking during battery-operated low-power modes. The turns counter
logic tracks the turns in either 45 or 180 degree increments, based on
the T45 register field. Due to its emphasis on low power, the signal path
which tracks total turns does not implement the same angle compensa-
tion as the primary signal path. Because of this, the turns count value
will not precisely match the primary angle output.
The turns counter saturates at +2047 and –2048 in the 45-degree mode
and +511 and –512 in the 180-degree mode. If this happens, the
Turns Count Warning Flag (bit 0 of serial register 0x26) will assert
and stay asserted until the turns counter is reset via the Control register
(serial register 0x1E). (see Primary Serial Interface Registers Reference
section).
During Low Power mode, the A1339 periodically measures the magnet
position, and updates the turns count based off the angular change from
the previous angle measurement. If the angle changes by ≥180 degrees, the
direction change is ambiguous and will be interpreted as a rotation in the
opposite direction. Any sample-to-sample delta greater than 135 degrees
will set the Turns Count Warning Flag (serial register 0x26, bit 3). This
is intended to give some indication relative to the low-power mode cycle
time as to whether the velocity is high enough over that sleep period for
the angle delta to be getting close to the 180 point of ambiguity.
Time
0 t 2t 3t 4t 5t 6t 7t
Big Gear Angle
(degrees)
0
100
200
300
Big Gear (40 Teeth)
Time
0 t 2t 3t 4t 5t 6t 7t
Small Gear Angle
(degrees)
0
100
200
300
Small Gear (8 Teeth)
Time
0 t 2t 3t 4t 5t 6t 7t
Turns Count
Output
0
10
20
30
40 A1339 Turns Count
180 Degree Count
45 Degree Count
CW
Rotation
CCW
Rotation
12 V
A1339
Small Gear
Big
Gear
Magnet
Figure 31: Example of a Turns Counting Application
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
33
Allegro MicroSystems, LLC
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INVOKING A TURNS COUNTER RESET
Resetting the turns counter is a command invoked using the
“special” field of the CTRL register (Register address 0x1E, see
Primary Serial Interface Reference). Following a reset, turns are
tracked relative to that point, as measured by the LPM signal path
(ZCD).
Transport Mode
Transport mode is effectively “sleep” mode, but with the low
frequency oscillator disabled such that no turns counting occurs.
To invoke transport mode, the serial CTRL.special field is set
to 6. Then when low power mode is enabled (SPI inputs 0 for >
64 μs), transport mode is entered. As soon as one of the incoming
SPI lines is high, the A1339 will wake up again. Transport mode
can be disabled using the customer EEPROM setting “tpmd”.
Precision, High Speed, Hall-Effect Angle Sensor IC
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A1339
34
Allegro MicroSystems, LLC
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The A1339 can be programmed in two ways:
Using the SPI interface for input and output, while supplying
the VCC pin with normal operating voltage
Using a Manchester protocol on the supply pin for input, and
the PWM pin for output.
The A1339 does not require special supply voltages to write to
the EEPROM.
All setting fields and all data fields of the sensor can be read
and written using both protocols. If EEPROM locking is used
(detailed in EEPROM lock section), then write access using
either of the protocols will be prevented.
A separate setting to completely disable the Manchester interface
is available in the dm field of the EEPROM. Using this setting
will cause the sensor to ignore any commands entered using
Manchester protocol. The SPI interface will not be disabled by
disabling the Manchester interface.
Interface Structure
The A1339 consists of two memory blocks: Primary serial
registers, and extended memory (shadow and EEPROM). The
primary serial interface registers are used for direct writes and
reads by the host controller for frequently required informa-
tion (for example, angle data, warning flags, field strength, and
temperature). All forms of communication (even to the extended
locations) operate through the primary registers, whether it be via
SPI or Manchester.
The primary serial registers also provide a data and address loca-
tion for accessing extended memory locations. Accessing these
extended location is done in an indirect fashion: the controller
writes into the primary interface to give a command to the sensor
to access the extended locations. The read/write is executed and
the result is again presented in the primary interface.
This concept is shown in Figure 32 below.
For writing extended locations, the primary interface offers the
registers “ewcs”, “ewa”, “ewdh”, and “ewdl”. “ewa” holds the
extended address that should be written, and “ewdh” / “ewdl”
contain the two high bytes and the two low bytes for the extended
location contents. The “ewcs” register is used for commands and
status information. Refer to the section “Read Transaction from
EEPROM” for further information and other register fields asso-
ciated with read transactions.
For reading extended locations, the primary interface offers
the registers “ercs”, “era”, “erdh”, and “erdl”. “era” holds the
extended address the should be read, and “erdh” / “erdl” con-
tain the two high bytes and the two low bytes for the extended
location contents. The “ercs” register is used for commands and
status information. Refer to the section “Read Transaction from
EEPROM” for further information and other register fields asso-
ciated with read transactions.
EEPROM writing requires additional procedures. For more infor-
mation on EEPROM and shadow memory read and write access,
see EEPROM and Shadow Memory section.
The primary serial interface can be accessed using the SPI and
using the Manchester interface. These two interfaces are detailed
in the following sections.
DEVICE PROGRAMMING INTERFACES
Primary Serial Interface
02:03 Extended Write Address
04:05 Extended Write Data High
06:07 Extended Write Data Low
08:09 Extended Write Control/Status
0A:0B Extended Read Address
0E:0F Extended Read Data High
10:11 Extended Read Data Low
0C:0D Extended Read Control/Status
Extended locaons
Shadow
address
0x58
0x59
0x60
...
...
0x61
1E:1F Device Control
20:21 Angle
EEPROM
address
0x17
0x18
0x19
0x20
...
...
0x21
Name
CU2
PWE
ABI
MSK
...
...
PWI
Write data
Read data
Address Funcon
SPI / Manchester IF
User
Figure 32: Serial Registers allow access to extended memory (EEPROM and Shadow)
Precision, High Speed, Hall-Effect Angle Sensor IC
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A1339
35
Allegro MicroSystems, LLC
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Sensor
VCC
GND
Host
SPI
Fixed supply
voltage, e.g. 5 V
R/W commands and
return data (SPI)
GND
Figure 33: SPI Interface Programming Setup
Input to A1339
CSx
SCLKx
MOSIx
CSx
SCLKx
MISOx
Output from A1339
tCS_IDLE
tCS
tSU tHD
tCHD
tSCLKL tSCLKH
R / W
DO-15 DO-14
Register Contents
DO-x
tCS_IDLE
tCS tCHD
tSCLKL
tDAV
tSCLKH
Figure 34: SPI Interface Timings Input
SPI Interface
The A1339 provides a full-duplex 4-pin SPI interface for each
die, using SPI mode 3 (CPHA = 1, CPOL = 1). All programming
can be done using this interface, but all programming can also be
done using the Manchester interface.
In addition to providing a communications interface, the SPI
interface is also used to control entering and leaving of the low
power and transport modes. If the SPI interface is not used, do not
leave the chip select line floating but instead follow the recom-
mendations in the “Typical Application Diagram” section.
The sensor responds to commands received on the MOSI (Mas-
ter-Out Slave-In), SCLK (Serial Clock), and CSB (Chip Select)
pins, and outputs data on the MISO (Master-In Slave-Out) pin.
All three input pins are 3.3 V and 5 V SPI compatible, with
threshold values determined by factory EEPROM settings. MISO
output voltage level will conform to 3.3 V or 5 V SPI levels,
based on factory settings. Regular part are shipped with 3.3 V
interface. Contact Allegro for ordering options of the 5 V variant.
The setup for communication using the SPI interface is given
below.
Input to A1339 CSx
SCLKx
MOSIx
CSx
SCLKx
MISOx
Output from A1339
tCS_IDLE
tCS
tSU tHD
tCHD
tSCLKL tSCLKH
R / W
DO-15 DO-14
Register Contents
DO-x
tCS_IDLE
tCS tCHD
tSCLKL
tDAV
tSCLKH
Figure 35: SPI Interface Timings Output
TIMING
The interface timing parameters from the specification table are
defined in the figures below.
Precision, High Speed, Hall-Effect Angle Sensor IC
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A1339
36
Allegro MicroSystems, LLC
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Characteristics Symbol Test Conditions Min. Typ. Max. Unit
SPI INTERFACE SPECIFICATIONS (for 3.3 V SPI Mode)
Digital Input High Voltage VIH MOSI, SCLK, CS pins 2.8 3.63 V
Digital Input Low Voltage VIL MOSI, SCLK, CS pins 0.5 V
SPI Output High Voltage VOH
MISO pins, CL = 20 pF, TA = 25°C,
5 V compliant 2.93 3.3 3.63 V
SPI Output Low Voltage VOL MISO pins, CL = 20 pF 0.3 V
SPI INTERFACE SPECIFICATIONS (for 5.0 V SPI Mode) (Contact Allegro for 5 V SPI ordering information)
Digital Input High Voltage VIH MOSI, SCLK, CS pins 3.75 5.5 V
Digital Input Low Voltage VIL MOSI, SCLK, CS pins 0.5 V
SPI Output High Voltage VOH MISO pins, CL = 20 pF, TA = 25°C, VCC ≥ 5.0V 4 5 5.5 V
SPI Output Low Voltage VOL MISO pins, CL = 20 pF 0.3 V
SPI INTERFACE SPECIFICATIONS
SPI Clock Frequency
[1] fSCLK MISO pins, CL = 20 pF 0.1 10 MHz
SPI Clock Duty Cycle
[1] DfSCLK SPICLKDC 40 - 60 %
SPI Frame Rate
[1] tSPI 5.8 588 kHz
Chip Select to First SCLK Edge
[1] tCS Time from CS going low to SCLK falling edge 50 ns
Chip Select Idle Time [1] tCS_IDLE
Time CS must be high between SPI message
frames 200 ns
Data Output Valid Time
[1] tDAV Data output valid after SCLK falling edge 30 ns
MOSI Setup Time
[1] tSU Input setup time before SCLK rising edge 25 ns
MOSI Hold Time
[1] tHD Input hold time after SCLK rising edge 50 ns
SCLK to CS Hold Time
[1] tCHD Hold SCLK high time before
¯
CS rising edge 5 ns
Load Capacitance
[1] CLLoading on digital output (MISO) pin 20 pF
[1] Parameter is not guaranteed at final test. Determined by design.
Precision, High Speed, Hall-Effect Angle Sensor IC
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Allegro MicroSystems, LLC
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MESSAGE FRAME SIZE
The SPI interface requires either 16, 17, or 20-bit packet lengths.
An extended 20-bit SPI packet allows 4 bits of CRC to accom-
pany every data packet. A 17-bit packet is only allowed if the
EEPROM/Shadow bit “s17” (bit 1 of EEPROM 0x1B) is set to 1.
CSN
SCLK
MISO
MOSI 15 14 1 0
Figure 36: Sixteen Bit SPI Transaction
CSN
SCLK
MISO
MOSI 15 14 1 0 X
Figure 37: Seventeen Bit SPI Transaction
CSN
SCLK
MISO
MOSI 15 14 1 0 C3 C2 C1 C0
Figure 38: Twenty Bit SPI Transaction
If more clock pulses than expected were detected by the sensor in
an SPI transaction, the interface warning “warn.ier” will activate.
This warning will not activate on clean SPI transactions with 16
or 20 bit, or with clean 17-bit transactions when “s17” is enabled.
The purpose of the 17-bit SPI option is to allow delayed reading of
the MISO line by the host. Some host allow to sample data from
the slave not on the rising edge, but on the next falling edge of
SCLK. This way, in case of long interface delays caused by large
line capacitance or very long cables, the permissible clock speed
can be increased. However, a 17th falling edge is required to read
the 16th bit coming from the sensor. For the sensor to not display
an error when this 17th clock is found, the bit “s17” must be set.
WRITE CYCLE
Write cycles consist of a 1-bit low, a 1-bit R/W (write = high),
6 address bits (corresponding to the primary serial register), 8
data bits, and 4 optional CRC bits. To write a full 16-bit serial
register, two write commands are required (even and odd byte
addresses). MOSI bits are clocked in on the rising edge of the
Master-generated SCLK signal.
READ CYCLE
Reading data always involves at least two SPI frames. In the first
frame, the read command is sent, while in the second frame, the
result from the first read is received. While receiving data from
the last read command, it is possible to send another read com-
mand (duplexed read). This way, every frame except the first one
contains data from the sensor. This is useful for very fast reading
of angle information.
When receiving the last frame, the host can transmit a command
with MOSI set to all zeros. This represents a read command from
register 0x00 and will not cause any reaction from the sensor.
Reading from register 0x00 will output the value 0x0000.
In frames where no previous read command was sent, the MISO
data output should be ignored.
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Because an SPI read command can transmit 16 data bits at one
time, and the primary serial registers are built from one even
and one odd byte, the entire 16-bit contents of one serial register
may be transmitted with one SPI frame. This is accomplished by
providing an even serial address value. If an odd value address
is sent, only the contents of the single byte will be returned, with
the eight most significant bits within the SPI packet set to zero.
Example: To read all 16 bits of the error register (0x24:0x25), an
SPI read request using address 0x24 should be sent. If only the
8 LSBs are desired, the address 0x25 should be used. Figure 39
shows examples of both an SPI write and an SPI read request,
using a 16-bit SPI message frame.
