PIC10F320-I/MC - MICROCHIP - Datasheet.Cloud

 2011 Microchip Technology Inc. Preliminary DS41585A

PIC10(L)F320/322

Data Sheet

6/8-Pin, High-Performance,

Flash Microcontrollers

DS41585A-page 2 Preliminary  2011 Microchip Technology Inc.

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ISBN: 978-1-61341-380-7

Note the following details of the code protection feature on Microchip devices:

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intended manner and under normal conditions.

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Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

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 2011 Microchip Technology Inc. Preliminary DS41585A-page 3

PIC10(L)F320/322

High-Performance RISC CPU:

• Only 35 Instructions to Learn:

- All single-cycle instructions, except branches

• Operating Speed:

- DC – 16 MHz clock input

- DC – 250 ns instruction cycle

• Up to 512 Words of Flash Program Memory

• 64 Bytes Data Memory

• Eight-level Deep Hardware Stack

• Interrupt Capability

• Processor Self-Write/Read access to Program

Memory

• Pinout Compatible to other 6-Pin PIC10FXXX

Microcontrollers

S pecial Microcontroller Features:

• Low-Power 16 MHz Internal Oscillator:

- Software selectable frequency range from

16 MHz to 31 kHz

- Factory calibrated to  1%, typical

• Wide Operating Range:

- 1.8V to 3.6V (PIC10LF320/322)

- 2.3V to 5.5V (PIC10F320/322)

• Power-on Reset (POR)

• Power-up Timer (PWRT)

• Brown-out Reset (BOR)

• Ultra Low-Power Sleep Regulator

• Extended Watchdog Timer (WDT)

• Programmable Code Protection

• Power-Saving Sleep mode

• Selectable Oscillator options (EC mode or Internal

Oscillator)

• In-Circuit Serial Programming™ (ICSP™) (via

Two Pins)

• In-Circuit Debugger Support

• Fixed Voltage Reference (FVR) with 1.024V,

2.048V and 4.096V (‘F’ variant only) Output

Levels

• Integrated Temperature Indicator

• 40-year Flash Data Retention

Low-Power Features (PIC10LF320/322):

• Standby Current:

- 20 nA @ 1.8V, typical

• Operating Current:

-25A @ 1 MHz, 1.8V, typical

• Watchdog Timer Current:

- 500 nA @ 1.8V, typical

Peripheral Feat ures:

• 4 I/O Pins:

- 1 input-only pin

- High current sink/source for LED drivers

- Individually selectable weak pull-ups

- Interrupt-on-Change

• Timer0: 8-Bit Timer/Counter with 8-Bit

Programmable Prescaler

• Timer2: 8-Bit Timer/Counter with 8-Bit Period

• Two PWM modules:

- 10-bit PWM, max. frequency 16 kHz

- Combined to single 2-phase output

• A/D Converter:

- 8-bit resolution with 3 channels

• Configurable Logic Cell (CLC):

- 8 selectable input source signals

- Two inputs per module

- Software selectable logic functions including:

AND/OR/XOR/D Flop/D Latch/SR/JK

- External or internal inputs/outputs

- Operation while in Sleep

• Numerically Controlled Oscillator (NCO):

- 20-bit accumulator

- 16-bit increment

- Linear frequency control

- High-speed clock input

- Selectable Output modes

- Fixed Duty Cycle (FDC)

- Pulse Frequency (PF) mode

• Complementary Waveform Generator (CWG):

- Selectable falling and rising edge dead-band

control

- Polarity control

- 2 auto-shutdown sources

- Multiple input sources: PWM, CLC, NCO

6/8-Pin Flash-Based , 8-Bit Microcontrollers

PIC10(L)F320/322

DS41585A-page 4 Preliminary  2011 Microchip Technology Inc.

FIGURE 1: 6-PIN DIAGRAM, PIC10(L)F320/322

FIGURE 2: 8-PIN DIAGRAM, PIC10(L)F320/322

TABLE 2: 6 AND 8-PIN ALLOCATION TABLE (PIC10(L)F320/322)

TABLE 1: PIC10(L)F320/322 FEATURE SUMMARY

Device

Program

Memory

Flash

(words)

SRAM

(bytes) I/O(1) 8-bit A/D (ch) CLC 10-bit

PWM Timers

8-bit NCO CWG

PIC10F320 256 64 4 3 1 2 2 1 1

PIC10LF320 256 64 4 3 1 2 2 1 1

PIC10F322 512 64 4 3 1 2 2 1 1

PIC10LF322 512 64 4 3 1 2 2 1 1

Note1: One pin is input-only.

I/O 6-Pin 8-Pin Analog Timer PWM Interrupts Pull-ups CWG NCO CLC Basic ICSP

RA0 1 5 AN0 —PWM1 IOC0 YCWG1A —CLC1IN1 —ICSPDAT

RA1 3 4 AN1 — PWM2 IOC1 Y CWG1B NCO1CLK CLC1 CLKIN ICSPCLK

RA2 4 3 AN2 T0CKI —INT/IOC2 YCWG1FLT NCO1 CLC1IN2 CLKR

RA3 6 8 — — — IOC3 Y — — — MCLR VPP

N/C — 1 — — — — — — — — — —

N/C — 6 — — — — — — — — — —

VDD 5 2 — — — — — — — — VDD —

VSS 27 — —— — — — — — VSS —

PIC10(L)F320

PIC10(L)F322

RA3/MCLR/V

VDD

RA2

ICSPCLK/RA1

ICSPDAT/RA0

SOT-23

PIC10(L)F320

PIC10(L)F322

RA3/MCLR/V

VSS

N/C

RA0/ICSPDAT

ICSPCLK/RA1

N/C

VDD

RA2

PDIP, DFN

 2011 Microchip Technology Inc. Preliminary DS41585A-page 5

PIC10(L)F320/322

Table of Contents

1.0 Device Overview .......................................................................................................................................................................... 7

2.0 Memory Organization ................................................................................................................................................................. 11

3.0 Device Configuration.................................................................................................................................................................. 21

4.0 Oscillator Module........................................................................................................................................................................ 27

5.0 Resets ........................................................................................................................................................................................ 33

6.0 Interrupts .................................................................................................................................................................................... 41

7.0 Power-Down Mode (Sleep) ........................................................................................................................................................ 51

8.0 Watchdog Timer (WDT) ............................................................................................................................................................. 53

9.0 Flash Program Memory Control ................................................................................................................................................. 57

10.0 I/O Port....................................................................................................................................................................................... 75

11.0 Interrupt-On-Change .................................................................................................................................................................. 81

12.0 Fixed Voltage Reference (FVR) ................................................................................................................................................. 85

13.0 Internal Voltage Regulator (IVR) ................................................................................................................................................ 87

14.0 Temperature Indicator Module ................................................................................................................................................... 89

15.0 Analog-to-Digital Converter (ADC) Module ................................................................................................................................ 91

16.0 Timer0 Module ......................................................................................................................................................................... 101

17.0 Timer2 Module ......................................................................................................................................................................... 105

18.0 Pulse Width Modulation (PWM) Module................................................................................................................................... 107

19.0 Configurable Cell Logic (CLC).................................................................................................................................................. 113

20.0 Numerically Controlled Oscillator (NCO) Module ..................................................................................................................... 129

21.0 Complementary Waveform Generator (CWG) Module ............................................................................................................ 139

22.0 In-Circuit Serial Programming™ (ICSP™) ............................................................................................................................... 155

23.0 Instruction Set Summary .......................................................................................................................................................... 159

24.0 Electrical Specifications............................................................................................................................................................ 169

25.0 DC and AC Characteristics Graphs and Charts ....................................................................................................................... 187

26.0 Development Support............................................................................................................................................................... 189

27.0 Packaging Information.............................................................................................................................................................. 193

Appendix A: Data Sheet Revision History.......................................................................................................................................... 201

Index .................................................................................................................................................................................................. 203

The Microchip Web Site..................................................................................................................................................................... 207

Customer Change Notification Service .............................................................................................................................................. 207

Customer Support .............................................................................................................................................................................. 207

Reader Response .............................................................................................................................................................................. 208

Product Identification System ............................................................................................................................................................ 209

PIC10(L)F320/322

DS41585A-page 6 Preliminary  2011 Microchip Technology Inc.

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Customer No tific atio n Syst em

 2011 Microchip Technology Inc. Preliminary DS41585A-page 7

PIC10(L)F320/322

1.0 DEVICE OVERVIEW

The PIC10(L)F320/322 are described within this data

sheet. They are available in 6/8-pin packages. Figure 1-1

shows a block diagram of the PIC10(L)F320/322

devices. Table 1 -2 shows the pinout descriptions.

Reference Tabl e 1 - 1 for peripherals available per

device.

TABLE 1-1: DEVICE PERIPHERAL

SUMMARY

Peripheral

PIC10(L)F320

PIC10(L)F322

Analog-to-Digital Converter (ADC) ●●

Configurable Logic Cell (CLC) ●●

Complementary Wave Generator (CWG) ●●

Fixed Voltage Reference (FVR) ●●

Numerically Controlled Oscillator (NCO) ●●

Temperature Indicator ●●

PWM Modules

PWM1 ●●

PWM2 ●●

Timers

Timer0 ●●

Timer2 ●●

PIC10(L)F320/322

DS41585A-page 8 Preliminary  2011 Microchip Technology Inc.

FIGURE 1-1: PIC10(L)F320/322 BLOCK DIAGRAM

PORTA

Note 1: See applicable chapters for more information on peripherals.

CPU

Program

Flash Memory

RAM

Timing

Generation

INTRC

Oscillator

MCLR

Figure 2-1

CLKIN

CLKR

ADC

8-Bit FVR

Te m p .

Indicator

Timer2Timer0

PWM1 PWM2 NCO CLC CWG

 2011 Microchip Technology Inc. Preliminary DS41585A-page 9

PIC10(L)F320/322

TABLE 1-2: PIC10(L)F320/322 PINOUT DESCRIPTION

Name Function Input

Type Output

Type Description

RA0/PWM1/CLC1IN1/CWG1A/

AN0/ICSPDAT

RA0 TTL CMOS General purpose I/O with IOC and WPU.

PWM1 — CMOS PWM output.

CLC1IN1 ST —CLC input.

CWG1A — CMOS CWG primary output.

AN0 AN — A/D Channel input.

ICSPDAT ST CMOS ICSP™ Data I/O.

RA1/PWM2/CLC1/CWG1B/AN1/

CLKIN/ICSPCLK/NCO1CLK

RA1 TTL CMOS General purpose I/O with IOC and WPU.

PWM2 — CMOS PWM output.

CLC1 — CMOS CLC output.

CWG1B — CMOS CWG complementary output.

AN1 AN — A/D Channel input.

CLKIN ST — External Clock input (EC mode).

ICSPCLK ST — Serial Programming Clock.

NCO1CLK ST — Numerical Controlled Oscillator external clock input.

RA2/INT/T0CKI/NCO1/CLC1IN2/

CLKR/AN2/CWG1FLT

RA2 TTL CMOS General purpose I/O with IOC and WPU.

INT ST — External interrupt.

T0CKI ST — Timer0 clock input.

NCO1 — CMOS Numerically Controlled Oscillator output.

CLC1IN2 ST — CLC input.

CLKR — CMOS Clock Reference output.

AN2 AN — A/D Channel input.

CWG1FLT ST — Complementary Waveform Generator Fault 1 source input.

RA3/MCLR/VPP RA3 TTL — General purpose input.

MCLR ST — Master Clear with internal pull-up.

VPP HV — Programming voltage.

VDD VDD Power — Positive supply.

VSS VSS Power — Ground reference.

Legend: AN = Analog input or output CMOS = CMOS compatible input or output

TTL = CMOS input with TTL levels ST = CMOS input with Schmitt Trigger levels

HV = High Voltage

PIC10(L)F320/322

DS41585A-page 10 Preliminary  2011 Microchip Technology Inc.

NOTES:

 2011 Microchip Technology Inc. Preliminary DS41585A-page 11

PIC10(L)F320/322

2.0 MEMORY ORGANIZATION

These devices contain the following types of memory:

• Program Memory

- Configuration Words

- Device ID

-User ID

- Flash Program Memory

• Data Memory

- Core Registers

- Special Function Registers

- General Purpose RAM

- Common RAM

The following features are associated with access and

control of program memory and data memory:

• PCL and PCLATH

•Stack

• Indirect Addressing

2.1 Program Memory Organization

The mid-range core has a 13-bit program counter

capable of addressing 8K x 14 program memory space.

This device family only implements up to 512 words of

the 8K program memory space. Table 2-1 shows the

memory sizes implemented for the PIC10(L)F320/322

family. Accessing a location above these boundaries will

cause a wrap-around within the implemented memory

space. The Reset vector is at 0000h and the interrupt

vector is at 0004h (see Figures 2-1, and 2-2).

TABLE 2-1: DEVICE SIZES AND ADDRESSES

Device Program Memory Space (Words) Last Program Memory Address

PIC10(L)F320 256 00FFh

PIC10(L)F322 512 01FFh

PIC10(L)F320/322

DS41585A-page 12 Preliminary  2011 Microchip Technology Inc.

FIGURE 2-1: PROGRAM MEMORY MAP

AND STACK FOR

PIC10(L)F320

FIGURE 2-2: PROGRAM MEMORY MAP

AND STACK FOR

PIC10(L)F322

PC<12:0>

0000h

0004h

Stack Level 0

Stack Level 8

Reset Vector

Interrupt Vector

Stack Level 1

0005h

On-chip

Program

Memory

Page 0

00FFh

Wraps to Page 0

0100h

CALL,

RETURN, RETLW

RETFIE

Rollover to Page 0

Rollover to Page 0 FFFh

PC<12:0>

0000h

0004h

Stack Level 0

Stack Level 8

Reset Vector

Interrupt Vector

Stack Level 1

0005h

On-chip

Program

Memory

Page 0

01FFh

Wraps to Page 0

0200h

CALL

RETURN, RETLW

RE TFIE

Rollover to Page 0

Rollover to Page 0 FFFh

 2011 Microchip Technology Inc. Preliminary DS41585A-page 13

PIC10(L)F320/322

2.2 Data Memory Organization

The data memory is in one bank, which contains the

General Purpose Registers (GPR) and the Special

Function Registers (SFR). The RP<1:0> bits of the

STATUS register are the bank select bits.

RP1 RP0

00 Bank 0 is selected

The bank extends up to 7Fh (128 bytes). The lower

locations of the bank are reserved for the Special Func-

tion Registers. Above the Special Function Registers

are the General Purpose Registers, implemented as

Static RAM.

2.2.1 GENERAL PURPOSE REGISTER

FILE

The register file is organized as 64 x 8 in the

PIC10(L)F320/322. Each register is accessed, either

directly or indirectly, through the File Select Register

(FSR) (see Section 2.4 “Indirect Addressing, INDF

and FSR Registers”).

2.2.2 SPECIAL FUNCTION REGISTERS

The Special Function Registers are registers used by

the CPU and peripheral functions for controlling the

desired operation of the device (see Tab l e 2-3). These

registers are static RAM.

The special registers can be classified into two sets:

core and peripheral. The Special Function Registers

associated with the “core” are described in this section.

Those related to the operation of the peripheral features

are described in the section of that peripheral feature.

PIC10(L)F320/322

DS41585A-page 14 Preliminary  2011 Microchip Technology Inc.

2.2.2.1 STATUS Register

The STATUS register, shown in Register 2-1, contains:

• the arithmetic status of the ALU

• the Reset status

• the bank select bits for data memory (SRAM)

The STATUS register can be the destination for any

instruction, like any other register. If the STATUS

the Z, DC or C bits, then the write to these three bits is

disabled. These bits are set or cleared according to the

device logic. Furthermore, the TO and PD bits are not

writable. Therefore, the result of an instruction with the

STATUS register as destination may be different than

intended.

For example, CLRF STATUS will clear the upper three

bits and set the Z bit. This leaves the STATUS register

as ‘000u u1uu’ (where u = unchanged).

It is recommended, therefore, that only BCF, BSF,

SWAPF and MOVWF instructions are used to alter the

STATUS register, because these instructions do not

affect any Status bits. For other instructions not affect-

ing any Status bits (see Section 23.0 “Instru ction Set

Summary”).

Note 1: Bits IRP and RP1 of the STATUS register

are not used by the PIC10(L)F320 and

should be maintained as clear. Use of

these bits is not recommended, since this

may affect upward compatibility with

future products.

2: The C and DC bits operate as a Borrow

and Digit Borrow out bit, respectively, in

subtraction.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 15

PIC10(L)F320/322

R/W-0/0 R/W-0/0 R/W-0/0 R-1/q R-1/q R/W-x/u R/W-x/u R/W-x/u

IRP RP1 RP0 TO PD ZDCC

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition

bit 7 IRP: Reserved(2)

bit 6-5 RP<1:0>: Reserved(2)

bit 4 TO: Time-out bit

1 = After power-up, CLRWDT instruction or SLEEP instruction

0 = A WDT time-out occurred

bit 3 PD: Power-Down bit

1 = After power-up or by the CLRWDT instruction

0 = By execution of the SLEEP instruction

bit 2 Z: Zero bit

1 = The result of an arithmetic or logic operation is zero

0 = The result of an arithmetic or logic operation is not zero

bit 1 DC: Digit Carry/Borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1)

1 = A carry-out from the 4th low-order bit of the result occurred

0 = No carry-out from the 4th low-order bit of the result

bit 0 C: Carry/Borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1)

1 = A carry-out from the Most Significant bit of the result occurred

0 = No carry-out from the Most Significant bit of the result occurred

Note1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the

second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low-order bit of

the source register.

2: Maintain as ‘0’.

PIC10(L)F320/322

DS41585A-page 16 Preliminary  2011 Microchip Technology Inc.

2.2.3 DEVICE MEMORY MAPS

The memory maps for PIC10(L)F320/322 are as shown

in Table 2-2.

TABLE 2-2: PIC10(L)F320/322 MEMORY MAP (BANK 0)

Legend: = Unimplemented data memory locations, read as ‘0’.

* = Not a physical register.

INDF(*) 00h PMADRL 20h

General

Purpose

Registers

32 Bytes

40h

5Fh

General

Purpose

Registers

32 Bytes

60h

7Fh

TMR0 01h PMADRH 21h

PCL 02h PMDATL 22h

STATUS 03h PMDATH 23h

FSR 04h PMCON1 24h

PORTA 05h PMCON2 25h

TRISA 06h CLKRCON 26h

LATA 07h NCO1ACCL 27h

ANSELA 08h NCO1ACCH 28h

WPUA 09h NCO1ACCU 29h

PCLATH 0Ah NCO1INCL 2Ah

INTCON 0Bh NCO1INCH 2Bh

PIR1 0Ch Reserved 2Ch

PIE1 0Dh NCO1CON 2Dh

OPTION_REG 0Eh NCO1CLK 2Eh

PCON 0Fh Reserved 2Fh

OSCCON 10h WDTCON 30h

TMR2 11h CLC1CON 31h

PR2 12h CLC1SEL1 32h

T2CON 13h CLC1SEL2 33h

PWM1DCL 14h CLC1POL 34h

PWM1DC 15h CLC1GATE1 35h

PWM1CON 16h CLC1GATE2 36h

PWM2DCL 17h CLC1GATE3 37h

PWM2DC 18h CLC1GATE4 38h

PWM2CON 19h CWG1CON0 39h

IOCAP 1Ah CWG1CON1 3Ah

IOCAN 1Bh CWG1ASD 3Bh

IOCAF 1Ch CWG1RC 3Ch

FVRCON 1Dh CWG1FC 3Dh

ADRES 1Eh VREGCON 3Eh

ADCON 1Fh BORCON 3Fh

 2011 Microchip Technology Inc. Preliminary DS41585A-page 17

PIC10(L)F320/322

TABLE 2-3: SPECIAL FUNCTION REGISTER SUMMARY (BANK 0)

Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR V a lue on all

other resets

Bank 0

00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx xxxx xxxx

01h TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu

02h PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000

03h STATUS IRP RP1 RP0 TO PD ZDCC0001 1xxx 000q quuu

04h FSR Indirect Data Memory Address Pointer xxxx xxxx uuuu uuuu

05h PORTA — — — — RA3 RA2 RA1 RA0 ---- xxxx ---- uuuu

06h TRISA — — — — —(1) TRISA2 TRISA1 TRISA0 ---- 1111 ---- 1111

07h LATA — — — — — LATA2 LATA1 LATA0 ---- -xxx ---- -uuu

08h ANSELA — — — — — ANSA2 ANSA1 ANSA0 ---- -111 ---- -111

09h WPUA — — — — WPUA3 WPUA2 WPUA1 WPUA0 ---- 1111 ---- 1111

0Ah PCLATH — — — — — — — PCLH0 ---- ---0 ---- ---0

0Bh INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 000u

0Ch PIR1 —ADIF— NCO1IF CLC1IF —TMR2IF—-0-0 0-0- -0-0 0-0-

0Dh PIE1 —ADIE— NCO1IE CLC1IE —TMR2IE—-0-0 0-0- -0-0 0-0-

0Eh OPTION_REG WPUEN INTEDG T0CS T0SE PSA PS<2:0> 1111 1111 uuuu uuuu

0Fh PCON — — — — — —PORBOR ---- --qq ---- --uu

10h OSCCON — IRCF<2:0> HFIOFR — LFIOFR HFIOFS -110 0-00 -110 0-00

11h TMR2 Timer2 Module Register 0000 0000 0000 0000

12h PR2 Timer2 Period Register 1111 1111 1111 1111

13h T2CON — TOUTPS<3:0> TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000

14h PWM1DCL PWM1DCL<1:0> — — — — — — xx-- ---- uu-- ----

15h PWM1DCH PWM1DCH<7:0> xxxx xxxx uuuu uuuu

16h PWM1CON PWM1EN PWM1OE PWM1OUT PWM1POL — — — — 0000 ---- 0000 ----

17h PWM2DCL PWM2DCL<1:0> — — — — — — xx-- ---- uu-- ----

18h PWM2DCH PWM2DCH<7:0> xxxx xxxx uuuu uuuu

19h PWM2CON PWM2EN PWM2OE PWM2OUT PWM2POL — — — — 0000 ---- 0000 ----

1Ah IOCAP — — — — IOCAP3 IOCAP2 IOCAP1 IOCAP0 ---- 0000 ---- 0000

1Bh IOCAN — — — — IOCAN3 IOCAN2 IOCAN1 IOCAN0 ---- 0000 ---- 0000

1Ch IOCAF — — — — IOCAF3 IOCAF2 IOCAF1 IOCAF0 ---- 0000 ---- 0000

1Dh FVRCON FVREN FVRRDY TSEN TSRNG ——ADFVR<1:0>0x00 --00 0x00 --00

1Eh ADRES A/D Result Register xxxx xxxx uuuu uuuu

1Fh ADCON ADCS<2:0> CHS<2:0> GO/

DONE ADON 0000 0000 0000 0000

Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.

Shaded locations are unimplemented, read as ‘0’.

Note 1: Unimplemented, read as ‘1’.

PIC10(L)F320/322

DS41585A-page 18 Preliminary  2011 Microchip Technology Inc.

Bank 0 (Continued)

20h PMADRL PMADR<7:0> 0000 0000 0000 0000

21h PMADRH — — — — — — — PMADR8 ---- ---0 ---- ---0

22h PMDATL PMDAT<7:0> xxxx xxxx uuuu uuuu

23h PMDATH ——PMDAT<13:8>--xx xxxx --uu uuuu

24h PMCON1 —CFGS LWLO FREE WRERR WREN WR RD 1000 0000 1000 q000

25h PMCON2 Program Memory Control Register 2 (not a physical register) 0000 0000 0000 0000

26h CLKRCON —CLKROE— — — — — — -0-- ---- -0-- ----

27h NCO1ACCL NCO1 Accumulator <7:0> 0000 0000 0000 0000

28h NCO1ACCH NCO1 Accumulator <15:8> 0000 0000 0000 0000

29h NCO1ACCU — NCO1 Accumulator <19..16> ---- 0000 ---- 0000

2Ah NCO1INCL NCO1 Increment <7:0> 0000 0001 0000 0001

2Bh NCO1INCH NCO1 Increment <15:8> 0000 0000 0000 0000

2Ch —Unimplemented — —

2Dh NCO1CON N1EN N1OE N1OUT N1POL — — —N1PFM0000 ---0 00x0 ---0

2Eh NCO1CLK N1PWS<2:0> — — —N1CKS<1:0>

000- --00 000- --00

2Fh Reserved Reserved xxxx xxxx uuuu uuuu

30h WDTCON ——WDTPS<4:0>SWDTEN--01 0110 --01 0110

31h CLC1CON LC1EN LC1OE LC1OUT LC1INTP LC1INTN LC1MODE<2:0> 00x0 -000 00x0 -000

32h CLC1SEL0 — LC1D2S<2:0> — LC1D1S<2:0> -xxx -xxx -uuu -uuu

33h CLC1SEL1 — LC1D4S<2:0> — LC1D3S<2:0> -xxx -xxx -uuu -uuu

34h CLC1POL LC1POL — — — LC1G4POL LC1G3POL LC1G2POL LC1G1POL 0--- xxxx 0--- uuuu

35h CLC1GLS0 LC1G1D4T LC1G1D4N LC1G1D3T LC1G1D3N LC1G1D2T LC1G1D2N LC1G1D1T LC1G1D1N xxxx xxxx uuuu uuuu

36h CLC1GLS1 LC1G2D4T LC1G2D4N LC1G2D3T LC1G2D3N LC1G2D2T LC1G2D2N LC1G2D1T LC1G2D1N xxxx xxxx uuuu uuuu

37h CLC1GLS2 LC1G3D4T LC1G3D4N LC1G3D3T LC1G3D3N LC1G3D2T LC1G3D2N LC1G3D1T LC1G3D1N xxxx xxxx uuuu uuuu

38h CLC1GLS3 LC1G4D4T LC1G4D4N LC1G4D3T LC1G4D3N LC1G4D2T LC1G4D2N LC1G4D1T LC1G4D1N xxxx xxxx uuuu uuuu

39h CWG1CON0 G1EN G1OEB G1OEA G1POLB G1POLA — — G1CS0 0000 0--0 0000 0--0

3Ah CWG1CON1 G1ASDLB<1:0> G1ASDLA<1:0> — — G1IS<1:0> xxxx --xx uuuu --uu

3Bh CWG1CON2 G1ASE G1ARSEN — — — — G1ASDCLC1 G1ASDFLT xx-- --xx uu-- --uu

3Ch CWG1DBR ——CWG1DBR<5:0>--xx xxxx --uu uuuu

3Dh CWG1DBF ——CWG1DBF<5:0>--xx xxxx --uu uuuu

3Eh VREGCON — — — — — —VREGPM1Reserved ---- --01 ---- --01

3Fh BORCON SBOREN BORFS — — — — — BORRDY 10-- ---q uu-- ---u

TABLE 2-3: SPECIAL FUNCTION REGISTER SUMMARY (BANK 0) (CONTINUED)

Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR V a lue on all

other resets

Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.

Shaded locations are unimplemented, read as ‘0’.

Note 1: Unimplemented, read as ‘1’.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 19

PIC10(L)F320/322

2.3 PCL and PCLATH

The Program Counter (PC) is 13 bits wide. The low byte

comes from the PCL register, which is a readable and

writable register. The high byte (PC<12:8>) is not directly

readable or writable and comes from PCLATH. On any

Reset, the PC is cleared. Figure 2-3 shows the two

situations for the loading of the PC. The upper example

in Figure 2-3 shows how the PC is loaded on a write to

PCL (PCLATH<4:0>  PCH). The lower example in

Figure 2-3 shows how the PC is loaded during a CALL or

GOTO instruction (PCLATH<4:3>  PCH).

FIGURE 2-3: LOADING OF PC IN

DIFFERENT SITUATIONS

2.3.1 MODIFYING PCL

Executing any instruction with the PCL register as the

destination simultaneously causes the Program

Counter PC<12:8> bits (PCH) to be replaced by the

contents of the PCLATH register. This allows the entire

contents of the program counter to be changed by

writing the desired upper 5 bits to the PCLATH register.

When the lower 8 bits are written to the PCL register, all

13 bits of the program counter will change to the values

contained in the PCLATH register and those being

written to the PCL register.

A computed GOTO is accomplished by adding an offset

to the program counter (ADDWF PCL). Care should be

exercised when jumping into a look-up table or

program branch table (computed GOTO) by modifying

the PCL register. Assuming that PCLATH is set to the

table start address, if the table length is greater than

255 instructions or if the lower 8 bits of the memory

address rolls over from 0xFF to 0x00 in the middle of

the table, then PCLATH must be incremented for each

address rollover that occurs between the table

beginning and the target location within the table.

For more information refer to Application Note AN556,

“Implementing a Table Read” (DS00556).

2.3.2 STACK

All devices have an 8-level x 13-bit wide hardware

stack (see Figure 2-1). The stack space is not part of

either program or data space and the Stack Pointer is

not readable or writable. The PC is PUSHed onto the

stack when a CALL instruction is executed or an inter-

rupt causes a branch. The stack is POPed in the event

of a RETURN, RETLW or a RETFIE instruction execu-

tion. PCLATH is not affected by a PUSH or POP oper-

ation.

The stack operates as a circular buffer. This means that

after the stack has been PUSHed eight times, the ninth

push overwrites the value that was stored from the first

push. The tenth push overwrites the second push (and

so on).

2.4 Indirect Addressing, INDF and

FSR Registers

The INDF register is not a physical register. Addressing

the INDF register will cause indirect addressing.

Indirect addressing is possible by using the INDF

actually accesses data pointed to by the File Select

produce 00h. Writing to the INDF register indirectly

results in a no operation (although Status bits may be

affected). An effective 9-bit address is obtained by

concatenating the 8-bit FSR and the IRP bit of the

STATUS register, as shown in Figure 2-4.

A simple program to clear RAM location 40h-7Fh using

indirect addressing is shown in Example 2-1.

EXAMPLE 2-1: INDIRECT ADDRESSING

12 8 7 0

5PCLATH<4:0>

PCLATH

Instruction with

ALU Result

GOTO, CALL

OPCODE <10:0>

12 11 10 0

PCLATH<4:3>

PCH PCL

PCLATH

PCH PCL

PCL as

Destination

Note 1: There are no Status bits to indicate Stack

Overflow or Stack Underflow conditions.

2: There are no instructions/mnemonics

called PUSH or POP. These are actions

that occur from the execution of the

CALL, RETURN, RETLW and RETFIE

instructions or the vectoring to an

interrupt address.

MOVLW 0x40 ;initialize pointer

MOVWF FSR ;to RAM

NEXT CLRF INDF ;clear INDF register

INCF FSR ;inc pointer

BTFSS FSR,7 ;all done?

GOTO NEXT ;no clear next

CONTINUE ;yes continue

PIC10(L)F320/322

DS41585A-page 20 Preliminary  2011 Microchip Technology Inc.

FIGURE 2-4: DIRECT/INDIRECT ADDRESSING PIC10(L)F320/322

Data

Memory

Indirect AddressingDirect Addressing

Location Select

From Opcode File Select Register

Location Select

00h

7Fh

Bank 0

For memory map detail, see Figure 2-2.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 21

PIC10(L)F320/322

3.0 DEVICE CONFIGURATION

Device Configuration consists of Configuration Word

and Device ID.

3.1 Configuration Word

There are several Configuration Word bits that allow

different oscillator and memory protection options.

These are implemented as Configuration Word at

2007h.

PIC10(L)F320/322

DS41585A-page 22 Preliminary  2011 Microchip Technology Inc.

U-1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1

— WRT<1:0> BORV LPBOR LVP

bit 13 bit 8

R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1 R/P-1/1

CP MCLRE PWRTE WDTE<1:0> BOREN<1:0> FOSC

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared P = Programmable bit

bit 13 Unimplemented: Read as ‘1’

bit 12-11 WRT<1:0>: Flash Memory Self-Write Protection bits

256 W Flash memory: PIC10(L)F320:

11 =Write protection off

10 =000h to 03Fh write-protected, 040h to 0FFh may be modified by PMCON control

01 =000h to 07Fh write-protected, 080h to 0FFh may be modified by PMCON control

00 =000h to 0FFh write-protected, no addresses may be modified by PMCON control

512 W Flash memory: PIC10(L)F322:

11 =Write protection off

10 =000h to 07Fh write-protected, 080h to 1FFh may be modified by PMCON control

01 =000h to 0FFh write-protected, 100h to 1FFh may be modified by PMCON control

00 =000h to 1FFh write-protected, no addresses may be modified by PMCON control

bit 10 BORV: Brown-out Reset Voltage Selection bit

1 = Brown-out Reset Voltage (VBOR) set to 1.9V (PIC10LF320/322) or 2.4V (PIC10F320/322)

0 = Brown-out Reset Voltage (VBOR) set to 2.7V

bit 9 LPBOR: Low-Power Brown-out Reset Enable bit

1 = Low-power Brown-out Reset is enabled

0 = Low-power Brown-out Reset is disabled

bit 8 LVP: Low-Voltage Programming Enable bit

1 = Low-Voltage Programming enabled. MCLR/VPP pin function is MCLR.

0 = High Voltage on MCLR/VPP must be used for programming

bit 7 CP: Code Protection bit(2)

1 = Program memory code protection is disabled

0 = Program memory code protection is enabled

bit 6 MCLRE: MCLR/VPP Pin Function Select bit

If LVP bit = 1:

This bit is ignored.

If LVP bit = 0:

1 =MCLR

/VPP pin function is MCLR; Weak pull-up enabled.

0 =MCLR

/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of

WPUA3 bit.

bit 5 PWRTE: Power-up Timer Enable bit(1)

1 = PWRT disabled

0 = PWRT enabled

Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer.

2: Once enabled, code-protect can only be disabled by bulk erasing the device.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 23

PIC10(L)F320/322

bit 4-3 WDTE<1:0>: Watchdog Timer Enable bit

11 = WDT enabled

10 = WDT enabled while running and disabled in Sleep

01 = WDT controlled by the SWDTEN bit in the WDTCON register

00 = WDT disabled

bit 2-1 BOREN<1:0>: Brown-out Reset Enable bits

11 = Brown-out Reset enabled; SBOREN bit is ignored

10 = Brown-out Reset enabled while running, disabled in Sleep; SBOREN bit is ignored

01 = Brown-out Reset controlled by the SBOREN bit in the BORCON register

00 = Brown-out Reset disabled; SBOREN bit is ignored

bit 0 FOSC: Oscillator Selection bit

1 = EC on CLKIN pin

0 = INTOSC oscillator I/O function available on CLKIN pin

Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer.

