NL27WZ07DFT2G - ON SEMICONDUCTOR

April, 2012 − Rev. 15

1Publication Order Number:

NL27WZ07/D

NL27WZ07

Dual Buffer with Open Drain

Outputs

The NL27WZ07 is a high performance dual buffer with open drain

outputs operating from a 1.65 to 5.5 V supply.

The internal circuit is composed of multiple stages, including an

open drain output. The open drain output provides the capability to set

the output switching level to a user selectable value with an external

resistor and power supply. The logic high output value is set by the

external power supply and can be less than, equal or greater than the

VCC power supply, provided the voltage supply is less than 5.5 V.

Features

•Extremely High Speed: tPD 2.3 ns (typical) at VCC = 5 V

•Designed for 1.65 V to 5.5 V VCC Operation, CMOS compatible

•Over Voltage Tolerant Inputs

•LVTTL Compatible − Interface Capability with 5 V TTL Logic

with VCC = 3 V

•LVCMOS Compatible

•24 mA Output Sink Capability

•Near Zero Static Supply Current Substantially Reduces System

Power Requirements

•Chip Complexity: FET = 72; Equivalent Gate = 18

•These Devices are Pb−Free and are RoHS Compliant

•NLV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q100

Qualified and PPAP Capable

IN A2 OUT Y2

Figure 1. Pinout (Top View)

Figure 2. Logic Symbol

1OUT Y1

IN A1

VCC

IN A1 OUT Y1

GND

IN A2 OUT Y2

See detailed ordering and shipping information in the package

dimensions section on page 4 of this data sheet.

ORDERING INFORMATION

MARKING

DIAGRAMS

SC−88

DF SUFFIX

CASE 419B

TSOP−6

DT SUFFIX

CASE 318G

PIN ASSIGNMENT

3IN A2

IN A1

GND

OUT Y2

OUT Y16

FUNCTION TABLE

A Input Y Output

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M7 M G

M7 = Device Code

M = Date Code*

G= Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation and/or position may vary

depending upon manufacturing location.

1M7 M G

Pin Function

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MAXIMUM RATINGS

Symbol Characteristics Value Units

VCC DC Supply Voltage −0.5 to +7.0 V

VIDC Input Voltage −0.5 ≤ VI ≤ +7.0 V

VODC Output Voltage

Output in Z or LOW State (Note 1)

−0.5 ≤ VO ≤ +7.0 V

IIK DC Input Diode Current

VI < GND

−50 mA

IOK DC Output Diode Current

VO < GND

−50 mA

IODC Output Sink Current ±50 mA

ICC DC Supply Current per Supply Pin ±100 mA

IGND DC Ground Current per Ground Pin ±100 mA

TSTG Storage Temperature Range −65 to +150 °C

PDPower Dissipation in Still Air

SC−88, TSOP−6200

qJA Thermal Resistance

SC−88, TSOP−6 333

°C/W

TLLead Temperature, 1 mm from case for 10 s 260 °C

TJJunction Temperature under Bias +150 °C

ILatchup Latchup Performance

Above VCC and Below GND at 85°C (Note 5) ±500

MSL Moisture Sensitivity Level 1

FRFlammability Rating

Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in

VESD ESD Classification

Human Body Model (Note 3)

Machine Model (Note 4)

Charged Device Model (Note 5)

> 2000

> 200

N/A

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. IO absolute maximum rating must be observed.

2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.

3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.

4. Tested to JESD22−C101−A

5. Tested to EIA/JESD78

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Max Units

VCC Supply Voltage

Operating

Data Retention Only

1.65

1.5

5.5

VIInput Voltage 0 5.5 V

VOOutput Voltage (Z or LOW State) 0 5.5 V

TAOperating Free−Air Temperature −55 +125 °C

Dt/DVInput Transition Rise or Fall Rate

VCC = 2.5 V ±0.2 V

VCC = 3.0 V ±0.3 V

VCC = 5.0 V ±0.5 V

ns/V

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DC ELECTRICAL CHARACTERISTICS

Symbol Parameter Condition

VCC

(V)