CSx
SCLKx
MOSIx
MISOx
A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
SCLKx
MOSIx
MISOx
R/W
Input
latched
Input
latched
12345678910 11 12 13 14 15 16
12345678910 11 12 13 14 15 16
12345678910 11 12 13 14 15 16
CSx
CSx
SCLKx
MOSIx
MISOx
R
/
W
R
/
W
A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
Register Contents (previous Read command selection, or Don’t Care)
Register Contents (previous Read command selection, or Don’t Care)
Register Contents (previous Read command selection, or Don’t Care)
DO-15 DO-14 DO-13 DO-12 DO-11 DO-9 DO-8 DO-7 DO-6 DO-5 DO-4 DO-3 DO-2 DO-1 DO-0DO-10
DO-15 DO-14 DO-13 DO-12 DO-11 DO-9 DO-8 DO-7 DO-6 DO-5 DO-4 DO-3 DO-2 DO-1 DO-0DO-10
DO-15 DO-14 DO-13 DO-12 DO-11 DO-9 DO-8 DO-7 DO-6 DO-5 DO-4 DO-3 DO-2 DO-1 DO-0DO-10
Figure 39: SPI Read and Write Pulse Sequences
(A) SPI Write example
(duplexed read available)
(B) SPI Read example:
register selection
(duplexed read available)
(C) SPI Read example:
data output from
selected register
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CRC
If the user want to check the data coming from the sensor, it is pos-
sible to use 20-bit SPI frames. Without additional setting required,
a 4-bit CRC is automatically generated and placed on the MISO
line if more than 16 bits are read from the sensor.
The four additional CRC bits on the MOSI line coming from
the host are ignored by the sensor, unless the “PWI.sc” bit is set
within EEPROM (0x1B, bit 0). When the incoming CRC check
is enabled, an incoming SPI packet with an incorrect CRC will be
discarded, and the CRC error flag set in serial register “warn.crc”.
The CRC is based on the polynomial x4 + x + 1 with the linear
feedback shift register preset to all 1s. The 16-bit packet is shifted
through from bit 15 (MSB) to bit 0 (LSB). The CRC logic is
shown in Figure 40. Data are fed into the CRC logic with MSB
first. Output is sent as C3-C2-C1-C0.
Input Data
C0 C1 C2 C3
Figure 40: SPI CRC
The CRC output by the sensor on the MISO pin will always be
correct. The CRC from the host on the MOSI pin must be correct
if the CRC enable bit PWI.sc in the EEPROM was set.
Note: If the ERD (extended read data) register is read before the
“ERCS.ERD” bit indicates a read has completed, there is a pos-
sibility of a CRC error, as the data could change during the read.
Do not read the ERD register until it is known to be stable based
on the done bit indication or waiting sufficient time.
The CRC can be calculated with the following C code:
/*
* CalculateCRC
*
* Take the 16-bit input and generate a 4-bit CRC
* Polynomial = x^4 + x + 1
* LFSR preset to all 1’s
*/
uint8_t CalculateCRC(uint16_t input)
{
bool CRC0 = true;
bool CRC1 = true;
bool CRC2 = true;
bool CRC3 = true;
int i;
bool DoInvert;
uint16_t mask = 0x8000;
for (i = 0; i < 16; ++i)
{
DoInvert = ((input & mask) != 0) ^ CRC3; // XOR
required?
CRC3 = CRC2;
CRC2 = CRC1;
CRC1 = CRC0 ^ DoInvert;
CRC0 = DoInvert;
mask >>= 1;
}
return (CRC3 ? 8U : 0U) + (CRC2 ? 4U : 0U) + (CRC1 ? 2U
: 0U) + (CRC0 ? 1U : 0U);
}
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Manchester Interface
To facilitate addressable device programming when using the
unidirectional PWM, ABI or UVW protocols, without requiring
four additional SPI connections, the A1339 incorporates a serial
input on the VCC line and responds to read requests using the
PWM line.
This interface allows an external controller to read and write regis-
ters in the A1339 EEPROM and volatile memory. The device uses
a point-to-point communication protocol, based on Manchester
encoding per G.E. Thomas (a rising edge indicates a 0 and a falling
edge indicates a 1), with address and data transmitted MSB first.
The addressable Manchester code implementation uses the logic
states of the SA0/SA1 pins to set address values for each die. In
this way, individual communication with up to four A1339 dies is
possible. To prevent any undesired programming of the A1339, the
serial interface can be disabled by setting the Disable Manchester
bit, “PWI.dm”, to 1. With this bit set, the sensor will ignore any
Manchester input on VCC.
The setup for communication using the Manchester interface is
given in Figure 41.
Sensor
VCC
GND
Host
PWM
R/W commands
(Manchester code)
Return data
(Manchester code)
GND
to logic high supply
MOSI/SA1
CS/SA0
Set to logic high
or to GND to
choose target ID#
Figure 41: Manchester Interface Programming Setup
CONCEPT OF MANCHESTER COMMUNICATION
The Manchester interface allows programming and readout with
a minimal number of pins involved. This is beneficial for sen-
sor subassemblies connected to wiring harnesses, because less
connections are needed. The supply level is typically modulated
between 5 and 8 volts (VMAN(H) and VMAN(L)) to produce a “low”
and “high” signal. In the absence of a clock signal, Manchester
encoding is used, allowing the sensor to determine the bit rate
that the host is using.
The master can freely choose any supported Manchester commu-
nication frequency for each transaction. The sensor will recognize
the transaction speed used by the master and send the response at
the same data rate.
As Manchester commands are sent on the supply line, the speed
is usually limited by capacitances on the supply line. A reduction
of the bit rate, or using a stronger line driver, can help to ensure
stable communication.
If a correct read command was sent, the sensor responds to the
master using the open-drain output on the PWM line. The high
level will be determined by the PWM pull-up (usually 3.3 V or
5 V), and the low level will be close to GND. The PWM uses an
open drain output, setting the logic levels to GND and logic level
high (see Figure 41). A sufficient pull-up resistor (e.g. 4.7 kΩ)
must be used to pull the line to a maximum logic high level VIN.
ENTERING MANCHESTER COMMUNICATION MODE
Provided the Disable Manchester bit is not set in EEPROM, the
A1339 continuously monitors the VCC line for valid Manchester
commands. The part takes no action until a valid Manchester
Access Code is received.
There are two special Manchester code commands used to
activate or deactivate the serial interface and specify the output
format used during Read operations:
1. Manchester Access Code: Enters Manchester Communication
Mode; Manchester code output on the PWM pin. See further
paragraphs for example.
2. Manchester Exit Code; returns the PWM pin to normal opera-
tion. See further paragraphs for example.
Once the Manchester Communication Mode is entered, the PWM
output pin will cease to provide angle data, interrupting any data
transmission in progress.
TRANSACTION TYPES
The A1339 receives all commands via the VCC pin, and responds
to Read commands via the PWM pin. This implementation of
Manchester encoding requires the communication pulses be
within a high (VMAN(H)) and low (VMAN(L)) range of voltages on
the VCC line. Each transaction is initiated by a command from
the controller; the sensor does not initiate any transactions. Two
commands are recognized by the A1339: Write and Read.
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CONTROLLER MANCHESTER MESSAGE STRUCTURE
The general format of a command message frame is shown in
Figure 42. Note that, in the Manchester coding used, a bit value
of 1 is indicated by a falling edge within the bit boundary, and
a bit value of zero is indicated by a rising edge within the bit
boundary.
A brief description of each bit is provided in Table 6.
Table 6: Manchester Command General Format
Bits Parameter
Name Description
2 Synchronization Value '00' sent to identify a command start
and to synchronise sensor clock
1 Read/Write 0 = write, 1 = read
4 Target ID
Select the target ID for this transaction.
[ID3 ID2 ID1 ID0] are each adressed /
ignored by a 1 / 0 at their address, so that
a write to [0011] will write to ID0 and ID1.
Reading from several sensors at the same
time is not supported.
Writing to [0000] is a broadcast write; it is
written to all sensor dies.
6 Address Serial address for read/write
16 Data Only for writes: 16 bit write data. Omit for
read commands
3 CRC 3-bit CRC, needed for all commands
When the A1339 is operating in PWM mode, the Die ID value is
determined by the state of the CSN and MOSI pins, as detailed in
Table 7.
Table 7: Pin Values
MOSI/SA1 CS/SA0 ID Value
0 0 ID0
0 1 ID1
1 0 ID2
1 1 ID3
Using the 4 bits of the Chip Select field, die can be selected
via their ID value, allowing up to four die to be individually
addressed and providing for different group addressing schemes.
Example: If Target ID = [1 0 1 0], all die with ID3 or ID1 will be
selected. If Target ID is set to [0 0 0 0], then no ID comparison
will be made, allowing all sensors to be addressed at once. In
case of PWM line sharing for Manchester communication, read-
ing must be done one die at a time.
Table 8: Target ID
Target ID
ID3 ID2 ID1 ID0
Figure 42: Manchester Message Format
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SENSOR MANCHESTER MESSAGE STRUCTURE
If a read command with the desired register number was sent
from the controller to the sensor, the device responds with a Read
Response frame using the Manchester protocol over the PWM
output.
The following command messages can be exchanged between the
device and the external controller:
Manchester Access Code (host to sensor)
Manchester Exit Code (host to sensor)
Manchester Write Command (host to sensor)
Manchester Read Command (host to sensor)
Manchester Read Response (sensor to host)
In addition to the contents of the requested memory location, a
Return Status field is included with every Read Response. This field
provides the ID used to communicate with the part and any errors
which may have occurred during the transaction. These bits are:
ID – ID (CSN/MOSI) unless BC = 1 (ID will be 00)
BC – Broadcast; ID field was zero or SPI mode active
AEAbort Error; edge detection failure after sync detect
OR– Overrun Error; A new Manchester command has been
received before the previous request could be completed
CS – Checksum error; a prior command had a checksum error
For EEPROM address information, refer to the EEPROM
structure section. For serial address locations, refer to the serial
register map.
Synchronize Return Status
MSB
00
Data (16 Bits) CRC
...0/10/1 0/10/10/1 0/10/1 0/1 0/10/
10
/1 0/1 C2 C1 C0
Figure 43: Manchester Message Format
0 0 0 0 0 0 1 1 1 1 1 1 1 0 1 1 0 0 0 1 0 1 1 0 1 0 0 1 0 1 1 0
0x62 0xD2
Figure 44: Target ID = [0 0 0 1], Data = Access code = 0x62D2, CRC = ‘110’ 4.3.5.2
Table 9: Return Status Bits
Return Status Bits (5 bits)
543210
ID BC AE OR CS
MANCHESTER ACCESS CODE
The Manchester Access Code has to be sent before other Man-
chester commands.
The Manchester Access Code always operates as a broadcast
pulse, meaning the sensor will not look at the Target ID field. For
example, if two sensors configured with ID0 and ID1 respec-
tively are sharing a common VCC line, a Manchester Access
Code with a Target ID value of [0 0 1 0] results in both sensors
entering Manchester Serial Communication mode.
Table 10: Manchester Access Code
Bits Parameter Name Description
2 Synchronization ‘00’
1 Read/Write ‘0’
4 Target ID ‘0000’ (this command will always be a
broadcast, even if it is addressed)
6 Address ‘111111’ (fixed number for Manchester
access message)
16 Data 0x62D2 (fixed number for Manchester
access message)
3 CRC 3-bit CRC
An example is given below, with target ID = [0 0 0 1], data =
access code = 0x62D2, and CRC = ‘110’.
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MANCHESTER EXIT CODE
The Manchester Exit Code can be sent after Manchester access
is complete in order to avoid accidental decoding of Manchester
commands.
The Manchester Exit Code always operates as a broadcast pulse,
meaning the sensor will not look at the Target ID field. For exam-
ple, if two sensors configured with ID0 and ID1 respectively are
sharing a common VCC line, a Manchester Access Code with a
Target ID value of [0 0 1 0] results in both sensors exiting Man-
chester Serial Communication mode.
Table 11: Manchester Exit Code
Bits Parameter Name Description
2 Synchronization ‘00’
1 Read/Write ‘0’
4 Target ID ‘0000’ (this command will always be a
broadcast, even if it is addressed)
6 Address ‘111111’ (fixed number for Manchester
exit message)
16 Data 0x0000 (any value except 0x62D2 can
be used for Manchester exit message)
3 CRC 3-bit CRC
An example is given below, with target ID = [0 0 0 1], data =
0x0000, and CRC = ‘110’.
0 0 0 0 0 0 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0
0x00 0x00
Figure 45: Target ID = [0 0 0 1], Data = 0x0000, CRC = ‘110’
MANCHESTER READ COMMAND
Determines the serial address within the sensor from which the
next Read Response will transmit data. The sensor must first
receive a Manchester Access Code before responding to a read
command.
This command is sent by the controller.