2: Once enabled, code-protect can only be disabled by bulk erasing the device.

PIC10(L)F320/322

DS41585A-page 24 Preliminary  2011 Microchip Technology Inc.

3.2 Code Protection

Code protection allows the device to be protected from

unauthorized access. Program memory protection and

data memory protection are controlled independently.

Internal access to the program memory and data

memory are unaffected by any code protection setting.

3.2.1 PROGRAM MEMORY PROTECTION

The entire program memory space is protected from

external reads and writes by the CP bit in Configuration

Word. When CP = 0, external reads and writes of

program memory are inhibited and a read will return all

‘0’s. The CPU can continue to read program memory,

regardless of the protection bit settings. Writing the

program memory is dependent upon the write

protection setting. See Section 3.3 “Write

Protection” for more information.

3.3 Write Protection

Write protection allows the device to be protected from

unintended self-writes. Applications, such as boot

loader software, can be protected while allowing other

regions of the program memory to be modified.

The WRT<1:0> bits in Configuration Word define the

size of the program memory block that is protected.

3.4 User ID

Four memory locations (2000h-2003h) are designated

as ID locations where the user can store checksum or

other code identification numbers. These locations are

readable and writable during normal execution. See

Section 3.5 “Device ID and Revision ID” for more

information on accessing these memory locations. For

more information on checksum calculation, see the

“PIC10(L)F320/322 Flash Memory Programming

Specification” (DS41572).

 2011 Microchip Technology Inc. Preliminary DS41585A-page 25

PIC10(L)F320/322

3.5 Device ID and Revision ID

The memory location 2006h is where the Device ID and

Revision ID are stored. The upper nine bits hold the

Device ID. The lower five bits hold the Revision ID. See

Section 9.4 “User ID, Device ID and Configuration

Word Access” for more information on accessing

these memory locations.

Development tools, such as device programmers and

debuggers, may be used to read the Device ID and

Revision ID.

RRRRRR

DEV8 DEV7 DEV6 DEV5 DEV4 DEV3

bit 13 bit 8

RRRRRRRR

DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0

bit 7 bit 0

Legend: U = Unimplemented bit, read as ‘0’

R = Readable bit W = Writable bit ‘0’ = Bit is cleared

-n = Value at POR ‘1’ = Bit is set x = Bit is unknown

bit 13-5 DEV< 8:0>: Device ID bits

bit 4-0 REV <4:0>: Revision ID bits

These bits are used to identify the revision.

Note 1: This location cannot be written.

Device DEVICEID<13:0> Values

DEV<8:0> REV<4:0>

PIC10F320 10 1001 101 x xxxx

PIC10LF320 10 1001 111 x xxxx

PIC10F322 10 1001 100 x xxxx

PIC10LF322 10 1001 110 x xxxx

PIC10(L)F320/322

DS41585A-page 26 Preliminary  2011 Microchip Technology Inc.

NOTES:

 2011 Microchip Technology Inc. Preliminary DS41585A-page 27

PIC10(L)F320/322

4.0 OSCILLATOR MODULE

4.1 Overview

The oscillator module has a variety of clock sources and

selection features that allow it to be used in a range of

applications while maximizing performance and

minimizing power consumption. Figure 4-1 illustrates a

block diagram of the oscillator module.

The system can be configured to use an internal

calibrated high-frequency oscillator as clock source, with

a choice of selectable speeds via software.

Clock source modes are configured by the FOSC bit in

Configuration Word (CONFIG).

1. EC oscillator from CLKIN.

2. INTOSC oscillator, CLKIN not enabled.

FIGURE 4-1: PIC10(L)F320/322 CLOCK S OURCE BLOC K DIAGRAM

HFINTOSC

16 MHz HFIOFR(1)

HFIOFS(1)

Divider

16 MHz

8 MHz

4 MHz

2 MHz

1 MHz

500 kHz

250 kHz

MUX

111

110

101

100

011

010

001

LFINTOSC

31 kHz

000

IRCF<2:0>

INTOSC

LFIOFR(1)

CLKIN EC

MUX

FOSC

(Configuration

Word)

System Clock

(CPU and

Peripherals)

CLKROE

CLKR

31 kHz

Note 1: HFIOFR, HFIOFS and LFIOFR are Status bits in the OSCCON register.

PIC10(L)F320/322

DS41585A-page 28 Preliminary  2011 Microchip Technology Inc.

4.2 Clock Source Modes

Clock source modes can be classified as external or

internal.

• Internal clock source (INTOSC) is contained

within the oscillator module, which has eight

selectable output frequencies, with a maximum

internal frequency of 16 MHz.

• The External Clock mode (EC) relies on an

external signal for the clock source.

The system clock can be selected between external or

internal clock sources via the FOSC bit of the

Configuration Word.

4.3 Internal Clock Modes

The internal clock sources are contained within the

oscillator module. The internal oscillator block has two

internal oscillators that are used to generate all internal

system clock sources: the 16 MHz High-Frequency

Internal Oscillator (HFINTOSC) and the 31 kHz

(LFINTOSC).

The HFINTOSC consists of a primary and secondary

clock. The secondary clock starts first with rapid start-

up time, but low accuracy. The secondary clock ready

signal is indicated with the HFIOFR bit of the OSCCON

time and higher accuracy. The primary clock is stable

when the HFIOFS bit of the OSCCON register bit goes

high.

4.3.1 INTOSC MODE

When the FOSC bit of the Configuration Word is

cleared, the INTOSC mode is selected. When INTOSC

is selected, CLKIN pin is available for general purpose

I/O. See Section 3.0 “Device Configuration” for

more information.

4.3.2 FREQUENCY SELECT BITS (IRCF)

The output of the 16 MHz HFINTOSC is connected to

a divider and multiplexer (see Figure 4-1). The Internal

Oscillator Frequency Select bits (IRCF) of the

OSCCON register select the frequency output of the

internal oscillator:

•HFINTOSC

-16 MHz

- 8 MHz (default after Reset)

-4 MHz

-2 MHz

-1 MHz

-500 kHz

-250 kHz

•LFINTOSC

-31 kHz

There is no delay when switching between HFINTOSC

frequencies with the IRCF bits. This is because the

switch involves only a change to the frequency output

divider.

Start-up delay specifications are located in

Section 24.0 “Electrical Specifications”.

Note: Following any Reset, the IRCF<2:0> bits

of the OSCCON register are set to ‘110’

and the frequency selection is set to

8 MHz. The user can modify the IRCF bits

to select a different frequency.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 29

PIC10(L)F320/322

4.3.3 REFERENCE CLOCK OUTPUT

CONTROL

FOSC/4 output is enabled via the CLKROE bit of

CLKRCON register. The signal drives the pin

regardless of the TRIS setting.

U-0 R/W-0/0 U-0 U-0 U-0 U-0 U-0 U-0

—CLKROE— — — — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

q = Value depends on condition

bit 7 Unimplemented: Read as ‘0’

bit 6 CLKROE: Reference Clock Output Enable bit

1 = Reference Clock output (CLKR), regardless of TRIS

0 = Reference Clock output disabled

bit 5-0 Unimplemented: Read as ‘0’

PIC10(L)F320/322

DS41585A-page 30 Preliminary  2011 Microchip Technology Inc.

4.4 Oscillator Control Registers

4.4.1 OSCILLATOR CONTROL

The Oscillator Control (OSCCON) register (Register 4-2)

displays the oscillator readiness, stability and allows

frequency selection of the internal oscillator (INTOSC)

system clock.

U-0 R/W-1/1 R/W-1/1 R/W-0/0 R-0/0 U-0 R-0/0 R-0/0

— IRCF<2:0> HFIOFR —LFIOFRHFIOFS

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition

bit 7 Unimplemented: Read as ‘0’

bit 6-4 IRCF<2:0>: INTOSC (FOSC) Frequency Select bits

111 = 16 MHz

110 = 8 MHz (default value)

101 = 4 MHz

100 = 2 MHz

011 = 1 MHz

010 = 500 kHz

001 = 250 kHz

000 = 31 kHz (LFINTOSC)

bit 3 HFIOFR: High-Frequency Internal Oscillator Ready bit

1 = 16 MHz Internal Oscillator (HFINTOSC) is ready

0 = 16 MHz Internal Oscillator (HFINTOSC) is not ready

bit 2 Unimplemented: Read as ‘0’

bit 1 LFIOFR: Low-Frequency Internal Oscillator Ready bit

1 = 31 kHz Internal Oscillator (LFINTOSC) is ready

0 = 31 kHz Internal Oscillator (LFINTOSC) is not ready

bit 0 HFIOFS: High-Frequency Internal Oscillator Stable bit

1 = 16 MHz Internal Oscillator (HFINTOSC) is stable

0 = 16 MHz Internal Oscillator (HFINTOSC) is not stable

 2011 Microchip Technology Inc. Preliminary DS41585A-page 31

PIC10(L)F320/322

4.5 External Clock Mode

4.5.1 EC MODE

The External Clock (EC) mode allows an externally

generated logic level as the system clock source. When

operating in this mode, an external clock source is

connected to the CLKIN input.

TABLE 4-1: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES

TABLE 4-2: SUMMARY OF CONFIGURATION WORD WITH CLOCK SOURCES

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register

on Page

CLKRCON —CLKROE — — — — — — 29

OSCCON — IRCF<2:0> HFIOFR —LFIOFR HFIOFS 30

Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by ECWG.

Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register

on Pa ge

CONFIG 13:8 — — — WRT<1:0> BORV LPBOR LVP 22

7:0 CP MCLRE PWRTE WDTE<1:0> BOREN<1:0> FOSC

Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources.

PIC10(L)F320/322

DS41585A-page 32 Preliminary  2011 Microchip Technology Inc.

NOTES:

 2011 Microchip Technology Inc. Preliminary DS41585A-page 33

PIC10(L)F320/322

5.0 RESETS

There are multiple ways to reset this device:

• Power-on Reset (POR)

• Brown-out Reset (BOR)

• Low-Power Brown-out Reset (LPBOR)

•MCLR Reset

•WDT Reset

• Programming mode exit

To allow VDD to stabilize, an optional Power-up Timer

can be enabled to extend the Reset time after a BOR

or POR event.

A simplified block diagram of the On-Chip Reset Circuit

is shown in Figure 5-1.

FIGURE 5-1: SIMPLIFIED B LOCK DIAGRAM OF ON-CHIP RESET CIRCUIT

Note 1: See Ta b le 5 - 1 for BOR active conditions.

Device

Reset

Power-on

Reset

WDT

Time-out

Brown-out

Reset

LPBOR

Reset

ICSP™ Programming Mode Exit

MCLRE

Sleep

BOR

Active(1)

PWRTE

LFINTOSC

VDD

PWRT

Done

PIC10(L)F320/322

DS41585A-page 34 Preliminary  2011 Microchip Technology Inc.

5.1 Power-on Reset (POR)

The POR circuit holds the device in Reset until VDD has

reached an acceptable level for minimum operation.

Slow rising VDD, fast operating speeds or analog

performance may require greater than minimum VDD.

The PWRT, BOR or MCLR features can be used to

extend the start-up period until all device operation

conditions have been met.

5.1.1 POWER-UP TIMER (PWRT)

The Power-up Timer provides a nominal 64 ms time-

out on POR or Brown-out Reset.

The device is held in Reset as long as PWRT is active.

The PWRT delay allows additional time for the VDD to

rise to an acceptable level. The Power-up Timer is

enabled by clearing the PWRTE bit in Configuration

Word.

The Power-up Timer starts after the release of the POR

and BOR.

For additional information, refer to Application Note

AN607, “Power-up Trouble Shooting” (DS00607).

5.2 Brown-Out Reset (BOR)

The BOR circuit holds the device in Reset when VDD

reaches a selectable minimum level. Between the

POR and BOR, complete voltage range coverage for

execution protection can be implemented.

The Brown-out Reset module has four operating

modes controlled by the BOREN<1:0> bits in Configu-

ration Word. The four operating modes are:

• BOR is always on

• BOR is off when in Sleep

• BOR is controlled by software

• BOR is always off

Refer to Table 5 - 1 for more information.

The Brown-out Reset voltage level is selectable by

configuring the BORV bit in Register 3-1.

A VDD noise rejection filter prevents the BOR from trig-

gering on small events. If VDD falls below VBOR for a

duration greater than parameter TBORDC, the device

will reset. See Figure 5-2 for more information.

TABLE 5-1: BOR OPERATING MODES

5.2.1 BOR IS ALWAYS ON

When the BOREN bits of Configuration Word are

programmed to ‘11’, the BOR is always on. The device

start-up will be delayed until the BOR is ready and VDD

is higher than the BOR threshold.

BOR protection is active during Sleep. The BOR does

not delay wake-up from Sleep.

5.2.2 BOR IS OFF IN SLEEP

When the BOREN bits of Configuration Word are

programmed to ‘10’, the BOR is on, except in Sleep.

The device start-up will be delayed until the BOR is

ready and VDD is higher than the BOR threshold.

BOR protection is not active during Sleep. The device

wake-up will be delayed until the BOR is ready.

5.2.3 BOR CONTROLLED BY SOFTWARE

When the BOREN bits of Configuration Word are

programmed to ‘01’, the BOR is controlled by the

SBOREN bit of the BORCON register. The device start-

up is not delayed by the BOR ready condition or the

VDD level.

BOR protection begins as soon as the BOR circuit is

ready. The status of the BOR circuit is reflected in the

BORRDY bit of the BORCON register.

BOR protection is unchanged by Sleep.

BOREN<1:0> SBOREN Device Mode BOR Mode Device Operation upon:

Release of POR/Wake- up from Sleep

11 X X Active Waits for BOR ready(1)

10 X Awake Active

Waits for BOR ready

Sleep Disabled

01 1XActive

Begins immediately0XDisabled

00 X XDisabled

Note 1: Even though this case specifically waits for the BOR, the BOR is already operating, so there is no delay in

start-up.

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FIGURE 5-2: BROWN-OUT SITUATIONS

R/W-1/u R/W-0/u U-0 U-0 U-0 U-0 U-0 R-q/u

SBOREN BORFS — — — — —BORRDY

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition

bit 7 SBOREN: Software Brown-out Reset Enable bit

If BOREN <1:0> in Configuration Word  01:

SBOREN is read/write, but has no effect on the BOR.

If BOREN <1:0> in Configuration Word = 01:

1 = BOR enabled

0 = BOR disabled

bit 6 BORFS: Brown-out Reset Fast Start bit(1)

If BOREN<1:0> = 11 (Always on) or BOREN<1:0> = 00 (Always off)

BORFS is read/write, but has no effect.

If BOREN <1:0> = 10 (Disabled in Sleep) or BOREN<1:0> = 01 (Under software control):

1 = Band gap is forced on always (covers Sleep/wake-up/operating cases)

0 =Band gap operates normally, and may turn off

bit 5-1 Unimplemented: Read as ‘0’

bit 0 BORRDY: Brown-out Reset Circuit Ready Status bit

1 = The Brown-out Reset circuit is active

0 = The Brown-out Reset circuit is inactive

Note 1: BOREN<1:0> bits are located in Configuration Word.

TPWRT(1)

VBOR

VDD

Internal

Reset

VBOR

VDD

Internal

Reset TPWRT(1)

< TPWRT

TPWRT(1)

VBOR

VDD

Internal

Reset

Note 1: TPWRT delay only if PWRTE bit is programmed to ‘0’.

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DS41585A-page 36 Preliminary  2011 Microchip Technology Inc.

5.3 Low-Power Brown-out Reset

(LPBOR)

The Low-Power Brown-Out Reset (LPBOR) is an

essential part of the Reset subsystem. Refer to

Figure 5-1 to see how the BOR interacts with other

modules.

The LPBOR is used to monitor the external VDD pin.

When too low of a voltage is detected, the device is

held in Reset. When this occurs, a register bit (BOR) is

changed to indicate that a BOR Reset has occurred.

The same bit is set for both the BOR and the LPBOR.

Refer to Register 5-2.

5.3.1 ENABLING LPBOR

The LPBOR is controlled by the LPBOR bit of

Configuration Word. When the device is erased, the

LPBOR module defaults to disabled.

5.3.1.1 LPBOR Module Output

The output of the LPBOR module is a signal indicating

whether or not a Reset is to be asserted. This signal is

OR’d together with the Reset signal of the BOR mod-

ule to provide the generic BOR signal which goes to

the PCON register and to the power control block.

5.4 MCLR

The MCLR is an optional external input that can reset

the device. The MCLR function is controlled by the

MCLRE and the LVP bit of Configuration Word (Table 5-

2).

5.4.1 MCLR ENABLED

When MCLR is enabled and the pin is held low, the

device is held in Reset. The MCLR pin is connected to

VDD through an internal weak pull-up.

The device has a noise filter in the MCLR Reset path.

The filter will detect and ignore small pulses.

5.4.2 MCLR DISABLED

When MCLR is disabled, the pin functions as a general

purpose input and the internal weak pull-up is under

software control.

5.5 Watchdog Timer (WDT) Reset

The Watchdog Timer generates a Reset if the firmware

does not issue a CLRWDT instruction within the time-out

period. The TO and PD bits in the STATUS register are

changed to indicate the WDT Reset. See Section 8.0

“Watchdog Timer” for more information.

5.6 Programming Mode ICSP Exit

Upon exit of Programming mode, the device will

behave as if a POR had just occurred.

5.7 Power-Up Timer

The Power-up Timer optionally delays device execution

after a BOR or POR event. This timer is typically used to

allow VDD to stabilize before allowing the device to start

running.

The Power-up Timer is controlled by the PWRTE bit of

Configuration Word.

5.8 S tart-up Sequence

Upon the release of a POR or BOR, the following must

occur before the device will begin executing:

1. Power-up Timer runs to completion (if enabled).

2. MCLR must be released (if enabled).

The total time-out will vary based on oscillator configu-

ration and Power-up Timer configuration. See

Section 4.0 “Oscillator Module” for more informa-

tion.

The Power-up Timer runs independently of MCLR

Reset. If MCLR is kept low long enough, the Power-up

Timer will expire. Upon bringing MCLR high, the device

will begin execution immediately (see Figure 5-3). This

is useful for testing purposes or to synchronize more

than one device operating in parallel.

TABLE 5-2: MCLR CONFIGURATION

MCLRE LVP MCLR

00Disabled

10Enabled

x1Enabled

Note: A Reset does not drive the MCLR pin low.

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FIGURE 5-3: RESET START-UP SEQUENCE

TMCLR

TPWRT

VDD

Internal POR

Power-Up Timer

MCLR

Internal RESET

Oscillator Modes

Internal Oscillator

Oscillator

FOSC

External Clock (EC)

CLKIN

FOSC

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5.9 Determining the Cause of a Reset

Upon any Reset, multiple bits in the STATUS and

PCON register are updated to indicate the cause of the

Reset. Ta b l e 5 - 3 and Ta b l e 5 - 4 show the Reset condi-

tions of these registers.

TABLE 5-3: RESET STATUS BITS AND THEIR SIGNIFICANCE

TABLE 5-4: RESET CONDITION FOR SPECIAL REGISTERS

POR BOR TO PD Condition

0x11Power-on Reset

u011Brown-out Reset

uu0uWDT Reset

uu00WDT Wake-up from Sleep

uuuuMCLR Reset during normal operation

uu10MCLR Reset during Sleep

Condition Program

Counter STATUS

Power-on Reset 0000h 0001 1000 ---- --0x

MCLR Reset during normal operation 0000h 000u uuuu ---- --uu

MCLR Reset during Sleep 0000h 0001 0uuu ---- --uu

WDT Reset 0000h 0000 uuuu ---- --uu

WDT Wake-up from Sleep PC + 1 0000 0uuu ---- --uu

Brown-out Reset 0000h 0001 1uuu ---- --u0

Interrupt Wake-up from Sleep PC + 1(1) 0001 0uuu ---- --uu

Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’.

Note1: When the wake-up is due to an interrupt and Global Enable bit (GIE) is set, the return address is pushed on

the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1.

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5.10 Power Control (PCON) Register

The Power Control (PCON) register contains flag bits

to differentiate between a:

• Power-on Reset (POR)

• Brown-out Reset (BOR)

The PCON register bits are shown in Register 5-2.

TABLE 5-5: SUMMARY OF REGISTERS ASSOCIATED WITH RESETS

TABLE 5-6: SUMMARY OF CONFIGURATION WORD WITH RESETS

U-0 U-0 U-0 U-0 U-0 U-0 R/W/HC-q/u R/W/HC-q/u

— — — — — — POR BOR

bit 7 bit 0

Legend:

HC = Bit is cleared by hardware

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition

bit 7-2 Unimplemented: Read as ‘0’

bit 1 POR: Power-on Reset Status bit

1 = No Power-on Reset occurred

0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)

bit 0 BOR: Brown-out Reset Status bit

1 = No Brown-out Reset occurred

0 = A Brown-out Reset occurred (must be set in software after a Power-on Reset or Brown-out Reset

occurs)

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register

on Page

BORCON SBOREN BORFS ————— BORRDY 35

PCON ——————PORBOR 39

STATUS IRP RP1 RP0 TO PD ZDC C15

WDTCON —— WDTPS<4:0> SWDTEN 55

Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Resets.

Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register

on Page

CONFIG 13:8 — — — WRT<1:0> BORV LPBOR LVP 22

7:0 CP MCLRE PWRTE WDTE<1:0> BOREN<1:0> FOSC

Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources.

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DS41585A-page 40 Preliminary  2011 Microchip Technology Inc.

NOTES:

 2011 Microchip Technology Inc. Preliminary DS41585A-page 41

PIC10(L)F320/322

6.0 INTERRUPTS

The interrupt feature allows certain events to preempt

normal program flow. Firmware is used to determine

the source of the interrupt and act accordingly. Some

interrupts can be configured to wake the MCU from

Sleep mode.

This chapter contains the following information for

Interrupts:

• Operation

• Interrupt Latency

• Interrupts During Sleep

•INT Pin

• Context Saving during Interrupts

Many peripherals produce Interrupts. Refer to the

corresponding chapters for details.

A block diagram of the interrupt logic is shown in

Figure 6-1.

FIGURE 6-1: INTERRUPT LOGIC

TMR0IF

TMR0IE

INTF

INTE

IOCIF

IOCIE Interrupt

to CPU

Wake-up

(If in Sleep mode)

GIE

(TMR2IF) PIR1<0>

PIRn<7>

PIEn<7>

PEIE

Peripheral Interrupts

(TMR2IE) PIE1<0>

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6.1 Operation

Interrupts are disabled upon any device Reset. They

are enabled by setting the following bits:

• GIE bit of the INTCON register

• Interrupt Enable bit(s) for the specific interrupt

events)

• PEIE bit of the INTCON register (if the Interrupt

Enable bit of the interrupt event is contained in the

PIE1 register)

The INTCON and PIR1 registers record individual inter-

rupts via interrupt flag bits. Interrupt flag bits will be set,

regardless of the status of the GIE, PEIE and individual

interrupt enable bits.

The following events happen when an interrupt event

occurs while the GIE bit is set:

• Current prefetched instruction is flushed

• GIE bit is cleared

• Current Program Counter (PC) is pushed onto the

stack

• PC is loaded with the interrupt vector 0004h

The firmware within the Interrupt Service Routine (ISR)

should determine the source of the interrupt by polling

the interrupt flag bits. The interrupt flag bits must be

cleared before exiting the ISR to avoid repeated

interrupts. Because the GIE bit is cleared, any interrupt

that occurs while executing the ISR will be recorded

through its interrupt flag, but will not cause the

processor to redirect to the interrupt vector.

The RETFIE instruction exits the ISR by popping the

previous address from the stack, and setting the GIE

bit.

For additional information on a specific interrupt’s

operation, refer to its peripheral chapter.

6.2 Interrupt Latency

Interrupt latency is defined as the time from when the

interrupt event occurs to the time code execution at the

interrupt vector begins. The latency for synchronous

interrupts is 3 or 4 instruction cycles. For asynchronous

interrupts, the latency is 3 to 5 instruction cycles,

depending on when the interrupt occurs. See Figure 6-2

and Section 6.3 “Interrupts During Sleep” for more

details.

Note 1: Individual interrupt flag bits are set,

regardless of the state of any other

enable bits.

2: All interrupts will be ignored while the GIE

bit is cleared. Any interrupt occurring

while the GIE bit is clear will be serviced

when the GIE bit is set again.

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FIGURE 6-2: INTERRUPT LATENCY

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

INTOSC

CLKR

PC 0004h 0005h

Inst(0004h)NOP

GIE

Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4

1 Cycle Instruction at PC

Inst(0004h)NOP

2 Cycle Instruction at PC

FSR ADDR PC+1 PC+2 0004h 0005h

Inst(0004h)NOP

GIE

PCPC-1

3 Cycle Instruction at PC

Execute

Interrupt

Inst(PC)

Interrupt Sampled

during Q1

Inst(PC)

PC-1 PC+1

NOP

PC New PC/

PC+1 0005hPC-1 PC+1/FSR

ADDR 0004h

NOP

Interrupt

GIE

Interrupt

INST(PC) NOPNOP

FSR ADDR PC+1 PC+2 0004h 0005h

Inst(0004h)NOP

GIE

PCPC-1

3 Cycle Instruction at PC

Interrupt

INST(PC) NOPNOP NOP

Inst(0005h)

Execute

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DS41585A-page 44 Preliminary  2011 Microchip Technology Inc.

FIGURE 6-3: INT PIN INTERRUPT TIMING

Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4

INTOSC

CLKR

INT pin

INTF

GIE

INSTRUCTION FLOW

Instruction

Fetched

Instruction

Executed

Interrupt Latency

PC PC + 1 PC + 1 0004h 0005h

Inst (0004h) Inst (0005h)

Forced NOP

Inst (PC) Inst (PC + 1)

Inst (PC – 1) Inst (0004h)

Forced NOP

Inst (PC)

—

Note 1: INTF flag is sampled here (every Q1).

2: Asynchronous interrupt latency = 3-5 TCY. Synchronous latency = 3-4 TCY, where TCY = instruction cycle time.

Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.

3: For minimum width of INT pulse, refer to AC specifications in Section 24.0 “Electrical Specifications”.

4: INTF is enabled to be set any time during the Q4-Q1 cycles.

(1) (2)

(3)

(4)

(1)

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6.3 Interrupts During Sleep

Some interrupts can be used to wake from Sleep. To

wake from Sleep, the peripheral must be able to

operate without the system clock. The interrupt source

must have the appropriate Interrupt Enable bit(s) set

prior to entering Sleep.

On waking from Sleep, if the GIE bit is also set, the

processor will branch to the interrupt vector. Otherwise,

the processor will continue executing instructions after

the SLEEP instruction. The instruction directly after the

SLEEP instruction will always be executed before

branching to the ISR. Refer to the Section 7.0 “Power-

Down Mode (Sleep)” for more details.

6.4 INT Pin

The INT pin can be used to generate an asynchronous

edge-triggered interrupt. This interrupt is enabled by

setting the INTE bit of the INTCON register. The

INTEDG bit of the OPTION_REG register determines on

which edge the interrupt will occur. When the INTEDG

bit is set, the rising edge will cause the interrupt. When

the INTEDG bit is clear, the falling edge will cause the

interrupt. The INTF bit of the INTCON register will be set

when a valid edge appears on the INT pin. If the GIE and

INTE bits are also set, the processor will redirect

program execution to the interrupt vector.

6.5 Context Saving During Interrupts

During an interrupt, only the return PC value is saved

on the stack. Typically, users may wish to save key

registers during an interrupt (e.g., W and STATUS

registers). This must be implemented in software.

Temporary holding registers W_TEMP and

STATUS_TEMP should be placed in the last 16 bytes

of GPR (see Figure 2-2). These 16 locations are

common to all banks and do not require banking. This

makes context save and restore operations simpler.

The code shown in Example 6-1 can be used to:

• Store the W register

• Store the STATUS register

• Execute the ISR code

• Restore the Status (and Bank Select Bit register)

• Restore the W register

EXAMPLE 6-1: SAVING STATUS AND W REGISTERS IN RAM

Note: These devices do not require saving the

PCLATH. However, if computed GOTOs

are used in both the ISR and the main

code, the PCLATH must be saved and

restored in the ISR.

MOVWF W_TEMP ;Copy W to TEMP register

SWAPF STATUS,W ;Swap status to be saved into W

;Swaps are used because they do not affect the status bits

MOVWF STATUS_TEMP ;Save status to bank zero STATUS_TEMP register

:(ISR) ;Insert user code here

SWAPF STATUS_TEMP,W ;Swap STATUS_TEMP register into W

;(sets bank to original state)

MOVWF STATUS ;Move W into STATUS register

SWAPF W_TEMP,F ;Swap W_TEMP

SWAPF W_TEMP,W ;Swap W_TEMP into W

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6.6 Interrupt Control Registers

6.6.1 INTCON REGISTER

The INTCON register is a readable and writable

for TMR0 register overflow, interrupt-on-change and

external INT pin interrupts.

Note: Interrupt flag bits are set when an interrupt

condition occurs, regardless of the state of

its corresponding enable bit or the Global

Interrupt Enable bit, GIE, of the INTCON

appropriate interrupt flag bits are clear

prior to enabling an interrupt.

R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0

GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF(1)

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7 GIE: Global Interrupt Enable bit

1 = Enables all active interrupts

0 = Disables all interrupts

bit 6 PEIE: Peripheral Interrupt Enable bit

1 = Enables all active peripheral interrupts

0 = Disables all peripheral interrupts

bit 5 TMR0IE: Timer0 Overflow Interrupt Enable bit

1 = Enables the Timer0 interrupt

0 = Disables the Timer0 interrupt

bit 4 INTE: INT External Interrupt Enable bit

1 = Enables the INT external interrupt

0 = Disables the INT external interrupt

bit 3 IOCIE: Interrupt-on-Change Interrupt Enable bit

1 = Enables the interrupt-on-change interrupt

0 = Disables the interrupt-on-change interrupt

bit 2 TMR0IF: Timer0 Overflow Interrupt Flag bit

1 = TMR0 register has overflowed

0 = TMR0 register did not overflow

bit 1 INTF: INT External Interrupt Flag bit

1 = The INT external interrupt occurred

0 = The INT external interrupt did not occur

bit 0 IOCIF: Interrupt-on-Change Interrupt Flag bit(1)

1 = When at least one of the interrupt-on-change pins changed state

0 = None of the interrupt-on-change pins have changed state

Note 1: The IOCIF Flag bit is read-only and cleared when all the Interrupt-on-Change flags in the IOCAF register

have been cleared by software.

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6.6.2 PIE1 REGISTER

The PIE1 register contains the interrupt enable bits, as

shown in Register 6-2.

Note: Bit PEIE of the INTCON register must be

set to enable any peripheral interrupt.

U-0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 U-0

—ADIE— NCO1IE CLC1IE —TMR2IE—

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7 Unimplemented: Read as ‘0’

bit 6 ADIE: A/D Converter Interrupt Enable bit

1 = Enables the A/D converter interrupt

0 = Disables the A/D converter interrupt

bit 5 Unimplemented: Read as ‘0’

bit 4 NCO1IE: Numerically Controlled Oscillator Interrupt Enable bit

1 = Enables the NCO overflow interrupt

0 = Disables the NCO overflow interrupt

bit 3 CLC1IE: Configurable Logic Block Interrupt Enable bit

1 = Enables the CLC interrupt

0 = Disables the CLC interrupt

bit 2 Unimplemented: Read as ‘0’

bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit

1 = Enables the TMR2 to PR2 Match interrupt

0 = Disables the TMR2 to PR2 Match interrupt

bit 0 Unimplemented: Read as ‘0’

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6.6.3 PIR1 REGISTER

The PIR1 register contains the interrupt flag bits, as

shown in Register 6-3.

Note: Interrupt flag bits are set when an interrupt

condition occurs, regardless of the state of

its corresponding enable bit or the Global

Interrupt Enable bit, GIE, of the INTCON

appropriate interrupt flag bits are clear prior

to enabling an interrupt.

U-0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 U-0

—ADIF— NCO1IF CLC1IF —TMR2IF—

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7 Unimplemented: Read as ‘0’

bit 6 ADIF: A/D Converter Interrupt Flag bit

1 = The A/D conversion completed

0 = The A/D conversion is not complete

bit 5 Unimplemented: Read as ‘0’

bit 4 NCO1IF: Numerically Controlled Oscillator Interrupt Flag bit

1 = NCO1 overflow occurred (must be cleared in software)

0 = No NCO1 overflow

bit 3 CLC1IF: Configurable Logic Block Rising Edge Interrupt Flag bit

1 = CLC interrupt occurred (must be cleared in software)

0 = No CLC Interrupt

bit 2 Unimplemented: Read as ‘0’

bit 1 TMR2IF: TMR2 to PR2 Match Interrupt Flag bit

1 = TMR2 to PR2 match occurred (must be cleared in software)

0 = No TMR2 to PR2 match

Note: The match must occur the number of times specified by the TMR2 postscaler (Register 17-1).

bit 0 Unimplemented: Read as ‘0’

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TABLE 6-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register

on Page

INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 46

IOCAF — — — — IOCAF3 IOCAF2 IOCAF1 IOCAF0 84

IOCAN — — — — IOCAN3 IOCAN2 IOCAN1 IOCAN0 83

IOCAP — — — — IOCAP3 IOCAP2 IOCAP1 IOCAP0 83

OPTION_REG WPUEN INTEDG T0CS T0SE PSA PS<2:0> 103

PIE1 —ADIE —NCO1IE CLC1IE —TMR2IE —47

PIR1 —ADIF —NCO1IF CLC1IF —TMR2IF —48

Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Interrupts.

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NOTES:

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PIC10(L)F320/322

7.0 POWER-DOWN MODE (SLEEP)

The Power-down mode is entered by executing a

SLEEP instruction.

Upon entering Sleep mode, the following conditions

exist:

1. WDT will be cleared but keeps running, if

enabled for operation during Sleep.

2. PD bit of the STATUS register is cleared.

3. TO bit of the STATUS register is set.

4. CPU clock is disabled.

5. 31 kHz LFINTOSC is unaffected and peripherals

that operate from it may continue operation in

Sleep.

6. ADC is unaffected, if the dedicated FRC clock is

selected.

7. I/O ports maintain the status they had before

SLEEP was executed (driving high, low or high-

impedance).

8. Resets other than WDT are not affected by

Sleep mode.

Refer to individual chapters for more details on

peripheral operation during Sleep.