TA = 25°C−55°C 3TA 3 125°C

Units

Min Typ Max Min Max

VIH High−Level Input Voltage 1.65 to 1.95

2.3 to 5.5

0.75 VCC

0.7 VCC

0.75 VCC

0.7 VCC

VIL Low−Level Input Voltage 1.65 to 1.95

2.3 to 5.5

0.25 VCC

0.3 VCC

0.25 VCC

0.3 VCC

ILKG Z−State Output Leakage

Current

VIN = VIL

VOUT = VCC or GND

2.3 to 5.5 ±5.0 ±10.0 mA

VOL Low−Level Output

Voltage

VIN = VIL

IOL = 100 mA1.65 to 5.5 0.0 0.1 0.1 V

IOL = 4 mA 1.65 0.08 0.24 0.24

IOL = 8 mA 2.3 0.20 0.3 0.3

IOL = 12 mA 2.7 0.22 0.4 0.4

IOL = 16 mA 3.0 0.28 0.4 0.4

IOL = 24 mA 3.0 0.38 0.55 0.55

IOL = 32 mA 4.5 0.42 0.55 0.55

IIN Input Leakage Current VIN = 5.5 V or GND 0 to 5.5 ±0.1 ±1.0 mA

IOFF Power Off

Leakage Current

VIN = 5.5 V or

VOUT = 5.5 V

0 1 10 mA

ICC Quiescent Supply Cur-

rent

VIN = 5.5 V or GND 5.5 1 10 mA

AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W

Symbol Parameter Condition VCC (V)

TA = 25°C−55°C 3 TA 3 125°C

Units

Min Typ Max Min Max

tPZL Propagation Delay

(Figure 3 and 4)

RL = R1 = 5000 W, CL = 15 pF 1.8 ±0.15 1.8 5.3 11.5 1.8 12.0 ns

RL = R1 = 500 W, CL = 50 pF

2.5 ±0.2 1.2 3.7 5.8 1.2 6.4

3.3 ±0.3 0.8 2.9 4.4 0.8 4.8

5.0 ±0.5 0.5 2.3 3.5 0.5 3.9

tPLZ Propagation Delay

(Figure 3 and 4)

RL = R1 = 5000 W, CL = 15 pF 1.8 ±0.15 1.8 5.3 11.5 1.8 12.0 ns

RL = R1 = 500 W, CL = 50 pF

2.5 ±0.2 1.2 2.8 5.8 1.2 6.4

3.3 ±0.3 0.8 2.1 4.4 0.8 4.8

5.0 ±0.5 0.5 1.4 3.5 0.5 3.9

CAPACITIVE CHARACTERISTICS

Symbol Parameter Condition Typical Units

CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF

COUT Output Capacitance VCC = 5.5 V, VI = 0 V or VCC 4.0 pF

CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 4.0 pF

6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.

Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin ) ICC. CPD is used to determine the no−load dynamic

power consumption; PD = CPD  VCC2  fin ) ICC  VCC.

NL27WZ07

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Figure 3. Switching Waveforms

PULSE

GENERATOR

DUT

VCC

RT = ZOUT of pulse generator (typically 50 W)

Figure 4. Test Circuit

50%

50% VCC

tPZL tPLZ

VCC

GND

HIGH

IMPEDANCE

VOL )0.3 V

VCC 2

ORDERING INFORMATION

Device Package Shipping†

NL27WZ07DFT2G SC−88 / SOT−363 / SC−70−6

(Pb−Free) 3000 / Tape & Reel

NLV27WZ07DFT2G* SC−88 / SOT−363 / SC−70−6

(Pb−Free) 3000 / Tape & Reel

NL27WZ07DTT1G TSOP−6

(Pb−Free) 3000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP

Capable.

NL27WZ07

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PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.

E0.2 (0.008) MM

123

654

−E−

b6 PL

SC−88/SC70−6/SOT−363

CASE 419B−02

ISSUE W

DIM MIN NOM MAX

MILLIMETERS

A0.80 0.95 1.10

A1 0.00 0.05 0.10

b0.10 0.21 0.30

C0.10 0.14 0.25

D1.80 2.00 2.20

0.031 0.037 0.043

0.000 0.002 0.004

0.004 0.008 0.012

0.004 0.005 0.010

0.070 0.078 0.086

MIN NOM MAX

INCHES

0.20 REF 0.008 REF

E1.15 1.25 1.35

e0.65 BSC

L0.10 0.20 0.30

2.00 2.10 2.20

0.045 0.049 0.053

0.026 BSC

0.004 0.008 0.012

0.078 0.082 0.086

ǒmm

inchesǓ

SCALE 20:1

0.65

0.025

0.65

0.025

0.50

0.0197

0.40

0.0157

1.9

0.0748

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

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PACKAGE DIMENSIONS

ÉÉ

TSOP−6

CASE 318G−02

ISSUE U

456

0.05

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM

LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,

PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR

GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D

AND E1 ARE DETERMINED AT DATUM H.

5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

MIN NOM MAX

MILLIMETERS

0.90 1.00 1.10

A1 0.01 0.06 0.10

b0.25 0.38 0.50

c0.10 0.18 0.26

D2.90 3.00 3.10

E2.50 2.75 3.00

e0.85 0.95 1.05

L0.20 0.40 0.60

0.25 BSC

−

0°10°

1.30 1.50 1.70

RECOMMENDED

NOTE 5

SEATING

PLANE

GAUGE

PLANE

DETAIL Z

0.60

3.20 0.95

0.95

PITCH

DIMENSIONS: MILLIMETERS

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

NL27WZ07/D

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

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Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your local

Sales Representative