Table 12: Manchester Read Command
Bits Parameter Name Description
2 Synchronization ‘00’
1 Read/Write ‘1’
4 Target ID Depends on targeted sensor ID, e.g. to
target ID0, use ‘0001’
6 Address Serial Register Address, e.g. 0x10 for
“read_data_lo”, or 0x20 for “angle”
3 CRC 3-bit CRC
An example is given below where register 0x20 “angle” is read
from target ID [0 0 0 1] with CRC = ‘111’. The two sync pulses
from the Read Response on the PWM return line are also shown.
0x20
0 0 0 0 0 0 0 0 0
00
01 1 11 1 1
Figure 46: Target ID = [0 0 0 1], “angle” = 0x20, CRC = ‘111’
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MANCHESTER READ RESPONSE
The read response transmits data from the sensor to the control-
ler after a read command. These data are sent by the sensor on the
open-drain PWM pin. A pull-up resistor is needed for this to work.
Read from an even address returns even byte [15:8] and odd byte
[7:0].
Read from an odd address returns odd byte [7:0] only. Data bits
[15:8] will be zeroes.
Table 13: Manchester Read Response
Bits Parameter Name Description
2 Synchronization ‘00’
2 ID Target ID of the responding sensor die. ‘00’ for ID0, ‘01’ for ID1, ‘10’ for ID2, ‘11’ for ID3.
1 BC flag “Broadcast”: Value set to ‘1’ if read command was a broadcast command (Target-ID set to [0 0 0
0]), ‘0’ if not
1 AE flag “Abort error”: Value set to ‘1’ if a previous transaction was aborted and discarded, typically caused
by incorrect bit lengths, ‘0’ is there was no problem. The error is stored until it can be transmitted
on the next read response, and is cleared afterwards.
1 OR flag “Overrun error”: If a command is sent to the sensor while the sensor is still sending a read
response, and this command is completely transmitted before the read response was finished, and
overrun error has occurred. This error is then stored until it can be transmitted on the next read
response, and is cleared afterwards.
1 CS flag “CRC error”: Value set to ‘1’ if a previous transaction had an incorrect CRC, ‘0’ means there was no
problem. The error is stored until it can be transmitted on the next read response, and is cleared
afterwards.
16 data Read from an Even address: even byte [15:8] and odd byte [7:0].
Read from an Odd address: odd byte [7:0] only. Data bits [15:8] will be zeroes.
3 CRC 3-bit CRC
An example is given below where register 0x20 “angle” is read,
and the response is ID ‘00’ (ID0), the four flags are all zeros (no
errors), the data is “0x5C34”, and the CRC is ‘100’.
0x20
0x5C 0x34
00 1 0 0 0 1 1 0 0 00 0 1 1 1
0 0 0 0 0 0 0 0 0 1011 1 0 0 0 0 1 1 0 1 0 1 0 0
0
Figure 47: ID = ‘00’, error ag = ‘0000’, Data = 0x5C34, CRC = ‘100’
MANCHESTER READ RESPONSE DELAY
The Manchester Read Reponse starts at the end of the Read
Command. The response may start a ¼ bit time before the CRC
is finished transmitting (overlap with last CRC bit) or ¼ after the
CRC finished transmitting.
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CRC
The serial Manchester interface uses a cyclic redundancy check
(CRC) for data-bit error checking of all the bits coming after
the two synchronization bits. The synchronization bits are not
included in the CRC. The CRC algorithm is based on the polyno-
mial:
g(x) = x3 + x + 1.
The calculation is represented graphically in Figure 48. The trail-
ing 3 bits of a message frame comprise the CRC token. The CRC
is initialized at 111. Data are fed into the CRC logic with MSB
first. Output is sent as C2-C1-C0.
Input DataC0 C1 C2
1 × x
0
1 × x
1
1 × x
2
1 × x
3
= x
3
× x × 1
Figure 48: Manchester CRC Calculation
The 3-bit Manchester CRC can be calculated using the following
C code:
// command: the manchester command, right justified, does
not include the space for the CRC
// numberOfBits: number of bits in the command not includ-
ing the 2 zero sync bits at the start of the command and the
three CRC bits
// Returns: The three bit CRC
// This code can be tested at http://codepad.org/yqTKnfmD
uint16_t ManchesterCRC(uint64_t data, uint16_t numberOfBits)
{
bool C0 = false;
bool C1 = false;
bool C2 = false;
bool C0p = true;
bool C1p = true;
bool C2p = true;
uint64_t bitMask = 1;
bitMask <<= numberOfBits - 1;
// Calculate the state machine
for (; bitMask != 0; bitMask >>= 1)
{
C2 = C1p;
C0 = C2p ^ ((data & bitMask) != 0);
C1 = C0 ^ C0p;
C0p = C0;
C1p = C1;
C2p = C2;
}
return (C2 ? 4U : 0U) + (C1 ? 2U : 0U) + (C0 ? 1U :
0U);
}
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EEPROM AND SHADOW MEMORY USAGE
The device uses EEPROM to permanently store configuration
parameters for operation. EEPROM is user-programmable and
permanently stores operation parameter values or customer
information. The operation parameters are downloaded to shadow
(volatile) memory at power-up. Shadow fields are initially loaded
from corresponding fields in EEPROM, but can be overwritten,
either by performing an extended write to the shadow addresses,
or by reprogramming the corresponding EEPROM fields and
power cycling the IC. Use of Shadow Memory is substantially
faster than accessing EEPROM. In situations where many
parameter need to be tested quickly, shadow memory is recom-
mended for trying parameter values before permanently program-
ming them into EEPROM. The shadow memory registers have
the same format as the EEPROM and are accessed at extended
addresses 0x40 higher than the equivalent EEPROM address.
Unused bits in the EEPROM do not exist in the related shadow
register, and will return 0 when read. Shadow registers do not
contain the ECC bits. Shadow registers have the same protection
restrictions as the EEPROM. All registers can be read without
unlocking. The mapping of bits from registers addresses in
EEPROM to their corresponding register addresses in SHADOW
is shown in the EEPROM table (See “EEPROM table” section).
Enabling EEPROM Access
To enable EEPROM write access after power-on-reset, a unlock
code needs to be written to the serial register “keycode”. This
involves five write commands, which should be executed after
each other:
Write 0x00 to register 0x3C[15:8]
Write 0x27 to register 0x3C[15:8]
Write 0x81 to register 0x3C[15:8]
Write 0x1F to register 0x3C[15:8]
Write 0x77 to register 0x3C[15:8]
This needs to be done once after power-on reset if the customer
intends to write to the EEPROM.
Writing to serial registers and reading from serial registers does
not require anything special after power-on.
Reading all EEPROM cells is always possible.
EEPROM Write Lock
It is possible to protect the EEPROM against accidental writes.
Setting the EEPROM field “lock” to value 0xC (‘1100’ binary)
will block any writes to the EEPROM, so that permanent
changes are not possible anymore. Temporary changes to the
setting are still possible by writing to the shadow memory, but
these changes are lost after a power cycle.
This lock is permanent and cannot be reversed. Reading of the
settings is still possible.
Setting the EEPROM field “lock” to value 0x3 (‘0011’ binary)
will lock EEPROM writes AND shadow memory writes. This
means none of the sensor settings can be changed anymore.
This lock is permanent and cannot be reversed. Reading of the
settings is still possible.
Write Transaction to EEPROM and Other
Extended Locations
Invoking an extended write access is a three-step process:
1. Write the extended address into the “ewa” register (using
SPI or Manchester direct access). “ewa” is the 8-bit extended
address that determines which extended memory address will
be accessed.
2. Write the data that is to be transferred into the “ewd” registers
(using SPI or Manchester direct access). This will take four
SPI writes or 2 Manchester packets to load all 32 bits of data.
3. Invoke the extended access by writing the direct “ewcs.exw”
bit with ‘1’.
The 32-bit of data in “ewd” are then written to the address speci-
fied in “ewa”.
The bit “ewcs.wdn” can be polled to determine when the write
completes. This is only necessary for EEPROM writes, which can
take up to 24 ms to complete. Shadow register writes complete
immediately in one system clock cycle after synchronization.
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For example, to write location 0x1F in the EEPROM with 0x00A45678:
• Write 0x1F to lower 8 bits of EWA register (0x1F to EWA+1 Address 0x03)
0x43 0x1F
• Write 0x00A45678 to EWD (0x00 to EWD, 0xA4 to EWD+1, 0x56 to EWD+2, 0x78 to EWD+3)
0x44 0x00 0x45 0xA4 0x46 0x56 0x47 0x78
• Write 0x80 to EWCS
0x48 0x80
• Read EWCS+1 until bit 0 (“wdn”) is set, or wait enough time.
In the example, register 0x08 is read, so that the second output byte is from register 0x09, and we wait for bit 0 to become ‘1’, which
happens in the last read.
0x08 0x00 0x00 0x00 0x08 0x00 0x00 0x00 0x08 0x00 0x00 0x00
0x00 0x00 0x01 0x00 0x00 0x00 0x01 0x00 0x00 0x00 0x00 0x01
If an access violation occurs (address not unlocked), the transaction will be terminated and the corresponding “rdn” or “wdn” bit set,
and the “xee” warning bit will assert. The “xee” bit in the “err” register will also set if the EEPROM write aborts.
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Read Transaction from EEPROM and Other
Extended Locations
Extended access is provided to additional memory space via the
direct registers. This access includes the EEPROM and EEPROM
shadow registers. All extended registers are up to 32 bits wide.
Invoking an extended read access is a three-step process:
1. Write the extended address to be read into the “era” register
(using SPI or Manchester direct access). “era” is the 8-bit
extended address that determines which extended memory
address will be accessed.
2. Invoke the extended access by writing the direct “ercs.ext”
bit with ‘1’. The address specied in “era” is then read, and
the data is loaded into the “erd” registers.
3. Read the “erd” registers (using SPI or Manchester direct ac-
cess) to get the extended data. This will take multiple packets
to get all 32 bits.
EEPROM read accesses may take up to 2 µs to complete. The
“ercs.rdn” bit can be polled to determine if the read access is
complete before reading the data. Shadow register reads complete
in one system clock cycle after synchronization. Do not attempt
to read the “erd” registers if the read access is potentially in
process, as it could change during the serial access and the data
will be inconsistent. It is also possible that an SPI CRC error will
be detected if the data changes during the serial read via the SPI
interface.
Precision, High Speed, Hall-Effect Angle Sensor IC
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A1339
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For example, to read location 0x1F in the EEPROM:
• Write 0x1F to lower 8 bits of “era” (0x1F to “era+1”, Address 0x0B)
0x4B 0x1F
• Write 0x80 to “ercs”
0x4C 0x80
• Read “ercs”+1 until bit 0 (“rdn”) is set, or wait enough time.
In the example, register 0x0C is read, so that the last bit of the second output byte contains the “rdn” bit.
0x0C 0x00 0x00 0x00
0x52 0x7B 0x00 0x01
• Read “erdh” (upper 16 bits of read data)
• Read “erdl” (lower 16 bits of read data)
In the example below, the result for the data at address 0x1F is 0x58A45678. In this value,
Bit [31:26] are the EEPROM CRC
Bit [25:24] are unused and zero
Bit [23:0] are the EEPROM values that can be used. These are the 24 bits containing the information 0xA45678 that was written
in the EEPROM write example.
0x0E 0x00 0x00 0x00 0x10 0x00 0x00 0x00
0x00 0x00 0x58 0xA4 0x00 0x00 0x56 0x78
Note that it would have been possible to pipeline transactions in this example, i.e. send a new command while reading return data from
the old command. This way the transaction could have been performed in 5 SPI frames instead of 8.
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A1339
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Allegro MicroSystems, LLC
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Shadow Memory Read and Write Transactions
Shadow memory Read and Write transactions are identical to
those for EEPROM. Instead of addressing to the EEPROM
extended address, one must address to the Shadow Extended
addresses, which are located at an offset of 0x40 above the
EEPROM. Refer to the EEPROM table for all addresses.
Precision, High Speed, Hall-Effect Angle Sensor IC
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A1339
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PRIMARY SERIAL INTERFACE REGISTER REFERENCE
Table 14: Primary Serial Interface Registers Bits Map
Address*
(0x00)
Register
Symbol
Read/
Write
Addressed Byte (MSB) Addressed Byte + 1 (LSB) LSB
Address
15 14 13 12 11 109876543210
0x00nopRO00000000000000000x01
0x02 ewa RW 0 0 0 0 0 0 0 0 write_adr 0x03
0x04 ewdh RW write_data_hi 0x05
0x06 ewdl RW write_data_lo 0x07
0x08 ewcs WO/RO exw 0 0 0 0 0 0 wip 0 0 0 0 0 0 0 wdn 0x09
0x0A era RW 0 0 0 0 0 0 0 0 read_adr 0x0B
0x0C ercs WO/RO exr 0 0 0 0 0 0 rip 0 0 0 0 0 0 0 rdn 0x0D
0x0E erdh RO read_data_hi 0x0F
0x10 erdl RO read_data_lo 0x11
0x12
0x14
0x16
0x18
0x1A
0x1C
UnusedRO0000000000000000
0x13
0x15
0x17
0x19
0x1B
0x1D
0x1E ctrl RW/WO special 0 cls clw cle initiate_special 0x1F
0x20 ang RO 0 ef uv p angle 0x21
0x22 sta RO 1 0 0 0 0 0 dieid rot lpsh sdn bdn lbr cstr bip aok 0x23
0x24 err RO 1 0 1 0 war stf avg abi plk zie eue ofe uvd uva msl rst 0x25
0x26 warn RO 1 0 1 1 ier crc 0 srw xee tr ese sat tcw bsy msh tov 0x27
0x28 tsen RO 1 1 1 1 temperature 0x29
0x2A field RO 1 1 1 0 gauss 0x2B
0x2C turns RO 1 1 0 p turns 0x2D
0x2E Unused RO 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0x2F
0x30 hang RO 0 ef uv p angle_hys 0x31
0x32 ang15 RO 0 angle_15 0x33
0x34 zang RO 0 ef uv p angle_zcd 0x35
0x36
0x38
0x3A
UnusedRO0000000000000000
0x37
0x39
0x3B
0x3C ikey WO/RO keycode 0 0 0 0 0 0 0 cul 0x3D
0x3E Unused RO 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0x3F
*Addresses that span multiple bytes are addressed by the most significant byte.