To minimize current consumption, the following condi-

tions should be considered:

• I/O pins should not be floating

• External circuitry sinking current from I/O pins

• Internal circuitry sourcing current from I/O pins

• Current draw from pins with internal weak pull-ups

• Modules using 31 kHz LFINTOSC

• CWG and NCO modules using HFINTOSC

I/O pins that are high-impedance inputs should be

pulled to VDD or VSS externally to avoid switching cur-

rents caused by floating inputs.

Examples of internal circuitry that might be sourcing

current include the FVR module. See Section 12.0

“Fixed Voltage Reference (FVR)” for more informa-

tion on these modules.

7.1 Wake-up from Sleep

The device can wake-up from Sleep through one of the

following events:

1. External Reset input on MCLR pin, if enabled

2. BOR Reset, if enabled

3. POR Reset

4. Watchdog Timer, if enabled

5. Any external interrupt

6. Interrupts by peripherals capable of running dur-

ing Sleep (see individual peripheral for more

information)

The first three events will cause a device Reset. The

last three events are considered a continuation of pro-

gram execution. To determine whether a device Reset

or wake-up event occurred, refer to Section 5.9

“Determining the Cause of a Reset”.

When the SLEEP instruction is being executed, the next

instruction (PC + 1) is prefetched. For the device to

wake-up through an interrupt event, the corresponding

interrupt enable bit must be enabled. Wake-up will

occur regardless of the state of the GIE bit. If the GIE

bit is disabled, the device continues execution at the

instruction after the SLEEP instruction. If the GIE bit is

enabled, the device executes the instruction after the

SLEEP instruction, the device will then call the Interrupt

Service Routine. In cases where the execution of the

instruction following SLEEP is not desirable, the user

should have a NOP after the SLEEP instruction.

The WDT is cleared when the device wakes up from

Sleep, regardless of the source of wake-up.

The Complementary Waveform Generator (CWG) and

the Numerically Controlled Oscillator (NCO) modules

can utilize the HFINTOSC oscillator as their respective

clock source. Under certain conditions, when the HFIN-

TOSC is selected for use with the CWG or NCO mod-

ules, the HFINTOSC will remain active during Sleep.

This will have a direct effect on the Sleep mode current.

Please refer to 21.0 “Complementary Waveform

Generator (CWG) Module” and 20.0 “Numerically

Controlled Oscillator (NCO) Module” for more infor-

mation.

PIC10(L)F320/322

DS41585A-page 52 Preliminary  2011 Microchip Technology Inc.

7.1.1 WAKE-UP USING INTERRUPTS

When global interrupts are disabled (GIE cleared) and

any interrupt source has both its interrupt enable bit

and interrupt flag bit set, one of the following will occur:

• If the interrupt occurs before the execution of a

SLEEP instruction

-SLEEP instruction will execute as a NOP.

- WDT and WDT prescaler will not be cleared

-TO

bit of the STATUS register will not be set

-PD

bit of the STATUS register will not be

cleared.

• If the interrupt occurs during or after the execu-

tion of a SLEEP instruction

-SLEEP instruction will be completely exe-

cuted

- Device will immediately wake-up from Sleep

- WDT and WDT prescaler will be cleared

-TO

bit of the STATUS register will be set

-PD bit of the STATUS register will be cleared.

Even if the flag bits were checked before executing a

SLEEP instruction, it may be possible for flag bits to

become set before the SLEEP instruction completes. To

determine whether a SLEEP instruction executed, test

the PD bit. If the PD bit is set, the SLEEP instruction

was executed as a NOP.

FIGURE 7-1: WAKE-UP FROM SLEEP THROUGH INTERRUPT

TABLE 7-1: SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

INTOSC

CLKR

Interrupt flag

GIE bit

(INTCON reg.)

Instruction Flow

Instruction

Fetched

Instruction

Executed

PC PC + 1 PC + 2

Inst(PC) = Sleep

Inst(PC - 1)

Inst(PC + 1)

Sleep

Processor in

Sleep

Interrupt Latency(1)

Inst(PC + 2)

Inst(PC + 1)

Inst(0004h) Inst(0005h)

Inst(0004h)

Forced NOP

PC + 2 0004h 0005h

Forced NOP

PC + 2

Note 1: GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line.

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on

Page

STATUS IRP RP1 RP0 TO PD ZDCC 15

WDTCON —— WDTPS<4:0> SWDTEN 55

Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used in Power-down mode.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 53

PIC10(L)F320/322

8.0 W ATCHDOG TIMER

The Watchdog Timer is a system timer that generates

a Reset if the firmware does not issue a CLRWDT

instruction within the time-out period. The Watchdog

Timer is typically used to recover the system from

unexpected events.

The WDT has the following features:

• Independent clock source

• Multiple operating modes

- WDT is always on

- WDT is off when in Sleep

- WDT is controlled by software

- WDT is always off

• Configurable time-out period is from 1 ms to 256

seconds (typical)

• Multiple Reset conditions

• Operation during Sleep

FIGURE 8-1: WATC HDOG TIMER BLOCK DIAGRAM

LFINTOSC 23-bit Programmable

Prescaler WDT WDT Time-out

WDTPS<4:0>

SWDTEN

Sleep

WDTE<1:0> = 11

WDTE<1:0> = 01

WDTE<1:0> = 10

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DS41585A-page 54 Preliminary  2011 Microchip Technology Inc.

8.1 Independent Clock Source

The WDT derives its time base from the 31 kHz

LFINTOSC internal oscillator. Time intervals in this

chapter are based on a nominal interval of 1ms. See

Section 24.0 “Electrical Specifications” for the

LFINTOSC tolerances.

8.2 WDT Operating Modes

The Watchdog Timer module has four operating modes

controlled by the WDTE<1:0> bits in Configuration

Word. See Tab le 8-1 .

8.2.1 WDT IS ALWAYS ON

When the WDTE bits of Configuration Word are set to

‘11’, the WDT is always on.

WDT protection is active during Sleep.

8.2.2 WDT IS OFF IN SLEEP

When the WDTE bits of Configuration Word are set to

‘10’, the WDT is on, except in Sleep.

WDT protection is not active during Sleep.

8.2.3 WDT CONTROLLED BY SOFTWARE

When the WDTE bits of Configuration Word are set to

‘01’, the WDT is controlled by the SWDTEN bit of the

WDTCON register.

WDT protection is unchanged by Sleep. See Table 8-1

for more details.

TABLE 8-1: WDT OPERATING MODES

8.3 Time-Out Period

The WDTPS bits of the WDTCON register set the time-

out period from 1 ms to 256 seconds (nominal). After a

Reset, the default time-out period is 2 seconds.

8.4 Clearing the WDT

The WDT is cleared when any of the following condi-

tions occur:

•Any Reset

•CLRWDT instruction is executed

• Device enters Sleep

• Device wakes up from Sleep

• Oscillator fail

• WDT is disabled

See Table 8-2 for more information.

8.5 Operation During Sleep

When the device enters Sleep, the WDT is cleared. If

the WDT is enabled during Sleep, the WDT resumes

counting.

When the device exits Sleep, the WDT is cleared

again.

When a WDT time-out occurs while the device is in

Sleep, no Reset is generated. Instead, the device

wakes up and resumes operation. The TO and PD bits

in the STATUS register are changed to indicate the

event. See Section 2.0 “Memory Organization” and

WDTE<1:0> SWDTEN Device

Mode WDT

Mode

11 X XActive

10 X Awake Active

Sleep Disabled

01 1X

Active

0Disabled

00 X X Disabled

TABLE 8-2: WDT CLEARING CONDITIONS

Conditions WDT

WDTE<1:0> = 00

Cleared

WDTE<1:0> = 01 and SWDTEN = 0

WDTE<1:0> = 10 and enter Sleep

CLRWDT Command

Exit Sleep

Change INTOSC divider (IRCF bits) Unaffected

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PIC10(L)F320/322

8.6 Watchdog Control Register

U-0 U-0 R/W-0/0 R/W-1/1 R/W-0/0 R/W-1/1 R/W-1/1 R/W-0/0

—— WDTPS<4:0> SWDTEN

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-6 Unimplemented: Read as ‘0’

bit 5-1 WDTPS<4:0>: Watchdog Timer Period Select bits(1)

Bit Value = Prescale Rate

11111 = Reserved. Results in minimum interval (1:32)

•

10011 = Reserved. Results in minimum interval (1:32)

10010 = 1:8388608 (223) (Interval 256s nominal)

10001 = 1:4194304 (222) (Interval 128s nominal)

10000 = 1:2097152 (221) (Interval 64s nominal)

01111 = 1:1048576 (220) (Interval 32s nominal)

01110 = 1:524288 (219) (Interval 16s nominal)

01101 = 1:262144 (218) (Interval 8s nominal)

01100 = 1:131072 (217) (Interval 4s nominal)

01011 = 1:65536 (Interval 2s nominal) (Reset value)

01010 = 1:32768 (Interval 1s nominal)

01001 = 1:16384 (Interval 512 ms nominal)

01000 = 1:8192 (Interval 256 ms nominal)

00111 = 1:4096 (Interval 128 ms nominal)

00110 = 1:2048 (Interval 64 ms nominal)

00101 = 1:1024 (Interval 32 ms nominal)

00100 = 1:512 (Interval 16 ms nominal)

00011 = 1:256 (Interval 8 ms nominal)

00010 = 1:128 (Interval 4 ms nominal)

00001 = 1:64 (Interval 2 ms nominal)

00000 = 1:32 (Interval 1 ms nominal)

bit 0 SWDTEN: Software Enable/Disable for Watchdog Timer bit

If WDTE<1:0> = 00:

This bit is ignored.

If WDTE<1:0> = 01:

1 = WDT is turned on

0 = WDT is turned off

If WDTE<1:0> = 1x:

This bit is ignored.

Note 1: Times are approximate. WDT time is based on 31 kHz LFINTOSC.

PIC10(L)F320/322

DS41585A-page 56 Preliminary  2011 Microchip Technology Inc.

TABLE 8-3: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER

TABLE 8-4: SUMMARY OF CONFIGURATION WORD WITH WATCHDOG TIMER

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register

on Page

OSCCON — IRCF<2:0> HFIOFR — LFIOFR HFIOFS 30

STATUS IRP RP1 RP0 TO PD ZDC C15

WDTCON —— WDTPS<4:0> SWDTEN 55

Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by

Watchdog Timer.

Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register

on Page

CONFIG 13:8 — — — WRT<1:0> BORV LPBOR LVP 22

7:0 CP MCLRE PWRTE WDTE<1:0> BOREN<1:0> FOSC

Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Watchdog Timer.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 57

PIC10(L)F320/322

9.0 FLASH PROGRAM MEMORY

CONTROL

The Flash program memory is readable and writable

during normal operation over the full VDD range.

Program memory is indirectly addressed using Special

Function Registers (SFRs). The SFRs used to access

program memory are:

•PMCON1

•PMCON2

•PMDATL

•PMDATH

• PMADRL

•PMADRH

When accessing the program memory, the

PMDATH:PMDATL register pair forms a 2-byte word

that holds the 14-bit data for read/write, and the

PMADRH:PMADRL register pair forms a 2-byte word

that holds the 9-bit address of the program memory

location being read.

The write time is controlled by an on-chip timer. The write/

erase voltages are generated by an on-chip charge pump

rated to operate over the operating voltage range of the

device.

The Flash program memory can be protected in two

ways; by code protection (CP bit in Configuration Word)

and write protection (WRT<1:0> bits in Configuration

Word).

Code protection (CP = 0)(1), disables access, reading

and writing, to the Flash program memory via external

device programmers. Code protection does not affect

the self-write and erase functionality. Code protection

can only be reset by a device programmer performing

a Bulk Erase to the device, clearing all Flash program

memory, Configuration bits and User IDs.

Write protection prohibits self-write and erase to a

portion or all of the Flash program memory as defined

by the bits WRT<1:0>. Write protection does not affect

a device programmers ability to read, write or erase the

device.

9.1 PMADRL and PMADRH Registers

The PMADRH:PMADRL register pair can address up

to a maximum of 512 words of program memory. When

selecting a program address value, the MSB of the

address is written to the PMADRH register and the LSB

is written to the PMADRL register.

9.1.1 PMCON1 AND PMCON2

REGISTERS

PMCON1 is the control register for Flash program

memory accesses.

Control bits RD and WR initiate read and write,

respectively. These bits cannot be cleared, only set, in

software. They are cleared by hardware at completion

of the read or write operation. The inability to clear the

WR bit in software prevents the accidental, premature

termination of a write operation.

The WREN bit, when set, will allow a write operation to

occur. On power-up, the WREN bit is clear. The

WRERR bit is set when a write operation is interrupted

by a Reset during normal operation. In these situations,

following Reset, the user can check the WRERR bit

and execute the appropriate error handling routine.

The PMCON2 register is a write-only register. Attempting

to read the PMCON2 register will return all ‘0’s.

To enable writes to the program memory, a specific

pattern (the unlock sequence), must be written to the

PMCON2 register. The required unlock sequence

prevents inadvertent writes to the program memory

write latches and Flash program memory.

9.2 Flash Program Memory Overview

It is important to understand the Flash program memory

structure for erase and programming operations. Flash

program memory is arranged in rows. A row consists of

a fixed number of 14-bit program memory words. A row

is the minimum size that can be erased by user software.

After a row has been erased, the user can reprogram

all or a portion of this row. Data to be written into the

program memory row is written to 14-bit wide data write

latches. These write latches are not directly accessible

to the user, but may be loaded via sequential writes to

the PMDATH:PMDATL register pair.

See Ta b l e 9 - 1 for Erase Row size and the number of

write latches for Flash program memory.

Note 1: Code protection of the entire Flash

program memory array is enabled by

clearing the CP bit of Configuration Word.

Note: If the user wants to modify only a portion

of a previously programmed row, then the

contents of the entire row must be read

and saved in RAM prior to the erase.

Then, new data and retained data can be

written into the write latches to reprogram

the row of Flash program memory. How-

ever, any unprogrammed locations can be

written without first erasing the row. In this

case, it is not necessary to save and

rewrite the other previously programmed

locations.

PIC10(L)F320/322

DS41585A-page 58 Preliminary  2011 Microchip Technology Inc.

9.2.1 READING THE FLASH PROGRAM

MEMORY

To read a program memory location, the user must:

1. Write the desired address to the

PMADRH:PMADRL register pair.

2. Clear the CFGS bit of the PMCON1 register.

3. Then, set control bit RD of the PMCON1 register.

Once the read control bit is set, the program memory

Flash controller will use the second instruction cycle to

read the data. This causes the second instruction

immediately following the “BSF PMCON1,RD” instruction

to be ignored. The data is available in the very next cycle,

in the PMDATH:PMDATL register pair; therefore, it can

be read as two bytes in the following instructions.

PMDATH:PMDATL register pair will hold this value until

another read or until it is written to by the user.

FIGURE 9-1: FLASH PROGRAM

MEMORY READ

FLOWCHART

TABLE 9-1: FLASH MEMORY

ORGANIZATION BY DEVICE

Device Row Erase

(words)

Write

Latches

(words)

PIC10(L)F320 16 16

PIC10(L)F322

Note: The two instructions following a program

memory read are required to be NOPs.

This prevents the user from executing a

two-cycle instruction on the next

instruction after the RD bit is set.

Start

Read Operation

Select

Program or Configuration Memory

(CFGS)

Select

Word Address

(PMADRH:PMADRL)

End

Read Operation

Instruction Fetched ignored

NOP execution forced

Instruction Fetched ignored

NOP execution forced

Initiate Read operation

(RD = 1)

Data read now in

PMDATH:PMDATL

 2011 Microchip Technology Inc. Preliminary DS41585A-page 59

PIC10(L)F320/322

FIGURE 9-2: FLASH PROGRAM MEMORY READ CYCLE EXECUTION

EXAMPLE 9-1: FLASH PROGRAM MEMORY READ

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

BSF PMCON1,RD

executed here

INSTR(PC + 1)

executed here

PC + 1 PMADRH,PMADRL PC+3 PC + 5

Flash ADDR

RD bit

PMDATH,PMDATL

PC + 3 PC + 4

INSTR (PC + 1)

INSTR(PC - 1)

executed here INSTR(PC + 3)

executed here INSTR(PC + 4)

executed here

Flash Data

PMDATH

PMDATL

INSTR (PC) INSTR (PC + 3) INSTR (PC + 4)

instruction ignored

Forced NOP

INSTR(PC + 2)

executed here

instruction ignored

Forced NOP

* This code block will read 1 word of program

* memory at the memory address:

PROG_ADDR_HI: PROG_ADDR_LO

* data will be returned in the variables;

* PROG_DATA_HI, PROG_DATA_LO

BANKSEL PMADRL ; not required on devices with 1 Bank of SFRs

MOVLW PROG_ADDR_LO ;

MOVWF PMADRL ; Store LSB of address

MOVLW PROG_ADDR_HI ;

MOVWF PMADRH ; Store MSB of address

BCF PMCON1,CFGS ; Do not select Configuration Space

BSF PMCON1,RD ; Initiate read

NOP ; Ignored (Figure 9-2)

MOVF PMDATL,W ; Get LSB of word

MOVWF PROG_DATA_LO ; Store in user location

MOVF PMDATH,W ; Get MSB of word

MOVWF PROG_DATA_HI ; Store in user location

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DS41585A-page 60 Preliminary  2011 Microchip Technology Inc.

9.2.2 FLASH MEMORY UNLOCK

SEQUENCE

The unlock sequence is a mechanism that protects the

Flash program memory from unintended self-write pro-

gramming or erasing. The sequence must be executed

and completed without interruption to successfully

complete any of the following operations:

•Row Erase

• Load program memory write latches

• Write of program memory write latches to pro-

gram memory

• Write of program memory write latches to User

IDs

The unlock sequence consists of the following steps:

1. Write 55h to PMCON2

2. Write AAh to PMCON2

3. Set the WR bit in PMCON1

4. NOP instruction

5. NOP instruction

Once the WR bit is set, the processor will always force

two NOP instructions. When an Erase Row or Program

Row operation is being performed, the processor will stall

internal operations (typical 2 ms), until the operation is

complete and then resume with the next instruction.

When the operation is loading the program memory write

latches, the processor will always force the two NOP

instructions and continue uninterrupted with the next

instruction.

Since the unlock sequence must not be interrupted,

global interrupts should be disabled prior to the unlock

sequence and re-enabled after the unlock sequence is

completed.

FIGURE 9-3: FLASH PROGRAM

MEMORY UNLOCK

SEQUENCE FLOWCHART

Write 055h to

PMCON2

Start

Unlock Sequence

Write 0AAh to

PMCON2

Initiate

Write or Erase operation

(WR = 1)

Instruction Fetched ignored

NOP execution forced

End

Unlock Sequence

Instruction Fetched ignored

NOP execution forced

 2011 Microchip Technology Inc. Preliminary DS41585A-page 61

PIC10(L)F320/322

9.2.3 ERASING FLASH PROGRAM

MEMORY

While executing code, program memory can only be

erased by rows. To erase a row:

1. Load the PMADRH:PMADRL register pair with

any address within the row to be erased.

2. Clear the CFGS bit of the PMCON1 register.

3. Set the FREE and WREN bits of the PMCON1

4. Write 55h, then AAh, to PMCON2 (Flash

programming unlock sequence).

5. Set control bit WR of the PMCON1 register to

begin the erase operation.

See Example 9-2.

After the “BSF PMCON1,WR” instruction, the processor

requires two cycles to set up the erase operation. The

user must place two NOP instructions after the WR bit is

set. The processor will halt internal operations for the

typical 2 ms erase time. This is not Sleep mode as the

clocks and peripherals will continue to run. After the

erase cycle, the processor will resume operation with

the third instruction after the PMCON1 write instruction.

FIGURE 9-4: FLASH PROGRAM

MEMORY ERASE

FLOWCHART

Disable Interrupts

(GIE = 0)

Start

Erase Operation

Select

Program or Configuration Memory

(CFGS)

Select Row Address

(PMADRH:PMADRL)

Select Erase Operation

(FREE = 1)

Enable Write/Erase Operation

(WREN = 1)

Unlock Sequence

(FIGURE x-x)

Disable Write/Erase Operation

(WREN = 0)

Re-enable Interrupts

(GIE = 1)

End

Erase Operation

CPU stalls while

ERASE operation completes

(2ms typical)

Figure 9-3

PIC10(L)F320/322

DS41585A-page 62 Preliminary  2011 Microchip Technology Inc.

EXAMPLE 9-2: ERASING ONE ROW OF PROGRAM MEMORY

; This row erase routine assumes the following:

; 1. A valid address within the erase row is loaded in ADDRH:ADDRL

; 2. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM)

BCF INTCON,GIE ; Disable ints so required sequences will execute properly

BANKSEL PMADRL ; not required on devices with 1 Bank of SFRs

MOVF ADDRL,W ; Load lower 8 bits of erase address boundary

MOVWF PMADRL

MOVF ADDRH,W ; Load upper 6 bits of erase address boundary

MOVWF PMADRH

BCF PMCON1,CFGS ; Not configuration space

BSF PMCON1,FREE ; Specify an erase operation

BSF PMCON1,WREN ; Enable writes

MOVLW 55h ; Start of required sequence to initiate erase

MOVWF PMCON2 ; Write 55h

MOVLW 0AAh ;

MOVWF PMCON2 ; Write AAh

BSF PMCON1,WR ; Set WR bit to begin erase

NOP ; NOP instructions are forced as processor starts

NOP ; row erase of program memory.

;

; The processor stalls until the erase process is complete

; after erase processor continues with 3rd instruction

BCF PMCON1,WREN ; Disable writes

BSF INTCON,GIE ; Enable interrupts

Required

Sequence

 2011 Microchip Technology Inc. Preliminary DS41585A-page 63

PIC10(L)F320/322

9.2.4 WRITING TO FLASH PROGRAM

MEMORY

Program memory is programmed using the following

steps:

1. Load the address in PMADRH:PMADRL of the

row to be programmed.

2. Load each write latch with data.

3. Initiate a programming operation.

4. Repeat steps 1 through 3 until all data is written.

Before writing to program memory, the word(s) to be

written must be erased or previously unwritten. Pro-

gram memory can only be erased one row at a time. No

automatic erase occurs upon the initiation of the write.

Program memory can be written one or more words at

a time. The maximum number of words written at one

time is equal to the number of write latches. See

Figure 9-5 (row writes to program memory with 16 write

latches) for more details.

The write latches are aligned to the Flash row address

boundary defined by the upper 10-bits of

PMADRH:PMADRL, (PMADRH<6:0>:PMADRL<7:5>)

with the lower 5-bits of PMADRL, (PMADRL<4:0>)

determining the write latch being loaded. Write opera-

tions do not cross these boundaries. At the completion

of a program memory write operation, the data in the

write latches is reset to contain 0x3FFF.

The following steps should be completed to load the

write latches and program a row of program memory.

These steps are divided into two parts. First, each write

latch is loaded with data from the PMDATH:PMDATL

using the unlock sequence with LWLO = 1. When the

last word to be loaded into the write latch is ready, the

LWLO bit is cleared and the unlock sequence

executed. This initiates the programming operation,

writing all the latches into Flash program memory.

1. Set the WREN bit of the PMCON1 register.

2. Clear the CFGS bit of the PMCON1 register.

3. Set the LWLO bit of the PMCON1 register.

When the LWLO bit of the PMCON1 register is

‘1’, the write sequence will only load the write

latches and will not initiate the write to Flash

program memory.

4. Load the PMADRH:PMADRL register pair with

the address of the location to be written.

5. Load the PMDATH:PMDATL register pair with

the program memory data to be written.

6. Execute the unlock sequence (Section 9.2.2

“Flash Memory Unlock Sequence”). The write

latch is now loaded.

7. Increment the PMADRH:PMADRL register pair

to point to the next location.

8. Repeat steps 5 through 7 until all but the last

write latch has been loaded.

9. Clear the LWLO bit of the PMCON1 register.

When the LWLO bit of the PMCON1 register is

‘0’, the write sequence will initiate the write to

Flash program memory.

10. Load the PMDATH:PMDATL register pair with

the program memory data to be written.

11. Execute the unlock sequence (Section 9.2.2

“Flash Memory Unlock Sequence”). The

entire program memory latch content is now

written to Flash program memory.

An example of the complete write sequence is shown in

Example 9-3. The initial address is loaded into the

PMADRH:PMADRL register pair; the data is loaded

using indirect addressing.

Note: The special unlock sequence is required

to load a write latch with data or initiate a

Flash programming operation. If the

unlock sequence is interrupted, writing to

the latches or program memory will not be

initiated.

Note: The program memory write latches are

reset to the blank state (0x3FFF) at the

completion of every write or erase

operation. As a result, it is not necessary

to load all the program memory write

latches. Unloaded latches will remain in

the blank state.

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DS41585A-page 64 Preliminary  2011 Microchip Technology Inc.

FIGURE 9-5: BLOCK WRITES TO FLASH PROGRAM MEMORY WITH 16 WRITE LATCHES

PMDATH PMDATL

7 5 0 7 0

6 8

1414

Write Latch #15

0Fh

1414

PMADRH PMADRL

7 1 0 7 4 3 0

Program Memory Write Latches

14 14 14

PMADRH<0>:

PMADRL<7:4>

Flash Program Memory

Row

Address

Decode

Addr

Write Latch #14

0Eh

Write Latch #1

01h

Write Latch #0

00h

Addr AddrAddr

000h 000Fh000Eh0000h 0001h

001h 001Fh001Eh0010h 0011h

002h 002Fh002Eh0020h 0021h

01Eh 01EFh01EEh01E0h 01E1h

01Fh 01FFh01FEh01F0h 01F1h

- - - - - r4 r3-r1 r0 c3 c2 c1 c0r2

PMADRL<3:0>

000h 2008h 

2000h - 2003h

Configuration

Word

USER ID 0 - 3

2007h2006h

DEVICEID

REVID

reserved

2004h - 2005h

reserved

Configuration Memory

CFGS = 0

CFGS = 1

 2011 Microchip Technology Inc. Preliminary DS41585A-page 65

PIC10(L)F320/322

FIGURE 9-6: FLASH PROGRAM MEMORY WRITE FLOWCHART

Disable Interrupts

(GIE = 0)

Start

Write Operation

Select

Program or Config. Memory

(CFGS)

Select Row Address

(PMADRH:PMADRL)

Select Write Operation

(FREE = 0)

Enable Write/Erase

Operation (WREN = 1)

Unlock Sequence

(Figure x-x)

Disable

Write/Erase Operation

(WREN = 0)

Re-enable Interrupts

(GIE = 1)

End

Write Operation

No delay when writing to

Program Memory Latches

Determine number of words

to be written into Program or

Configuration Memory.

The number of words cannot

exceed the number of words

per row.

(word_cnt) Load the value to write

(PMDATH:PMDATL)

Update the word counter

(word_cnt--)

Last word to

write ?

Increment Address

(PMADRH:PMADRL++)

Unlock Sequence

(Figure x-x)

CPU stalls while Write

operation completes

(2ms typical)

Load Write Latches Only

(LWLO = 1)

Write Latches to Flash

(LWLO = 0)

Yes

Figure 9-3

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EXAMPLE 9-3: WRITING TO FLASH PROGRAM MEMORY

; This write routine assumes the following:

; 1. 64 bytes of data are loaded, starting at the address in DATA_ADDR

; 2. Each word of data to be written is made up of two adjacent bytes in DATA_ADDR,

; stored in little endian format

; 3. A valid starting address (the least significant bits = 00000) is loaded in ADDRH:ADDRL

; 4. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM)

;BCF INTCON,GIE ; Disable ints so required sequences will execute properly

BANKSEL PMADRH ; not required on devices with 1 Bank of SFRs

MOVF ADDRH,W ; Load initial address

MOVWF PMADRH ;

MOVF ADDRL,W ;

MOVWF PMADRL ;

MOVLW LOW DATA_ADDR ; Load initial data address

MOVWF FSR0 ;

BCF PMCON1,CFGS ; Not configuration space

BSF PMCON1,WREN ; Enable writes

BSF PMCON1,LWLO ; Only Load Write Latches

LOOP MOVIW FSR0++ ; Load first data byte into lower

MOVWF PMDATL ;

MOVIW FSR0++ ; Load second data byte into upper

MOVWF PMDATH ;

MOVF PMADRL,W ; Check if lower bits of address are '00000'

XORLW 0x1F ; Check if we're on the last of 16 addresses

ANDLW 0x1F ;

BTFSC STATUS,Z ; Exit if last of 16 words,

GOTO START_WRITE ;

MOVLW 55h ; Start of required write sequence:

MOVWF PMCON2 ; Write 55h

MOVLW 0AAh ;

MOVWF PMCON2 ; Write AAh

BSF PMCON1,WR ; Set WR bit to begin write

NOP ; NOP instructions are forced as processor

; loads program memory write latches

NOP ;

INCF PMADRL,F ; Still loading latches Increment address

GOTO LOOP ; Write next latches

START_WRITE

BCF PMCON1,LWLO ; No more loading latches - Actually start Flash program

; memory write

MOVLW 55h ; Start of required write sequence:

MOVWF PMCON2 ; Write 55h

MOVLW 0AAh ;

MOVWF PMCON2 ; Write AAh

BSF PMCON1,WR ; Set WR bit to begin write

NOP ; NOP instructions are forced as processor writes

; all the program memory write latches simultaneously

NOP ; to program memory.

; After NOPs, the processor

; stalls until the self-write process in complete

; after write processor continues with 3rd instruction

BCF PMCON1,WREN ; Disable writes

BSF INTCON,GIE ; Enable interrupts

Required

Sequence

Required

Sequence

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9.3 Modifying Flash Progr am Memory

When modifying existing data in a program memory

row, and data within that row must be preserved, it must

first be read and saved in a RAM image. Program

memory is modified using the following steps:

1. Load the starting address of the row to be

modified.

2. Read the existing data from the row into a RAM

image.

3. Modify the RAM image to contain the new data

to be written into program memory.

4. Load the starting address of the row to be

rewritten.

5. Erase the program memory row.

6. Load the write latches with data from the RAM

image.

7. Initiate a programming operation.

FIGURE 9-7: FLASH PROGRAM

MEMORY MODIFY

FLOWCHART

Start

Modify Operation

Read Operation

(Figure x.x)

Erase Operation

(Figure x.x)

Modify Image

The words to be modified are

changed in the RAM image

End

Modify Operation

Write Operation

use RAM image

(Figure x.x)

An image of the entire row read

must be stored in RAM

Figure 9-2

Figure 9-4

Figure 9-5

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9.4 User ID, Device ID and

Configurati on Word Access

Instead of accessing program memory, the User ID’s,

Device ID/Revision ID and Configuration Word can be

accessed when CFGS = 1 in the PMCON1 register.

This is the region that would be pointed to by

PC<13> = 1, but not all addresses are accessible.

Different access may exist for reads and writes. Refer

to Table 9 -2.

When read access is initiated on an address outside

the parameters listed in Ta bl e 9 - 2, the

PMDATH:PMDATL register pair is cleared, reading

back ‘0’s.

TABLE 9-2: USER ID, DEVICE ID AND CONFIGURATION WORD ACCESS (CFGS = 1)

EXAMPLE 9-4: CONFIGURATION WORD AND DEVICE ID ACCESS

Address Function Read Access Write Access

2000h-2003h User IDs Yes Yes

2006h Device ID/Revision ID Yes No

2007h Configuration Word Yes No

* This code block will read 1 word of program memory at the memory address:

* PROG_ADDR_LO (must be 00h-08h) data will be returned in the variables;

* PROG_DATA_HI, PROG_DATA_LO

BANKSEL PMADRL ; not required on devices with 1 Bank of SFRs

MOVLW PROG_ADDR_LO ;

MOVWF PMADRL ; Store LSB of address

CLRF PMADRH ; Clear MSB of address

BSF PMCON1,CFGS ; Select Configuration Space

BCF INTCON,GIE ; Disable interrupts

BSF PMCON1,RD ; Initiate read

NOP ; Executed (See Figure 9-2)

NOP ; Ignored (See Figure 9-2)

BSF INTCON,GIE ; Restore interrupts

MOVF PMDATL,W ; Get LSB of word

MOVWF PROG_DATA_LO ; Store in user location

MOVF PMDATH,W ; Get MSB of word

MOVWF PROG_DATA_HI ; Store in user location

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9.5 Write Verify

It is considered good programming practice to verify that

program memory writes agree with the intended value.

Since program memory is stored as a full page then the

stored program memory contents are compared with the

intended data stored in RAM after the last write is

complete.

FIGURE 9-8: FLASH PROGRAM

MEMORY VERIFY

FLOWCHART

Start

Verify Operation

Read Operation

(Figure x.x)

End

Verify Operation

This routine assumes that the last row

of data written was from an image

saved in RAM. This image will be used

to verify the data currently stored in

Flash Program Memory.

PMDAT =

RAM image

Last

Word ?

Fail

Verify Operation

Yes

Figure 9-2

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9.6 Flash Program Memory Control Registers

R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u

PMDAT<7:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-0 PMDAT<7:0>: The value of the program memory word pointed to by PMADRH and PMADRL after a

program memory read command.

U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u

——PMDAT<13:8>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-6 Unimplemented: Read as ‘0’

bit 5-0 PMDAT<13:8>: The value of the program memory word pointed to by PMADRH and PMADRL after a

program memory read command.

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R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0

PMADR<7:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-0 PMADR<7:0>: Program Memory Read Address low bits

U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0

— — — — — — —PMADR8

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-1 Unimplemented: Read as ‘0’

bit 0 PMADR8: Program Memory Read Address High bit

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U-1(1) R/W-0/0 R/W-0/0 R/W/HC-0/0 R/W/HC-0/q(2) R/W-0/0 R/S/HC-0/0 R/S/HC-0/0

— CFGS LWLO FREE WRERR WREN WR RD

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware

bit 7 Unimplemented: Read as ‘1’

bit 6 CFGS: Configuration Select bit

1 = Access Configuration, User ID and Device ID Registers

0 = Access Flash program memory

bit 5 LWLO: Load Write Latches Only bit(3)

1 = Only the addressed program memory write latch is loaded/updated on the next WR command

0 = The addressed program memory write latch is loaded/updated and a write of all program memory

write latches will be initiated on the next WR command

bit 4 FREE: Program Flash Erase Enable bit

1 = Performs an erase operation on the next WR command (hardware cleared upon completion)

0 = Performs an write operation on the next WR command

bit 3 WRERR: Program/Erase Error Flag bit

1 = Condition indicates an improper program or erase sequence attempt or termination (bit is set

automatically on any set attempt (write ‘1’) of the WR bit).

0 = The program or erase operation completed normally.

bit 2 WREN: Program/Erase Enable bit

1 = Allows program/erase cycles

0 = Inhibits programming/erasing of program Flash

bit 1 WR: Write Control bit

1 = Initiates a program Flash program/erase operation.

The operation is self-timed and the bit is cleared by hardware once operation is complete.

The WR bit can only be set (not cleared) in software.

0 = Program/erase operation to the Flash is complete and inactive.

bit 0 RD: Read Control bit

1 = Initiates a program Flash read. Read takes one cycle. RD is cleared in hardware. The RD bit can

only be set (not cleared) in software.

0 = Does not initiate a program Flash read.

Note 1: Unimplemented bit, read as ‘1’.

2: The WRERR bit is automatically set by hardware when a program memory write or erase operation is started

(WR = 1).

3: The LWLO bit is ignored during a program memory erase operation (FREE = 1).

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TABLE 9-3: SUMMARY OF REGISTERS ASSOCIATED WITH FLASH PROGRAM MEMORY

TABLE 9-4: SUMMARY OF CONFIGURATION WORD WITH FLASH PROGRAM MEMORY

W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0

Program Memory Control Register 2

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-0 Flash Memory Unlock Pattern bits

To unlock writes, a 55h must be written first, followed by an AAh, before setting the WR bit of the

PMCON1 register. The value written to this register is used to unlock the writes. There are specific

timing requirements on these writes.

Name B i t 7 Bit 6 Bit 5 B it 4 Bit 3 B it 2 Bit 1 B it 0 Register on

Page

INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 46

PMCON1 —CFGS LWLO FREE WRERR WREN WR RD 72

PMCON2 Program Memory Control Register 2 73

PMADRL PMADR<7:0> 71

PMADRH — — — — — — —PMADR8 71

PMDATL PMDAT<7:0> 70

PMDATH —— PMDAT<13:8> 70

Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Flash program memory module.

Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register

on Pa ge

CONFIG 13:8 — — — WRT<1:0> BORV LPBOR LVP 22

7:0 CP MCLR PWRTE WDTE<1:0> BOREN<1:0> FOSC

Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Flash program memory.

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NOTES:

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10.0 I/O PORT

Depending on which peripherals are enabled, some or

all of the pins may not be available as general purpose

I/O. In general, when a peripheral is enabled on a port

pin, that pin cannot be used as a general purpose

output. However, the pin can still be read.

PORTA has three standard registers for its operation.

These registers are:

• TRISA register (data direction)

• PORTA register (reads the levels on the pins of

the device)

• LATA register (output latch)

Some ports may have one or more of the following

additional registers. These registers are:

• ANSELA (analog select)

• WPUA (weak pull-up)

The Data Latch (LATA register) is useful for read-

modify-write operations on the value that the I/O pins

are driving.

A write operation to the LATA register has the same

effect as a write to the corresponding PORTA register.

A read of the LATA register reads of the values held in

the I/O PORT latches, while a read of the PORTA

Ports that support analog inputs have an associated

ANSELA register. When an ANSEL bit is set, the digital

input buffer associated with that bit is disabled.

Disabling the input buffer prevents analog signal levels

on the pin between a logic high and low from causing

excessive current in the logic input circuitry. A

simplified model of a generic I/O port, without the

interfaces to other peripherals, is shown in Figure 10-1.

FIGURE 10-1: I/O PORT OPERATION

EXAMPLE 10-1: INITIALIZI NG PORTA

Write LATA

Data Register

I/O pin

Read PORTA

Write PORTA

TRISA

Read LATA

Data Bus

To peripherals

ANSELA

VDD

VSS

; This code example illustrates

; initializing the PORTA register. The

; other ports are initialized in the same

; manner.

BANKSEL PORTA ;not required on devices with 1 Bank of SFRs

CLRF PORTA ;Init PORTA

BANKSEL LATA ;not required on devices with 1 Bank of SFRs

CLRF LATA ;

BANKSEL ANSELA ;not required on devices with 1 Bank of SFRs

CLRF ANSELA ;digital I/O

BANKSEL TRISA ;not required on devices with 1 Bank of SFRs

MOVLW B'00000011' ;Set RA<1:0> as inputs

MOVWF TRISA ;and set RA<2:3> as

;outputs

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10.1 PORTA Registers

PORTA is a 8-bit wide, bidirectional port. The

corresponding data direction register is TRISA

(Register 10-2). Setting a TRISA bit (= 1) will make the

corresponding PORTA pin an input (i.e., disable the

output driver). Clearing a TRISA bit (= 0) will make the

corresponding PORTA pin an output (i.e., enables

output driver and puts the contents of the output latch

on the selected pin). Example 10-1 shows how to

initialize PORTA.

Reading the PORTA register (Register 10-1) reads the

status of the pins, whereas writing to it will write to the

PORT latch. All write operations are read-modify-write

operations. Therefore, a write to a port implies that the

port pins are read, this value is modified and then

written to the PORT data latch (LATA).

The TRISA register (Register 10-2) controls the

PORTA pin output drivers, even when they are being

used as analog inputs. The user should ensure the bits

in the TRISA register are maintained set when using

them as analog inputs. I/O pins configured as analog

input always read ‘0’.

10.1.1 WEAK PULL-UPS

Each of the PORTA pins has an individually configu-

rable internal weak pull-up. Control bits WPUA<3:0>

enable or disable each pull-up (see Register 10-5).

Each weak pull-up is automatically turned off when the

port pin is configured as an output. All pull-ups are dis-

abled on a Power-on Reset by the WPUEN bit of the

OPTION_REG register.

10.1.2 ANSELA REGISTER

The ANSELA register (Register 10-4) is used to

configure the Input mode of an I/O pin to analog.

Setting the appropriate ANSELA bit high will cause all

digital reads on the pin to be read as ‘0’ and allow

analog functions on the pin to operate correctly.

The state of the ANSELA bits has no effect on digital

output functions. A pin with TRIS clear and ANSEL set

will still operate as a digital output, but the Input mode

will be analog. This can cause unexpected behavior

when executing read-modify-write instructions on the

affected port.

10.1.3 PORTA FUNCTIONS AND OUTPUT

PRIORITIES

Each PORTA pin is multiplexed with other functions. The

pins, their combined functions and their output priorities

are shown in Table 10-1.

When multiple outputs are enabled, the actual pin

control goes to the peripheral with the highest priority.

Digital output functions may control the pin when it is in

Analog mode with the priority shown in Table 10-1.

Note: The ANSELA bits default to the Analog

mode after Reset. To use any pins as

digital general purpose or peripheral

inputs, the corresponding ANSEL bits

must be initialized to ‘0’ by user software.

TABLE 10-1: PORTA OUTPUT PRIORITY

Pin Name Function Priority(1)

RA0 ICSPDAT

CWG1A

PWM1

RA0

RA1 CWG1B

PWM2

CLC1

RA1

RA2 NCO1

CLKR

RA2

RA3 None

Note 1: Priority listed from highest to lowest.

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U-0 U-0 U-0 U-0 R-x/x R/W-x/x R/W-x/x R/W-x/x

— — — — RA3 RA2 RA1 RA0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-4 Unimplemented: Read as ‘0’

bit 3-0 RA<3:0>: PORTA I/O Value bits (RA3 is read-only)

Note 1: Writes to PORTx are actually written to the corresponding LATx register. Reads from PORTx register

return actual I/O pin values.

U-0 U-0 U-0 U-0 U-1 R/W-1/1 R/W-1/1 R/W-1/1

— — — — —(1) TRISA2 TRISA1 TRISA0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-4 Unimplemented: Read as ‘0’

bit 3 Unimplemented: Read as ‘1’

bit 2-0 TRISA<2:0>: RA<2:0> Port I/O Tri-State Control bits

1 = Port output driver is disabled

0 = Port output driver is enabled

Note 1: Unimplemented, read as ‘1’.

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U-0 U-0 U-0 U-0 U-0 R/W-x/u R/W-x/u R/W-x/u

— — — — — LATA2 LATA1 LATA0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-3 Unimplemented: Read as ‘0’

bit 2-0 LATA<2:0>: RA<2:0> Output Latch Value bits

Note 1: Writes to PORTx are actually written to the corresponding LATx register. Reads from LATx register return

U-0 U-0 U-0 U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1

— — — — — ANSA2 ANSA1 ANSA0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-3 Unimplemented: Read as ‘0’

bit 2-0 ANSA<2:0>: Analog Select between Analog or Digital Function on Pins RA<2:0>, respectively

1 = Analog input. Pin is assigned as analog input(1). Digital Input buffer disabled.

0 = Digital I/O. Pin is assigned to port or Digital special function.

Note 1: Setting a pin to an analog input automatically disables the digital input circuitry. Weak pull-ups, if

available, are unaffected. The corresponding TRIS bit must be set to Input mode by the user in order to

allow external control of the voltage on the pin.

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U-0 U-0 U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1

— — — — WPUA3(2) WPUA2 WPUA1 WPUA0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-4 Unimplemented: Read as ‘0’

bit 3-0 WPUA<3:0>: Weak Pull-up PORTA Control bits

1 = Weak Pull-up enabled(1)

0 = Weak Pull-up disabled.

Note 1: Enabling weak pull-ups also requires that the WPUEN bit of the OPTION_REG register be cleared

(Register 16-1).

2: If MCLRE = 1, weak pull-up on RA3 is internally enabled, but not reported here.

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TABLE 10-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register

on Page

ANSELA ————— ANSA2 ANSA1 ANSA0 78

IOCAF ———— IOCAF3 IOCAF2 IOCAF1 IOCAF0 84

IOCAN ———— IOCAN3 IOCAN2 IOCAN1 IOCAN0 83

IOCAP ———— IOCAP3 IOCAP2 IOCAP1 IOCAP0 83

LATA ————— LATA2 LATA1 LATA0 78

PORTA ———— RA3 RA2 RA1 RA0 77

TRISA —————(1) TRISA2 TRISA1 TRISA0 77

WPUA ———— WPUA3 WPUA2 WPUA1 WPUA0 79

Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by

PORTA.

Note 1: Unimplemented, read as ‘1’.

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11.0 INTERRUPT-ON-CHANGE

The PORTA pins can be configured to operate as

Interrupt-On-Change (IOC) pins. An interrupt can be

generated by detecting a signal that has either a rising

edge or a falling edge. Any individual PORTA pin, or

combination of PORTA pins, can be configured to

generate an interrupt. The Interrupt-on-change module

has the following features:

• Interrupt-on-Change enable (Master Switch)

• Individual pin configuration

• Rising and falling edge detection

• Individual pin interrupt flags

Figure 11-1 is a block diagram of the IOC module.

11.1 Enabling the Module

To allow individual PORTA pins to generate an interrupt,

the IOCIE bit of the INTCON register must be set. If the

IOCIE bit is disabled, the edge detection on the pin will

still occur, but an interrupt will not be generated.

11.2 Individual Pin Configuration

For each PORTA pin, a rising edge detector and a falling

edge detector are present. To enable a pin to detect a

rising edge, the associated IOCAPx bit of the IOCAP

the associated IOCANx bit of the IOCAN register is set.

A pin can be configured to detect rising and falling

edges simultaneously by setting both the IOCAPx bit

and the IOCANx bit of the IOCAP and IOCAN registers,

respectively.

11.3 Interrupt Flags

The IOCAFx bits located in the IOCAF register are

status flags that correspond to the Interrupt-on-change

pins of PORTA. If an expected edge is detected on an

appropriately enabled pin, then the status flag for that pin

will be set, and an interrupt will be generated if the IOCIE

bit is set. The IOCIF bit of the INTCON register reflects

the status of all IOCAFx bits.

11.4 Clearing Interrupt Flags

The individual status flags, (IOCAFx bits), can be

cleared by resetting them to zero. If another edge is

detected during this clearing operation, the associated

status flag will be set at the end of the sequence,

regardless of the value actually being written.

In order to ensure that no detected edge is lost while

clearing flags, only AND operations masking out known

changed bits should be performed. The following

sequence is an example of what should be performed.

EXAMPL E 11-1:

11.5 Operation in S le e p

The interrupt-on-change interrupt sequence will wake

the device from Sleep mode, if the IOCIE bit is set.

If an edge is detected while in Sleep mode, the IOCAF

executed out of Sleep.

MOVLW 0xff

XORWF IOCAF, W

ANDWF IOCAF, F

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FIGURE 11-1: INTERRUPT-ON-CHANGE BLOCK DIAGRAM

IOCANx

IOCAPx

Q4Q1

Data Bus =

0 or 1

Write IOCAFx

IOCIE

To Data Bus

IOCAFx

Edge

Detect

IOC Interrupt

to CPU Core

From all other

IOCAFx individual

pin detectors

Q4Q1

Q4Q1 Q4Q1 Q4Q1

RAx

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11.6 Interrupt-On-Change Registers

U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0

— — — — IOCAP3 IOCAP2 IOCAP1 IOCAP0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-4 Unimplemented: Read as ‘0’.

bit 3-0 IOCAP<3:0>: Interrupt-on-change PORTA Positive Edge Enable bits

1 = Interrupt-on-Change enabled on the pin for a positive going edge. Associated Status bit and

interrupt flag will be set upon detecting an edge.(1)

0 = Interrupt-on-Change disabled for the associated pin.

Note 1: Interrupt-on-change also requires that the IOCIE bit of the INTCON register be set (Register 6-1).

U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0

— — — — IOCAN3 IOCAN2 IOCAN1 IOCAN0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-4 Unimplemented: Read as ‘0’.

bit 3-0 IOCAN<3:0>: Interrupt-on-change PORTA Negative Edge Enable bits

1 = Interrupt-on-Change enabled on the pin for a negative going edge. Associated Status bit and

interrupt flag will be set upon detecting an edge.(1)

0 = Interrupt-on-Change disabled for the associated pin.

Note 1: Interrupt-on-change also requires that the IOCIE bit of the INTCON register be set (Register 6-1).

PIC10(L)F320/322

DS41585A-page 84 Preliminary  2011 Microchip Technology Inc.

TABLE 11-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE

U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0

— — — — IOCAF3 IOCAF2 IOCAF1 IOCAF0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared HS - Bit is set in hardware

bit 7-4 Unimplemented: Read as ‘0’.

bit 3-0 IOCAF<3:0>: Interrupt-on-change PORTA Flag bits

1 = An enable change was detected on the associated pin.

Set when IOCAPx = 1 and a rising edge was detected on RAx, or when IOCANx = 1 and a falling

edge was detected on RAx.(1)

0 = No change was detected, or the user cleared the detected change.

Note 1: Interrupt-on-change also requires that the IOCIE bit of the INTCON register be set (Register 6-1).

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register

on Page

INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 46

IOCAF ———— IOCAF3 IOCAF2 IOCAF1 IOCAF0 84

IOCAN ———— IOCAN3 IOCAN2 IOCAN1 IOCAN0 83

IOCAP ———— IOCAP3 IOCAP2 IOCAP1 IOCAP0 83

TRISA —————(1) TRISA2 TRISA1 TRISA0 77

Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Interrupt-on-Change.

Note 1: Unimplemented, read as ‘1’.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 85

PIC10(L)F320/322

12.0 FIXED VOLTAGE REFERENCE

(FVR)

The Fixed Voltage Reference, or FVR, is a stable

voltage reference, independent of VDD, with 1.024V,

2.048V or 4.096V selectable output levels. The output

of the FVR can be configured to supply a reference

voltage to the following:

• ADC input channel

The FVR can be enabled by setting the FVREN bit of

the FVRCON register.

12.1 Independent Gain Amplifiers

The output of the FVR supplied to the ADC is routed

through an independent programmable gain amplifier.

The amplifier can be configured to amplify the

reference voltage by 1x, 2x or 4x, to produce the three

possible voltage levels.

The ADFVR<1:0> bits of the FVRCON register are

used to enable and configure the gain amplifier settings

for the reference supplied to the ADC module. Refer-

ence Section 15.0 “Analog-to-Digital Converter

(ADC) Module” for additional information.

12.2 FVR Stabilization Period

When the Fixed Voltage Reference module is enabled, it

requires time for the reference and amplifier circuits to

stabilize. Once the circuits stabilize and are ready for use,

the FVRRDY bit of the FVRCON register will be set. See

Section 24.0 “Electrical Specifications” for the

minimum delay requirement.

FIGURE 12-1: VOLTAGE REFERENCE BLOCK DIAGRAM

FVR

(To ADC Module)

1.024V Fixed

Reference

FVREN

FVRRDY

ADFVR<1:0>

Any peripheral requiring

the Fixed Reference

(See Table 12-1)

TABLE 12-1: PERIPHERALS REQUIRING THE FIXED VOLTAGE REFERENCE (FVR)

Peripheral Conditions Description

HFINTOSC FOSC = 1EC on CLKIN pin.

BOR

BOREN<1:0> = 11 BOR always enabled.

BOREN<1:0> = 10 and BORFS = 1BOR disabled in Sleep mode, BOR Fast Start enabled.

BOREN<1:0> = 01 and BORFS = 1BOR under software control, BOR Fast Start enabled.

IVR All PIC10F320/322 devices, when

VREGPM1 = 1 and not in Sleep

The device runs off of the Power-Save mode regulator when

in Sleep mode.

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DS41585A-page 86 Preliminary  2011 Microchip Technology Inc.

12.3 FVR Control Registers

TABLE 12-2: SUMMARY OF REGISTERS ASSOCIATED WITH FIXED VOLTAGE REFERENCE

R/W-0/0 R-q/q R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0

FVREN FVRRDY(1) TSEN TSRNG ——ADFVR<1:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition

bit 7 FVREN: Fixed Voltage Reference Enable bit

1 = Fixed Voltage Reference is enabled

0 = Fixed Voltage Reference is disabled

bit 6 FVRRDY: Fixed Voltage Reference Ready Flag bit(1)

1 = Fixed Voltage Reference output is ready for use

0 = Fixed Voltage Reference output is not ready or not enabled

bit 5 TSEN: Temperature Indicator Enable bit(3)

1 = Temperature Indicator is enabled

0 = Temperature Indicator is disabled

bit 4 TSRNG: Temperature Indicator Range Selection bit(3)

1 =VOUT = VDD - 4VT (High Range)

0 =V

OUT = VDD - 2VT (Low Range)

bit 3-2 Unimplemented: Read as ‘0 ‘

bit 1-0 ADFVR<1:0>: ADC Fixed Voltage Reference Selection bit

11 = ADC Fixed Voltage Reference Peripheral output is 4x (4.096V)(2)

10 = ADC Fixed Voltage Reference Peripheral output is 2x (2.048V)(2)

01 = ADC Fixed Voltage Reference Peripheral output is 1x (1.024V)

00 = ADC Fixed Voltage Reference Peripheral output is off.

Note 1: FVRRDY indicates the true state of the FVR.

2: Fixed Voltage Reference output cannot exceed VDD.

3: See Section 14.0 “Temperature Indicator Module” for additional information.

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register

on page

FVRCON FVREN FVRRDY TSEN TSRNG ——ADFVR<1:0>86

Legend: Shaded cells are not used with the Fixed Voltage Reference.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 87

PIC10(L)F320/322

13.0 INTERNAL VOLTAGE

REGULATOR (IVR)

The Internal Voltage Regulator (IVR), which provides

operation above 3.6V is available on:

•PIC10(L)F320

•PIC10(L)F322

This circuit regulates a voltage for the internal device

logic while permitting the VDD and I/O pins to operate

at a higher voltage. When VDD approaches the

regulated voltage, the IVR output automatically tracks

the input voltage.

The IVR operates in one of three power modes based

on user configuration and peripheral selection. The

operating power modes are:

-High

-Low

- Power Save Sleep mode

Power modes are selected automatically depending on

the device operation, as shown in Tabl e 1 3-1. Tracking

mode is selected automatically when VDD drops below

the safe operating voltage of the core.

TABLE 13-1: IVR POWER MODES - REGULATED

Note: IVR is disabled in Tracking mode, but will

consume power. See Section 24.0

“Electrical Specifications” for more

information.

VREGPM1 Bit Sleep Mode Memory Bias Power Mode IVR Power Mode

xNo

EC Mode or INTOSC = 16 MHz (HP Bias) High

INTOSC = 1 to 8 MHz (MP Bias)

INTOSC = 31 kHz to 500 kHz (LP Bias) Low

0Yes Don’t Care Low

1Yes No HFINTOSC Power Save(1)

No Peripherals

Note 1: Forced to Low-Power mode by any of the following conditions:

• BOR is enabled

• HFINTOSC is an active peripheral source

• Self-write is active

• ADC is in an active conversion

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DS41585A-page 88 Preliminary  2011 Microchip Technology Inc.

U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-1/1

——————VREGPM1Reserved

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-2 Unimplemented: Read as ‘0’

bit 1 VREGPM1: Voltage Regulator Power Mode Selection bit

1 = Power-Save Sleep mode enabled in Sleep. Draws lowest current in Sleep, slower wake-up.

0 = Low-Power mode enabled in Sleep. Draws higher current in Sleep, faster wake-up.

bit 0 Reserved: Maintain this bit set.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 89

PIC10(L)F320/322

14.0 TEMPERATURE INDICATOR

MODULE

This family of devices is equipped with a temperature

circuit designed to measure the operating temperature

of the silicon die. The circuit’s range of operating

temperature falls between of -40°C and +85°C. The

output is a voltage that is proportional to the device

temperature. The output of the temperature indicator is

internally connected to the device ADC.

The circuit may be used as a temperature threshold

detector or a more accurate temperature indicator,

depending on the level of calibration performed. A one-

point calibration allows the circuit to indicate a

temperature closely surrounding that point. A two-point

calibration allows the circuit to sense the entire range

of temperature more accurately. Reference Application

Note AN1333, “Use and Calibration of the Internal

Temperature Indicator” (DS01333) for more details

regarding the calibration process.

14.1 Circuit Operation

Figure 14-1 shows a simplified block diagram of the

temperature circuit. The proportional voltage output is

achieved by measuring the forward voltage drop across

multiple silicon junctions.

Equation 14-1 describes the output characteristics of

the temperature indicator.

EQUATION 14-1: VOUT RANGES

The temperature sense circuit is integrated with the

Fixed Voltage Reference (FVR) module. See

Section 12.0 “Fixed Voltage Reference (FVR)” for

more information.

The circuit is enabled by setting the TSEN bit of the

FVRCON register. When disabled, the circuit draws no

current.

The circuit operates in either high or low range. The high

range, selected by setting the TSRNG bit of the

FVRCON register, provides a wider output voltage. This

provides more resolution over the temperature range,

but may be less consistent from part to part. This range

requires a higher bias voltage to operate and thus, a

higher VDD is needed.

The low range is selected by clearing the TSRNG bit of

the FVRCON0 register. The low range generates a

lower voltage drop and thus, a lower bias voltage is

needed to operate the circuit. The low range is provided

for low voltage operation.

FIGURE 14-1: TEMPERATURE CIRCUIT

DIAGRAM

14.2 Minimum Operating VDD vs.

Minimum Sensing Temperature

When the temperature circuit is operated in low range,

the device may be operated at any operating voltage

that is within specifications.

When the temperature circuit is operated in high range,

the device operating voltage, VDD, must be high

enough to ensure that the temperature circuit is cor-

rectly biased.

Table 14-1 shows the recommended minimum VDD vs.

range setting.

TABLE 14-1: RECOMMENDED VDD VS.

RANGE

14.3 Temperature Output

The output of the circuit is measured using the internal

Analog-to-Digital Converter. A channel is reserved for

the temperature circuit output. Refer to Section 15.0

“Analog-to-Digital Converter (ADC) Module” for

detailed information.

14.4 ADC Acquisition Time

To ensure accurate temperature measurements, the

user must wait at least 200 s after the ADC input

multiplexer is connected to the temperature indicator

output before the conversion is performed. In addition,

the user must wait 200 s between sequential

conversions of the temperature indicator output.

High Range: VOUT = VDD - 4VT

Low R ange: VOUT = VDD - 2VT

Min. VDD, TSRNG = 1Min. VDD, TSRNG = 0

3.6V 1.8V

TSEN

TSRNG

VDD

VOUT To AD C

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TABLE 14-2: SUMMARY OF REGISTERS

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register

on Page

FVRCON FVREN FVRRDY TSEN TSRNG — — ADFVR<1:0> 86

ADCON ADCS<2:0> CHS<2:0> GO/

DONE ADON 96

ADRES A/D Result Register 97

Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Interrupt-on-Change.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 91

PIC10(L)F320/322

15.0 ANALOG-TO-DIGITAL

CONVERTER (ADC) MODULE

The Analog-to-Digital Converter (ADC) converts an

analog input signal to an 8-bit binary representation of

that signal. This device uses three analog input

channels, which are multiplexed into a single sample

and hold circuit. The output of the sample and hold is

connected to the input of the converter. The converter

generates an 8-bit binary result via successive

approximation and stores the conversion result into the

ADC result register (ADRES). Figure 15-1 shows the

block diagram of the ADC.

The ADC voltage reference is software selectable to be

either internally generated or externally supplied.

The ADC can generate an interrupt upon completion of

a conversion. This interrupt can be used to wake-up the

device from Sleep.

FIGURE 15-1: ADC S IMPLIFIE D BLOCK DIAGRAM

FVR

VREF- = Vss

Note 1: When ADON = 0, all multiplexer inputs are disconnected.

2: See ADCON register (Register 15-1) for detailed analog channel selection per device.

ADON(1)

GO/DONE

VSS

ADC

000

001

010

111

CHS<2:0>(2)

AN0

AN1

AN2

ADRES

Temp Indicator 110

VREF+ = VDD

011

100

101

Reserved

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DS41585A-page 92 Preliminary  2011 Microchip Technology Inc.

15.1 ADC Configuration

When configuring and using the ADC the following

functions must be considered:

• Port configuration

• Channel selection

• ADC conversion clock source

• Interrupt control

15.1.1 PORT CONFIGURATION

The ADC can be used to convert both analog and

digital signals. When converting analog signals, the I/O

pin should be configured for analog by setting the

associated TRIS and ANSEL bits. Refer to

Section 10.0 “I/O Port” for more information.

15.1.2 CHANNEL SELECTION

There are up to 5 channel selections available:

• AN<2:0> pins

• Temperature Indicator

• FVR (Fixed Voltage Reference) Output

Refer to Section 12.0 “Fixed Voltage Reference

(FVR)” and Section 14.0 “Temperature Indicator

Module” for more information on these channel selec-

tions.

The CHS bits of the ADCON register determine which

channel is connected to the sample and hold circuit.

When changing channels, a delay is required before

starting the next conversion. Refer to Section 15.2

“ADC Operation” for more information.

15.1.3 ADC VOLTAGE REFERENCE

There is no external voltage reference connections to

the ADC. Only VDD can be used as a reference source.

The FVR is only available as an input channel and not

a VREF+ input to the ADC.

15.1.4 CONVERSION CLOCK

The source of the conversion clock is software select-

able via the ADCS bits of the ADCON register

(Register 15-1). There are seven possible clock

options:

•F

OSC/2

•F

OSC/4

•FOSC/8

•FOSC/16

•F

OSC/32

•FOSC/64

•FRC (dedicated internal oscillator)

The time to complete one bit conversion is defined as

AD. One full 8-bit conversion requires 9.5 TAD periods

as shown in Figure 15-2.

For correct conversion, the appropriate TAD specifica-

tion must be met. Refer to the A/D conversion require-

ments in Section 24.0 “Electrical Specifica t ion s” for

more information. Table 15-1 gives examples of appro-

priate ADC clock selections.

Note: Analog voltages on any pin that is defined

as a digital input may cause the input buf-

fer to conduct excess current.

Note 1: Any changes in the system clock fre-

quency will change the ADC clock fre-

quency, which may adversely affect the

ADC result.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 93

PIC10(L)F320/322

TABLE 15-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES

FIGURE 15-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES

ADC Clock Period (TAD) Device Frequency (FOSC)

ADC

Clock Source ADCS<2:0> 16 MHz 8 MHz 4 MHz 1 MHz

FOSC/2 000 125 ns(1) 250 ns(1) 500 ns(1) 2.0 s

FOSC/4 100 250 ns(1) 500 ns(1) 1.0 s4.0 s

FOSC/8 001 0.5 s(1) 1.0 s2.0 s8.0 s(2)

FOSC/16 101 1.0 s2.0 s4.0 s16.0 s(2)

FOSC/32 010 2.0 s4.0 s8.0 s(2) 32.0 s(2)

FOSC/64 110 4.0 s8.0 s(2) 16.0 s(2) 64.0 s(2)

FRC x11 1.0-6.0 s(1,3) 1.0-6.0 s(1,3) 1.0-6.0 s(1,3) 1.0-6.0 s(1,3)

Legend: Shaded cells are outside of recommended range.

Note 1: These values violate the minimum required TAD time.

2: For faster conversion times, the selection of another clock source is recommended.

3: The ADC clock period (TAD) and total ADC conversion time can be minimized when the ADC clock is derived from the

system clock FOSC. However, the FRC clock source must be used when conversions are to be performed with the

device in Sleep mode.

TAD1TAD2TAD3 TAD4 TAD5TAD6TAD7TAD8

Set GO bit

Holding capacitor is disconnected from analog input

TAD9

TCY - TAD

ADRES is loaded, GO bit is cleared,

ADIF bit is set, holding capacitor is

Conversion starts

b7 b4 b3 b2 b1 b0

b6 b5

On the following cycle:

(typically 100 ns)

connected to analog input.

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DS41585A-page 94 Preliminary  2011 Microchip Technology Inc.

15.1.5 INTERRUPTS

The ADC module allows for the ability to generate an

interrupt upon completion of an Analog-to-Digital

conversion. The ADC Interrupt Flag is the ADIF bit in

the PIR1 register. The ADC Interrupt Enable is the

ADIE bit in the PIE1 register. The ADIF bit must be

cleared in software.

This interrupt can be generated while the device is

operating or while in Sleep. If the device is in Sleep, the

interrupt will wake-up the device. Upon waking from

Sleep, the next instruction following the SLEEP instruc-

tion is always executed. If the user is attempting to

wake-up from Sleep and resume in-line code execu-

tion, the GIE and PEIE bits of the INTCON register

must be disabled. If the GIE and PEIE bits of the

INTCON register are enabled, execution will switch to

the Interrupt Service Routine.

15.2 ADC Operation

15.2.1 STARTING A CONVERSION

To enable the ADC module, the ADON bit of the

ADCON register must be set to a ‘1’. Setting the GO/

DONE bit of the ADCON register to a ‘1’ will start the

Analog-to-Digital conversion.

15.2.2 COMPLETION OF A CONVERSION

When the conversion is complete, the ADC module will:

• Clear the GO/DONE bit

• Set the ADIF Interrupt Flag bit

• Update the ADRES register with new conversion

result

15.2.3 TERMINATING A CONVERSION

If a conversion must be terminated before completion,

the GO/DONE bit can be cleared in software. The

ADRES register will be updated with the partially com-

plete Analog-to-Digital conversion sample. Incomplete

bits will match the last bit converted.

15.2.4 ADC OPERATION DURING SLEEP

The ADC module can operate during Sleep. This

requires the ADC clock source to be set to the FRC

option. When the FRC clock source is selected, the

ADC waits one additional instruction before starting the

conversion. This allows the SLEEP instruction to be

executed, which can reduce system noise during the

conversion. If the ADC interrupt is enabled, the device

will wake-up from Sleep when the conversion

completes. If the ADC interrupt is disabled, the ADC

module is turned off after the conversion completes,

although the ADON bit remains set.

When the ADC clock source is something other than

FRC, a SLEEP instruction causes the present conver-

sion to be aborted and the ADC module is turned off,

although the ADON bit remains set.

Note: The ADIF bit is set at the completion of

every conversion, regardless of whether

or not the ADC interrupt is enabled.

Note: The GO/DONE bit should not be set in the

same instruction that turns on the ADC.

Refer to Section 15.2.5 “A/D Conver-

sion Procedure”.

Note: A device Reset forces all registers to their

Reset state. Thus, the ADC module is

turned off and any pending conversion is

terminated.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 95

PIC10(L)F320/322

15.2.5 A/D CONVERSION PROCEDURE

This is an example procedure for using the ADC to

perform an Analog-to-Digital conversion:

1. Configure Port:

• Disable pin output driver (Refer to the TRIS

• Configure pin as analog (Refer to the ANSEL

2. Configure the ADC module:

• Select ADC conversion clock

• Select ADC input channel

• Turn on ADC module

3. Configure ADC interrupt (optional):

• Clear ADC interrupt flag

• Enable ADC interrupt

• Enable peripheral interrupt

• Enable global interrupt(1)

4. Wait the required acquisition time(2).

5. Start conversion by setting the GO/DONE bit.

6. Wait for ADC conversion to complete by one of

the following:

• Polling the GO/DONE bit

• Waiting for the ADC interrupt (interrupts

enabled)

7. Read ADC Result.

8. Clear the ADC interrupt flag (required if interrupt

is enabled).

Note 1: The global interrupt can be disabled if the

user is attempting to wake-up from Sleep

and resume in-line code execution.

2: Refer to Section 15.4 “A/D Acquisition

Requirements”.

PIC10(L)F320/322

DS41585A-page 96 Preliminary  2011 Microchip Technology Inc.

15.3 ADC Register Definitions

The following registers are used to control the

operation of the ADC.

R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0

ADCS<2:0> CHS<2:0> GO/DONE ADON

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-5 ADCS<2:0>: A/D Conversion Clock Select bits

111 =F

110 =FOSC/64

101 =F

OSC/16

100 =F

OSC/4

011 =F

010 =FOSC/32

001 =F

OSC/8

000 =F

OSC/2

bit 4-2 CHS<2:0>: Analog Channel Select bits

111 = FVR (Fixed Voltage Reference) Buffer Output(2)

110 = Temperature Indicator(1)

101 = Reserved. No channel connected.

100 = Reserved. No channel connected.

011 = Reserved. No channel connected.

010 =AN2

001 =AN1

000 =AN0

bit 1 GO/DONE: A/D Conversion Status bit

If ADON = 1:

1 = A/D conversion in progress (Setting this bit starts the A/D conversion)

0 = A/D conversion not in progress (This bit is automatically cleared by hardware when the A/D con-

version is complete.)

If this bit is cleared while a conversion is in progress, the conversion will stop and the results of the

conversion up to this point will be transferred to the result registers, but the ADIF interrupt flag bit will

not be set.

If ADON = 0:

0 = A/D conversion not in progress

bit 0 ADON: ADC Enable bit

1 = ADC is enabled

0 = ADC is disabled and consumes no operating current

Note 1: See Section 14.0 “Temperature Indicator Module” for more information.