Address 0x00 0x01
Bit 15 14 13 12 11 10987654321 0
Name000000000000000 0
R/WRRRRRRRRRRRRRRR R
Address 0x00:0x00 (NOP) – Null Register
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Address 0x02 0x03
Bit 15 14 13 12 11 10987654321 0
Name 0 0 0 0 0 0 0 0 WRITE_ADDR
R/W R R R R R R R R R/W R/W R/W R/W R/W R/W R/W R/W
Address 0x02:0x03 (EWA) – Extended Write Address
WRITE_ADDR[7:0]:
Address to be used for an extended write. Address ranges:
0x00 - 0x1F: EEPROM (requires ≈ 24 ms following execution of a write)
0x40 - 0x5F: Shadow
Address 0x04 0x05
Bit 15 14 13 12 11 10987654321 0
Name WRITE_DATA_HI
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Address 0x04:0x05 (EWDH) – Extended Write Data High
WRITE_DATA_HI[15:0]:
Upper 16 bits of data for an extended write operation.
Address 0x06 0x07
Bit 15 14 13 12 11 10987654321 0
Name WRITE_DATA_LO
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Address 0x06:0x07 (EWDL) – Extended Write Data Low
WRITE_DATA_LO[15:0]:
Lower 16 bits of data for an extended write operation.
Address 0x08 0x09
Bit 15 14 13 12 11 10987654321 0
Name EXW 0 0 0 0 0 0 WIP 0 0 0 0 0 0 0 WDN
R/WWRRRRRRRRRRRRRR R
Address 0x08:0x09 (EWCS) – Extended Write Control and Status
EXW[15]:
Initiate extended write by writing with ‘1’. Sets WIP, clears WDN. Write-
only, always reads back 0.
WIP[8]:
Write in progress when ‘1’ .
RDN[0]:
Write done when ‘1’, clears when EXR set to ‘1’.
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Address 0x0A 0x0B
Bit 15 14 13 12 11 10987654321 0
Name 0 0 0 0 0 0 0 0 READ_ADDR
R/W R R R R R R R R R/W R/W R/W R/W R/W R/W R/W R/W
Address 0x0A:0x0B (ERA) – Extended Read Address
READ_ADDR[7:0]:
Address to be used for an extended read. Address ranges:
0x00 - 0x1F: EEPROM (requires ≈2 µs)
0x40 - 0x5F: Shadow
Address 0x0C 0x0D
Bit 15 14 13 12 11 10987654321 0
Name EXR 0 0 0 0 0 0 RIP 0 0 0 0 0 0 0 RDN
R/WWRRRRRRRRRRRRRR R
Address 0x0C:0x0D (ERCS) – Extended Read Control and Status
EXR[15]:
Initiate extended read by writing with ‘1’. Sets RIP, clears RDN. Write-
only, always reads back 0.
RIP[8]:
Read in progress when ‘1’ .
RDN[0]:
Read done when ‘1’, clears when EXR set to ‘1’.
Address 0x0E 0x0F
Bit 15 14 13 12 11 10987654321 0
Name READ_DATA_HI
R/WRRRRRRRRRRRRRRR R
Address 0x0E:0x0F (ERDH) – Extended Read Data High
READ_DATA_HI[15:0]:
Upper 16 bits of data from extended read operation, valid when ERCS.
RDN set to ‘1’ .
Address 0x10 0x11
Bit 15 14 13 12 11 10987654321 0
Name READ_DATA_LO
R/WRRRRRRRRRRRRRRR R
Address 0x10:0x11 (ERDL) – Extended Read Data Low
READ_DATA_LO[15:0]:
Lower 16 bits of data from extended read operation, valid when ERCS.
RDN set to ‘1’.
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SPECIAL[15:12]:
Defines specific actions to be taken by the IC. Many actions will only
be invoked after the CTRL.INITIATE_SPECIAL field is written with the
correct value. Aside from EEPROM margining, this field will return 0x00 on
completion.
Value Description
0000 No action.
0001 Enable EEPROM low voltage margin. IC must be unlocked.
Initiate with 0xA5.
0010 Enable EEPROM high voltage margin. IC must be
unlocked. Initiate with 0xA5.
0100 Turns counter reset. Initiate with 0x46.
0101 Reload EEPROM. Requires IC to be unlocked. Initiate with
0xA5.
0110 Enable transport mode on next LPM entry.
0111 Hard reset. Requires unlock of part. Initiate with 0xA5.
1001 Run CVH self-test. Initiate with 0xB9.
1010 Run Logic BIST. Initiate with 0xB9.
1011 Run both CVH self-test and Logic BIST. Tests are run in
parallel. Initiate with 0xB9.
CLS[10]:
Clear Status register bits “SDN” and “BDN”, when set to “1”.
STA.SDN indicates that a “special access” task (i.e. CVH self-test) is
completed.
STA.BDN indicates the IC has booted properly and completed any start-up
self-tests.
CLW[9]:
Clear warning (WARN) register when set to “1”.
Clears bits that were previously read from the WARN (register 0x26:0x27).
Write-only, always returns 0.
CLE[8]:
Clear error (ERR) register when set to “1”.
Clears bits that were previously read from the ERR (register 0x24:25).
Write-only, always returns 0.
INITIATE_SPECIAL[7:0]:
Write after setting certain CTRL.SPECIAL bits to initiate the selected
action(s).
Always returns 0’s.
Value Description
0xB9 Initiate self-tests.
0x46 Initiate turns counter reset.
0x5A Initiate hard reset.
0xA5 Initiate EEPROM margin or reload.
Address 0x1E 0x1F
Bit 15 14 13 12 11 10987654321 0
Name SPECIAL 0 CLS CLW CLE INITIATE_SPECIAL
R/W R/W R/W R/W R/W R R/W W W W W W W W W W W
Address 0x1E:0x1F (CTRL) – Device Control
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Address 0x20 0x21
Bit 15 14 13 12 11 10987654321 0
Name 0 EF UV P ANGLE
R/WRRRRRRRRRRRRRRR R
Address 0x20:0x21 (ANG) – Current Angle Reading (12 bits)
EF[14]:
Error Flag. Will be “1” if any unmasked bit in ERR or WARN is set.
Value Description
0 No unmasked errors
1 Unmasked error is present
UV[13]:
Undervoltage Flag (real time). Logical OR of analog and digital UV flags
(UVD and UVA flags). Conditions are realtime, but may be masked by
EEPROM error mask bits.
Value Description
0 No undervoltage condition detected
1 Undervoltage condition detected
P[12]:
Parity bit. Odd parity is calculated across all bits (EF, UV, ANGLE). Result
is that there should always be an odd number of 1’s in this 16 bit word.
ANGLE[11:0]:
Angle from PLL after processing.
Angle in degrees is 12-bit value × (360/4096).
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Address 0x22 0x23
Bit 15 14 13 12 11 10987654321 0
Name 1 0 0 0 0 0 DIE_ID ROT LPSH SDN BDN LBR CSTR BIP AOK
R/WRRRRRRRRRRRRRRR R
Address 0x22:0x23 (STA) – Device Status
RIDC[15:12]:
Register ID bits. Used to distinguish this registers from other serial
registers. Hard-coded value.
Value Description
1000 Register ID value
DIE_ID[9:8]:
DIE ID, loaded from EEPROM (for multi-die packages). Used for
identification purposes only. No impact on sensor functionality.
Set in factory by Allegro.
ROT[7]:
Indicates observed rotation direction, based on the hysteresis logic. Valid
only if Hysteresis is enabled (see EEPROM 0x1C).
Value Description
0 Increasing angles
1 Decreasing angles
LPSH[6]:
Indicates the observed rotation velocity exceeds the threshold for entering
“sleep” state of LPM. Sensor will automatically enter the “WAKE” state.
Value Description
0 Velocity supports entering LPM.
1 Velocity too high to enter LPM. LPM will not be entered.
SDN[5]:
Special access (from CTRL register) done. Clears to 0 when a “special
command” is triggered, set 1 when complete. Can clear with CTRL.CLS
bit = 1.
Value Description
0 “Special” command in progress, unless cleared previously
1 “Special” command completed
BDN[4]:
Boot complete. EEPROM loaded and any startup self-tests are complete.
Can clear with CTRL.CLS bit = 1.
Value Description
0 Boot not complete, unless cleared previously.
1 Boot complete
LBR[3]:
Logic BIST (LBIST) running.
Value Description
0 LBIST not running
1 LBIST running
CSTR[2]:
CVH Self-test running.
Value Description
0 CVH self-test not running
1 CVH self-test running
BIP[1]:
Boot in progress. Output values may not be valid.
Value Description
0 Boot not in progress
1 Sensor is undergoing its boot sequence
AOK[0]:
Angle output is OK. Indicates the PLL is locked and stat-up sequence has
completed.
Value Description
0 Angle is not valid
1 PLL is locked, angle value is valid
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Address 0x24 0x25
Bit 15 14 13 12 11 10987654321 0
Name 1 0 1 0 WAR STF AVG ABI PLK ZIE EUE OFE UVD UVA MSL RST
R/WRRRRRRRRRRRRRRR R
Address 0x24:0x25 (ERR) – Device Error Flags
This is the error register. All errors are latched, meaning they will remain high after they occurred. Errors need to be read and then cleared in order to
remove them. It is important that the user clears errors so that subsequent errors become visible. This is especially important for the “RST” error flag
(reset), which is always enabled after power on. Not removing it means that an unexpected reset cannot be discovered afterwards.
RIDC[15:12]:
Register ID bits. Used to distinguish this registers from other serial
registers. Hard-coded value.
Value Description
1010 Register ID value
WAR[11]:
Warning. An unmasked bit within the WARN register is asserted.
May be masked by setting MSK.WAR bit in EEPROM.
Value Description
0 No unmasked flag set in the WARN register (0x26:27)
1 Unmasked flag set in the WARN register
STF[10]:
Self-test failure. Indicates either LBIST or CVH self-test failed.
Value Description
0 No self-test failure
1 Self-test failure
AVG[9]:
Angle averaging error. Indicates the ORATE value is too high for the
rotation velocity, and the averaged angle value is corrupted.
The ORATE setting allows multiple angle values to be averaged together,
for improved precision. This reduces the response time of the sensor, and
can result in corrupted angle values is the velocity is too high.
Value Description
0No Averaging error
1 Averaging error
ABI[8]:
ABI integrity fault. The quadrature integrity of the ABI could not be
maintained.
Value Description
0 No ABI integrity fault
1 ABI integrity fault
PLK[7]:
PLL lost lock. This indicates the PLL is not tracking the incoming angle
properly. Angle value is corrupt.
Value Description
0 No PLL lock.
1 PLL lost lock. Angle value invalid.
ZIE[6]:
Zero crossing integrity error—a zero crossing did not occur within the
maximum time expected, likely indicating missing magnet, or extreme
rotation.
Value Description
0 No Zero crossing error
1 Zero crossing error
EUE[5]:
EEPROM uncorrectable error. A multi-bit EEPROM read occurred.
EEPROM bit errors are only checked on EEPROM load (i.e. power-up or
reset).
Value Description
0 No multi-bit EEPROM error
1 Multi-bit EEPROM error
OFE[4]:
Oscillator Frequency Error. One of the oscillator watchdogs circuits,
monitoring the high frequency and low frequency oscillators has tripped.
Value Description
0 No oscillator error
1 Oscillator watchdog error
UVD[3]:
VCC Undervoltage detector tripped. Will continue to set until fault goes
away (and ERR register is cleared). This is the VCC input pin voltage.
Value Description
0 No VCC voltage error
1 VCC undervoltage error detected
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UVA[2]:
Undervoltage detector tripped. Will continue to set until fault goes away
(and ERR register is cleared). This is the analog regulator output.
Value Description
0 No voltage error
1 Voltage error on the analog regulator output
MSL[1]:
Magnetic sense low fault. Magnetic sense was below the low limit
threshold.
Low limit threshold is set via the COM.MAG_THRES_LO field in
EEPROM.
By default this is set to ≈200 G.
Value Description
0 No magnetic field low fault
1 Magnetic field lower than threshold
RST[0]:
Reset condition. Sets on power-on reset or hard reset. Does not set on
LBIST. Indicates volatile registers have been re-initialized.
Value Description
0 No reset
1 Device has been reset. Volatile registers are re-initialized.
Precision, High Speed, Hall-Effect Angle Sensor IC
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Allegro MicroSystems, LLC
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Address 0x26 0x27
Bit 15 14 13 12 11 10987654321 0
Name 1 0 1 1 IER CRC 0 SRW XEE TR ESE SAT TCW BSY MSH TOV
R/WRRRRRRRRRRRRRRR R
Address 0x26:0x27 (WARN) – Device Warning Flags
This is the warning register. All warnings are latched, meaning they will remain high after they occurred. Warnings need to be read and then cleared in
order to remove them. Warnings indicate either communication type conditions or conditions that may result in a degradation of the angle accuracy, but
are less likely than errors to indicate a corruption of the angle.
RIDC[15:12]:
Register ID bits. Used to distinguish this registers from other serial
registers. Hard-coded value.
Value Description
1011 Register ID value
IER[11]:
Interface error. Invalid number of bits in SPI packet, or bit 15 of MOSI
data = ‘1’. Packet was discarded.
Also indicates a Manchester error.
Value Description
0 No Interface Error
1 Interface Error
CRC[10]:
Incoming SPI CRC error. Packet was discarded.
Incoming CRC is only checked if the PWI.SC bit in EEPROM is set.
Value Description
0 No incoming SPI CRC error
1 Incoming SPI CRC is bad
SRW[8]:
Slew rate warning. This warning is asserted if the ABI slew rate limiting
is enabled and a condition that requires the limiting to be applied has
occurred.
Purpose of Slew Rate Limiting is to prevent an ABI integrity error.
Value Description
0 Slew rate limiting is not active.
1Slew rate limiting is active. ABI output is incrementing at the
designated slew rate.
XEE[7]:
Extended execute error. A command initiated by an extended write failed.
Write failed due to access error (not unlocked) or EEPROM write failure.
Value Description
0 No incoming extended error
1 Extended execute Error
TR[6]:
Temperature out of range. The temperature sensor calculated a
temperature below –60°C or above 180°C. Temperature will saturate at
those limits.
Value Description
0 Temperature sensor in range
1 Sensed temperature is below -60° or above 180°C
ESE[5]:
EEPROM soft error. A correctable (single-bit) EEPROM read occurred.
EEPROM bit errors are only checked on EEPROM load (power-on or
reset).
Value Description
0 No single bit EEPROM error
1 EEPROM single bit error detected and corrected
SAT[4]:
Aggregate saturation flag. Shows that any internal signals have saturated,
likely to have been cause by extremely strong or weak fields.
Value Description
0 No saturation detected within the signal chain.
1 Saturation conditions detected within the signal chain.
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TCW[3]:
Turns counter warning. Over 135° of angle change between “awake”
states in LPM. Indicates the rotation rate is too high for the programmed
sleep time.
Sleep time may be changed via the LPC.LPM_CYCLE_TIME field in
EEPROM.
Value Description
0 No turns count warning
1 Angle difference between two awake states is > 135°
BSY[2]:
Extended access overflow. An Extended write or Extended read was
initiated before previous was done.
Value Description
0 No extended access error
1 extended access error
MSH[1]:
Magnetic sense high fault. Magnetic sense was above the high limit
threshold.
High limit threshold is set via the COM.MAG_THRES_HI field in
EEPROM.
By default this is set to ≈1200 G.
Value Description
0 No magnetic field high fault
1 Magnetic field above threshold
TOV[0]:
Turns Counter Overflow Error.
The turns counter surpassed its maximum value of +255/-256 full
rotations.
This is equivalent to an Turns register value of ±511/-512 or +2047/-2048,
depending on the resolution (180° or 45°).
Must be cleared with a turns count reset (See special commands in the
CTRL register description, 0x1E).
Value Description
0 No turns count overflow error
1 Turns count overflow error
Address 0x28 0x29
Bit 15 14 13 12 11 10987654321 0
Name 1 1 1 1 TEMPERATURE
R/WRRRRRRRRRRRRRRR R
Address 0x28:0x29 (TSEN) – Temperature Sensor
RIDC[15:12]:
Register ID bits. Used to distinguish this registers from other serial
registers. Hard-coded value.
Value Description
1111 Register ID value
TEMPERATURE[11:0]:
Current junction temperature from internal temperature sensor relative
to room temperature (signed value, 2’s complement). Value is in 1/8 of a
degree. Temperature °C ≈ (TSEN.TEMPERATURE / 8) + 25.0.
Address 0x2A 0x2B
Bit 15 14 13 12 11 10987654321 0
Name 1 1 1 0 GAUSS
R/WRRRRRRRRRRRRRRR R
Address 0x2A:0x2B (FIELD) – Field Strength (in gauss)
RIDC[15:12]:
Register ID bits. Used to distinguish this registers from other serial
registers. Hard-coded value.
Value Description
1110 Register ID value
GAUSS [11:0]:
Measured field strength in gauss. Updated every 128 µs.
Precision, High Speed, Hall-Effect Angle Sensor IC
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A1339
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Address 0x0C 0x0D
Bit 15 14 13 12 11 10987654321 0
Name 1 1 0 P TURNS
R/WRRRRRRRRRRRRRRR R
Address 0x2C:0x2D (TURNS) – Turns Counter
RIDC[15:13]:
Register ID bits. Used to distinguish this registers from other serial
registers. Hard-coded value.
Value Description
110 Register ID value
P[12]:
Parity bit. Odd parity is calculated across all bits. Result is that there
should always be an odd number of 1’s in this 16-bit word.
TURNS [11:0]:
Signed 2’s complement value. Indicates total number of turns relative to
angle observed on power-up. Turns resolution set via EEPROM to either
180° or 45°.
The A1339 is capable of tracking up to 256 full mechanical rotations,
independent of the resolution selected.
Bit Value
Turns in 180° mode
(Actual mechanical
full rotations)
Turns in 45° mode
(Actual mechanical full
rotations)
0000 0000 0000 0 (0) 0 (0)
0000 0000 0001 +1 (+1/2) +1 (+1/8)
0001 1111 1111 +511 (255.5) +511 (+63.875 )
0010 0000 0000 N/A +512 (+64)
0111 1111 1111 N/A +2047(+255.875)
1111 1111 1111 -1 (-1/2) -1 (-1/8th)
1110 0000 0000 -512 (-256) -512 (-64)
1000 0000 0000 N/A -2048 (-256)
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Address 0x30 0x31
Bit 15 14 13 12 11 10987654321 0
Name 0 EF UV P ANGLE_HYS
R/WRRRRRRRRRRRRRRR R
Address 0x30:0x31 (HANG) – Hysteresis Angle Value (12 bits)
EF[14]:
Error Flag. Will be “1” if any unmasked bit in ERR or WARN is set.
Value Description
0 No unmasked errors
1 Unmasked error is present
UV[13]:
Undervoltage Flag (real time). Logical OR of analog and digital UV flags
(UVD and UVA flags). Conditions are realtime, but may be masked by
EEPROM error mask bits.
Value Description
0 No undervoltage condition detected
1 Undervoltage condition detected
P[12]:
Parity bit. Odd parity is calculated across all bits (EF, UV, ANGLE_HYS).
Result is that there should always be an odd number of 1’s in this 16 bit
word.
ANGLE_HYS[11:0]:
Angle from PLL after hysteresis processing.
Angle in degrees is 12-bit value × (360/4096).
Address 0x32 0x33
Bit 15 14 13 12 11 10987654321 0
Name 0 ANGLE_15
R/WRRRRRRRRRRRRRRR R
Address 0x32:0x33 (ANG15) – Current Angle Reading (15 bits)
ANGLE_15[14:0]:
15-bit compensated angle (not rounded).
Angle in degrees is a 15-bit value × (360/32768)
.
Precision, High Speed, Hall-Effect Angle Sensor IC
with Integrated Diagnostics for Safety-Critical Applications
A1339
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Address 0x34 0x35
Bit 15 14 13 12 11 10987654321 0
Name 0 EF UV P ANGLE_ZCD
R/WRRRRRRRRRRRRRRR R
Address 0x34:0x35 (ZANG) – ZCD Angle (low power signal path)
Angle from the ZCD signal path is used for turns counter in normal and low power mode. This angle is not compensated over temperature and will not
exactly match the PLL angle value.
EF[14]:
Error Flag. Will be “1” if any unmasked bit in ERR or WARN is set.
Value Description
0 No unmasked errors
1 Unmasked error is present
UV[13]:
Undervoltage Flag (real time). Logical OR of analog and digital UV flags
(UVD and UVA flags). Conditions are realtime, but may be masked by
EEPROM error mask bits.
Value Description
0 No undervoltage condition detected
1 Undervoltage condition detected
P[12]:
Parity bit. Odd parity is calculated across all bits (EF, UV, ANGLE_ZCD).
Result is that there should always be an odd number of 1’s in this 16 bit
word.
ANGLE_ZCD[11:0]:
Angle from the ZCD signal path. Not compensated.
Angle in degrees is 12-bit value × (360/4096).
Address 0x3C 0x3D
Bit 15 14 13 12 11 10987654321 0
Name KEYCODE 0 0 0 0 0 0 0 CUL
R/W W W W W W W W W R R R R R R R R
Address 0x3C:0x3D (KEY) – Key Register
KEYCODE[15:8]:
Unlock code is entered here. Once unlocked EEPROM and Shadow
registers may be written. In addition some “special” commands require a
device unlock.
Unlocking requires five successive writes to the KEYCODE field, following
the unlock sequence shown below.
The CUL indicates a successful unlock.
Write # Code
1 0x00
2 0x27
3 0x81
4 0x1F
5 0x77
CUL[0]:
Indicates the device is unlocked.
Value Description
0 Device is not unlocked
1 Device is unlocked
Precision, High Speed, Hall-Effect Angle Sensor IC
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EEPROM/SHADOW MEMORY TABLE
Table 15: EEPROM / Shadow Memory Map
EEPROM
Address
Shadow
Memory
Address
Register
Name
Bits
31:26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10987654321 0
0x18 0x58 PWE ECC TOV TR MSH SAT ESE MSL UV AVG ZIE PLK STF EUE OFE
0x19 0x59 ABI ECC ABI_SLEW_TIME INV -X- -X- AHE INDEX_MODE WDH PLH IOE UVW RESOLUTION_PAIRS
0x1A 0x5A MSK ECC IER CRC -X- SRW XEE TR ESE SAT TCW BSY MSH TOV WAR STF AVG ABI PLK ZIE EUE OFE UVD UVA MSL RST
0x1B 0x5B PWI ECC PEN PWM_BAND PWM_FREQ PHE PEO PES WP_HYS WP_THRES DM S17 SC
0x1C 0x5C ANG ECC ORATE RD RO HYSTERESIS ZERO_OFFSET
0x1D 0x5D LPC ECC T45 TPMD LPMD LPM_CYCLE_TIME LPM_WAKE_THRESHOLD
0x1E 0x5E COM ECC LOCK LBE CSE DST DHR MAG_THRES_HI MAG_THRES_LO
0x1F CUS ECC Customer EEPROM Space
The EEPROM/Shadow register bitmap is shown below.
All EEPROM and shadow contents can be read by the user, with-
out unlocking. Writing requires device unlock.
Bit 23 22 21 20 19 18 17 16 15 14 13 12 11 10987654321 0
Name–––––––––––TOV TR MSH SAT ESE MSL UV AVG ZIE PLK STF EUE OFE
Default–––––––––––000000000000 0
Address 0x18 (PWE) – PWM Error Enable
This address space contains the PWM error enable bits. When set to
“1”, the PWM output will respond to errors, as set via the PWI.PEO and
PWI.PES bits.
TOV[12]:
PWM turns counter overflow error enable.
Duty cycle 72.5%, if PWI.PEO and PWI.PES are “1”.
Value Description
0 PWM does not respond to a TOV error
1 PWM output respond to a TOV error
TR[11]:
PWM Temperature out of range error enable.
Duty cycle 66.875%, if PWI.PEO and PWI.PES are “1”.
Value Description
0 PWM does not respond to a TR error
1 PWM output respond to a TR error
MSH[10]:
PWM magnetic sense high error enable.
Duty cycle 61.25%, if PWI.PEO and PWI.PES are “1”.
Value Description
0 PWM does not respond to a MSH error
1 PWM output respond to a MSH error
SAT[9]:
PWM saturation error enable.
Duty cycle 55.625%, if PWI.PEO and PWI.PES are “1”.
Value Description
0 PWM does not respond to a SAT error
1 PWM output respond to a SAT error
Precision, High Speed, Hall-Effect Angle Sensor IC
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ESE[8]:
PWM EEPROM soft error enable.
Duty cycle 50%, if PWI.PEO and PWI.PES are “1”.
Value Description
0 PWM does not respond to a ESE error
1 PWM output respond to a ESE error
MSL[7]:
PWM magnetic sense low error enable.
Duty cycle 44.375%, if PWI.PEO and PWI.PES are “1”.
Value Description
0 PWM does not respond to a MSL error
1 PWM output respond to a MSL error
UV[6]:
PWM undervoltage error enable.
Duty cycle 38.75%, if PWI.PEO and PWI.PES are “1”.