2: See Section 12.0 “Fixed Voltage Reference (FVR)” for more information.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 97

PIC10(L)F320/322

R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u

ADRES<7:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-0 ADRES<7:0>: ADC Result Register bits

8-bit result

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DS41585A-page 98 Preliminary  2011 Microchip Technology Inc.

15.4 A/D Acquisition Requirements

For the ADC to meet its specified accuracy, the charge

holding capacitor (CHOLD) must be allowed to fully

charge to the input channel voltage level. The Analog

Input model is shown in Figure 15-3. The source

impedance (RS) and the internal sampling switch (RSS)

impedance directly affect the time required to charge

the capacitor CHOLD. The sampling switch (RSS)

impedance varies over the device voltage (VDD), refer

to Figure 15-3. The maximum recommended

impedance for analog sources is 10 k. As the

source impedance is decreased, the acquisition time

may be decreased. After the analog input channel is

selected (or changed), an A/D acquisition must be

done before the conversion can be started. To

calculate the minimum acquisition time, Equation 15-1

may be used. This equation assumes that 1/2 LSb error

is used (511 steps for the ADC). The 1/2 LSb error is

the maximum error allowed for the ADC to meet its

specified resolution.

EQUATION 15-1: ACQUISITION TIME EXAMPLE

TACQ Amplifier Settling Time Hold Capa citor Charging Time Temp erature Coefficient++=

TAMP TCTCOFF++=

2µs TCTemperature - 25°C0.05µs/°C++=

TCCHOLD RIC RSS RS++ ln(1/511)–=

10pF 1k



10k



++– ln(0.001957)=

1.12=µs

VAPPLIED 1e

Tc–

---------

–







VAPPLIED 11

2n1+

1–

--------------------------–





VAPPLIED 11

2n1+

1–

--------------------------

–





VCHOLD=

VAPPLIED 1e

TC–

----------

–







VCHOLD=

;[1] VCHOLD charged to within 1/2 lsb

;[2] VCHOLD char ge response to VAPPLIED

;combining [1] and [2]

The value for TC can be approximated with the following equations:

Solving for TC:

Therefore:

Temperature 50°C and external impedance of 10k



5.0V V DD=

Assumptions:

Note: Where n = number of bits of the ADC.

TACQ 2µs 1.12µs 50°C- 25°C0.05µs/°C++=

4.37µs=

Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out.

2: The charge holding capacitor (CHOLD) is not discharged after each conversion.

3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin

leakage specification.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 99

PIC10(L)F320/322

FIGURE 15-3: ANALOG INPUT MODEL

FIGURE 15-4: ADC TRANSFER FUNCTION

CPIN

Analog

5 pF

VDD

VT  0.6V

VT  0.6V I LEAKAGE(1)

RIC  1k

Sampling

Switch

SS Rss

CHOLD = 10 pF

VSS/VREF-

Sampling Switch

567891011

(k)

VDD

Legend:

CPIN

I LEAKAGE

RIC

CHOLD

= Input Capacitance

= Threshold Voltage

= Leakage current at the pin due to

= Interconnect Resistance

= Sampling Switch

= Sample/Hold Capacitance

various junctions

RSS

Note 1: Refer to Section 24.0 “Elect rical Specifications”.

RSS = Resistance of Sampling Switch

Input

FFh

FEh

ADC Output Code

FDh

FCh

03h

02h

01h

00h

Full-Scale

FBh

0.5 LSB

VREF-Zero-Scale

Transition VREF+

Transition

1.5 LSB

Full-Scale Range

Analog Input Voltage

PIC10(L)F320/322

DS41585A-page 100 Preliminary  2011 Microchip Technology Inc.

TABLE 15-2: SUMMARY OF REGISTERS ASSOCIATED WITH ADC

Name Bit 7 Bit 6 Bit 5 B it 4 B it 3 B it 2 Bit 1 Bit 0 Register

on Page

ADCON ADCS<2:0> CHS<2:0> GO/DONE ADON 96

ADRES ADRES<7:0> 97

ANSELA ————— ANSA2 ANSA1 ANSA0 78

FVRCON FVREN FVRRDY TSEN TSRNG ——ADFVR<1:0>86

INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 46

PIE1 —ADIE—NCO1IE CLC1IE —TMR2IE —47

PIR1 —ADIF—NCO1IF CLC1IF —TMR2IF —48

TRISA ————— TRISA2 TRISA1 TRISA0 77

Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends on condition. Shaded cells are not

used for ADC module.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 101

PIC10(L)F320/322

16.0 TIMER0 MODULE

The Timer0 module is an 8-bit timer/counter with the

following features:

• 8-bit timer/counter register (TMR0)

• 8-bit prescaler (independent of Watchdog Timer)

• Programmable internal or external clock source

• Programmable external clock edge selection

• Interrupt on overflow

Figure 16-1 is a block diagram of the Timer0 module.

16.1 Timer0 Operation

The Timer0 module can be used as either an 8-bit timer

or an 8-bit counter.

16.1.1 8-BIT TIMER MODE

The Timer0 module will increment every instruction

cycle, if used without a prescaler. 8-Bit Timer mode is

selected by clearing the T0CS bit of the OPTION_REG

When TMR0 is written, the increment is inhibited for

two instruction cycles immediately following the write.

16.1.2 8-BIT COUNTER MODE

In 8-Bit Counter mode, the Timer0 module will increment

on every rising or falling edge of the T0CKI pin.

8-Bit Counter mode using the T0CKI pin is selected by

setting the T0CS bit in the OPTION_REG register to ‘1’.

The rising or falling transition of the incrementing edge

for the external input source is determined by the T0SE

bit in the OPTION_REG register.

FIGURE 16-1: BLOCK DIAGRAM OF THE TIMER0 PRESCALER

Note: The value written to the TMR0 register

can be adjusted, in order to account for

the two instruction cycle delay when

TMR0 is written.

T0CKI

T0SE

TMR0

PS<2:0>

Data Bus

Set Flag bit TMR0IF

on Overflow

T0CS

8-bit

Prescaler

FOSC/4

PSA

SYNC

2 TCY

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DS41585A-page 102 Preliminary  2011 Microchip Technology Inc.

16.1.3 SOFTWARE PROGRAMMABLE

PRESCALER

A single software programmable prescaler is available

for use with Timer0. The prescaler assignment is

controlled by the PSA bit of the OPTION_REG register.

To assign the prescaler to Timer0, the PSA bit must be

cleared to a ‘0’.

There are 8 prescaler options for the Timer0 module

ranging from 1:2 to 1:256. The prescale values are

selectable via the PS<2:0> bits of the OPTION_REG

The prescaler is not readable or writable. When

assigned to the Timer0 module, all instructions writing to

the TMR0 register will clear the prescaler.

16.1.4 TIMER0 INTERRUPT

Timer0 will generate an interrupt when the TMR0

interrupt flag bit of the INTCON register is set every

time the TMR0 register overflows, regardless of

whether or not the Timer0 interrupt is enabled. The

TMR0IF bit can only be cleared in software. The Timer0

interrupt enable is the TMR0IE bit of the INTCON

16.1.5 8-BIT COUNTER MODE

SYNCHRONIZATION

When in 8-Bit Counter mode, the incrementing edge on

the T0CKI pin must be synchronized to the instruction

clock. Synchronization can be accomplished by

sampling the prescaler output on the Q2 and Q4 cycles

of the instruction clock. The high and low periods of the

external clocking source must meet the timing

requirements as shown in Section 24.0 “Electrical

Specifications”.

Note: The Timer0 interrupt cannot wake the

processor from Sleep since the timer is

frozen during Sleep.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 103

PIC10(L)F320/322

R/W-1/u R/W-1/u R/W-1/u R/W-1/u R/W-1/u R/W-1/u R/W-1/u R/W-1/u

WPUEN INTEDG T0CS T0SE PSA PS<2:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7 WPUEN: Weak Pull-up Enable bit(1)

1 = Weak pull-ups are disabled

0 = Weak pull-ups are enabled by individual PORT latch values

bit 6 INTEDG: Interrupt Edge Select bit

1 = Interrupt on rising edge of INT pin

0 = Interrupt on falling edge of INT pin

bit 5 T0CS: TMR0 Clock Source Select bit

1 = Transition on T0CKI pin

0 = Internal instruction cycle clock (FOSC/4)

bit 4 T0SE: TMR0 Source Edge Select bit

1 = Increment on high-to-low transition on T0CKI pin

0 = Increment on low-to-high transition on T0CKI pin

bit 3 PSA: Prescaler Assignment bit

1 = Prescaler is inactive and has no effect on the Timer 0 module

0 = Prescaler is assigned to the Timer0 module

bit 2-0 PS<2:0>: Prescaler Rate Select bits

Note 1: WPUEN does not disable the pull-up for the MCLR input when MCLR = 1.

000

001

010

011

100

101

110

111

1 : 2

1 : 4

1 : 8

1 : 16

1 : 32

1 : 64

1 : 128

1 : 256

Bit Value TMR0 Rate

TABLE 16-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on

Page

INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 46

OPTION_REG WPUEN INTEDG T0CS T0SE PSA PS<2:0> 103

TMR0 Timer0 module Register 46

TRISA — — — — — TRISA2 TRISA1 TRISA0 77

Legend: – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the

Timer0 module.

PIC10(L)F320/322

DS41585A-page 104 Preliminary  2011 Microchip Technology Inc.

NOTES:

 2011 Microchip Technology Inc. Preliminary DS41585A-page 105

PIC10(L)F320/322

17.0 TIMER2 MODULE

The Timer2 module is an 8-bit timer with the following

features:

• 8-bit timer register (TMR2)

• 8-bit period register (PR2)

• Interrupt on TMR2 match with PR2

• Software programmable prescaler (1:1, 1:4, 1:64)

• Software programmable postscaler (1:1 to 1:16)

See Figure 17-1 for a block diagram of Timer2.

17.1 Timer2 Operation

The clock input to the Timer2 module is the system

instruction clock (FOSC/4). The clock is fed into the

Timer2 prescaler, which has prescale options of 1:1,

1:4 or 1:64. The output of the prescaler is then used to

increment the TMR2 register.

The values of TMR2 and PR2 are constantly compared

to determine when they match. TMR2 will increment

from 00h until it matches the value in PR2. When a

match occurs, two things happen:

• TMR2 is reset to 00h on the next increment cycle.

• The Timer2 postscaler is incremented.

The match output of the Timer2/PR2 comparator is

then fed into the Timer2 postscaler. The postscaler has

postscale options of 1:1 to 1:16 inclusive. The output of

the Timer2 postscaler is used to set the TMR2IF

interrupt flag bit in the PIR1 register.

The TMR2 and PR2 registers are both fully readable

and writable. On any Reset, the TMR2 register is set to

00h and the PR2 register is set to FFh.

Timer2 is turned on by setting the TMR2ON bit in the

T2CON register to a ‘1’. Timer2 is turned off by clearing

the TMR2ON bit to a ‘0’.

The Timer2 prescaler is controlled by the T2CKPS bits

in the T2CON register. The Timer2 postscaler is

controlled by the TOUTPS bits in the T2CON register.

The prescaler and postscaler counters are cleared

when:

• A write to TMR2 occurs.

• A write to T2CON occurs.

• Any device Reset occurs (Power-on Reset, MCLR

Reset, Watchdog Timer Reset, or Brown-out

Reset).

FIGURE 17-1: TIMER2 BLOCK DIAGRAM

Note: TMR2 is not cleared when T2CON is

written.

Comparator

TMR2 Sets Flag

TMR2

Output

Reset

Postscaler

Prescaler

PR2

FOSC/4

1:1 to 1:16

1:1, 1:4, 1:64

bit TMR2IF

TOUTPS<3:0>

T2CKPS<1:0>

PIC10(L)F320/322

DS41585A-page 106 Preliminary  2011 Microchip Technology Inc.

U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0

— TOUTPS<3:0> TMR2ON T2CKPS<1:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7 Unimplemented: Read as ‘0’

bit 6-3 TOUTPS<3:0>: Timer2 Output Postscaler Select bits

1111 = 1:16 Postscaler

1110 = 1:15 Postscaler

1101 = 1:14 Postscaler

1100 = 1:13 Postscaler

1011 = 1:12 Postscaler

1010 = 1:11 Postscaler

1001 = 1:10 Postscaler

1000 =1:9 Postscaler

0111 =1:8 Postscaler

0110 =1:7 Postscaler

0101 =1:6 Postscaler

0100 =1:5 Postscaler

0011 =1:4 Postscaler

0010 =1:3 Postscaler

0001 =1:2 Postscaler

0000 =1:1 Postscaler

bit 2 TMR2ON: Timer2 On bit

1 = Timer2 is on

0 = Timer2 is off

bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits

1x = Prescaler is 64

01 = Prescaler is 4

00 = Prescaler is 1

TABLE 17-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2

Name B it 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bi t 0 Register on

Page

INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 46

PIE1 —ADIE —NCO1IE CLC1IE —TMR2IE —47

PIR1 —ADIF —NCO1IF CLC1IF —TMR2IF —48

PR2 Timer2 module Period Register 105

TMR2 Timer2 module Register 105

T2CON — TOUTPS<3:0> TMR2ON T2CKPS<1:0> 106

Legend: x = unknown, u = unchanged, - = unimplemented read as ‘0’. Shaded cells are not used for Timer2 module.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 107

PIC10(L)F320/322

18.0 PULSE-WIDTH MODULATION

(PW M ) MODULE

The PWM module generates a Pulse-Width Modulated

signal determined by the duty cycle, period, and

resolution that are configured by the following registers:

•PR2

•T2CON

• PWMxDCH

• PWMxDCL

•PWMxCON

Figure 18-1 shows a simplified block diagram of PWM

operation.

Figure 18-2 shows a typical waveform of the PWM

signal.

FIGURE 18-1: SI MPLIFIED PWM BLOCK DIAGRAM

For a step-by-step procedure on how to set up this

module for PWM operation, refer to Section 18.1.9

“Setup for PWM Operation using PWMx Pins”.

FIGURE 18-2: PWM OUT P UT

PWMxDCH

Comparator

TMR2

Comparator

PR2

(1)

Duty Cycle registers PWMxDCL<7:6>

Clear Timer,

PWMx pin and

latch Duty Cycle

Note 1: 8-bit timer is concatenated with the two Least Significant bits of 1/FOSC adjusted by the Timer2

prescaler to create a 10-bit time base.

Latched

(Not visible to user)

Output Polarity (PWMxPOL)

TMR2 Module

PWMxOUT

to other peripherals: CLC and CWG

PWMx

Output Enable (PWMxOE)

TRIS Control

Period

Pulse Width

TMR2 = 0

TMR2 =

TMR2 = PR2

PWMxDCH<7:0>:PWMxDCL<7:6>

PIC10(L)F320/322

DS41585A-page 108 Preliminary  2011 Microchip Technology Inc.

18.1 PWMx Pin Configuration

All PWM outputs are multiplexed with the PORT data

latch. The user must configure the pins as outputs by

clearing the associated TRIS bits.

18.1.1 FUNDAMENTAL OPERATION

The PWM module produces a 10-bit resolution output.

Timer2 and PR2 set the period of the PWM. The

PWMxDCL and PWMxDCH registers configure the

duty cycle. The period is common to all PWM modules,

whereas the duty cycle is independently controlled.

All PWM outputs associated with Timer2 are set when

TMR2 is cleared. Each PWMx is cleared when TMR2

is equal to the value specified in the corresponding

PWMxDCH (8 MSb) and PWMxDCL<7:6> (2 LSb)

registers. When the value is greater than or equal to

PR2, the PWM output is never cleared (100% duty

cycle).

18.1.2 PWM OUTPUT POLARITY

The output polarity is inverted by setting the PWMxPOL

bit of the PWMxCON register.

18.1.3 PWM PERIOD

The PWM period is specified by the PR2 register of

Timer2. The PWM period can be calculated using the

formula of Equation 18-1.

EQUATION 18-1: PWM PERIOD

When TMR2 is equal to PR2, the following three events

occur on the next increment cycle:

•TMR2 is cleared

• The PWM output is active. (Exception: When the

PWM duty cycle = 0%, the PWM output will

remain inactive.)

• The PWMxDCH and PWMxDCL register values

are latched into the buffers.

18.1.4 PWM DUTY CYCLE

The PWM duty cycle is specified by writing a 10-bit value

to the PWMxDCH and PWMxDCL register pair. The

PWMxDCH register contains the eight MSbs and the

PWMxDCL<7:6>, the two LSbs. The PWMxDCH and

PWMxDCL registers can be written to at any time.

Equation 18-2 is used to calculate the PWM pulse

width.

Equation 18-3 is used to calculate the PWM duty cycle

ratio.

EQUATION 18-2: PULSE WIDTH

EQUATION 18-3: DUTY CYCLE RATIO

The 8-bit timer TMR2 register is concatenated with the

two Least Significant bits of 1/FOSC, adjusted by the

Timer2 prescaler to create the 10-bit time base. The

system clock is used if the Timer2 prescaler is set to 1:1.

Note: Clearing the PWMxOE bit will relinquish

control of the PWMx pin.

Note: The Timer2 postscaler is not used in the

determination of the PWM frequency. The

postscaler could be used to have a servo

update rate at a different frequency than the

PWM output.

Note: The PWMxDCH and PWMxDCL registers

are double buffered. The buffers are updated

when Timer2 matches PR2. Care should be

taken to update both registers before the

timer match occurs.

PWM Period PR21+4TOSC =

(TM R2 Prescale Value)

Note: T

OSC = 1/FOSC

Note: The Timer2 postscaler has no effect on the

PWM operation.

Pulse Width PWMxDCH:PWMxDCL<7:6>



TOSC



(TMR2 Prescale Value)

Note: TOSC = 1/FOSC

Duty Cycle Ratio PWMxDCH:PWMxDCL<7:6>

4 PR2 1+

-----------------------------------------------------------------------------------=

 2011 Microchip Technology Inc. Preliminary DS41585A-page 109

PIC10(L)F320/322

18.1.5 PWM RESOLUTION

The resolution determines the number of available duty

cycles for a given period. For example, a 10-bit resolution

will result in 1024 discrete duty cycles, whereas an 8-bit

resolution will result in 256 discrete duty cycles.

The maximum PWM resolution is 10 bits when PR2 is

255. The resolution is a function of the PR2 register

value as shown by Equation 18-4.

EQUATION 18-4: PWM RESOLUTION

18.1.6 OPERATION IN SLEEP MODE

In Sleep mode, the TMR2 register will not increment

and the state of the module will not change. If the

PWMx pin is driving a value, it will continue to drive that

value. When the device wakes up, TMR2 will continue

from its previous state.

18.1.7 CHANGES IN SYSTEM CLOCK

FREQUENCY

The PWM frequency is derived from the system clock

frequency (FOSC). Any changes in the system clock fre-

quency will result in changes to the PWM frequency.

Refer to Section 4.0 “Oscillator Module” for

additional details.

18.1.8 EFFECTS OF RESET

Any Reset will force all ports to Input mode and the

PWM registers to their Reset states.

Note: If the pulse width value is greater than the

period the assigned PWM pin(s) will

remain unchanged.

Resolution 4PR2 1+log 2log

------------------------------------------ bits=

TABLE 18-1: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz)

PWM Frequency 0.31 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz

Timer Prescale (1, 4, 64) 64 4 1 1 1 1

PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17

Maximum Resolution (bits) 10 10 10 8 7 6.6

TABLE 18-2: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz)

PWM Frequency 0.31 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz

Timer Prescale (1, 4, 64) 64 4 1 1 1 1

PR2 Value 0x65 0x65 0x65 0x19 0x0C 0x09

Maximum Resolution (bits) 8 8 8 6 5 5

PIC10(L)F320/322

DS41585A-page 110 Preliminary  2011 Microchip Technology Inc.

18.1.9 SETUP FOR PWM OPERATION

USING PWMx PINS

The following steps should be taken when configuring

the module for PWM operation using the PWMx pins:

1. Disable the PWMx pin output driver(s) by setting

the associated TRIS bit(s).

2. Clear the PWMxCON register.

3. Load the PR2 register with the PWM period value.

4. Clear the PWMxDCH register and bits <7:6> of

the PWMxDCL register.

5. Configure and start Timer2:

• Clear the TMR2IF interrupt flag bit of the

PIR1 register. See Note below.

• Configure the T2CKPS bits of the T2CON

• Enable Timer2 by setting the TMR2ON bit of

the T2CON register.

6. Enable PWM output pin and wait until Timer2

overflows, TMR2IF bit of the PIR1 register is set.

See Note below.

7. Enable the PWMx pin output driver(s) by clear-

ing the associated TRIS bit(s) and setting the

PWMxOE bit of the PWMxCON register.

8. Configure the PWM module by loading the

PWMxCON register with the appropriate values.

Note 1: In order to send a complete duty cycle

and period on the first PWM output, the

above steps must be followed in the order

given. If it is not critical to start with a

complete PWM signal, then move Step 8

to replace Step 4.

2: For operation with other peripherals only,

disable PWMx pin outputs.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 111

PIC10(L)F320/322

18.2 PWM Register Definitions

R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 U-0 U-0 U-0 U-0

PWMxEN PWMxOE PWMxOUT PWMxPOL — — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7 PWMxEN: PWM Module Enable bit

1 = PWM module is enabled

0 = PWM module is disabled

bit 6 PWMxOE: PWM Module Output Enable bit

1 = Output to PWMx pin is enabled

0 = Output to PWMx pin is disabled

bit 5 PWMxOUT: PWM Module Output Value bit

bit 4 PWMxPOL: PWMx Output Polarity Select bit

1 = PWM output is active low.

0 = PWM output is active high.

bit 3-0 Unimplemented: Read as ‘0’

PIC10(L)F320/322

DS41585A-page 112 Preliminary  2011 Microchip Technology Inc.

R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u

PWMxDCH<7:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-0 PWMxDCH<7:0>: PWM Duty Cycle Most Significant bits

These bits are the MSbs of the PWM duty cycle. The two LSbs are found in the PWMxDCL Register.

R/W-x/u R/W-x/u U-0 U-0 U-0 U-0 U-0 U-0

PWMxDCL<7:6> — — — — — —

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-6 PWMxDCL<7:6>: PWM Duty Cycle Least Significant bits

These bits are the LSbs of the PWM duty cycle. The MSbs are found in the PWMxDCH Register.

bit 5-0 Unimplemented: Read as ‘0’

TABLE 18-3: SUMMARY OF REGISTERS ASSOCIATED WITH PWM

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register

on Page

ANSELA — — — — — ANSA2 ANSA1 ANSA0 78

LATA — — — — — LATA2 LATA1 LATA0 78

PORTA — — — — RA3 RA2 RA1 RA0 77

PR2 Timer2 module Period Register 105

PWM1CON PWM1EN PWM1OE PWM1OUT PWM1POL — — — — 111

PWM1DCH PWM1DCH<7:0> 112

PWM1DCL PWM1DCL<7:6> — — — — — — 112

PWM2CON PWM2EN PWM2OE PWM2OUT PWM2POL — — — — 111

PWM2DCH PWM2DCH<7:0> 112

PWM2DCL PWM2DCL<7:6> — — — — — — 112

T2CON —TOUTPS<3:0> TMR2ON T2CKPS<1:0> 106

TMR2 Timer2 module Register 105

TRISA — — — — — TRISA2 TRISA1 TRISA0 77

Legend: - = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the PWM.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 113

PIC10(L)F320/322

19.0 CONFIGURABLE LOGIC CELL

(CLC)

The Configurable Logic Cell (CLCx) provides program-

mable logic that operates outside the speed limitations

of software execution. The logic cell selects any combi-

nation of the eight input signals and through the use of

configurable gates reduces the selected inputs to four

logic lines that drive one of eight selectable single-out-

put logic functions.

Input sources are a combination of the following:

• Two I/O pins

• Internal clocks

• Peripherals

• Register bits

The output can be directed internally to peripherals and

to an output pin.

Refer to Figure 19-1 for a simplified diagram showing

signal flow through the CLCx.

Possible configurations include:

• Combinatorial Logic

-AND

-NAND

- AND-OR

- AND-OR-INVERT

-OR-XOR

-OR-XNOR

• Latches

-S-R

- Clocked D with Set and Reset

- Transparent D with Set and Reset

- Clocked J-K with Reset

FIGURE 19-1: CLCx SIMPLIFIED BLOCK DIAGRAM

lcxg1

lcxg2

lcxg3

lcxg4

Interrupt

det

Logic

Function

Input Data Selection Gates

CLCx

LCxOE

lcxq

LCxPOL

LCxOUT

LCxMODE<2:0>

lcx_out

CLCxIN[0]

CLCxIN[1]

CLCxIN[2]

CLCxIN[3]

CLCxIN[4]

CLCxIN[5]

CLCxIN[6]

CLCxIN[7]

TRIS Control

Interrupt

det

LCxINTP

LCxINTN CLCxIF

sets

LCxEN

See Figure 19-2

flag

See Figure 19-3

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DS41585A-page 114 Preliminary  2011 Microchip Technology Inc.

19.1 CLCx Setup

Programming the CLCx module is performed by config-

uring the four stages in the logic signal flow. The four

stages are:

•Data selection

• Data gating

• Logic function selection

• Output polarity

Each stage is setup at run time by writing to the corre-

sponding CLCx Special Function Registers. This has

the added advantage of permitting logic reconfiguration

on-the-fly during program execution.

19.1.1 DATA SELECTION

There are eight signals available as inputs to the con-

figurable logic. Four 8-input multiplexers are used to

select the inputs to pass on to the next stage.

Data inputs are selected with the CLCxSEL0 and

CLCxSEL1 registers (Register 19-3 and Register 19-4,

respectively).

Data selection is through four multiplexers as indicated

on the left side of Figure 19-2. Data inputs in the figure

are identified by a generic numbered input name.

Table 19-1 correlates the generic input name to the

actual signal for each CLC module. The columns

labeled lcxd1 through lcxd4 indicate the MUX output for

the selected data input. D1S through D4S are

abbreviations for the MUX select input codes:

LCxD1S<2:0> through LCxD4S<2:0>, respectively.

Selecting a data input in a column excludes all other

inputs in that column.

19.1.2 DATA GATING

Outputs from the input multiplexers are directed to the

desired logic function input through the data gating

stage. Each data gate can direct any combination of the

four selected inputs.

The gate stage is more than just signal direction. The gate

can be configured to direct each input signal as inverted

or non-inverted data. Directed signals are ANDed

together in each gate. The output of each gate can be

inverted before going on to the logic function stage.

The gating is in essence a 1-to-4 input AND/NAND/OR/

NOR gate. When every input is inverted and the output

is inverted, the gate is an OR of all enabled data inputs.

When the inputs and output are not inverted, the gate

is an AND or all enabled inputs.

Table 19-2 summarizes the basic logic that can be

obtained in gate 1 by using the gate logic select bits.

The table shows the logic of four input variables, but

each gate can be configured to use less than four. If no

inputs are selected, the output will be zero or one,

depending on the gate output polarity bit.

It is possible (but not recommended) to select both the

true and negated values of an input. When this is done,

the gate output is zero, regardless of the other inputs,

but may emit logic glitches (transient-induced pulses). If

the output of the channel must be zero or one, the

recommended method is to set all gate bits to zero and

use the gate polarity bit to set the desired level.

Data gating is configured with the logic gate select

registers as follows:

• Gate 1: CLCxGLS0 (Register 19-5)

• Gate 2: CLCxGLS1 (Register 19-6)

• Gate 3: CLCxGLS2 (Register 19-7)

• Gate 4: CLCxGLS3 (Register 19-8)

numbers because other variations of this module have

multiple gate selections in the same register.

Data gating is indicated in the right side of Figure 19-2.

Only one gate is shown in detail. The remaining three

gates are configured identically with the exception that

the data enables correspond to the enables for that gate.

Note: Data selections are undefined at power-up.

TABLE 19-1: CLCx DATA INPUT

SELECTION

Data Input lcxd1

D1S lcxd2

D2S lcxd3

D3S lcxd4

D4S CLC 1

CLCxIN[0] 000 000 000 000 CLCx

CLCxIN[1] 001 001 001 001 CLCxIN1

CLCxIN[2] 010 010 010 010 CLCxIN2

CLCxIN[3] 011 011 011 011 PWM1

CLCxIN[4] 100 100 100 100 PWM2

CLCxIN[5] 101 101 101 101 NCOx

CLCxIN[6] 110 110 110 110 FOSC

CLCxIN[7] 111 111 111 111 LFINTOSC

Note: Data gating is undefined at power-up.

TABLE 19-2: DATA GATING LOGIC

CLCxGLS0 LCxGyPOL Gate Logic

0x55 1AND

0x55 0NAND

0xAA 1NOR

0xAA 0OR

0x00 0Logic 0

0x00 1Logic 1

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PIC10(L)F320/322

19.1.3 LOGIC FUNCTION

There are eight available logic functions including:

• AND-OR

•OR-XOR

•AND

• S-R Latch

• D Flip-Flop with Set and Reset

• D Flip-Flop with Reset

• J-K Flip-Flop with Reset

• Transparent Latch with Set and Reset

Logic functions are shown in Figure 19-3. Each logic

function has four inputs and one output. The four inputs

are the four data gate outputs of the previous stage. The

output is fed to the inversion stage and from there to other

peripherals, an output pin, and back to the CLCx itself.

19.1.4 OUTPUT POLARITY

The last stage in the configurable logic cell is the output

polarity. Setting the LCxPOL bit of the CLCxCON reg-

ister inverts the output signal from the logic stage.

Changing the polarity while the interrupts are enabled

will cause an interrupt for the resulting output transition.

19.1.5 CLCX SETUP STEPS

The following steps should be followed when setting up

the CLCx:

• Disable CLCx by clearing the LCxEN bit.

• Select desired inputs using CLCxSEL0 and

CLCxSEL1 registers (See Table 19-1).

• Clear any associated ANSEL bits.

• Set all TRIS bits associated with inputs.

• Clear all TRIS bits associated with outputs.

• Enable the chosen inputs through the four gates

using CLCxGLS0, CLCxGLS1, CLCxGLS2, and

CLCxGLS3 registers.

• Select the gate output polarities with the

LCxPOLy bits of the CLCxPOL register.

• Select the desired logic function with the

LCxMODE<2:0> bits of the CLCxCON register.

• Select the desired polarity of the logic output with

the LCxPOL bit of the CLCxPOL register. (This

step may be combined with the previous gate out-

put polarity step).

• If driving the CLCx pin, set the LCxOE bit of the

CLCxCON register and also clear the TRIS bit

corresponding to that output.

• If interrupts are desired, configure the following

bits:

- Set the LCxINTP bit in the CLCxCON register

for rising event.

- Set the LCxINTN bit in the CLCxCON

- Set the CLCxIE bit of the associated PIE

registers.

- Set the GIE and PEIE bits of the INTCON

• Enable the CLCx by setting the LCxEN bit of the

CLCxCON register.

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19.2 CLCx Interrupts

An interrupt will be generated upon a change in the

output value of the CLCx when the appropriate interrupt

enables are set. A rising edge detector and a falling

edge detector are present in each CLC for this purpose.

TheCLCxIF bit of the associated PIR registers will be

set when either edge detector is triggered and its asso-

ciated enable bit is set. The LCxINTP enables rising

edge interrupts and the LCxINTN bit enables falling

edge interrupts. Both are located in the CLCxCON reg-

ister.

To fully enable the interrupt, set the following bits:

• LCxON bit of the CLCxCON register

• CLCxIE bit of the associated PIE registers

• LCxINTP bit of the CLCxCON register (for a rising

edge detection)

• LCxINTN bit of the CLCxCON register (for a falling

edge detection)

• PEIE and GIE bits of the INTCON register

The CLCxIF bit of the associated PIR registers must be

cleared in software as part of the interrupt service. If

another edge is detected while this flag is being

cleared, the flag will still be set at the end of the

sequence.

19.3 Effects of a Reset

The CLCxCON register is cleared to zero as the result

of a Reset. All other selection and gating values remain

unchanged.

19.4 Operation During Sleep

The selection, gating, and logic functions are not

affected by Sleep. Operation will continue provided that

the source signals are also not affected by Sleep.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 117

PIC10(L)F320/322

FIGURE 19-2: INPUT DATA SELECTION AND GATING

lcxg1

LCxG1POL

Data GATE 1

LCxD1G1T

lcxg2

lcxg3

lcxg4

Data GATE 2

Data GATE 3

Data GATE 4

LCxD1G1N

LCxD2G1T

LCxD2G1N

LCxD3G1T

LCxD3G1N

LCxD4G1T

LCxD4G1N

LCxD1S<2:0>

LCxD2S<2:0>

LCxD3S<2:0>

LCxD4S<2:0>

CLCxIN[0]

CLCxIN[1]

CLCxIN[2]

CLCxIN[3]

CLCxIN[4]

CLCxIN[5]

CLCxIN[6]

CLCxIN[7]

000

111

000

111

000

111

000

111

CLCxIN[0]

CLCxIN[1]

CLCxIN[2]

CLCxIN[3]

CLCxIN[4]

CLCxIN[5]

CLCxIN[6]

CLCxIN[7]

CLCxIN[0]

CLCxIN[1]

CLCxIN[2]

CLCxIN[3]

CLCxIN[4]

CLCxIN[5]

CLCxIN[6]

CLCxIN[7]

CLCxIN[0]

CLCxIN[1]

CLCxIN[2]

CLCxIN[3]

CLCxIN[4]

CLCxIN[5]

CLCxIN[6]

CLCxIN[7]

Data Selection

Note: All controls are undefined at power-up.

lcxd1T

lcxd1N

lcxd2T

lcxd2N

lcxd3T

lcxd3N

lcxd4T

lcxd4N

(Same as Data GATE 1)

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DS41585A-page 118 Preliminary  2011 Microchip Technology Inc.

FIGURE 19-3: P ROGRAMM ABLE LOGIC FUNCTIONS

lcxg1

lcxg2

lcxg3

lcxg4

lcxq

lcxg1

lcxg2

lcxg3

lcxg4

lcxq

lcxg1

lcxg2

lcxg3

lcxg4

lcxq

lcxg1

lcxg2

lcxg3

lcxg4

lcxq

lcxg1

lcxg2

lcxg3

lcxg4

lcxq

lcxg2

lcxg3

lcxg4

lcxq

lcxg1

lcxg2

lcxg3

lcxg4

lcxq

lcxg1

lcxg3

lcxq

lcxg4

lcxg2

LCxMODE<2:0>= 000

LCxMODE<2:0>= 010

LCxMODE<2:0>= 001

LCxMODE<2:0>= 011

LCxMODE<2:0>= 100

LCxMODE<2:0>= 110

LCxMODE<2:0>= 101

LCxMODE<2:0>= 111

AND - OR OR - XOR

4-Input AND S-R Latch

1-Input D Flip-Flop with S and R 2-Input D Flip-Flop with R

1-Input Transparent Latch with S and R

J-K Flip-Flop with R

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19.5 CLC Control Registers

R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0

LCxEN LCxOE LCxOUT LCxINTP LCxINTN LCxMODE<2:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Reset

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7 LCxEN: Configurable Logic Cell Enable bit

1 = Configurable Logic Cell is enabled and mixing input signals

0 = Configurable Logic Cell is disabled and has logic zero output

bit 6 LCxOE: Configurable Logic Cell Output Enable bit

1 = Configurable Logic Cell port pin output enabled

0 = Configurable Logic Cell port pin output disabled

bit 5 LCxOUT: Configurable Logic Cell Data Output bit

Read-only: logic cell output data, after LCxPOL; sampled from lcx_out wire.

bit 4 LCxINTP: Configurable Logic Cell Positive Edge Going Interrupt Enable bit

1 = CLCxIF will be set when a rising edge occurs on lcx_out

0 = CLCxIF will not be set

bit 3 LCxINTN: Configurable Logic Cell Negative Edge Going Interrupt Enable bit

1 = CLCxIF will be set when a falling edge occurs on lcx_out

0 = CLCxIF will not be set

bit 2-0 LCxMODE<2:0>: Configurable Logic Cell Functional Mode bits

111 = Cell is 1-input transparent latch with S and R

110 = Cell is J-K Flip-Flop with R

101 = Cell is 2-input D Flip-Flop with R

100 = Cell is 1-input D Flip-Flop with S and R

011 = Cell is S-R latch

010 = Cell is 4-input AND

001 =Cell is OR-XOR

000 = Cell is AND-OR

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R/W-x/u U-0 U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u

LCxPOL — — — LCxG4POL LCxG3POL LCxG2POL LCxG1POL

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Reset

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7 LCxPOL: LCOUT Polarity Control bit

1 = The output of the logic cell is inverted

0 = The output of the logic cell is not inverted

bit 6-4 Unimplemented: Read as ‘0’

bit 3 LCxG4POL: Gate 4 Output Polarity Control bit

1 = The output of gate 4 is inverted when applied to the logic cell

0 = The output of gate 4 is not inverted

bit 2 LCxG3POL: Gate 3 Output Polarity Control bit

1 = The output of gate 3 is inverted when applied to the logic cell

0 = The output of gate 3 is not inverted

bit 1 LCxG2POL: Gate 2 Output Polarity Control bit

1 = The output of gate 2 is inverted when applied to the logic cell

0 = The output of gate 2 is not inverted

bit 0 LCxG1POL: Gate 1 Output Polarity Control bit

1 = The output of gate 1 is inverted when applied to the logic cell

0 = The output of gate 1 is not inverted

 2011 Microchip Technology Inc. Preliminary DS41585A-page 121

PIC10(L)F320/322

U-0 R/W-x/u R/W-x/u R/W-x/u U-0 R/W-x/u R/W-x/u R/W-x/u

— LCxD2S<2:0> — LCxD1S<2:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7 Unimplemented: Read as ‘0’

bit 6-4 LCxD2S<2:0>: Input Data 2 Selection Control bits(1)

111 = CLCxIN[7] is selected for lcxd2.

110 = CLCxIN[6] is selected for lcxd2.

101 = CLCxIN[5] is selected for lcxd2.

100 = CLCxIN[4] is selected for lcxd2.

011 = CLCxIN[3] is selected for lcxd2.

010 = CLCxIN[2] is selected for lcxd2.

001 = CLCxIN[1] is selected for lcxd2.

000 = CLCxIN[0] is selected for lcxd2.

bit 3 Unimplemented: Read as ‘0’

bit 2-0 LCxD1S<2:0>: Input Data 1 Selection Control bits(1)

111 = CLCxIN[7] is selected for lcxd1.

110 = CLCxIN[6] is selected for lcxd1.

101 = CLCxIN[5] is selected for lcxd1.

100 = CLCxIN[4] is selected for lcxd1.

011 = CLCxIN[3] is selected for lcxd1.

010 = CLCxIN[2] is selected for lcxd1.

001 = CLCxIN[1] is selected for lcxd1.

000 = CLCxIN[0] is selected for lcxd1.

Note 1: See Table 19-1 for signal names associated with inputs.

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DS41585A-page 122 Preliminary  2011 Microchip Technology Inc.

U-0 R/W-x/u R/W-x/u R/W-x/u U-0 R/W-x/u R/W-x/u R/W-x/u

— LCxD4S<2:0> — LCxD3S<2:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7 Unimplemented: Read as ‘0’

bit 6-4 LCxD4S<2:0>: Input Data 4 Selection Control bits(1)

111 = CLCxIN[7] is selected for lcxd4.

110 = CLCxIN[6] is selected for lcxd4.

101 = CLCxIN[5] is selected for lcxd4

100 = CLCxIN[4] is selected for lcxd4.

011 = CLCxIN[3] is selected for lcxd4.

010 = CLCxIN[2] is selected for lcxd4.

001 = CLCxIN[1] is selected for lcxd4.

000 = CLCxIN[0] is selected for lcxd4.

bit 3 Unimplemented: Read as ‘0’

bit 2-0 LCxD3S<2:0>: Input Data 3 Selection Control bits(1)

111 = CLCxIN[7] is selected for lcxd3.

110 = CLCxIN[6] is selected for lcxd3.

101 = CLCxIN[5] is selected for lcxd3.

100 = CLCxIN[4] is selected for lcxd3.

011 = CLCxIN[3] is selected for lcxd3.

010 = CLCxIN[2] is selected for lcxd3.

001 = CLCxIN[1] is selected for lcxd3.

000 = CLCxIN[0] is selected for lcxd3.

Note 1: See Table 19-1 for signal names associated with inputs.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 123

PIC10(L)F320/322

R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u

LCxG1D4T LCxG1D4N LCxG1D3T LCxG1D3N LCxG1D2T LCxG1D2N LCxG1D1T LCxG1D1N

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7 LCxG1D4T: Gate 1 Data 4 True (non-inverted) bit

1 = lcxd4T is gated into lcxg1

0 = lcxd4T is not gated into lcxg1

bit 6 LCxG1D4N: Gate 1 Data 4 Negated (inverted) bit

1 = lcxd4N is gated into lcxg1

0 = lcxd4N is not gated into lcxg1

bit 5 LCxG1D3T: Gate 1 Data 3 True (non-inverted) bit

1 = lcxd3T is gated into lcxg1

0 = lcxd3T is not gated into lcxg1

bit 4 LCxG1D3N: Gate 1 Data 3 Negated (inverted) bit

1 = lcxd3N is gated into lcxg1

0 = lcxd3N is not gated into lcxg1

bit 3 LCxG1D2T: Gate 1 Data 2 True (non-inverted) bit

1 = lcxd2T is gated into lcxg1

0 = lcxd2T is not gated into lcxg1

bit 2 LCxG1D2N: Gate 1 Data 2 Negated (inverted) bit

1 = lcxd2N is gated into lcxg1

0 = lcxd2N is not gated into lcxg1

bit 1 LCxG1D1T: Gate 1 Data 1 True (non-inverted) bit

1 = lcxd1T is gated into lcxg1

0 = lcxd1T is not gated into lcxg1

bit 0 LCxG1D1N: Gate 1 Data 1 Negated (inverted) bit

1 = lcxd1N is gated into lcxg1

0 = lcxd1N is not gated into lcxg1

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R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u

LCxG2D4T LCxG2D4N LCxG2D3T LCxG2D3N LCxG2D2T LCxG2D2N LCxG2D1T LCxG2D1N

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7 LCxG2D4T: Gate 2 Data 4 True (non-inverted) bit

1 = lcxd4T is gated into lcxg2

0 = lcxd4T is not gated into lcxg2

bit 6 LCxG2D4N: Gate 2 Data 4 Negated (inverted) bit

1 = lcxd4N is gated into lcxg2

0 = lcxd4N is not gated into lcxg2

bit 5 LCxG2D3T: Gate 2 Data 3 True (non-inverted) bit

1 = lcxd3T is gated into lcxg2

0 = lcxd3T is not gated into lcxg2

bit 4 LCxG2D3N: Gate 2 Data 3 Negated (inverted) bit

1 = lcxd3N is gated into lcxg2

0 = lcxd3N is not gated into lcxg2

bit 3 LCxG2D2T: Gate 2 Data 2 True (non-inverted) bit

1 = lcxd2T is gated into lcxg2

0 = lcxd2T is not gated into lcxg2

bit 2 LCxG2D2N: Gate 2 Data 2 Negated (inverted) bit

1 = lcxd2N is gated into lcxg2

0 = lcxd2N is not gated into lcxg2

bit 1 LCxG2D1T: Gate 2 Data 1 True (non-inverted) bit

1 = lcxd1T is gated into lcxg2

0 = lcxd1T is not gated into lcxg2

bit 0 LCxG2D1N: Gate 2 Data 1 Negated (inverted) bit

1 = lcxd1N is gated into lcxg2

0 = lcxd1N is not gated into lcxg2

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PIC10(L)F320/322

R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u

LCxG3D4T LCxG3D4N LCxG3D3T LCxG3D3N LCxG3D2T LCxG3D2N LCxG3D1T LCxG3D1N

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7 LCxG3D4T: Gate 3 Data 4 True (non-inverted) bit

1 = lcxd4T is gated into lcxg3

0 = lcxd4T is not gated into lcxg3

bit 6 LCxG3D4N: Gate 3 Data 4 Negated (inverted) bit

1 = lcxd4N is gated into lcxg3

0 = lcxd4N is not gated into lcxg3

bit 5 LCxG3D3T: Gate 3 Data 3 True (non-inverted) bit

1 = lcxd3T is gated into lcxg3

0 = lcxd3T is not gated into lcxg3

bit 4 LCxG3D3N: Gate 3 Data 3 Negated (inverted) bit

1 = lcxd3N is gated into lcxg3

0 = lcxd3N is not gated into lcxg3

bit 3 LCxG3D2T: Gate 3 Data 2 True (non-inverted) bit

1 = lcxd2T is gated into lcxg3

0 = lcxd2T is not gated into lcxg3

bit 2 LCxG3D2N: Gate 3 Data 2 Negated (inverted) bit

1 = lcxd2N is gated into lcxg3

0 = lcxd2N is not gated into lcxg3

bit 1 LCxG3D1T: Gate 3 Data 1 True (non-inverted) bit

1 = lcxd1T is gated into lcxg3

0 = lcxd1T is not gated into lcxg3

bit 0 LCxG3D1N: Gate 3 Data 1 Negated (inverted) bit

1 = lcxd1N is gated into lcxg3

0 = lcxd1N is not gated into lcxg3

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R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u

LCxG4D4T LCxG4D4N LCxG4D3T LCxG4D3N LCxG4D2T LCxG4D2N LCxG4D1T LCxG4D1N

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7 LCxG4D4T: Gate 4 Data 4 True (non-inverted) bit

1 = lcxd4T is gated into lcxg4

0 = lcxd4T is not gated into lcxg4

bit 6 LCxG4D4N: Gate 4 Data 4 Negated (inverted) bit

1 = lcxd4N is gated into lcxg4

0 = lcxd4N is not gated into lcxg4

bit 5 LCxG4D3T: Gate 4 Data 3 True (non-inverted) bit

1 = lcxd3T is gated into lcxg4

0 = lcxd3T is not gated into lcxg4

bit 4 LCxG4D3N: Gate 4 Data 3 Negated (inverted) bit

1 = lcxd3N is gated into lcxg4

0 = lcxd3N is not gated into lcxg4

bit 3 LCxG4D2T: Gate 4 Data 2 True (non-inverted) bit

1 = lcxd2T is gated into lcxg4

0 = lcxd2T is not gated into lcxg4

bit 2 LCxG4D2N: Gate 4 Data 2 Negated (inverted) bit

1 = lcxd2N is gated into lcxg4

0 = lcxd2N is not gated into lcxg4

bit 1 LCxG4D1T: Gate 4 Data 1 True (non-inverted) bit

1 = lcxd1T is gated into lcxg4

0 = lcxd1T is not gated into lcxg4

bit 0 LCxG4D1N: Gate 4 Data 1 Negated (inverted) bit

1 = lcxd1N is gated into lcxg4

0 = lcxd1N is not gated into lcxg4

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PIC10(L)F320/322

TABLE 19-3: SUMMARY OF REGISTERS ASSOCIATED WITH CLCx

Name Bit7 Bit6 Bit5 Bit4 BIt3 Bit2 Bit1 Bit0 Register

on Page

CLC1CON LC1EN LC1OE LC1OUT LC1INTP LC1INTN LC1MODE<2:0> 119

CLC1GLS0 LC1G1D4T LC1G1D4N LC1G1D3T LC1G1D3N LC1G1D2T LC1G1D2N LC1G1D1T LC1G1D1N 123

CLC1GLS1 LC1G2D4T LC1G2D4N LC1G2D3T LC1G2D3N LC1G2D2T LC1G2D2N LC1G2D1T LC1G2D1N 124

CLC1GLS2 LC1G3D4T LC1G3D4N LC1G3D3T LC1G3D3N LC1G3D2T LC1G3D2N LC1G3D1T LC1G3D1N 125

CLC1GLS3 LC1G4D4T LC1G4D4N LC1G4D3T LC1G4D3N LC1G4D2T LC1G4D2N LC1G4D1T LC1G4D1N 126

CLC1POL LC1POL — — — LC1G4POL LC1G3POL LC1G2POL LC1G1POL 120

CLC1SEL0 — LC1D2S<2:0> — LC1D1S<2:0> 121

CLC1SEL1 — LC1D4S<2:0> — LC1D3S<2:0> 122

INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 46

PIE1 —ADIE —NCO1IE CLC1IE —TMR2IE —47

PIR1 —ADIF —NCO1IF CLC1IF —TMR2IF —48

TRISA — — — — — TRISA2 TRISA1 TRISA0 77

Legend: — = unimplemented read as ‘0’. Shaded cells are not used for CLC module.

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NOTES:

 2011 Microchip Technology Inc. Preliminary DS41585A-page 129

PIC10(L)F320/322

20.0 NUMERICALLY CONTROLLE D

OSCILLATOR (NCO) MODULE

The Numerically Controlled Oscillator (NCOx) module

is a timer that uses the overflow from the addition of an

increment value to divide the input frequency. The

advantage of the addition method over simple counter

driven timer is that the resolution of division does not

vary with the divider value. The NCOx is most useful for

applications that requires frequency accuracy and fine

resolution at a fixed duty cycle.

Features of the NCOx include:

• 16-bit increment function

• Fixed Duty Cycle (FDC) mode

• Pulse Frequency (PF) mode

• Output pulse width control

• Multiple clock input sources

• Output polarity control

• Interrupt capability

Figure 20-1 is a simplified block diagram of the NCOx

module.

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DS41585A-page 130 Preliminary  2011 Microchip Technology Inc.

FIGURE 20-1: NUME RICA LLY CONTROLLED OSCILLATOR (NCOx) MODULE SIMPLIFIED BLOCK DIAGRAM

xEN

LC1OUT

HFINTOSC

NCO1CLK

xCKS<1:0>

Note 1: The increment registers are double-buffered to allow for value changes to be made without first disabling the NCOx

module. They are shown here for reference. The buffers are not user-accessible.

(1)

FOSC

Increment

Buffer

Accumulator



Overflow

NCOx Clock

xOUT bit

Interrupt event Set NCOxIF flag

NxPOL

NCOx Clock

NxPFM

To CLC and

CWG

modules

Ripple Counter Reset

PWS<2:0>

NCOx

NxOE

TRIS Control

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20.1 NCOx OPERATION

The NCOx operates by repeatedly adding a fixed value

to an accumulator. Additions occur at the input clock

rate. The accumulator will overflow with a carry

periodically, which is the raw NCOx output. This

effectively reduces the input clock by the ratio of the

addition value to the maximum accumulator value. See

Equation 20-1.

The NCOx output can be further modified by stretching

the pulse or toggling a flip-flop. The modified NCOx

output is then distributed internally to other peripherals

and optionally output to a pin. The accumulator overflow

also generates an interrupt.

The NCOx output creates an instantaneous frequency,

which may cause uncertainty. This output depends on

the ability of the receiving circuit (i.e., CWG or external

resonant converter circuitry) to average the

instantaneous frequency to reduce uncertainty.

20.1.1 NCOx CLOCK SOURCES

Clock sources available to the NCOx include:

•HFINTOSC

•FOSC

•LC1OUT

• NCO1CLK pin

The NCOx clock source is selected by configuring the

NxCKS<1:0> bits in the NCOxCLK register.

20.1.2 ACCUMULATOR

The Accumulator is a 20-bit register. Read and write

access to the Accumulator is available through three

registers:

• NCOxACCL

• NCOxACCH

• NCOxACCU

20.1.3 ADDER

The NCOx Adder is a full adder, which operates

asynchronously to the clock source selected. The

addition of the previous result and the increment value

replaces the accumulator value on the rising edge of

each input clock.

20.1.4 INCREMENT REGISTERS

The Increment value is stored in two 8-bit registers

making up a 16-bit increment. In order of LSB to MSB

they are:

• NCOxINCL

• NCOxINCH

Both of the registers are readable and writeable. The

Increment registers are double-buffered to allow for

value changes to be made without first disabling the

NCOx module.

The buffer loads are immediate when the module is dis-

abled. Writing to the MS register first is necessary

because then the buffer is loaded synchronously with

the NCOx operation after the write is executed on the

lower increment register.

EQUATION 20-1:

Note: The increment buffer registers are not user-

accessible.

FOVERFLOW NCO Clock Frequency Increment Value

----------------------------------------------------------------------------------------------------------------=

n = Accumulator width in bits

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20.2 FIXED DUTY CYCLE (FDC) MODE

In Fixed Duty Cycle (FDC) mode, every time the

Accumulator overflows, the output is toggled. This

provides a 50% duty cycle, provided that the increment

value remains constant. For more information, see

Figure 20-2.

The FDC mode is selected by clearing the NxPFM bit

in the NCOxCON register.

20.3 PULSE FREQUENCY (PF) MODE

In Pulse Frequency (PF) mode, every time the Accu-

mulator overflows, the output becomes active for one

or more clock periods. See Section 20.3.1 “OUTPUT

PULSE WIDTH CONTROL” for more information.

Once the clock period expires, the output returns to an

inactive state. This provides a pulsed output.

The output becomes active on the rising clock edge

immediately following the overflow event. For more

information, see Figure 20-2.

The value of the active and inactive states depends on

the Polarity bit, NxPOL in the NCOxCON register.

The PF mode is selected by setting the NxPFM bit in

the NCOxCON register.

20.3.1 OUTPUT PULSE WIDTH CONTROL

When operating in PF mode, the active state of the out-

put can vary in width by multiple clock periods. Various

pulse widths are selected with the NxPWS<2:0> bits in

the NCOxCLK register.

When the selected pulse width is greater than the

Accumulator overflow time frame, then NCOx opera-

tion is undefined.

20.4 OUTPUT POLARITY CONTROL

The last stage in the NCOx module is the output polar-

ity. The NxPOL bit in the NCOxCON register selects the

output polarity. Changing the polarity while the inter-

rupts are enabled will cause an interrupt for the result-

ing output transition.

The NCOx output can be used internally by source

code or other peripherals. This is done by reading the

NxOUT (read-only) bit of the NCOxCON register.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 133

PIC10(L)F320/322

FIGURE 20-2: FDC OUTPUT MODE OPERATION DIAGRAM

Clock

Source

NCOx

Increment

Value

NCOx

Value

Accumulator 0000h 4000h FC000h 0000h 4000h 8000h 0000h 4000h 8000h C000h

4000h

1 0000h

Overflow

Event

Interrupt

NCOx

Output

FDC Mode

NCOx

Output

PF Mode

NCOxPWS = 000

NCOx

Output

NCOxPWS = 001

PF Mode

FC000h

8000h

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DS41585A-page 134 Preliminary  2011 Microchip Technology Inc.

20.5 Interrupts

When the Accumulator overflows, the NCOx Interrupt

Flag bit, NCOxIF, of the PIR1 register is set. To enable

this interrupt event, the following bits must be set:

• NxEN bit of the NCOxCON register

• NCOxIE bit of the PIE1 register

• PEIE bit of the INTCON register

• GIE bit of the INTCON register

The interrupt must be cleared by software by clearing

the NCOxIF bit in the Interrupt Service Routine.

20.6 Effects of a Reset

All of the NCOx registers are cleared to zero as the

result of a Reset.

20.7 Operation In Sleep

The NCO module operates independently from the

system clock and will continue to run during Sleep,

provided that the clock source selected remains active.

The HFINTOSC remains active during Sleep when the

NCO module is enabled and the HFINTOSC is

selected as the clock source, regardless of the system

clock source selected.

In other words, if the HFINTOSC is simultaneously

selected as the system clock and the NCO clock

source, when the NCO is enabled, the CPU will go idle

during Sleep, but the NCO will continue to operate and

the HFINTOSC will remain active.

This will have a direct effect on the Sleep mode current.

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20.8 NCOx Control Registers

R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 U-0 U-0 U-0 R/W-0/0

NxEN NxOE NxOUT NxPOL — — —NxPFM

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7 NxEN: NCOx Enable bit

1 = NCOx module is enabled

0 = NCOx module is disabled

bit 6 NxOE: NCOx Output Enable bit

1 = NCOx output pin is enabled

0 = NCOx output pin is disabled

bit 5 NxOUT: NCOx Output bit

1 = NCOx output is high

0 = NCOx output is low

bit 4 NxPOL: NCOx Polarity bit

1 = NCOx output signal is active high

0 = NCOx output signal is active low

bit 3-1 Unimplemented: Read as ‘0’.

bit 0 NxPFM: NCOx Pulse Frequency mode bit

1 = NCOx operates in Pulse Frequency mode

0 = NCOx operates in Fixed Duty Cycle mode

R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 U-0 R/W-0/0 R/W-0/0

NxPWS<2:0> ———NxCKS<1:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-5 NxPWS<2:0>: NCOx Output Pulse Width Select bits(1, 2)

111 = 128 NCOx clock periods

110 = 64 NCOx clock periods

101 = 32 NCOx clock periods

100 = 16 NCOx clock periods

011 = 8 NCOx clock periods

010 = 4 NCOx clock periods

001 = 2 NCOx clock periods

000 = 1 NCOx clock periods

bit 4-2 Unimplemented: Read as ‘0’

bit 1-0 NxCKS<1:0>: NCOx Clock Source Select bits

11 = NCO1CLK

10 = LC1OUT

01 = FOSC

00 = HFINTOSC (16 MHz)

Note 1: NxPWS applies only when operating in Pulse Frequency mode.

2: If NCOx pulse width is greater than NCOx overflow period, operation is undefined.

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DS41585A-page 136 Preliminary  2011 Microchip Technology Inc.

R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0

NCOxACC<7:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-0 NCOxACC<7:0>: NCOx Accumulator, low byte

Note1: NxPWS applies only when operating in Pulse Frequency mode.

2: If NCOx pulse width is greater than NCOx overflow period, operation is undefined.

R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0

NCOxACC<15:8>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-0 NCOxACC<15:8>: NCOx Accumulator, high byte

U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0

— — — — NCOxACC<19:16>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-4 Unimplemented: Read as ‘0’

bit 3-0 NCOxACC<19:16>: NCOx Accumulator, upper byte

 2011 Microchip Technology Inc. Preliminary DS41585A-page 137

PIC10(L)F320/322

R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-1/1

NCOxINC<7:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-0 NCOxINC<7:0>: NCOx Increment, low byte

R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0

NCOxINC<15:8>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared

bit 7-0 NCOxINC<15:8>: NCOx Increment, high byte

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DS41585A-page 138 Preliminary  2011 Microchip Technology Inc.

TABLE 20-1: SUMMARY OF REGISTERS ASSOCIATED WITH NCOx

Name Bit 7 Bit 6 Bit 5 B it 4 B it 3 B it 2 Bit 1 Bit 0 Register

on Page

CLC1SEL0 — LC1D2S2 LC1D2S1 LC1D2S0 — LC1D1S2 LC1D1S1 LC1D1S0 121

CLC1SEL1 — LC1D4S2 LC1D4S1 LC1D4S0 — LC1D3S2 LC1D3S1 LC1D3S0 122

CWG1CON1 G1ASDLB<1:0> G1ASDLA<1:0> —— G1IS<1:0> 150

INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 46

NCO1ACCH NCO1ACCH<15:8> 136

NCO1ACCL NCO1ACCL<7:0> 136

NCO1ACCU — NCO1ACCU<19:16 136

NCO1CLK N1PWS<2:0> ———N1CKS<1:0>135

NCO1CON N1EN N1OE N1OUT N1POL ———N1PFM135

NCO1INCH NCO1INCH<15:8> 137

NCO1INCL NCO1INCL<7:0> 137

PIE1 —ADIE —NCO1IE CLC1IE —TMR2IE —47

PIR1 —ADIF — NCO1IF CLC1IF —TMR2IF —48

TRISA ————— TRISA2 TRISA1 TRISA0 77

Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends on condition. Shaded cells are not

used for ADC module.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 139

PIC10(L)F320/322

21.0 COMPLEMENTARY WAVEFORM

GENERATOR (CWG) MODULE

The Complementary Waveform Generator (CWG) pro-

duces a complementary waveform with dead-band

delay from a selection of input sources.

The CWG module has the following features:

• Selectable dead-band clock source control

• Selectable input sources

• Output enable control

• Output polarity control

• Dead-band control with Independent 6-bit rising

and falling edge dead-band counters

• Auto-shutdown control with:

- Selectable shutdown sources

- Auto-restart enable

- Auto-shutdown pin override control

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DS41585A-page 140 Preliminary  2011 Microchip Technology Inc.

FIGURE 21-1: CW G BLOCK DIAGRAM

cwg_clock

GxCS

Input Source

PWM1OUT

PWM2OUT

N1OUT

CWG1FLT (INT pin)

GxASDFLT

LC1OUT

GxASDCLC1

FOSC

HFINTOSC

GxIS

LC1OUT

Auto-Shutdown

Source

POLA

GxARSEN

CWGxDBR

POLB

CWGxDBF

‘0’

‘1’

‘0’

‘1’

ASDLB

GxASDLA

CWGxA

CWGxB

GxASDLA = 01

GxASDLB = 01

GxASE

GxOEA

GxOEB

=TRISx

TRISx

x = CWG module number

WRITE

GxASE Data Bit

shutdown

set dominate

 2011 Microchip Technology Inc. Preliminary DS41585A-page 141

PIC10(L)F320/322

FIGURE 21-2: TYPICAL CWG OPERATION WITH PWM1 (NO AUTO-SHUTDOWN)

Rising Edge D

Falling Edge Dead Band

Rising Edge Dead Band

Falling Edge Dead Band

cwg_clock

PWM1

CWGxA

CWGxB

Rising Edge

Dead Band

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21.1 Fundamental Operation

The CWG generates a two output complementary

waveform from one of four selectable input sources.

The off-to-on transition of each output can be delayed

from the on-to-off transition of the other output, thereby,

creating a time delay immediately where neither output

is driven. This is referred to as dead time and is covered

in Section 21.5 “Dead-Band Control”. A typical

operating waveform, with dead band, generated from a

single input signal is shown in Figure 21-2.

It may be necessary to guard against the possibility of

circuit faults or a feedback event arriving too late or not

at all. In this case, the active drive must be terminated

before the Fault condition causes damage. This is

referred to as auto-shutdown and is covered in

Section 21.9 “Auto-shutdown Control”.

21.2 Clock Source

The CWG module allows for up to 2 different clock

sources to be selected:

• Fosc (system clock)

• HFINTOSC (16 MHz only)

The clock sources are selected using the G1CS0 bit of

the CWGxCON0 register (Register 21-1).

21.3 Selectable Input Sources

The CWG uses four different input sources to gener-

ate the complementary waveform:

•PWM1

•PWM2

•N1OUT

•LC1OUT

The input sources are selected using the GxIS<1:0>

bits in the CWGxCON1 register (Register 21-2).

21.4 Output Control

Immediately after the CWG module is enabled, the

complementary drive is configured with both CWGxA

and CWGxB drives cleared.

21.4.1 OUTPUT ENABLES

Each CWG output pin has individual output enable

control. Output enables are selected with the GxOEA

and GxOEB bits of the CWGxCON0 register. When an

output enable control is cleared, the module asserts no

control over the pin. When an output enable is set, the

override value or active PWM waveform is applied to

the pin per the port priority selection. The output pin

enables are dependent on the module enable bit,

GxEN. When GxEN is cleared, CWG output enables

and CWG drive levels have no effect.

21.4.2 POLARITY CONTROL

The polarity of each CWG output can be selected

independently. When the output polarity bit is set, the

corresponding output is active high. Clearing the output

polarity bit configures the corresponding output as

active low. However, polarity does not affect the

override levels. Output polarity is selected with the

GxPOLA and GxPOLB bits of the CWGxCON0 register.

21.5 Dead-Band Control

Dead-band control provides for non-overlapping output

signals to prevent shoot-through current in power

switches. The CWG contains two 6-bit dead-band

counters. One dead-band counter is used for the rising

edge of the input source control. The other is used for

the falling edge of the input source control.

Dead band is timed by counting CWG clock periods

from zero up to the value in the rising or falling dead-

band counter registers. See CWGxDBR and

CWGxDBF registers (Register 21-4 and Register 21-5,

respectively).

21.6 Rising Edge Dead Band

The rising edge dead band delays the turn-on of the

CWGxA output from when the CWGxB output is turned

off. The rising edge dead-band time starts when the

rising edge of the input source signal goes true. When

this happens, the CWGxB output is immediately turned

off and the rising edge dead-band delay time starts.

When the rising edge dead-band delay time is reached,

the CWGxA output is turned on.

The CWGxDBR register sets the duration of the dead-

band interval on the rising edge of the input source

signal. This duration is from 0 to 64 counts of dead band.

Dead band is always counted off the edge on the input

source signal. A count of 0 (zero), indicates that no

dead band is present.

If the input source signal is not present for enough time

for the count to be completed, no output will be seen on

the respective output.

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21.7 Falling Edge Dead Band

The falling edge dead band delays the turn-on of the

CWGxB output from when the CWGxA output is turned

off. The falling edge dead-band time starts when the

falling edge of the input source goes true. When this

happens, the CWGxA output is immediately turned off

and the falling edge dead-band delay time starts. When

the falling edge dead-band delay time is reached, the

CWGxB output is turned on.

The CWGxDBF register sets the duration of the dead-

band interval on the falling edge of the input source sig-

nal. This duration is from 0 to 64 counts of dead band.

Dead band is always counted off the edge on the input

source signal. A count of 0 (zero), indicates that no

dead band is present.

If the input source signal is not present for enough time

for the count to be completed, no output will be seen on

the respective output.

Refer to Figure 21-3 and Figure 21-4 for examples.

21.8 Dead-Band Uncertainty

When the rising and falling edges of the input source

triggers the dead-band counters, the input may be asyn-

chronous. This will create some uncertainty in the dead-

band time delay. The maximum uncertainty is equal to

one CWG clock period. Refer to Equation 21-1 for more

detail.

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DS41585A-page 144 Preliminary  2011 Microchip Technology Inc.

FIGURE 21-3: DEA D-BAND OPERATION, CWGxDBR = 01H, CWGxDBF = 02H

FIGURE 21-4: DEA D-BAND OPERATION, CWGxDBR = 03H, CWGxDBF = 04H, SOURCE SHORTER THAN DEAD BAND

Input Source

CWGxA

CWGxB

cwg_clock

source shorter than dead band

Input Source

CWGxA

CWGxB

cwg_clock

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PIC10(L)F320/322

EQUATION 21-1: DEAD-BAND DELAY TIME

UNCERTAINTY

EXAMPLE 21-1: DEA D-BAND DELAY TIME

UNCERTAINTY

TDEADBAND_UNCERTAINTY 1

Fcwg_clock

-----------------------------=

Therefore:

Fcwg_clock 16 MHz=

16 MHz

-------------------=

625ns=

TDEADBAND_UNCERTAINTY 1

Fcwg_clock

-----------------------------=

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DS41585A-page 146 Preliminary  2011 Microchip Technology Inc.

21.9 Auto-shutdown Control

Auto-shutdown is a method to immediately override the

CWG output levels with specific overrides that allow for

safe shutdown of the circuit. The shutdown state can be

either cleared automatically or held until cleared by

software.

21.9.1 SHUTDOWN

The Shutdown state can be entered by either of the fol-

lowing two methods:

• Software generated

• External Input

21.9.1.1 Software Generated Shutdown

Setting the GxASE bit of the CWGxCON2 register will

force the CWG into the shutdown state.

When auto-restart is disabled, the shutdown state will

persist as long as the GxASE bit is set.

When auto-restart is enabled, the GxASE bit will clear

automatically and resume operation on the next rising

edge event. See Figure 21-6.

21.9.1.2 External Input Source

External shutdown inputs provide the fastest way to

safely suspend CWG operation in the event of a Fault

condition. When any of the selected shutdown inputs

goes high, the CWG outputs will immediately go to the

selected override levels without software delay. Any

combination of two input sources can be selected to

cause a shutdown condition. The two sources are:

•LC1OUT

•CWG1FLT

Shutdown inputs are selected using the GxASDS0 and

GxASDS1 bits of the CWGxCON2 register.

(Register 21-3).

21.10 Operation During Sleep

The CWG module operates independently from the

system clock and will continue to run during Sleep,

provided that the clock and input sources selected

remain active.

The HFINTOSC remains active during Sleep, provided

that the CWG module is enabled, the input source is

active, and the HFINTOSC is selected as the clock

source, regardless of the system clock source

selected.

In other words, if the HFINTOSC is simultaneously

selected as the system clock and the CWG clock

source, when the CWG is enabled and the input source

is active, the CPU will go idle during Sleep, but the

CWG will continue to operate and the HFINTOSC will

remain active.

This will have a direct effect on the Sleep mode current.

Note: Shutdown inputs are level sensitive, not

edge sensitive. The shutdown state can-

not be cleared, except by disabling

auto-shutdown, as long as the shutdown

input level persists.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 147

PIC10(L)F320/322

21.11 Configuring the CWG

The following steps illustrate how to properly configure

the CWG to ensure a synchronous start:

1. Ensure that the TRIS control bits corresponding

to CWGxA and CWGxB are set so that both are

configured as inputs.

2. Clear the GxEN bit, if not already cleared.

3. Set desired dead-band times with the CWGxDBR

and CWGxDBF registers.