Value Description
0 PWM does not respond to an UV error
1 PWM output respond to a UV error
AVG[5]:
PWM averaging error enable.
Duty cycle 33.125%, if PWI.PEO and PWI.PES are “1”.
Value Description
0 PWM does not respond to a AVG error
1 PWM output respond to a AVG error
ZIE[4]:
PWM zero crossing error enable.
Duty cycle 27.5%, if PWI.PEO and PWI.PES are “1”.
Value Description
0 PWM does not respond to a ZIE error
1 PWM output respond to a ZIE error
PLK[3]:
PWM PLL lost lock error enable.
Duty cycle 21.875%, if PWI.PEO and PWI.PES are “1”.
Value Description
0 PWM does not respond to a PLK error
1 PWM output respond to a PLK error
STF[2]:
PWM Self test error enable.
Duty cycle 16.25%, if PWI.PEO and PWI.PES are “1”.
Value Description
0 PWM does not respond to a STF error
1 PWM output respond to a STF error
EUE[1]:
PWM EEPROM uncorrectable error enable.
Duty cycle 10.625%, if PWI.PEO and PWI.PES are “1”.
Value Description
0 PWM does not respond to a EUE error
1 PWM output respond to a EUE error
OFE[0]:
PWM Oscillator frequency error enable.
Duty cycle 5%, if PWI.PEO and PWI.PES are “1”.
Value Description
0 PWM does not respond to a OFE error
1 PWM output respond to a OFE error
Precision, High Speed, Hall-Effect Angle Sensor IC
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A1339
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Bit 23 22 21 20 19 18 17 16 15 14 13 12 11 10987654321 0
Name ABI_SLEW_TIME INV -X- -X- AHE INDEX_MODE WDH PLH IOE UVW RESOLUTION_PAIRS
Default––0010000––100000010010 0
Address 0x19(ABI) – ABI Control
ABI_SLEW_TIME[20:16]:
ABI slew time rate. “0” disables slew limiting.
Minimum edged-to-edge time for ABI output is defined by:
(N + 1) × 125 ns
where “N” is the value of ABI_SLEW_TIME.
This limits the maximum ABI velocity. Reducing the ABI resolution can be
used to counteract this.
Value Description
00 0000 Slew limiting disable
00 0001 250 ns of slew control
11 1111 8 µs of slew control
INV[15]:
Invert ABI/UVW signals.
Value Description
0
ABI/UVW signals behave as shown below for an increasing
angle value. Q1 through Q4 represent changes in angle at
the ABI resolution.
State Name A B
Q1 0 0
Q2 0 1
Q3 1 1
Q4 1 0
1
ABI/UVW signals are inverted and behave as shown below
for an increasing angle value. Q1 through Q4 represent
changes in angle at the ABI resolution.
State Name A B
Q1 1 1
Q2 1 0
Q3 0 0
Q4 0 1
AHE[12]:
ABI hysteresis enable. When “1” hysteresis is applied to the ABI angle.
Value Description
0 Hysteresis is not applied to ABI
1 Hysteresis applied to ABI outputs
INDEX_MODE[9:8]:
Defines the width and placement of the “I” pulse in ABI.
Value Description
0 “I” pulse is set only at 0° to +R
1 “I” pulse set between –R to +R
2 “I” pulse set between –R to +2R
3 “I” pulse set between -2R and +2R
“R” indicates the ABI quadrature resolution.
A
B
A=0
Q1
A=+R
Q2
A=-R
Q4
A=-2R
Q3
True Zero to 360 Disconnuity
Mode 0
Mode 1
Mode 2
Mode 3
WDH[7]:
Enable ABI all high (before inversion) as error mode if oscillator frequency
watchdog error trips.
Value Description
0 ABI pins do not respond to an OFE Flag
1 ABI outputs go high if an OFE is detected
PLH[6]:
Enable ABI all high (before inversion) as error mode if a PLL loss of lock is
detected.
Value Description
0 ABI pins do not respond to an PLK Flag
1 ABI outputs go high if the PLK flag is set
IOE[5]:
Incremental output enable.
Value Description
0 ABI/UVW pins are not active
1 ABI/UVW pins are active. Behavior defined by ABI.UVW bit
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UVW[4]:
Define behavior of the ABI/UVW pins. If ABI.IOE = 1.
Value Description
0 ABI active
1 UVW active
RESOLUTION_PAIRS[3:0]:
Defines resolution of ABI/UVW outputs.
In ABI mode, cycle resolution = 2(14-n) where “n” is the
RESOLUTION_PAIRS value.
In UVW mode, the number of pole pairs is n + 1.
Value AB Cycles per Rev UVW Pole Pairs
0000 N/A 1
0001 N/A 2
0010 N/A 3
0011 211 = 2048 4
0100 210 = 1024 5
1110 20 = 1 15
1111 N/A 16
Precision, High Speed, Hall-Effect Angle Sensor IC
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Bit 23 22 21 20 19 18 17 16 15 14 13 12 11 10987654321 0
Name IER CRC -X- SRW XEE TR ESE SAT TCW BSY MSH TOV WAR STF AVG ABI PLK ZIE EUE OFE UVD UVA MSL RST
Default00–00000000000000000000 0
Address 0x1A (MSK) – Mask Bits
This address range contains error mask bits. When set, the applicable
error condition will not assert the “EF” bit in the various angle and turns
count registers.
IER[23]:
Masks the IER flag from setting the “EF” bit.
CRC[22]:
Masks the CRC flag from setting the “EF” bit.
SRW[20]:
Masks the SRW flag from setting the “EF” bit.
XEE[19]:
Masks the XEE flag from setting the “EF” bit.
TR[18]:
Masks the TR flag from setting the “EF” bit.
ESE[17]:
Masks the ESE flag from setting the “EF” bit.
SAT[16]:
Masks the SAT flag from setting the “EF” bit.
TCW[15]:
Masks the TCW flag from setting the “EF” bit.
BSY[14]:
Masks the BSY flag from setting the “EF” bit.
MSH[13]:
Masks the MSH flag from setting the “EF” bit.
TOV[12]:
Masks the TOV flag from setting the “EF” bit.
WAR[11]:
Masks the WAR flag from setting the “EF” bit.
STF[10]:
Masks the STF flag from setting the “EF” bit.
AVG[9]:
Masks the AVG flag from setting the “EF” bit.
ABI[8]:
Masks the ABI flag from setting the “EF” bit.
PLK[7]:
Masks the PLK flag from setting the “EF” bit.
ZIE[6]:
Masks the ZIE flag from setting the “EF” bit.
EUE[5]:
Masks the EUE flag from setting the “EF” bit.
OFE[4]:
Masks the OFE flag from setting the “EF” bit.
UVD[3]:
Masks the UVD flag from setting the “EF” bit.
UVA[2]:
Masks the UVA flag from setting the “EF” bit.
MSL[1]:
Masks the MSL flag from setting the “EF” bit.
RST[0]:
Masks the RST flag from setting the “EF” bit.
Precision, High Speed, Hall-Effect Angle Sensor IC
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Bit 23 22 21 20 19 18 17 16 15 14 13 12 11 10987654321 0
Name PEN PWM_BAND PWM_FREQ PHE PEO PES WP_HYS WP_THRES DM S17 SC
Default01100111000000010000000 0
Address 0x1B (PWI) – PWM Interface Control
PEN[23]:
PWM Enable.
Value Description
0 PWM pin tri-stated
1 PWM enabled
PWM_BAND[22:20]:
PWM frequency band. Defines the PWM carrier frequency when combined
with PWM_FREQ.
PWM_FREQ[19:16]:
PWM frequency select. Defines the PWM carrier frequency when
combined with PWM_BAND.
Table 16: Nominal PWM Carrier Frequencies
PWM_BAND
01234567
PWM_FREQ
0 3125 2778 2273 1667 1087 641 352 185
1 3101 2740 2222 1613 1042 610 333 175
2 3077 2703 2174 1563 1000 581 316 166
3 3053 2667 2128 1515 962 556 301 157
4 3030 2632 2083 1471 926 532 287 150
5 3008 2597 2041 1429 893 510 275 143
6 2985 2564 2000 1389 862 490 263 137
7 2963 2532 1961 1351 833 472 253 131
8 2941 2500 1923 1316 806 455 243 126
9 2920 2469 1887 1282 781 439 234 121
10 2899 2439 1852 1250 758 424 225 116
11 2878 2410 1818 1220 735 410 217 112
12 2857 2381 1786 1190 714 397 210 108
13 2837 2353 1754 1163 694 385 203 105
14 2817 2326 1724 1136 676 373 197 101
15 2797 2299 1695 1111 658 362 191 98
PHE[14]:
PWM Hysteresis enable.
Value Description
0 No hysteresis applied to PWM output
1 Hysteresis settings applied to PWM output
PEO[13]:
PWM Error Output Enable. If “1” PWM will respond to errors, as defined
by the PES bit.
Value Description
0 PWM output does not respond to error flags
1PWM output will respond to errors, as defined by the PWI.
PES field.
PES[12]:
PWM Error Select, if PEO = 1.
Value Description
0PWM output tri-states for all enabled error conditions (See
PWE address space).
1
For all enabled errors the PWM carrier frequency is halved
and the highest priority error is identified by a specific duty
cycle. See the PWE address space description.
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WP_HYS[9:8]:
WAKE pin hysteresis. Defines the voltage difference between VWAKE(HI)
and VWAKE(LO).
Value Description
050 mV of Hysteresis
1 150 mV of Hysteresis
2 300 mV of Hysteresis
3 400 mV of Hysteresis
VWAKE(LO) = VWAKE(HI) – WP_HYS, or 100 mV whichever is greater.
WP_THRES[6:4]:
WAKE pin voltage threshold. Defines the voltage threshold of VWAKE(HI).
Value VWAKE(HI) Threshold
000 300 mV
001 350 mV
010 400 mV
111 650 mV
Together with WP_HYS, this defines both VWAKE(HI) and VWAKE(LO).
Table 17: Nominal Wake Pin Threshold Levels
WP_THRES WP_HYS Threshold (rising) Hysteresis Voltage Threshold (falling)
Bit2 Bit1 Bit0 Bit1 Bit0 mV mV mV
0 0 0 0 0 300 50 250
0 0 0 0 1 300 150 150
0 0 0 1 0 300 300 100
0 0 0 1 1 300 400 100
0 0 1 0 0 350 50 300
0 0 1 0 1 350 150 200
0 0 1 1 0 350 300 100
0 0 1 1 1 350 400 100
0 1 0 0 0 400 50 350
0 1 0 0 1 400 150 250
0 1 0 1 0 400 300 100
0 1 0 1 1 400 400 100
0 1 1 0 0 450 50 400
0 1 1 0 1 450 150 300
0 1 1 1 0 450 300 150
0 1 1 1 1 450 400 100
1 0 0 0 0 500 50 450
1 0 0 0 1 500 150 350
1 0 0 1 0 500 300 200
1 0 0 1 1 500 400 100
1 0 1 0 0 550 50 500
1 0 1 0 1 550 150 400
1 0 1 1 0 550 300 250
1 0 1 1 1 550 400 150
1 1 0 0 0 600 50 550
1 1 0 0 1 600 150 450
1 1 0 1 0 600 300 300
1 1 0 1 1 600 400 200
1 1 1 0 0 650 50 600
1 1 1 0 1 650 150 500
1 1 1 1 0 650 300 350
11111 650 400 250
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DM[3]:
Disable Manchester Interface.
Value Description
0 Manchester functions normally
1A1339 will no longer respond to Manchester command on
the VCC line
S17[1]:
A1339 ignores the 17th SPI clock. Allows negative edge sampling at the
MCU (host).
SC[0]:
A1339 monitors the incoming CRC.
Value Description
0 No monitoring of the incoming CRC
1 A1339 monitors incoming CRC. Discards packet if corrupt.
Bit 23 22 21 20 19 18 17 16 15 14 13 12 11 10987654321 0
Name ORATE RD RO HYSTERESIS ZERO_OFFSET
Default00000010100000000000000 0
Address 0x1C (ANG)
ORATE[23:20]:
Reduces the output rate by averaging samples. 2ORATE samples will
be averaged. ORATE values above 12 are reduced to 12 in the logic,
meaning that up to 4096 samples = 4 ms can be selected as averaging
time.
Value Description
0000 1 sample. 1 µs update rate.
0001 2 samples. 2 µs update rate.
0010 4 samples. 4 µs update rate.
1100 4096 samples. ≈4 ms update rate.
RD[19]:
Rotates die. Rotates final angle 180°. Last step in the angle algorithm.
This is a convenient setting to adjust one die in a dual die package for
conformance to the other die. Occurs after the Zero_offset and RO
adjustments.
Value Description
0 No rotation applied
1 180° added to final angle
RO[18]:
Rotation Direction. If set to 0, increasing angle movement is in the
clockwise direction when looking down on the top of the die. If set to 1,
increasing angle movement is in the counter-clockwise direction.
Occurs after the Zero_offset adjust and prior to the RD manipulation.