4. Setup the following controls in CWGxCON2

auto-shutdown register:

• Select desired shutdown source.

• Select both output overrides to the desired

levels (this is necessary even if not using

auto-shutdown because start-up will be from

a shutdown state).

• Set the GxASE bit and clear the GxARSEN

bit.

5. Select the desired input source using the

CWGxCON1 register.

6. Configure the following controls in CWGxCON0

• Select desired clock source.

• Select the desired output polarities.

• Set the output enables for the outputs to be

used.

7. Set the GxEN bit.

8. Clear TRIS control bits corresponding to

CWGxA and CWGxB to be used to configure

those pins as outputs.

9. If auto-restart is to be used, set the GxARSEN

bit and the GxASE bit will be cleared automati-

cally. Otherwise, clear the GxASE bit to start the

CWG.

21.11.1 PIN OVERRIDE LEVELS

The levels driven to the output pins, while the shutdown

input is true, are controlled by the GxASDLA and

GxASDLB bits of the CWGxCON2 register

(Register 21-3). GxASDLA controls the CWG1A

override level and GxASDLB controls the CWG1B

override level. The control bit logic level corresponds to

the output logic drive level while in the shutdown state.

The polarity control does not apply to the override level.

21.11.2 AUTO-SHUTDOWN RESTART

After an auto-shutdown event has occurred, there are

two ways to have resume operation:

• Software controlled

• Auto-restart

The restart method is selected with the GxARSEN bit

of the CWGxCON2 register. Waveforms of software

controlled and automatic restarts are shown in

Figure 21-5 and Figure 21-6.

21.11.2.1 Software controlled restart

When the GxARSEN bit of the CWGxCON2 register is

cleared, the CWG must be restarted after an auto-shut-

down event by software.

The CWG will resume operation on the first rising edge

event after the GxASE bit is cleared. Clearing the shut-

down state requires all selected shutdown inputs to be

low, otherwise the GxASE bit will remain set.

21.11.2.2 Auto-Restart

When the GxARSEN bit of the CWGxCON2 register is

set, the CWG will restart from the auto-shutdown state

automatically.

After the shutdown event clears, the GxASE bit will

clear automatically and the CWG will resume operation

on the first rising edge event.

PIC10(L)F320/322

DS41585A-page 148 Preliminary  2011 Microchip Technology Inc.

FIGU RE 21-5: SHU TDOW N FUN CTI ONAL IT Y, AUTO-R ESTART DI SABL ED ( Gx ARSE N = 0)

FIGURE 21-6: SHU TDOWN FUNCTIONALITY, AUTO-RESTART ENABLED (GxARSEN = 1)

Shutdown

GxASE Cleared by Software

Output Resumes

No Shutdown

CWG Input

GxASE

CWG1A

Source

Shutdown Source

Shutdown Event Ceases

Tri-State (No Pulse)

CWG1B Tri-State (No Pulse)

Shutdown

Tri-State (No Pulse)

GxASE auto-cleared by hardware

Output Resumes

No Shutdown

CWG Input

GxASE

CWG1A

Source

Shutdown Source

Shutdown Event Ceases

CWG1B

Tri-State (No Pulse)

 2011 Microchip Technology Inc. Preliminary DS41585A-page 149

PIC10(L)F320/322

21.12 CWG Control Registers

R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0

GxEN GxOEB GxOEA GxPOLB GxPOLA ——GxCS0

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition

bit 7 GxEN: CWGx Enable bit

1 = Module is enabled

0 = Module is disabled

bit 6 GxOEB: CWGxB Output Enable bit

1 = CWGxB is available on appropriate I/O pin

0 = CWGxB is not available on appropriate I/O pin

bit 5 GxOEA: CWGxA Output Enable bit

1 = CWGxA is available on appropriate I/O pin

0 = CWGxA is not available on appropriate I/O pin

bit 4 GxPOLB: CWGxB Output Polarity bit

1 = Output is inverted polarity

0 = Output is normal polarity

bit 3 GxPOLA: CWGxA Output Polarity bit

1 = Output is inverted polarity

0 = Output is normal polarity

bit 2-1 Unimplemented: Read as ‘0’

bit 0 GxCS0: CWGx Clock Source Select bit

1 =HFINTOSC

0 =FOSC

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R/W-x/u R/W-x/u R/W-x/u R/W-x/u U-0 U-0 R/W-0/0 R/W-0/0

GxASDLB<1:0> GxASDLA<1:0> — — GxIS<1:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition

bit 7-6 GxASDLB<1:0>: CWGx Shutdown State for CWGxB

When an auto shutdown event is present (GxASE = 1):

11 = CWGxB pin is driven to ‘1’, regardless of the setting of the GxPOLB bit.

10 = CWGxB pin is driven to ‘0’, regardless of the setting of the GxPOLB bit.

01 = CWGxB pin is tri-stated

00 = CWGxB pin is driven to its inactive state after the selected dead-band interval. GxPOLB still will

control the polarity of the output.

bit 5-4 GxASDLA<1:0>: CWGx Shutdown State for CWGxA

When an auto shutdown event is present (GxASE = 1):

00 = CWGxA pin is driven to its inactive state after the selected dead-band interval. GxPOLA still will

control the polarity of the output.

01 = CWGxA pin is tri-stated

10 = CWGxA pin is driven to ‘0’, regardless of the setting of the GxPOLA bit.

11 = CWGxA pin is driven to ‘1’, regardless of the setting of the GxPOLA bit.

bit 3-2 Unimplemented: Read as ‘0’

bit 1-0 GxIS<1:0>: CWGx Dead-band Source Select bits

11 =LC1OUT

10 =N1OUT

01 =PWM2OUT

00 =PWM1OUT

 2011 Microchip Technology Inc. Preliminary DS41585A-page 151

PIC10(L)F320/322

R/W-0/0 R/W-0/0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0

GxASE GxARSEN — — — — GxASDCLC1 GxASDFLT

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition

bit 7 GxASE: Auto-Shutdown Event Status bit

1 = An Auto-Shutdown event has occurred

0 = No Auto-Shutdown event has occurred

bit 6 GxARSEN: Auto-Restart Enable bit

1 = Auto-restart is enabled

0 = Auto-restart is disabled

bit 5-2 Unimplemented: Read as ‘0’

bit 1 GxASDCLC1: CWG Auto-shutdown Source Enable bit 1

1 = Shutdown when LC1OUT is high

0 = LC1OUT has no effect on shutdown

bit 0 GxASDFLT: CWG Auto-shutdown Source Enable bit 0

1 = Shutdown when CWG1FLT input is low

0 =C

WG1FLT input has no effect on shutdown

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DS41585A-page 152 Preliminary  2011 Microchip Technology Inc.

DEAD-BAND COUNT REGISTER

U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u

— — CWGxDBR<5:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition

bit 7-6 Unimplemented: Read as ‘0’

bit 5-0 CWGxDBR<5:0>: Complementary Waveform Generator (CWGx) Rising Counts bits

11 1111 = 63-64 counts of dead band

11 1110 = 62-63 counts of dead band





00 0010 = 2-3 counts of dead band

00 0001 = 1-2 counts of dead band

00 0000 = 0 counts of dead band

U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u

— — CWGxDBF<5:0>

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets

‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition

bit 7-6 Unimplemented: Read as ‘0’

bit 5-0 CWGxDBF<5:0>: Complementary Waveform Generator (CWGx) Falling Counts bits

11 1111 = 63-64 counts of dead band

11 1110 = 62-63 counts of dead band





00 0010 = 2-3 counts of dead band

00 0001 = 1-2 counts of dead band

00 0000 = 0 counts of dead band. Dead-band generation is bypassed.

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PIC10(L)F320/322

TABLE 21-1: SUMMARY OF REGISTERS ASSOCIATED WITH CWG

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register

on Pag e

ANSELA — — — — — ANSA2 ANSA1 ANSA0 78

CWG1CON0 G1EN G1OEB G1OEA G1POLB G1POLA ——G1CS0150

CWG1CON1 G1ASDLB<1:0> G1ASDLA<1:0> — — G1IS<1:0> 151

CWG1CON2 G1ASE G1ARSEN — — — — GxASDCLC1 GxASDFLT 152

CWG1DBF — — CWG1DBF<5:0> 153

CWG1DBR — — CWG1DBR<5:0> 153

LATA — — — — — LATA2 LATA1 LATA0 78

TRISA — — — — — TRISA2 TRISA1 TRISA0 77

Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by CWG.

PIC10(L)F320/322

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NOTES:

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PIC10(L)F320/322

22.0 IN-CIRCUIT SERIAL

PROGRAMMING™ (ICSP™)

ICSP™ programming allows customers to manufacture

circuit boards with unprogrammed devices. Programming

can be done after the assembly process allowing the

device to be programmed with the most recent firmware

or a custom firmware. Five pins are needed for ICSP™

programming:

• ICSPCLK

• ICSPDAT

•MCLR

/VPP

•VDD

•VSS

In Program/Verify mode the Program Memory, User

IDs and the Configuration Words are programmed

through serial communications. The ICSPDAT pin is a

bidirectional I/O used for transferring the serial data

and the ICSPCLK pin is the clock input. For more

information on ICSP™ refer to the “PIC16(L)F178X

Memory Programming Specification” (DS41457).

22.1 High-Voltage Programming Entry

Mode

The device is placed into High-Voltage Programming

Entry mode by holding the ICSPCLK and ICSPDAT

pins low then raising the voltage on MCLR/VPP to VIHH.

Some programmers produce VPP greater than VIHH

(9.0V), an external circuit is required to limit the VPP

voltage. See Figure 22-1 for example circuit.

FIGURE 22-1: VP P LIMITER EXAM PLE CIRCUIT

VREF

VPP

VDD

VSS

ICSP_DATA

ICSP_CLOCK

RJ11-6PIN

270 Ohm

To M P L A B® ICD 2 To Targe t Board

R2 R3

10k 1% 24k 1%

LM431BCMX

Note: The MPLAB® ICD 2 produces a VPP

voltage greater than the maximum VPP

specification of the PIC10(L)F320/322.

PIC10(L)F320/322

DS41585A-page 156 Preliminary  2011 Microchip Technology Inc.

22.2 Low-Voltage Progr ammin g Entry

Mode

The Low-Voltage Programming Entry mode allows the

PIC10(L)F320/322 devices to be programmed using

VDD only, without high voltage. When the LVP bit of

Configuration Word is set to ‘1’, the low-voltage ICSP

programming entry is enabled. To disable the

Low-Voltage ICSP mode, the LVP bit must be

programmed to ‘0’.

Entry into the Low-Voltage Programming Entry mode

requires the following steps:

1. MCLR is brought to VIL.

2. A 32-bit key sequence is presented on

ICSPDAT, while clocking ICSPCLK.

Once the key sequence is complete, MCLR must be

held at VIL for as long as Program/Verify mode is to be

maintained.

If low-voltage programming is enabled (LVP = 1), the

MCLR Reset function is automatically enabled and

cannot be disabled. See Section 5.3 “Low-Power

Brown-out Reset (LPBOR)” for more information.

The LVP bit can only be reprogrammed to ‘0’ by using

the High-Voltage Programming mode.

22.3 Common Programming Interfaces

Connection to a target device is typically done through

an ICSP™ header. A commonly found connector on

development tools is the RJ-11 in the 6P6C (6 pin, 6

connector) configuration. See Figure 22-2.

FIGURE 22-2: ICD RJ-11 STYLE

CONNECTOR INTERFACE

Another connector often found in use with the PICkit™

programmers is a standard 6-pin header with 0.1 inch

spacing. Refer to Figure 22-3.

FIGURE 22-3: PI Ckit™ STYLE CONNECTOR INTERFACE

Target

Bottom Side

PC Board

VPP/MCLR VSS

ICSPCLK

VDD

ICSPDAT

Pin Description*

1 = VPP/MCLR

2 = VDD Target

3 = VSS (ground)

4 = ICSPDAT

5 = ICSPCLK

6 = No Connect

* The 6-pin header (0.100" spacing) accepts 0.025" square pins.

Pin Description*

1 = VPP/MCLR

2 = VDD Target

3 = VSS (ground)

4 = ICSPDAT

5 = ICSPCLK

6 = No Connect

Pin 1 Indicator

 2011 Microchip Technology Inc. Preliminary DS41585A-page 157

PIC10(L)F320/322

For additional interface recommendations, refer to your

specific device programmer manual prior to PCB

design.

It is recommended that isolation devices be used to

separate the programming pins from other circuitry.

The type of isolation is highly dependent on the specific

application and may include devices such as resistors,

diodes, or even jumpers. See Figure 22-4 for more

information.

FIGURE 22-4: TYPICAL CONNECTION FOR ICSP™ PROGRAMMING

VDD

VPP

VSS

External

Device to be

Data

Clock

VDD

MCLR/VPP

VSS

ICSPDAT

ICSPCLK

To Normal Connections

*Isolation devices (as required).

Programming

Signals Programmed

VDD

PIC10(L)F320/322

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NOTES:

 2011 Microchip Technology Inc. Preliminary DS41585A-page 159

PIC10(L)F320/322

23.0 INSTRUCTION SET SUMMARY

The PIC10(L)F320/322 instruction set is highly orthog-

onal and is comprised of three basic categories:

•Byte-oriented operations

•Bit-oriented operations

•Literal and cont rol operations

Each PIC16 instruction is a 14-bit word divided into an

opcode, which specifies the instruction type and one or

more operands, which further specify the operation of

the instruction. The formats for each of the categories

is presented in Figure 23-1, while the various opcode

fields are summarized in Tab l e 2 3-1 .

Table 23-2 lists the instructions recognized by the

MPASMTM assembler.

For byte-oriented instructions, ‘f’ represents a file

designator. The file register designator specifies which

file register is to be used by the instruction.

The destination designator specifies where the result of

the operation is to be placed. If ‘d’ is zero, the result is

placed in the W register. If ‘d’ is one, the result is placed

in the file register specified in the instruction.

For bit-oriented instructions, ‘b’ represents a bit field

designator, which selects the bit affected by the

operation, while ‘f’ represents the address of the file in

which the bit is located.

For literal and control operations, ‘k’ represents an

8-bit or 11-bit constant, or literal value.

One instruction cycle consists of four oscillator periods;

for an oscillator frequency of 4 MHz, this gives a normal

instruction execution time of 1 s. All instructions are

executed within a single instruction cycle, unless a

conditional test is true, or the program counter is

changed as a result of an instruction. When this occurs,

the execution takes two instruction cycles, with the

second cycle executed as a NOP.

All instruction examples use the format ‘0xhh’ to

represent a hexadecimal number, where ‘h’ signifies a

hexadecimal digit.

23.1 Read-Modify-Write Operations

Any instruction that specifies a file register as part of

the instruction performs a Read-Modify-Write (RMW)

operation. The register is read, the data is modified,

and the result is stored according to either the instruc-

tion or the destination designator ‘d’. A read operation

is performed on a register even if the instruction writes

to that register.

For example, a CLRF PORTA instruction will read

PORTA, clear all the data bits, then write the result back

to PORTA. This example would have the unintended

consequence of clearing the condition that set the

IOCIF flag.

TABLE 23-1: OPCODE FIELD

DESCRIPTIONS

FIGURE 23-1: GENERAL FORMAT FOR

INSTRUCTIONS

Field Description

fRegister file address (0x00 to 0x7F)

WWorking register (accumulator)

bBit address within an 8-bit file register

kLiteral field, constant data or label

xDon’t care location (= 0 or 1).

The assembler will generate code with x = 0.

It is the recommended form of use for

compatibility with all Microchip software tools.

dDestination select; d = 0: store result in W,

d = 1: store result in file register f.

Default is d = 1.

PC Program Counter

TO Time-out bit

CCarry bit

DC Digit carry bit

ZZero bit

PD Power-down bit

Byte-oriented file r e gister operati ons

13 8 7 6 0

d = 0 for destination W

OPCODE d f (FILE #)

d = 1 for destination f

f = 7-bit file register address

Bit-oriente d file register operations

13 10 9 7 6 0

OPCODE b (BIT #) f (FILE #)

b = 3-bit bit address

f = 7-bit file register address

Literal and control operations

13 8 7 0

OPCODE k (literal)

k = 8-bit immediate value

13 11 10 0

OPCODE k (literal)

k = 11-bit immediate value

General

CALL and GOTO instructions only

PIC10(L)F320/322

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TABLE 23-2: PIC10(L)F320/322 INSTRUCTION SET

Mnemonic,

Operands Description Cycles 14-Bit Opcod e Status

Affected Notes

MSb LSb

BYTE-ORIENTED FILE REGISTER OPERATIONS

ADDWF

ANDWF

CLRF

CLRW

COMF

DECF

DECFSZ

INCF

INCFSZ

IORWF

MOVF

MOVWF

NOP

RLF

RRF

SUBWF

SWAPF

XORWF

f, d

–

f, d

–

f, d

Add W and f

AND W with f

Clear f

Clear W

Complement f

Decrement f

Decrement f, Skip if 0

Increment f

Increment f, Skip if 0

Inclusive OR W with f

Move f

Move W to f

No Operation

Rotate Left f through Carry

Rotate Right f through Carry

Subtract W from f

Swap nibbles in f

Exclusive OR W with f

1(2)

0111

0101

0001

1001

0011

1011

1010

1111

0100

1000

0000

1101

1100

0010

1110

0110

dfff

lfff

0xxx

dfff

lfff

0xx0

dfff

ffff

xxxx

ffff

0000

ffff

C, DC, Z

1, 2

1, 2, 3

1, 2

1, 2, 3

1, 2

BIT-ORIENTED FILE REGISTER OPERATIONS

BCF

BSF

BTFSC

BTFSS

f, b

Bit Clear f

Bit Set f

Bit Test f, Skip if Clear

Bit Test f, Skip if Set

1 (2)

00bb

01bb

10bb

11bb

bfff

ffff

1, 2

LITERAL AND CONTROL OPERATIONS

ADDLW

ANDLW

CALL

CLRWDT

GOTO

IORLW

MOVLW

RETFIE

RETLW

RETURN

SLEEP

SUBLW

XORLW

–

Add literal and W

AND literal with W

Call Subroutine

Clear Watchdog Timer

Go to address

Inclusive OR literal with W

Move literal to W

Return from interrupt

Return with literal in W

Return from Subroutine

Go into Standby mode

Subtract W from literal

Exclusive OR literal with W

111x

1001

0kkk

0000

1kkk

1000

00xx

0000

01xx

0000

110x

1010

kkkk

0110

kkkk

0000

kkkk

0000

0110

kkkk

0100

kkkk

1001

kkkk

1000

0011

kkkk

C, DC, Z

TO, PD

C, DC, Z

Note 1: When an I/O register is modified as a function of itself (e.g., MOVF PORTA, 1), the value used will be that value present

on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external

device, the data will be written back with a ‘0’.

2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if

assigned to the Timer0 module.

3: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second

cycle is executed as a NOP.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 161

PIC10(L)F320/322

23.2 Instruction Descriptions

ADDLW Add literal and W

Syntax: [ label ] ADDLW k

Operands: 0  k  255

Operation: (W) + k  (W)

Status Affected: C, DC, Z

Description: The contents of the W register

are added to the eight-bit literal ‘k’

and the result is placed in the

W register.

ADDWF Add W and f

Syntax: [ label ] ADDWF f,d

Operands: 0  f  127

d 0,1

Operation: (W) + (f)  (destination)

Status Affected: C, DC, Z

Description: Add the contents of the W register

with register ‘f’. If ‘d’ is ‘0’, the

result is stored in the W register. If

‘d’ is ‘1’, the result is stored back

in register ‘f’.

ANDLW AND literal with W

Syntax: [ label ] ANDLW k

Operands: 0  k  255

Operation: (W) .AND. (k)  (W)

Status Affected: Z

Description: The contents of W register are

AND’ed with the eight-bit literal

‘k’. The result is placed in the W

ANDWF AND W with f

Syntax: [ label ] ANDWF f,d

Operands: 0  f  127

d 0,1

Operation: (W) .AND. (f)  (destination)

Status Affected: Z

Description: AND the W register with register

‘f’. If ‘d’ is ‘0’, the result is stored in

the W register. If ‘d’ is ‘1’, the

result is stored back in register ‘f’.

BCF Bit Clear f

Syntax: [ label ] BCF f,b

Operands: 0  f  127

0  b  7

Operation: 0  (f<b>)

Status Affected: None

Description: Bit ‘b’ in register ‘f’ is cleared.

BSF Bit Set f

Syntax: [ label ] BSF f,b

Operands: 0  f  127

0  b  7

Operation: 1  (f<b>)

Status Affected: None

Description: Bit ‘b’ in register ‘f’ is set.

BTFSC Bit Test f, Skip if Clear

Syntax: [ label ] BTFSC f,b

Operands: 0  f  127

0  b  7

Operation: skip if (f<b>) = 0

Status Affected: None

Description: If bit ‘b’ in register ‘f’ is ‘1’, the next

instruction is executed.

If bit ‘b’ in register ‘f’ is ‘0’, the next

instruction is discarded, and a NOP

is executed instead, making this a

two-cycle instruction.

PIC10(L)F320/322

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BTFSS Bit Test f, Skip if Set

Syntax: [ label ] BTFSS f,b

Operands: 0  f  127

0  b < 7

Operation: skip if (f<b>) = 1

Status Affected: None

Description: If bit ‘b’ in register ‘f’ is ‘0’, the next

instruction is executed.

If bit ‘b’ is ‘1’, then the next

instruction is discarded and a NOP

is executed instead, making this a

two-cycle instruction.

CALL Call Subrouti ne

Syntax: [ label ] CALL k

Operands: 0  k  2047

Operation: (PC)+ 1 TOS,

k  PC<10:0>,

(PCLATH<4:3>)  PC<12:11>

Status Affected: None

Description: Call Subroutine. First, return

address (PC + 1) is pushed onto

the stack. The eleven-bit

immediate address is loaded into

PC bits <10:0>. The upper bits of

the PC are loaded from PCLATH.

CALL is a two-cycle instruction.

CLRF Clear f

Syntax: [ label ] CLRF f

Operands: 0  f  127

Operation: 00h  (f)

1  Z

Status Affected: Z

Description: The contents of register ‘f’ are

cleared and the Z bit is set.

CLRW Clear W

Syntax: [ label ] CLRW

Operands: None

Operation: 00h  (W)

1  Z

Status Affected: Z

Description: W register is cleared. Zero bit (Z)

is set.

CLRWDT Clear Watchdog Timer

Syntax: [ label ] CLRWDT

Operands: None

Operation: 00h  WDT

0  WDT prescaler,

1  TO

1  PD

Status Affected: TO, PD

Description: CLRWDT instruction resets the

Watchdog Timer. It also resets the

prescaler of the WDT.

Status bits TO and PD are set.

COMF Complement f

Syntax: [ label ] COMF f,d

Operands: 0  f  127

d  [0,1]

Operation: (f)  (destination)

Status Affected: Z

Description: The contents of register ‘f’ are

complemented. If ‘d’ is ‘0’, the

result is stored in W. If ‘d’ is ‘1’,

the result is stored back in

DECF Decrement f

Syntax: [ label ] DECF f,d

Operands: 0  f  127

d  [0,1]

Operation: (f) - 1  (destination)

Status Affected: Z

Description: Decrement register ‘f’. If ‘d’ is ‘0’,

the result is stored in the W

stored back in register ‘f’.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 163

PIC10(L)F320/322

DECFSZ Decrement f, Skip if 0

Syntax: [ label ] DECFSZ f,d

Operands: 0  f  127

d  [0,1]

Operation: (f) - 1  (destination);

skip if result = 0

Status Affected: None

Description: The contents of register ‘f’ are

decremented. If ‘d’ is ‘0’, the result

is placed in the W register. If ‘d’ is

‘1’, the result is placed back in

If the result is ‘1’, the next

instruction is executed. If the

result is ‘0’, then a NOP is

executed instead, making it a

two-cycle instruction.

GOTO Unconditional Branch

Syntax: [ label ] GOTO k

Operands: 0  k  2047

Operation: k  PC<10:0>

PCLATH<4:3>  PC<12:11>

Status Affected: None

Description: GOTO is an unconditional branch.

The eleven-bit immediate value is

loaded into PC bits <10:0>. The

upper bits of PC are loaded from

PCLATH<4:3>. GOTO is a

two-cycle instruction.

INCF Increment f

Syntax: [ label ] INCF f,d

Operands: 0  f  127

d  [0,1]

Operation: (f) + 1  (destination)

Status Affected: Z

Description: The contents of register ‘f’ are

incremented. If ‘d’ is ‘0’, the result

is placed in the W register. If ‘d’ is

‘1’, the result is placed back in

INCFSZ Increment f, Skip if 0

Syntax: [ label ] INCFSZ f,d

Operands: 0  f  127

d  [0,1]

Operation: (f) + 1  (destination),

skip if result = 0

Status Affected: None

Description: The contents of register ‘f’ are

incremented. If ‘d’ is ‘0’, the result

is placed in the W register. If ‘d’ is

‘1’, the result is placed back in

If the result is ‘1’, the next

instruction is executed. If the

result is ‘0’, a NOP is executed

instead, making it a two-cycle

instruction.

IORLW Inclusive OR literal with W

Syntax: [ label ] IORLW k

Operands: 0  k  255

Operation: (W) .OR. k  (W)

Status Affected: Z

Description: The contents of the W register are

OR’ed with the eight-bit literal ‘k’.

The result is placed in the

W register.

IORWF Inclusive OR W with f

Syntax: [ label ] IORWF f,d

Operands: 0  f  127

d  [0,1]

Operation: (W) .OR. (f)  (destination)

Status Affected: Z

Description: Inclusive OR the W register with

placed in the W register. If ‘d’ is

‘1’, the result is placed back in

PIC10(L)F320/322

DS41585A-page 164 Preliminary  2011 Microchip Technology Inc.

MOVF Move f

Syntax: [ label ] MOVF f,d

Operands: 0  f  127

d  [0,1]

Operation: (f)  (dest)

Status Affected: Z

Description: The contents of register ‘f’ is

moved to a destination dependent

upon the status of ‘d’. If d = 0,

destination is W register. If d = 1,

the destination is file register ‘f’

itself. d = 1 is useful to test a file

affected.

Words: 1

Cycles: 1

Example: MOVF FSR, 0

After Instruction

W= value in FSR

Z= 1

MOVLW Move literal to W

Syntax: [ label ] MOVLW k

Operands: 0  k  255

Operation: k  (W)

Status Affected: None

Description: The eight-bit literal ‘k’ is loaded into

W register. The “don’t cares” will

assemble as ‘0’s.

Words: 1

Cycles: 1

Example: MOVLW 0x5A

After Instruction

W= 0x5A

MOVWF Move W to f

Syntax: [ label ] MOVWF f

Operands: 0  f  127

Operation: (W)  (f)

Status Affected: None

Description: Move data from W register to

Words: 1

Cycles: 1

Example: MOVW

FOPTION_REG

Before Instruction

OPTION_REG = 0xFF

W = 0x4F

After Instruction

OPTION_REG = 0x4F

W = 0x4F

NOP No Operation

Syntax: [ label ] NOP

Operands: None

Operation: No operation

Status Affected: None

Description: No operation.

Words: 1

Cycles: 1

Example: NOP

 2011 Microchip Technology Inc. Preliminary DS41585A-page 165

PIC10(L)F320/322

RETFIE Return from Interrupt

Syntax: [ label ] RETFIE

Operands: None

Operation: TOS  PC,

1  GIE

Status Affected: None

Description: Return from Interrupt. Stack is

POPed and Top-of-Stack (TOS) is

loaded in the PC. Interrupts are

enabled by setting Global

Interrupt Enable bit, GIE

(INTCON<7>). This is a two-cycle

instruction.

Words: 1

Cycles: 2

Example: RETFIE

After Interrupt

PC = TOS

GIE = 1

RETLW Return with literal in W

Syntax: [ label ] RETLW k

Operands: 0  k  255

Operation: k  (W);

TOS  PC

Status Affected: None

Description: The W register is loaded with the

eight-bit literal ‘k’. The program

counter is loaded from the top of

the stack (the return address).

This is a two-cycle instruction.

Words: 1

Cycles: 2

Example:

TABLE

DONE

CALL TABLE;W contains

;table offset

;value

GOTO DONE

•

ADDWF PC ;W = offset

RETLW k1 ;Begin table

RETLW k2 ;

•

RETLW kn ;End of table

Before Instruction

W = 0x07

After Instruction

W = value of k8

RETURN Return from Subroutine

Syntax: [ label ] RETURN

Operands: None

Operation: TOS  PC

Status Affected: None

Description: Return from subroutine. The stack

is POPed and the top of the stack

(TOS) is loaded into the program

counter. This is a two-cycle

instruction.

PIC10(L)F320/322

DS41585A-page 166 Preliminary  2011 Microchip Technology Inc.

RLF Rotate Left f through Carry

Syntax: [ label ] RLF f,d

Operands: 0  f  127

d  [0,1]

Operation: See description below

Status Affected: C

Description: The contents of register ‘f’ are

rotated one bit to the left through

the Carry flag. If ‘d’ is ‘0’, the

result is placed in the W register.

If ‘d’ is ‘1’, the result is stored

back in register ‘f’.

Words: 1

Cycles: 1

Example: RLF REG1,0

Before Instruction

REG1 = 1110 0110

C=0

After Instruction

REG1 = 1110 0110

W = 1100 1100

C=1

RRF Rotate Right f through Carry

Syntax: [ label ] RRF f,d

Operands: 0  f  127

d  [0,1]

Operation: See description below

Status Affected: C

Description: The contents of register ‘f’ are

rotated one bit to the right through

the Carry flag. If ‘d’ is ‘0’, the

result is placed in the W register.

If ‘d’ is ‘1’, the result is placed

back in register ‘f’.

SLEEP Enter Sleep mode

Syntax: [ label ] SLEEP

Operands: None

Operation: 00h  WDT,

0  WDT prescaler,

1  TO,

0  PD

Status Affected: TO, PD

Description: The power-down Status bit, PD is

cleared. Time-out Status bit, TO

is set. Watchdog Timer and its

prescaler are cleared.

The processor is put into Sleep

mode with the oscillator stopped.

SUBLW Subtract W from literal

Syntax: [ label ] SUBLW k

Operands: 0 k 255

Operation: k - (W) W)

Status Affected: C, DC, Z

Description: The W register is subtracted (2’s

complement method) from the

eight-bit literal ‘k’. The result is

placed in the W register.

Result Condition

C = 0W  k

C = 1W  k

DC = 0W<3:0>  k<3:0>

DC = 1W<3:0>  k<3:0>

 2011 Microchip Technology Inc. Preliminary DS41585A-page 167

PIC10(L)F320/322

SUBWF Subtract W from f

Syntax: [ label ] SUBWF f,d

Operands: 0 f 127

d  [0,1]

Operation: (f) - (W) destination)

Status Affected: C, DC, Z

Description: Subtract (2’s complement method)

W register from register ‘f’. If ‘d’ is

‘0’, the result is stored in the W

stored back in register ‘f’.

SWAPF Swap Nibbles in f

Syntax: [ label ] SWAPF f,d

Operands: 0  f  127

d  [0,1]

Operation: (f<3:0>)  (destination<7:4>),

(f<7:4>)  (destination<3:0>)

Status Affected: None

Description: The upper and lower nibbles of

‘0’, the result is placed in the W

placed in register ‘f’.

XORLW Exclusive OR literal with W

Syntax: [ label ] XORLW k

Operands: 0 k 255

Operation: (W) .XOR. k W)

Status Affected: Z

Description: The contents of the W register

are XOR’ed with the eight-bit

literal ‘k’. The result is placed in

the W register.

C = 0W  f

C = 1W  f

DC = 0W<3:0>  f<3:0>

DC = 1W<3:0>  f<3:0>

XORWF Exclusive OR W with f

Syntax: [ label ] XORWF f,d

Operands: 0  f  127

d  [0,1]

Operation: (W) .XOR. (f) destination)

Status Affected: Z

Description: Exclusive OR the contents of the

W register with register ‘f’. If ‘d’ is

‘0’, the result is stored in the W

stored back in register ‘f’.

PIC10(L)F320/322

DS41585A-page 168 Preliminary  2011 Microchip Technology Inc.

NOTES:

 2011 Microchip Technology Inc. Preliminary DS41585A-page 169

PIC10(L)F320/322

24.0 ELECTRICAL SPECIFICATIONS

Absolute Maximum Ratings(†)

Ambient temperature under bias....................................................................................................... -40°C to +125°C

Storage temperature ........................................................................................................................ -65°C to +150°C

Voltage on VDD with respect to VSS, PIC10F320/322 ........................................................................ -0.3V to +6.5V

Voltage on VDD with respect to VSS, PIC10LF320/322 ...................................................................... -0.3V to +4.0V

Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V

Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V)

Total power dissipation(1) ............................................................................................................................... 800 mW

Maximum current out of VSS pin, -40°C  TA  +85°C for industrial............................................................... 200 mA

Maximum current out of VSS pin, -40°C  TA  +125°C for extended ............................................................ 120 mA

Maximum current into VDD pin, -40°C  TA  +85°C for industrial.................................................................. 200 mA

Maximum current into VDD pin, -40°C  TA  +125°C for extended ............................................................... 120 mA

Clamp current, IK (VPIN < 0 or VPIN > VDD)20 mA

Maximum output current sunk by any I/O pin.................................................................................................... 25 mA

Maximum output current sourced by any I/O pin .............................................................................................. 25 mA

Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD –  IOH} +  {(VDD – VOH) x IOH} + (VOl x IOL).

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above

those indicated in the operation listings of this specification is not implied. Exposure above maximum rating condi-

tions for extended periods may affect device reliability.

PIC10(L)F320/322

DS41585A-page 170 Preliminary  2011 Microchip Technology Inc.

FIGURE 24-1: PIC10F320/322 VOLTAGE FREQUENCY GRAPH, -40°C





+125°C

FIGURE 24-2: PI C10LF 32 0/32 2 VOLTAGE FREQUENCY GRAPH, -40°C





+125°C

2.5

Frequency (MHz)

VDD (V)

Note 1: The shaded region indicates the permissible combinations of voltage and frequency.

2: Refer to Table 24-1 for each Oscillator mode’s supported frequencies.

42010 16

5.5

2.3

1.8

2.5

Frequency (MHz )

VDD (V)

Note 1: The shaded region indicates the permissible combinations of voltage and frequency.

2: Refer to Table 24-1 for each Oscillator mode’s supported frequencies.