Value Description
0Output angle increases with a clockwise rotation (when
viewed from above the magnet and device)
1Output angle increases with a counter-clockwise rotation
(when viewed from above the magnet and device)
HYSTERESIS[17:12]:
Angle Hysteresis threshold. In 14bit resolution. Provides ≈0 to 1.384° of
hysteresis.
Value Description
00 0000 No Hysteresis
00 0001 ≈0.022° of Hysteresis
11 1111 ≈1.384° of Hysteresis
ZERO_OFFSET[11:0]:
Post-compensation zero offset (or DC adjust), at 12-bit resolution.
This value is subtracted from the measured angle value.
Operation occurs prior to the RD and RO manipulations.
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Bit 23 22 21 20 19 18 17 16 15 14 13 12 11 10987654321 0
Name T45 TPMD LPMD LPM_CYCLE_TIME LPM_WAKE_THRESHOLD
Default1- 000000101100101001111 1
Address 0x1D (LPC)
T45[23]:
Defines the resolution of the turns counter.
Value Description
0 Turns counter measures 180° of rotation
1 Turns counter measures 45° of rotation
TPMD[21]:
Transport mode disable.
Value Description
0Transport mode can be entered via a “special” command,
on next entry into LPM
1 Transport mode disabled
LPMD[20]:
Low Power Mode Disable.
Value Description
0 Low power mode may be entered
1 Low power mode disabled
LPM_CYCLE_TIME[17:12]:
Defines the length of the “sleep” state within LPM (time between “wake”
states).
Sleep time = (N + 1) × 8.192 ms.
The alive counter increment rate.
Value Description
00 0000 8.192 ms sleep time
00 0001 16.384 ms sleep time
00 1011 98.304 ms sleep time
11 1111 524.288 ms sleep time
LPM_WAKE_THRESHOLD[10:0]:
Minimum sample-to-sample angle difference between WAKE states, which
will force the IC to stay in the WAKE state (not go back into “sleep” mode).
Also used as maximum angle difference in normal power mode to decide if
the device can enter low power mode. In both cases, the angle difference
is calculated over the time given in “LPM_CYCLE_TIME”. Resolution is 11
bit, for values of 0 to 180 degrees, with resolution of (360/4096) degrees
per LSB.
As the observed positional displacement between successive samples
approaches 180°, the direction of rotation becomes ambiguous. Therefore,
it is not recommended to set this value close to 180°.
Default value = 671 codes = 58.97°.
With the default sleep time of 98.304 ms, this equates to ≈100 RPM.
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Bit 23 22 21 20 19 18 17 16 15 14 13 12 11 10987654321 0
Name LOCK LBE CSE DST DHR MAG_THRES_HI MAG_THRES_LO
Default000011––––0010010100110 1
Address 0x1E (COM)
LOCK[23:20]:
EEPROM and Shadow memory lock.
Permanent lock.
Value Description
1100 Writing to EEPROM is locked
0011 Writing to EEPROM and Shadow memory is locked
LBE[19]:
Power-up Logic BIST enable.
LBIST requires ≈30 ms to run.
Value Description
0 LBIST isn’t run on power-up
1 LBIST is run on power-up
LBIST and CVH self-test are run in parallel. Therefore if both are enabled
on power-up, power-on time is ≈30 ms.
CSE[18]:
Power-up CVH self-test enable.
CVH self-test requires ≈30 ms to run.
Value Description
0 CVH is not run on power-up
1 CVH is run on power-up
LBIST and CVH self-test are run in parallel. Therefore, if both are enabled
on power-up, power-on time is ≈30 ms.
DST[13]:
Disable Self-test initiation from the serial register.
Value Description
0Self-tests may be initiated via a “special” serial register
command.
1Prevents running either LBIST or CVH self-test from the
CTRL register.
DHR[12]:
Disable Hard reset from the serial register.
Value Description
0A Hard reset may be initiated via a “special” serial register
command.
1 Prevents initiating a Hard reset from the CTRL register.
MAG_THRES_HI[11:6]:
Magnetic threshold high value. Determine set-point of the MSH flag. When
set to 0, check is disabled.
Limit increases in 32 G increments. Set to 1184 G at factory.
Value Description
00 0000 High field flag disabled
00 0001 32 G
00 0010 64 G
10 0101 1184 G
11 1111 2016 G
MAG_THRES_LO[5:0]:
Magnetic threshold low value. Determine set-point of the MSL flag. When
set to 0, check is disabled.
Limit increased in 16 G increments. Set to 208 G at factory.
Value Description
00 0000 Low field flag disabled
00 0001 16 G
00 0010 32 G
00 1101 208 G
11 1111 1008 G
Bit 23 22 21 20 19 18 17 16 15 14 13 12 11 10987654321 0
Name Customer EEPROM Space
Default00000000000000000000000 0
Address 0x1F (CUST)
CUSTOMER[23:0]:
Customer EEPROM space.
Precision, High Speed, Hall-Effect Angle Sensor IC
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A1339
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SAFETY AND DIAGNOSTICS
The A1339 was developed in accordance with the ASIL design
flow (ISO 26262) and incorporates several internal diagnostics as
well as error/warning/status flags enabling the host microntroller
to assess the operational status of the die.
A short summary of the A1339 diagnostics is provided below. A
complete listing and discussion of the A1339 safety features may
be found in the “A1339 Safety Manual”, which is available upon
request.
Built-In Self-Tests
The A1339 features two built-in-self-tests (BISTS) which may
be configured to run at power-up and may also be initiated at any
time by the system microcontroller via a serial register write. A
failure of any one of the self-tests will assert the Self-Test Failure
Flag, STF, within the Error register.
CVH SELF-TEST
CVH self-test is a method of verifying the operation of the CVH
transducer without applying an external magnetic field. This
feature is useful for both manufacturing test and for integration
debug. The CVH self-test is implemented by changing the switch
configuration from the normal operating mode into a test configu-
ration, allowing a test current to drive the CVH in place of the
magnetic field. By changing the direction of the test current and
by changing the elements in the CVH that are driven, the self-test
circuit emulates a changing angle of magnetic field. The mea-
sured angle is monitored to determine a passing or failing device.
CVH self-test typically takes 30 ms to run (when run in parallel
with LBIST, entire test time is 30 ms).
LOGIC BUILT-IN SELF-TEST (LBIST)
Logic BIST is implemented to verify the integrity of the A1339
logic. It can be executed in parallel with the CVH self-test.
LBIST is effectively a form of auto-driven scan. The logic to be
tested is broken into 31 scan chains. The chains are fed in paral-
lel by a 31-bit linear feedback shift register (LFSR) to generate
pseudo-random data. The output of the scan chains are fed back
into a multiple input shift register (MISR) that accumulates the
shifted bits into a 31-bit signature.
LBIST takes ≈30 ms to complete (when run in parallel with CHV
self-test, the entire test time is ≈30 ms).
Status, Error, and Warning Flags
The A1339 features many flags used to detect faulty external or
internal conditions. Table 18 briefly describes a selection.
All flags may be read through the serial registers via SPI or
Manchester communication. All unmasked error flags will assert
the “General Error” flag which is included in the angle register
(0x20), providing a “snapshot” of the sensors status.
Error reporting when using PWM or ABI is more limited and
discussed later on.
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Table 18: Status and Error Flags
Fault Condition Description Sensor Response
VCC < VUVD Indicates VCC is below expected level. UVD flag set in ERR register
UV flag set in ANG register
EF flag set in ANG register
Field > High Threshold Sensor monitors field level in case of mechanical failure.
High Level is programmable from 0-2016 G in 32 G steps.
By default set to ≈1184 G.
MSH flag set in WARN register
EF flag set in ANG register
Field < Low Threshold Sensor monitors field level in case of mechanical failure.
Low Level is programmable from 0-1008 G in 16 G steps.
By default set to ≈208 G.
MSL flag set in ERR register
EF flag set in ANG register
TA < –60°C or TA > 180°C Ambient temperature beyond maximum detectable value. TR flag set in WARN register
EF flag set in ANG register
Oscillator Frequency Discrepancy The A1339 cross-checks the high and low frequency oscillators
for proper functionality.
OFE flag set in ERR register
EF flag set in ANG register
Single Bit EEPROM Error (correctable) Detects and corrects single bit EEPROM errors. ESE bit set in WARN register
EF flag set in ANG register
Multi-Bit EEPROM failure (uncorrectable) Detects multi-bit EEPROM errors. EUE bit set in ERR register
EF flag set in ANG register
Signal Path Failure Multiple comparisons and checks within the signal path:
Main signal path output compared to low power signal path
(ZCD)
PLL lock status monitored
Main signal path is checked for saturation
PLK or ZIE set within the ERR register
EF flag set within the ANG register
Loss of VCC Determines if system power was lost. Indicates all volatile
registers have been reset (such as turns count).
RST bit set in ERR register
EF flag set in ANG register
ABI Integrity Fault Excessive noise or excessive rotational velocity for a given ABI
resolution. IC monitors state of ABI and flags skipped states.
ABI bit set in ERR register
EF flag set in ANG register
Analog regulator drift IC monitors output of analog regulator, ensuring transducer is
supplied with proper voltage.
UVA bit set in ERR register
UV flag set in ANG register
EF flag set in ANG register
Excessive magnet travel Sensor detects when > 256 rotations have occurred, indicating
the turns counter has saturated.
TOV bit set in WARN register
EF flag set in ANG register
Excessive magnet velocity for LPM If the sensor detects > 135° travel between LPM “wake” states,
error flag is set.
TCW bit set in WARN register
EF flag set in ANG register
Excessive Magnet Velocity during LPM
(default > 100 RPM)
When the sample-to-sample angle difference between “Wake”
states is greater than LPM_WAKE_THRESHOLD level, IC will
enter and stay in the “Wake” state to prevent missing turns.
IC stays in WAKE state until velocity is
reduced
Excessive magnet velocity for a given
ORATE setting
Indicates the angle reading spanned more than 2 quadrants
during the ORATE sample period, therefore the average may be
incorrect. Can occur under extreme velocity and high averaging,
or with no magnetic field and the samples out of the CVH are
random.
AVG bit set in ERR register
EF flag set in the ANG register
Incoming SPI Packet Corruption IER error detects an invalid number of SCLKs, or a ‘1’ in the
MSB on MOSI.
If using 20-bit SPI packets and incoming CRC validation is
enabled (SC bit in EEPROM 0x1B), the CRC flag will assert.
Depending on implementation and
amount of corruption:
IER bit set in WARN register
CRC bit set in WARN register
EF flag set in ANG register
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ERROR REPORTING IN PWM
The PWM output can be configured to change state if certain
errors occur. There are three options:
No error reporting
Tristate the PWM
Halve the carrier frequency and represent the error via
different duty cycles
Two EEPROM bits, “PEO” and “PES” control how errors are
reported in PWM mode, both of which are in the PWS address
row of EEPROM:
Table 19: PWM Error Output Enable Option (PEO)
Code Description
0 PWM does not respond to errors.
1 PWM output responds to errors as selected with
the PES field.
Table 20: PWM Error Select (PES)
Code Description
0 PWM tristates on an error.
1 PWM carrier frequency halved and highest
priority error output on PWM as selected duty
cycle.
The error priority and corresponding duty cycle are shown in
Table 21 below, with the high priority error dictating the PWM
duty cycle.
Each error code must be enabled via EEPROM. This prevents
losing the PWM output due to a spurious error.
The enable bits can be found within the PWE (0x18) EEPROM
row.
Table 21: PWM Error Duty Cycle and Priority
Error Priority Duty Cycle % Description / Persistence
OFE 1 (highest) 5 Watchdog error. Permanent.
EUE 2 10.625 EEPROM uncorrectable error. Permanent.
STF 3 16.25 Self-test failure. Permanent.
PLK 4 21.875 PLL not locked. Persists until PLL locks.
ZIE 5 27.5 Zero-crossing integrity error. Persists until goes away.
AVG 6 33.125 Angle averaging error. Outputs once then clears.
UV 7 38.75 Undervoltage (UVA and/or UVCC dependent on serial error masks).
Persists until no unmasked undervoltage.
MSL 8 44.375 Persists until field strength higher than low threshold.
ESE 9 50 EEPROM correctable error. Outputs once then clears.
SAT 10 55.625 Persists until no saturation warnings.
MSH 11 61.25 Persists until field strength lower than high threshold.
TR 12 66.875 Persists until temperature within range.
TOV 13 (lowest) 72.5 Turns counter overflow. Persists until cleared via CTRL register.
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ERROR REPORTING IN ABI/UVW
Error reporting when using ABI/UVW requires the transmis-
sion of angle information to be interrupted. As a result, only the
two most severe errors are allowed to interrupt the pulse stream,
preventing potential spurious errors from interrupting the primary
mission of the IC.
As further insurance against undesired ABI/UVW interruption,
error reporting must be individually enabled in EEPROM. The
error conditions which may be reported are:
Oscillator Frequency Error
PLL Loss of Lock Error
When enabled, and an error occurs, all three ABI lines will be
brought high (prior to inversion, if enabled). This is an undefined
state in both ABI (if using default I mode width) and UVW.
Error reporting is enabled via the following two EEPROM bits,
housed within address row 0x19.
WDH[7]:
Enable ABI all high (before inversion) as error mode if oscilla-
tor frequency watchdog error trips.
Value Description
0 ABI pins do not respond to an OFE Flag
1 ABI outputs go high if an OFE is detected
PLH[6]:
Enable ABI all high (before inversion) as error mode if a PLL
loss of lock is detected.
Value Description
0 ABI pins do not respond to an PLK Flag
1 ABI outputs go high if the PLK flag is set
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APPLICATION INFORMATION
The A1339 features SPI, PWM, ABI/UVW, and Manchester outputs. Basic reference circuits for connecting the A1339 are shown
below in Figure 49.
A
A1339
I
B
GND
CS/SA0
MISO
MOSI/SA1
SCLK
VCC
VS
BYP
RP
PWM Out
VCC
0.1 µF
Optional, enabled/disabled
via EEPROM
PWM
Typical A1339 configuration using PWM output.
Digital reads/writes requests transmitted via Manchester encoding on the VCC line.
SA0/SA1 brought to BYP or GND to configure Manchester address.
0.1 µF
A1339 PWM/ABI
When using PWM, LPM should be disabled
by setting the LPMD bit within EEPROM (bit 20 of address 0x1D).
A
A1339
I
B
GND
CS/SA0
MISO
MOSI/SA1
SCLK
VCC
BYP
VCC
0.1 µF
Optional, enabled/disabled
via EEPROM
PWM
Host Micro
Optional I/O Pull-Ups
≈100 kΩ
Optional, enabled/disabled
via EEPROM
0.1 µF
Typical A1339 configuration using SPI interface.
A1339 SPI
A
A1339
I
B
GND
CS/SA0
MISO
MOSI/SA1
SCLK
VCC
BYP
Optional, enabled/disabled
via EEPROM*
PWM
Host Micro
Optional I/O Pull-Ups
≈100 kΩ
50 Ω
0.1 µF
VBatt
39 V
External Protection
For Load Dump
(Battery Only)
4.7 kΩ
PWM Out
125 Ω
0.1 µF
Vs
A1339 reference design for stringent EMC requirements.
*If using ABI outputs, a 10 nF capacitor to GND on each line is recommended
A1339 EMC Circuit
(this added capacitance will reduce the edge rates on ABI).
Figure 49: A1339 PWM/ABI, SPI, and EMC Application Circuits
ESD Performance
Under certain conditions, the ESD rating of the dual die IC may
be less than 2 kV if ground pins are not tied together. Contact
Allegro for questions regarding ESD optimization.
Table 22: HBM ESD Rating (per AEC-Q100 002)
Package ESD Rating
TSSOP-14 5 kV
eTSSOP-24 4 kV [1]
[1] All GND pins shorted together.
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Setting the Zero-Degree Position
When shipped from the factory, the default angle value when
oriented as shown in Figure 50 is 0° for both die. In some cases,
the end user may want to program an angle offset in the A1339 to
compensate for variations in magnetic assemblies, or for applica-
tions where absolute system-level readings are required.
The internal algorithm for computing the output angle is as fol-
lows:
Angleout = AngleRAW – ZERO_OFFSET
where ZERO_OFFSET is a 12-bit field in EEPROM.
To “zero out” the A1339 reported angle, during final application
calibration, position the magnet above the A1339 in the desired
zero-degree position and read the reported angle. This angle
becomes the necessary ZERO_OFFSET value to “zero-out” the
angle.
In some cases, it may be convenient to have a 180° offset
between die. The RD field (bit 19 of EEPROM location 0x19)
allows a 180° offset to be applied. When set, this bit adds 180° to
the output of the die (occurs after ZERO_OFFSET and rotation
adjustments).
NS
Target poles aligned with
A1339 elements
E1
Pin 1
E2
Figure 50: Orientation of Magnet Relative to
Primary and Secondary Die
Magnetic Target Requirements
The A1339 is designed to operate with magnets constructed with
a variety of magnetic materials, geometries, and field strengths.
See Table 23 for a list of common magnet dimensions.
The A1339 actively measures and adapts to its magnetic envi-
ronment. This allows operation throughout a large range of
field strengths (recommended range is 300 to 1000 G, operation
beyond this range will not result in long term damage). Due to
the greater signal-to-noise ratio provided at higher field strengths,
performance inherently increases with increasing field strength.
Typical angle performance over applied field strength is shown in
Figure 52 and Figure 53
Table 23: Target Magnet Parameters
Magnetic Material Diameter
(mm)
Thickness
(mm)
Neodymium (sintered)* 10 2.5
Neodymium (sintered) 8 3
Neodymium / SmCo 6 2.5
NS
Thickness
Diameter
* A sintered Neodymium magnet with 10 mm (or greater) diameter
and 2.5 mm thickness is the recommended magnet for redundant
applications.
1600
1400
1200
1000
800
600
400
200
0
0.5 2.5 4.5 6.5 8.5
Air Gap (mm)
SmCo24
NdFe30
Ceramic
(Ferrite)
Magnetic Field (G)
Figure 51: Magnetic Field versus Air Gap for a magnet 6 mm
in diameter and 2.5 mm thick.
Allegro can provide similar curves for customer application magnets
upon request. Allegro recommends larger magnets for applications
that require optimized accuracy performance.
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200 300 400 500 600 700 800 900
Field Strength in Gauss
0
0.5
1
1.5
2
2.5
Angle Error in Degrees
25°C
150°C
Recommended Operating Range
(300 G and above)
Figure 52: Angle Error over Field Strength
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Angle Noise in Degrees
200 300 400 500 600 700 800 900
Field Strength in Gauss
25°C
150°C
Recommended Operating Range
(300 G and above)
Figure 53: Noise (3 Sigma) over Field Strength
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A1339
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Allegro MicroSystems, LLC
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Magnet Misalignment
Magnetic misalignment with the A1339 package impacts the
linearity of the observed magnetic signal and consequently the
resulting accuracy. The influence of mechanical misalignment
may be minimized by reducing the overall airgap and by choos-
ing a larger magnet diameter. Figure 54 shows the influence of
magnet diameter of eccentricity error.
The dual die variant of the A1339 uses a stacked die approach,
resulting in a common eccentricity value for both die. This
eliminates the “native misalignment” present in “side-by-side”
packaging options.
0 0.5 1
1.5
Misalignment (mm)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
Angle Error
6.00 mm Diameter
8.00 mm Diameter
10.00 mm Diameter
Figure 54: Simulated Error versus Eccentricity for di󰀨erent size magnet diameters, at 2.0 mm air gap
Typical Systemic Error versus magnet to sensor eccentricity (daxial), Note: “Systemic Error” refers to application errors in alignment
and system timing. It does not refer to sensor IC device errors. The data in this graph is simulated with ideal magnetization.
Target rotation axis
Target clockwise rotation
(Increasing angle, with
default EEPROM settings)
Target counter clockwise rotation
(decreasing angles, with
default EEPROM settings)
Figure 55: Rotation Direction Denition
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A1339
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Allegro MicroSystems, LLC
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I/O STRUCTURES
33 Ω
A/U, B/V, I/W, MISO PWM
33 Ω
SCK/CSN/MOSI
1 kΩ
WAKE
1 kΩ 1 MΩ
VPOS
VREF
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Figure 56: Package LP, 24-Pin TSSOP with Exposed Thermal Pad
PACKAGE OUTLINE DRAWINGS
For Reference Only –Not for Tooling Use
(Reference MO-153 ADT)
NOT TO SCALE
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
A
1.20 MAX
0.15
0.00
0.30
0.19
0.20
0.09
0.60 ±0.15 1.00 REF
C
SEATING
PLANE
C0.10
24X
0.65 BSC
0.25 BSC
21
24
7.80 ±0.10
4.40±0.10 6.40±0.20
GAUGE PLANE
SEATING PLANE
B
4.32 NOM
3 NOM
0.65
6.103.00
4.32
1.65
0.45
CPCB Layout Reference View
A
C
EHall elements (E1, E2), corresponding to respective die; not to scale.
D Branding scale and appearance at supplier discretion.
F
Terminal #1 mark area.
Reference land pattern layout (reference IPC7351 TSOP65P640X120-25M)
;
all pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances; when
mounting on a multilayer PCB, thermal vias can improve thermal dissipation
(reference EIA/JEDEC Standard JESD51-5).
Active Area Depth. F1: 0.47 mm; F2: 0.62 mm.
D
1
Standard Branding Reference View
BExposed thermal pad (bottom surface); dimensions may vary with device.
E
E1
E2
2.20
E
E
3.90
Lines 1, 2, 3: Maximum 9 characters per line
Line 1: Part number
Line 2: Logo A, 4-digit date code
Line 3: Characters 5, 6, 7, 8 of
Assembly Lot Number
XXXXXXXXX
Date Code
Lot Number
FF1
FF2
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Allegro MicroSystems, LLC
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Figure 57: Package LE, 14-Pin TSSOP
For Reference Only Not for Tooling Use
(Reference DWG-2870)
Dimensions in millimeters NOT TO SCALE
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
A
B
B
Branding scale and appearance at supplier discretion.
Hall element (D1); not to scale.
C
D
6.00
0.65
0.45
1.70
14
21
1
C
PCB Layout Reference View
Standard Branding Reference View
Lines 1, 2: Maximum 7 characters per line
Line 3: Maximum 5 characters per line
Line 1: Part number
Line 2: Logo A, 4-digit date code
Line 3: Characters 5, 6, 7, 8 of
Assembly Lot Number
Terminal #1 mark area.
Reference land pattern layout (reference IPC7351 TSOP65P640X120-14M);
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances; when
mounting on a multilayer PCB, thermal vias at the exposed thermal pad land
can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5).
XXXXXXX
Date Code
Lot Number
A
1.10 MAX
0.15
0.00
0.95
0.85
0.30
0.19
0.20
0.09
0.60
1.00 REF
C
SEATING
PLANE
C0.10
16X
0.65 BSC
0.25 BSC
21
14
5.00 ±0.10
4.40 ±0.10 6.40 BSC
GAUGE PLANE
SEATING PLANE
D
D
D
Branded Face
+0.15
–0.10
2.50
2.20
D1
D E1
DD1
E
Active Area Depth 0.36 mm.
E
Precision, High Speed, Hall-Effect Angle Sensor IC
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APPENDIX A: ANGLE ERROR AND DRIFT DEFINITION
Angle error is the difference between the actual position of the
magnet and the position of the magnet as measured by the angle
sensor IC (without noise). This measurement is done by reading
the angle sensor IC output and comparing it with a high resolu-
tion encoder (refer to Figure 58).
Angle Error
E [º]
E =–
Sensor Real
E
max
E–E
max min
E
minl
360º
Reference
Angle
Real
Figure 58: Angle Error Denition
Angle Error Definition
Throughout this document, the term “angle error” is used exten-
sively. Thus, it is necessary to introduce a single angle error
definition for a full magnetic rotation. The term “angle error” is
calculated according to the following formula:
maxmin
AngleError
EE
2
=
In other words, it is the amplitude of the deviation from a perfect
straight line between 0 and 360 degrees. For the purposes of a
generic definition, the offset of the IC angle profile is removed
prior to the error calculation (this can be seen in Figure 58). The
offset itself will depend on the starting IC angle position relative
to the encoder 0° and thus can differ anywhere from 0-360°.
Angle Drift
Angle drift is the change in the observed angular position over
temperature, relative to 25°C.
During Allegro’s factory trim, drift is measured at 150°C. The
value is calculated using the following formula:
AngleDrift = Angle25°C – Angle150°C
where each Angle value is an array corresponding to 16 angular
positions around a circle.
Reference Angle
Ideal
Angle Error (Deg)
Angle Drift of 150°C in Reference to 25°C
Error 25°C
Error 150°C
No Error
Drift of data point 1
Drift of data point 2
Figure 59: Angle Drift of 150°C in Reference to 25°C [1]
[1] Note that the data above is simply a representation of angle
drift and not real data.
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Copyright ©2018, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of
Allegro’s product can reasonably be expected to cause bodily harm.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its
use; nor for any infringement of patents or other rights of third parties which may result from its use.
Copies of this document are considered uncontrolled documents.
For the latest version of this document, visit our website:
www.allegromicro.com
Revision History
Number Date Description
September 25, 2017 Initial release
1 February 23, 2018
Updated Functional Block Diagram (p. 1), Transport Mode Supply Current value (p. 6), Response Time
value (p. 8), Typical Performance Characteristics section (p. 9-10), Figure 12 (p. 13), Figure 13 (p. 14),
Device Programming Interfaces section (p. 34-50), Table 14 heading (p. 51), Mag_Thresh_Hi and
Mag_Thresh_Lo descriptions (p. 73), Table 18 (p. 75), Setting the Zero-Degree Position section (p. 79),
Magnetic Target Requirements section (p. 79-80), I/O Structures (p. 82), and Package Outline Drawings
active area depths (p. 83-84).
Added Manchester Interface Specifications (p. 7), Impact of High Speed Sensing section (p. 11-12).
Removed CRC Documentation appendix.
2 August 7, 2018 Added A1339LLPTR-5-DD-T to Selection Guide (p. 2); updated Power-On Time (p. 6), Manchester High
Voltage and footnotes (p. 7-8).
3 October 15, 2018 Updated ASIL status