420

10 16

3.6

 2011 Microchip Technology Inc. Preliminary DS41585A-page 171

PIC10(L)F320/322

24.1 DC Characteristics: PIC10(L)F320/322-I/E (Industri al, Extended)

PIC10LF320/322 Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +85°C for industrial

-40°C  TA  +125°C for extended

PIC10F320/322 Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +85°C for industrial

-40°C  TA  +125°C for extended

Param.

No. Sym. Characteristic Min. Typ† Max. Units Conditions

D001 VDD Supply Voltage

PIC10LF320/322 1.8

2.5

—

3.6

FOSC  16 MHz:

FOSC  20 MHz

D001 PIC10F320/322 2.3

2.5

—

5.5

FOSC  16 MHz:

FOSC  20 MHz

D002* VDR RAM Data Retentio n Voltage(1)

PIC10LF320/322 1.5 — — V Device in Sleep mode

D002* PIC10F320/322 1.7 — — V Device in Sleep mode

VPOR*Power-on Reset Release Voltage —1.6— V

VPORR*Power-on R eset Rearm Voltage

PIC10LF320/322 — 0.8 — V Device in Sleep mode

PIC10F320/322 —1.7 — V Device in Sleep mode

D003 VADFVR Fixed Voltage Reference Voltage

for ADC, Initial Accuracy -7

-8

-7

-8

-7

-8

% 1.024V, VDD  2.5V, 85°C

1.024V, VDD  2.5V, 125°C

2.048V, VDD  2.5V, 85°C

2.048V, VDD  2.5V, 125°C

4.096V, VDD  4.75V, 85°C

4.096V, VDD  4.75V, 125°C

D003C* TCVFVR Temperature Coefficient, Fixed

Voltage Reference — -130 — ppm/°C

D003D* VFVR/

VIN

Line Regulation, Fixed Voltage

Reference — 0.270 — %/V

D004* SVDD VDD Rise Rate to ensure internal

Power-on Reset signal

0.05 — — V/ms See Section 5.1 “Power-on Reset

(POR)” for details.

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. These parameters are for design guidance only and are not

tested.

Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.

PIC10(L)F320/322

DS41585A-page 172 Preliminary  2011 Microchip Technology Inc.

FIGURE 24-3: POR AND POR REARM WITH SLOW RISING VDD

VDD

VPOR

VPORR

VSS

NPOR

TPOR(3)

POR REARM

Note 1: When NPOR is low, the device is held in Reset.

2: TPOR 1 s typical.

3: TVLOW 2.7 s typical.

TVLOW(2)

 2011 Microchip Technology Inc. Preliminary DS41585A-page 173

PIC10(L)F320/322

24.2 DC Characteristics: PIC10(L)F320/322-I/E (Industri al, Extended)

PIC10LF320/322 Standard Operating Conditions (unless otherwise st ated)

Operating temperature -40°C  TA  +85°C for industrial

-40°C  TA  +125°C for extended

PIC10F320/322 Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +85°C for industrial

-40°C  TA  +125°C for extended

Param

No. Device

Characteristics Min. Typ† Max. Units Conditions

VDD Note

Supply Current (IDD)(1, 2)

D009 LDO Regulator —350 —A — EC OR INTOSC (8-16 MHZ)

— 5 — A — Sleep with Power-Save mode (requires FVR

and BOR to be disabled)

D013 — 140 — A1.8FOSC = 500 kHz

EC mode

— 317 — A3.0

D013 —156 —A2.3 FOSC = 500 kHz

EC mode

—336 —A3.0

—384 —A5.0

D014 — 225 — A1.8FOSC = 8 MHz

EC mode

— 475 — A3.0

D014 —250 —A2.3 FOSC = 8 MHz

EC mode

—500 —A3.0

—600 —A5.0

D015 — 3.4 — mA 3.0 FOSC = 20 MHz

EC mode

—4.1 — mA 3.6

D015 —3.6 —mA 3.0 FOSC = 20 MHz

EC mode

—3.9 —mA 5.0

D016 — 7 — A1.8FOSC = 32 kHz

LFINTOSC mode, 85°C

—10 — A3.0

D016 —21 —A2.3 FOSC = 32 kHz

LFINTOSC mode, 85°C

—27 —A3.0

—28 —A5.0

D016A — 8 — A1.8FOSC = 32 kHz

LFINTOSC mode, 125°C

—11 — A3.0

Note 1: The test conditions for all IDD measurements in active operation mode are: CLKIN = external square wave, from

rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading

and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current

consumption.

PIC10(L)F320/322

DS41585A-page 174 Preliminary  2011 Microchip Technology Inc.

D017 Supply Current (IDD)(1, 2)

— 130 — A1.8FOSC = 500 kHz

HFINTOSC mode

— 190 — A3.0

D017 —150 —A2.3 FOSC = 500 kHz

HFINTOSC mode

—210 —A3.0

—270 —A5.0

D018 — 800 — A1.8FOSC = 8 MHz

HFINTOSC mode

— 1300 — A3.0

D018 —0.85 —mA 2.3 FOSC = 8 MHz

HFINTOSC mode

—1.4 —mA 3.0

—1.6 —mA 5.0

D019 — 1.25 — mA 1.8 FOSC = 16 MHz

HFINTOSC mode

—2.0 — mA 3.0

D019 —1.4 —mA 2.3 FOSC = 16 MHz

HFINTOSC mode

—2.2 —mA 3.0

—2.4 —mA 5.0

24.2 DC Characteristics: PIC10(L)F320/322-I/E (Industri al, Extended) (Cont inued)

PIC10LF320/322 Standard Operati ng C onditions (unles s otherwise s tated)

Operating temperature -40°C  TA  +85°C for industrial

-40°C  TA  +125°C for extended

PIC10F320/322 Standard Operating Conditions (unless ot he r wis e sta ted)

Operating temperature -40°C  TA  +85°C for industrial

-40°C  TA  +125°C for extended

Param

No. Device

Characteristics Min. Typ† Max. Units Conditions

VDD Note

Note 1: The test conditions for all IDD measurements in active operation mode are: CLKIN = external square wave, from

rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading

and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current

consumption.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 175

PIC10(L)F320/322

24.3 DC Characteristics: PIC10(L)F320/322-I /E (Power-Down)

PIC10LF320/322 Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +85°C for industrial

-40°C  TA  +125°C for extended

PIC10F320/322 Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +85°C for industrial

-40°C  TA  +125°C for extended

Param

No. Device Characteristics Min. Typ† Max.

+85°C Max.

+125°C Units Conditions

VDD Note

Power-down Base Current (IPD)(2)

D023 — 0.06 — — A 1.8 WDT, BOR, and FVR disabled,

all Peripherals Inactive

—0.08 — — A3.0

D023 —15 — — A2.3 WDT, BOR, and FVR disabled,

all Peripherals Inactive

—18 — — A3.0

—19 — — A5.0

D024 — 0.5 — — A 1.8 LPWDT Current (No te 1)

—0.8 — — A3.0

D024 —16 — — A2.3 LPWDT Current (Note 1)

—19 — — A3.0

—20 — — A5.0

D025 — 8.5 — — A 1.8 FVR current

—8.5 — — A3.0

D025 —32 — — A2.3 FVR current

—39 — — A3.0

—70 — — A5.0

D026 — 7.5 — — A 3.0 BOR Current (Note 1)

D026 —34 — — A3.0 BOR Current (Note 1)

—67 — — A5.0

D028 — 0.1 — — A 1.8 A/D Current (Note 1, Note 3), no

conversion in progress

—0.1 — — A3.0

D028 —16 — — A2.3 A/D Current (Note 1, Note 3), no

conversion in progress

—21 — — A3.0

—25 — — A5.0

D029 — 250 — — A 1.8 A/D Current (Note 1, Note 3),

conversion in progress

—250 — — A3.0

D029 —280 — — A2.3 A/D Current (Note 1, Note 3),

conversion in progress

—280 — — A3.0

—280 — — A5.0

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are

not tested.

Legend: TBD = To Be Determined

Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is

enabled. The peripheral  current can be determined by subtracting the base IDD or IPD current from this limit. Max

values should be used when calculating total current consumption.

2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.

3: A/D oscillator source is FRC.

PIC10(L)F320/322

DS41585A-page 176 Preliminary  2011 Microchip Technology Inc.

24.4 DC Characteristics: PIC10(L)F320/322-I/E

DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +85°C for industrial

-40°C  TA  +125°C for extended

Param

No. Sym. Characteristic Min. Typ† Max. Units Conditions

VIL Input Low Voltage

I/O PORT:

D032 with TTL buffer — — 0.8 V 4.5V  VDD  5.5V

D032A — — 0.15 VDD V1.8V  VDD  4.5V

D033 with Schmitt Trigger buffer — — 0.2 VDD V2.0V  VDD  5.5V

D034 MCLR ——0.2VDD V

VIH Input H igh Voltage

I/O ports:

D040 with TTL buffer 2.0 — — V 4.5V  VDD 5.5V

D040A 0.25 VDD +

0.8

——V1.8V  VDD  4.5V

D041 with Schmitt Trigger buffer 0.8 VDD ——V2.0V  VDD  5.5V

D042 MCLR 0.8 VDD ——V

IIL Input Leakage Current(2)

D060 I/O ports — ± 5

± 5

± 125

± 1000

VSS  VPIN  VDD, Pin at

high-impedance @ 85°C

125°C

D061 MCLR —± 50± 200nAVSS  VPIN  VDD @ 85°C

IPUR Weak Pull-up Current

D070* 25

100

140

200

300 A

VDD = 3.3V, VPIN = VSS

VDD = 5.0V, VPIN = VSS

VOL Output Low Voltage

D080 I/O ports

——0.6V

IOL = 8mA, VDD = 5V

IOL = 6mA, VDD = 3.3V

IOL = 1.8mA, VDD = 1.8V

VOH Output High Voltage

D090 I/O ports

VDD - 0.7 — — V

IOH = 3.5mA, VDD = 5V

IOH = 3mA, VDD = 3.3V

IOH = 1mA, VDD = 1.8V

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are

not tested.

Note 1: Negative current is defined as current sourced by the pin.

2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent

normal operating conditions. Higher leakage current may be measured at different input voltages.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 177

PIC10(L)F320/322

24.5 Memory Programming Requirements

DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +125°C

Param

No. Sym. Characteristic Min. Typ† Max. Units Conditions

Program Memory Programming

Specifications

D110 VIHH Voltage on MCLR/VPP pin 8.0 — 9.0 V (Note 2, Note 3)

D111 IDDP Supply Current during Programming — — 10 mA

D112 VDD for Bulk Erase 2.7 — VDD

max.

D113 VPEW VDD for Write or Row Erase VDD

min.

—V

max.

D114 IPPPGM Current on MCLR/VPP during

Erase/Write

——1.0mA

D115 IDDPGM Current on VDD during Erase/Write — 5.0 mA

Program Flash Memory

D121 EPCell Endurance 10K — — E/W -40C to +85C (Note 1)

D122 VPR VDD for Read VDD

min.

—V

max.

D123 TIW Self-timed Write Cycle Time — 2 2.5 ms

D124 TRETD Characteristic Retention 40 — — Year Provided no other

specifications are violated

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are

not tested.

Note 1: Self-write and Block Erase.

2: Required only if single-supply programming is disabled.

3: The MPLAB ICD 2 does not support variable VPP output. Circuitry to limit the ICD 2 VPP voltage must be placed

between the ICD 2 and target system when programming or debugging with the ICD 2.

PIC10(L)F320/322

DS41585A-page 178 Preliminary  2011 Microchip Technology Inc.

24.6 Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +125°C

Param

No. Sym. Characteristic Typ. Units Conditions

TH01 JA Thermal Resistance Junction to Ambient 60 C/W 6-pin SOT-23 package

80 C/W 8-pin PDIP package

90 C/W 8-pin DFN package

TH02 JC Thermal Resistance Junction to Case 31.4 C/W 6-pin SOT-23 package

24 C/W 8-pin PDIP package

24 C/W 8-pin DFN package

TH03 TJMAX Maximum Junction Temperature 150 C

TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O

TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD(1)

TH06 PI/OI/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))

TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/JA(2)

Note 1: IDD is current to run the chip alone without driving any load on the output pins.

2: TA = Ambient Temperature

3: TJ = Junction Temperature

 2011 Microchip Technology Inc. Preliminary DS41585A-page 179

PIC10(L)F320/322

24.7 Timing Parameter Symbology

The timing parameter symbols have been created with

one of the following formats:

FIGURE 24-4: LOAD CONDITIONS

1. TppS2ppS

2. TppS

F Frequency T Time

Lowercase letters (pp) and their meanings:

cc CCP1 osc CLKIN

ck CLKR rd RD

cs CS rw RD or WR

di SDI sc SCK

do SDO ss SS

dt Data in t0 T0CKI

io I/O PORT t1 T1CKI

mc MCLR wr WR

Uppercase letters and their meanings:

FFall PPeriod

HHigh RRise

I Invalid (High-impedance) V Valid

L Low Z High-impedance

Vss

Legend: CL = 50 pF for all pins

Load Condition

PIC10(L)F320/322

DS41585A-page 180 Preliminary  2011 Microchip Technology Inc.

24.8 AC Characteristics: PIC10(L)F320/322-I/E

FIGURE 24-5: CLOCK TIMING

TABLE 24-1: CLOCK OSCILLATOR TIMING REQUIREMENTS

TABLE 24-2: OSCILLATOR PARAMETERS

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +125°C

Param

No. Sym. Characteristic Min. Typ† Max. Units Conditions

OS01 FOSC External CLKIN Frequency(1) DC — 20 MHz EC mode

OS02 TOSC External CLKIN Period(1) 31.25 — ns EC Oscillator mode

OS03 TCY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not

tested.

Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on

characterization data for that particular oscillator type under standard operating conditions with the device executing code.

Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-

sumption. All devices are tested to operate at “min” values with an external clock applied to CLKIN pin. When an external

clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.

Standard Operating Conditions (unless otherwise stated)

Operating Temperature -40°C TA +125°C

Param

No. Sym. Characteristic Freq.

Tolerance Min. Typ† Max. Units Conditions

OS08 HFOSC Internal Calibrated HFINTOSC

Frequency(1) ±2%

±3%

—

16.0

—

MHz

0°C  TA  +60°C, VDD 2.5V

60°C TA 85°C, VDD 2.5V

±5% — 16.0 — MHz -40°C  TA  +125°C

OS09 LFOSC Internal LFINTOSC Frequency — — 31 — kHz -40°C  TA  +125°C

OS10* TIOSC ST HFINTOSC

Wake-up from Sleep Start-up Time

——58s

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not

tested.

Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as

possible. 0.1 F and 0.01 F values in parallel are recommended.

CLKIN

CLKR

Q4 Q1 Q2 Q3 Q4 Q1

OS02

OS03

(CLKROE = 1)

 2011 Microchip Technology Inc. Preliminary DS41585A-page 181

PIC10(L)F320/322

FIGURE 24-6: CLKR AN D I/O TIMING

TABLE 24-3: CLKR AND I/O TIMING PARAMETERS

S tandard Operating Conditions (unless othe rwis e stated)

Operating Temperature -40°C T

A +125°C

Param

No. Sym. Characteristic Min. Typ† Max. Units Conditions

OS11 TosH2ckL FOSC to CLKR (1) ——70nsVDD = 3.3-5.0V

OS12 TosH2ckH FOSC to CLKR (1) ——72nsVDD = 3.3-5.0V

OS13 TckL2ioV CLKR to Port out valid(1) ——20ns

OS14 TioV2ckH Port input valid before CLKR(1) TOSC + 200 ns — — ns

OS15 TosH2ioV Fosc (Q1 cycle) to Port out valid — 50 70* ns VDD = 3.3-5.0V

OS16 TosH2ioI Fosc (Q2 cycle) to Port input invalid

(I/O in hold time)

50 — — ns VDD = 3.3-5.0V

OS17 TioV2osH Port input valid to Fosc(Q2 cycle)

(I/O in setup time)

20 — — ns

OS18 TioR Port output rise time —

—

ns VDD = 1.8V

VDD = 3.3-5.0V

OS19 TioF Port output fall time —

—

ns VDD = 1.8V

VDD = 3.3-5.0V

OS20* Tinp INT pin input high or low time 25 — — ns

OS21* Tioc Interrupt-on-change new input level

time

25 — — ns

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.0V, 25C unless otherwise stated.

Note1: Measurements are taken in EC mode where CLKR output is 4 x TOSC.

FOSC

CLKR

I/O pin

(Input)

I/O pin

(Output)

Q4 Q1 Q2 Q3

OS11

OS19

OS13

OS15

OS18, OS19

OS20

OS21

OS17

OS16

OS14

OS12

OS18

Old Value New Value

Write Fetch Read ExecuteCycle

PIC10(L)F320/322

DS41585A-page 182 Preliminary  2011 Microchip Technology Inc.

FIGURE 24-7: RESET, WATCHDOG TIMER, AND POWER-UP TIMER TI MING

FIGURE 24-8: BROW N-OUT RESET TIMING AND CHARACTERISTICS

VDD

MCLR

Internal

POR

PWRT

Time-out

Internal Reset(1)

Watchdog Timer

I/O pins

Note1: Asserted low.

Reset(1)

VBOR

VDD

(Device in Brown-out Reset) (Device not in Brown-out Reset)

33(1)

Note 1: 64 ms delay only if PWRTE bit in the Configuration Word register is programmed to ‘0’.

Reset

(due to BOR)

VBOR and VHYST

 2011 Microchip Technology Inc. Preliminary DS41585A-page 183

PIC10(L)F320/322

TABLE 24-4: RESET, WATCHDOG TIMER, POWER-UP TIMER AND BROWN-OUT RESET

PARAMETERS

FIGURE 24-9: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS

TABLE 24-5: T IMER0 EXTERNAL CLOCK REQUIREMENTS

Standard Operating Conditions (unless otherwise stated)

Operating Temperature -40°C TA +125°C

Param

No. Sym. Characteristic Min. Typ† Max. Units Conditions

30 TMCLMCLR Pulse Width (low) 2

—

s

VDD = 3.3-5V, -40°C to +85°C

VDD = 3.3-5V

31 TWDTLP Low-Power Watchdog Timer

Time-out Period

10 16 27 ms VDD = 3.3V-5V

1:16 Prescaler used

33* TPWRT Power-up Timer Period, PWRTE =040 64 140 ms

34* TIOZ I/O high-impedance from MCLR Low

or Watchdog Timer Reset

——2.0s

35 VBOR Brown-out Reset Voltage TBD

2.38

1.80

2.7

2.4

1.9

TBD

2.73

2.11

BORV = 2.7V

BORV = 2.4V (PIC10F320/322)

BORV = 1.9V (PIC10LF320/322)

36* VHYST Brown-out Reset Hysteresis 0 25 50 mV -40°C to +85°C

37* TBORDC Brown-out Reset DC Response Time 1 3 5 sVDD  VBOR

Legend: TBD = To Be Determined

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only

and are not tested.

Standard Operating Conditions (unless otherwise stated)

Operating Temperature -40°C TA +125°C

Param

No. Sym. Characteristic Min. Typ† Max. Units Conditions

40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 — — ns

With Prescaler 10 — — ns

41* TT0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 — — ns

With Prescaler 10 — — ns

42* TT0P T0CKI Period Greater of:

20 or TCY + 40

— — ns N = prescale value

(2, 4, ..., 256)

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not

tested.

T0CKI

40 41

TMR0

PIC10(L)F320/322

DS41585A-page 184 Preliminary  2011 Microchip Technology Inc.

TABLE 24-6: PIC10(L)F320/322 A/D CONVERTER (ADC) CHARACTERISTICS:

TABLE 24-7: PIC10(L)F320/322 A/D CONVERSION REQUIREMENTS

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +125°C

Param

No. Sym. Characteristic Min. Typ† Max. Units Conditions

AD01 NRResolution — — 8 bit

AD02 EIL Integral Error — — ±1.7 LSb VREF = 3.0V

AD03 EDL Differential Error — — ±1 LSb No missing codes

VREF = 3.0V

AD04 EOFF Offset Error — — ±2.5 LSb VREF = 3.0V

AD05 EGN Gain Error — — ±2.0 LSb VREF = 3.0V

AD06 VREF Reference Voltage(3) 1.8 — VDD VVREF = (VREF+ minus VREF-) (Note 5)

AD07 VAIN Full-Scale Range VSS —VREF V

AD08 ZAIN Recommended Impedance of

Analog Voltage Source

—— 10

kCan go higher if external 0.01F capacitor is

present on input pin.

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not

tested.

Note 1: Total Absolute Error includes integral, differential, offset and gain errors.

2: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes.

3: ADC VREF is from external VREF, VDD pin or FVR, whichever is selected as reference input.

4: When ADC is off, it will not consume any current other than leakage current. The power-down current specification

includes any such leakage from the ADC module.

5: FVR voltage selected must be 2.048V or 4.096V.

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  TA  +125°C

Param

No. Sym. Characteristic Min. Typ† Max. Units Conditions

AD130* TAD A/D Clock Period 1.0 — 9.0 sTOSC-based

A/D Internal FRC Oscillator

Period

1.0 1.6 6.0 s ADCS<1:0> = 11 (ADRC mode)

AD131 TCNV Conversion Time (not including

Acquisition Time)(1) —9.5—TAD Set GO/DONE bit to conversion

complete

AD132* TACQ Acquisition Time — 5.0 — s

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not

tested.

Note 1: The ADRES register may be read on the following TCY cycle.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 185

PIC10(L)F320/322

FIGURE 24-10: PIC10(L)F320/322 A/D CONVERSION TIMING (NORMAL MODE)

FIGURE 24-11: PIC10(L)F320/322 A/D CONVERSION TIMING (SLEEP MODE)

AD131

AD130

BSF ADCON, GO

A/D CLK

A/D Data

ADRES

ADIF

Sample

OLD_DATA

Sampling Stopped

DONE

NEW_DATA

765 3210

Note 1: If the A/D clock source is selected as FRC, a time of TCY is added before the A/D clock starts. This allows the

SLEEP instruction to be executed.

1 Tcy

AD134 (TOSC/2(1))

1 Tcy

AD132

AD131

AD130

BSF ADCON, GO

A/D CLK

A/D Data

ADRES

ADIF

Sample

OLD_DATA

Sampling Stopped

DONE

NEW_DATA

7 5 3210

Note 1: If the A/D clock source is selected as FRC, a time of TCY is added before the A/D clock starts. This allows the

SLEEP instruction to be executed.

AD134

1 Tcy

(TOSC/2 + TCY(1))

1 Tcy

PIC10(L)F320/322

DS41585A-page 186 Preliminary  2011 Microchip Technology Inc.

NOTES:

 2011 Microchip Technology Inc. Preliminary DS41585A-page 187

PIC10(L)F320/322

25.0 DC AND AC

CHARACTERISTICS GRAPHS

AND CHARTS

Graphs and charts are not available at this time.

PIC10(L)F320/322

DS41585A-page 188 Preliminary  2011 Microchip Technology Inc.

NOTES:

 2011 Microchip Technology Inc. Preliminary DS41585A-page 189

PIC10(L)F320/322

26.0 DEVELOPMENT SUPPORT

The PIC® microcontrollers and dsPIC® digital signal

controllers are supported with a full range of software

and hardware development tools:

• Integrated Development Environment

- MPLAB® IDE Software

• Compilers/Assemblers/Linkers

- MPLAB C Compiler for Various Device

Families

- HI-TECH C for Various Device Families

- MPASMTM Assembler

-MPLINK

TM Object Linker/

MPLIBTM Object Librarian

- MPLAB Assembler/Linker/Librarian for

Various Device Families

• Simulators

- MPLAB SIM Software Simulator

•Emulators

- MPLAB REAL ICE™ In-Circuit Emulator

• In-Circuit Debuggers

- MPLAB ICD 3

- PICkit™ 3 Debug Express

• Device Programmers

- PICkit™ 2 Programmer

- MPLAB PM3 Device Programmer

• Low-Cost Demonstration/Development Boards,

Evaluation Kits, and Starter Kits

26.1 MPLAB Integrated Development

Environment Software

The MPLAB IDE software brings an ease of software

development previously unseen in the 8/16/32-bit

microcontroller market. The MPLAB IDE is a Windows®

operating system-based application that contains:

• A single graphical interface to all debugging tools

- Simulator

- Programmer (sold separately)

- In-Circuit Emulator (sold separately)

- In-Circuit Debugger (sold separately)

• A full-featured editor with color-coded context

• A multiple project manager

• Customizable data windows with direct edit of

contents

• High-level source code debugging

• Mouse over variable inspection

• Drag and drop variables from source to watch

windows

• Extensive on-line help

• Integration of select third party tools, such as

IAR C Compilers

The MPLAB IDE allows you to:

• Edit your source files (either C or assembly)

• One-touch compile or assemble, and download to

emulator and simulator tools (automatically

updates all project information)

• Debug using:

- Source files (C or assembly)

- Mixed C and assembly

- Machine code

MPLAB IDE supports multiple debugging tools in a

single development paradigm, from the cost-effective

simulators, through low-cost in-circuit debuggers, to

full-featured emulators. This eliminates the learning

curve when upgrading to tools with increased flexibility

and power.

PIC10(L)F320/322

DS41585A-page 190 Preliminary  2011 Microchip Technology Inc.

26.2 MPLAB C Compilers for Various

Device Families

The MPLAB C Compiler code development systems

are complete ANSI C compilers for Microchip’s PIC18,

PIC24 and PIC32 families of microcontrollers and the

dsPIC30 and dsPIC33 families of digital signal control-

lers. These compilers provide powerful integration

capabilities, superior code optimization and ease of

use.

For easy source level debugging, the compilers provide

symbol information that is optimized to the MPLAB IDE

debugger.

26.3 HI-TECH C for Various Device

Families

The HI-TECH C Compiler code development systems

are complete ANSI C compilers for Microchip’s PIC

family of microcontrollers and the dsPIC family of digital

signal controllers. These compilers provide powerful

integration capabilities, omniscient code generation

and ease of use.

For easy source level debugging, the compilers provide

symbol information that is optimized to the MPLAB IDE

debugger.

The compilers include a macro assembler, linker, pre-

processor, and one-step driver, and can run on multiple

platforms.

26.4 MPASM Assembler

The MPASM Assembler is a full-featured, universal

macro assembler for PIC10/12/16/18 MCUs.

The MPASM Assembler generates relocatable object

files for the MPLINK Object Linker, Intel® standard HEX

files, MAP files to detail memory usage and symbol

reference, absolute LST files that contain source lines

and generated machine code and COFF files for

debugging.

The MPASM Assembler features include:

• Integration into MPLAB IDE projects

• User-defined macros to streamline

assembly code

• Conditional assembly for multi-purpose

source files

• Directives that allow complete control over the

assembly process

26.5 MPLINK Object Linker/

MPLIB Object Librarian

The MPLINK Object Linker combines relocatable

objects created by the MPASM Assembler and the

MPLAB C18 C Compiler. It can link relocatable objects

from precompiled libraries, using directives from a

linker script.

The MPLIB Object Librarian manages the creation and

modification of library files of precompiled code. When

a routine from a library is called from a source file, only

the modules that contain that routine will be linked in

with the application. This allows large libraries to be

used efficiently in many different applications.

The object linker/library features include:

• Efficient linking of single libraries instead of many

smaller files

• Enhanced code maintainability by grouping

related modules together

• Flexible creation of libraries with easy module

listing, replacement, deletion and extraction

26.6 MPLAB Assembler, Linker and

Librarian for Various Device

Families

MPLAB Assembler produces relocatable machine

code from symbolic assembly language for PIC24,

PIC32 and dsPIC devices. MPLAB C Compiler uses

the assembler to produce its object file. The assembler

generates relocatable object files that can then be

archived or linked with other relocatable object files and

archives to create an executable file. Notable features

of the assembler include:

• Support for the entire device instruction set

• Support for fixed-point and floating-point data

• Command line interface

• Rich directive set

• Flexible macro language

• MPLAB IDE compatibility

 2011 Microchip Technology Inc. Preliminary DS41585A-page 191

PIC10(L)F320/322

26.7 MPLAB SIM Software Simulator

The MPLAB SIM Software Simulator allows code

development in a PC-hosted environment by simulat-

ing the PIC MCUs and dsPIC® DSCs on an instruction

level. On any given instruction, the data areas can be

examined or modified and stimuli can be applied from

a comprehensive stimulus controller. Registers can be

logged to files for further run-time analysis. The trace

buffer and logic analyzer display extend the power of

the simulator to record and track program execution,

actions on I/O, most peripherals and internal registers.

The MPLAB SIM Software Simulator fully supports

symbolic debugging using the MPLAB C Compilers,

and the MPASM and MPLAB Assemblers. The soft-

ware simulator offers the flexibility to develop and

debug code outside of the hardware laboratory envi-

ronment, making it an excellent, economical software

development tool.

26.8 MPLAB REAL ICE In-Circuit

Emulator System

MPLAB REAL ICE In-Circuit Emulator System is

Microchip’s next generation high-speed emulator for

Microchip Flash DSC and MCU devices. It debugs and

programs PIC® Flash MCUs and dsPIC® Flash DSCs

with the easy-to-use, powerful graphical user interface of

the MPLAB Integrated Development Environment (IDE),

included with each kit.

The emulator is connected to the design engineer’s PC

using a high-speed USB 2.0 interface and is connected

to the target with either a connector compatible with in-

circuit debugger systems (RJ11) or with the new high-

speed, noise tolerant, Low-Voltage Differential Signal

(LVDS) interconnection (CAT5).

The emulator is field upgradable through future firmware

downloads in MPLAB IDE. In upcoming releases of

MPLAB IDE, new devices will be supported, and new

features will be added. MPLAB REAL ICE offers

significant advantages over competitive emulators

including low-cost, full-speed emulation, run-time

variable watches, trace analysis, complex breakpoints, a

ruggedized probe interface and long (up to three meters)

interconnection cables.

26.9 MPLAB ICD 3 In-Circuit Debugger

System

MPLAB ICD 3 In-Circuit Debugger System is Micro-

chip's most cost effective high-speed hardware

debugger/programmer for Microchip Flash Digital Sig-

nal Controller (DSC) and microcontroller (MCU)

devices. It debugs and programs PIC® Flash microcon-

trollers and dsPIC® DSCs with the powerful, yet easy-

to-use graphical user interface of MPLAB Integrated

Development Environment (IDE).

The MPLAB ICD 3 In-Circuit Debugger probe is con-

nected to the design engineer's PC using a high-speed

USB 2.0 interface and is connected to the target with a

connector compatible with the MPLAB ICD 2 or MPLAB

REAL ICE systems (RJ-11). MPLAB ICD 3 supports all

MPLAB ICD 2 headers.

26.10 PICkit 3 In-Circuit Debugger/

Programmer and

PICkit 3 Debug Express

The MPLAB PICkit 3 allows debugging and program-

ming of PIC® and dsPIC® Flash microcontrollers at a

most affordable price point using the powerful graphical

user interface of the MPLAB Integrated Development

Environment (IDE). The MPLAB PICkit 3 is connected

to the design engineer's PC using a full speed USB

interface and can be connected to the target via an

Microchip debug (RJ-11) connector (compatible with

MPLAB ICD 3 and MPLAB REAL ICE). The connector

uses two device I/O pins and the reset line to imple-

ment in-circuit debugging and In-Circuit Serial Pro-

gramming™.

The PICkit 3 Debug Express include the PICkit 3, demo

board and microcontroller, hookup cables and CDROM

with user’s guide, lessons, tutorial, compiler and

MPLAB IDE software.

PIC10(L)F320/322

DS41585A-page 192 Preliminary  2011 Microchip Technology Inc.

26.11 PICkit 2 Development

Programmer/Debugger and

PICkit 2 Debug Express

The PICkit™ 2 Development Programmer/Debugger is

a low-cost development tool with an easy to use inter-

face for programming and debugging Microchip’s Flash

families of microcontrollers. The full featured

Windows® programming interface supports baseline

(PIC10F, PIC12F5xx, PIC16F5xx), midrange

(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,

dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit

microcontrollers, and many Microchip Serial EEPROM

products. With Microchip’s powerful MPLAB Integrated

Development Environment (IDE) the PICkit™ 2

enables in-circuit debugging on most PIC® microcon-

trollers. In-Circuit-Debugging runs, halts and single

steps the program while the PIC microcontroller is

embedded in the application. When halted at a break-

point, the file registers can be examined and modified.

The PICkit 2 Debug Express include the PICkit 2, demo

board and microcontroller, hookup cables and CDROM

with user’s guide, lessons, tutorial, compiler and

MPLAB IDE software.

26.12 MPLAB PM3 Device Programmer

The MPLAB PM3 Device Programmer is a universal,

CE compliant device programmer with programmable

voltage verification at VDDMIN and VDDMAX for

maximum reliability. It features a large LCD display

(128 x 64) for menus and error messages and a modu-

lar, detachable socket assembly to support various

package types. The ICSP™ cable assembly is included

as a standard item. In Stand-Alone mode, the MPLAB

PM3 Device Programmer can read, verify and program

PIC devices without a PC connection. It can also set

code protection in this mode. The MPLAB PM3

connects to the host PC via an RS-232 or USB cable.

The MPLAB PM3 has high-speed communications and

optimized algorithms for quick programming of large

memory devices and incorporates an MMC card for file

storage and data applications.

26.13 Demonstration/Development

Boards, Evaluation Kits, and

Starter Kits

A wide variety of demonstration, development and

evaluation boards for various PIC MCUs and dsPIC

DSCs allows quick application development on fully func-

tional systems. Most boards include prototyping areas for

adding custom circuitry and provide application firmware

and source code for examination and modification.

The boards support a variety of features, including LEDs,

temperature sensors, switches, speakers, RS-232

interfaces, LCD displays, potentiometers and additional

EEPROM memory.

The demonstration and development boards can be

used in teaching environments, for prototyping custom

circuits and for learning about various microcontroller

applications.

In addition to the PICDEM™ and dsPICDEM™ demon-

stration/development board series of circuits, Microchip

has a line of evaluation kits and demonstration software

for analog filter design, KEELOQ® security ICs, CAN,

IrDA®, PowerSmart battery management, SEEVAL®

evaluation system, Sigma-Delta ADC, flow rate

sensing, plus many more.

Also available are starter kits that contain everything

needed to experience the specified device. This usually

includes a single application and debug capability, all

on one board.

Check the Microchip web page (www.microchip.com)

for the complete list of demonstration, development

and evaluation kits.

 2011 Microchip Technology Inc. Preliminary DS41585A-page 193

PIC10(L)F320/322

27.0 PACKAGING INFORMATION

27.1 Package Marking Information

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

6-Lead SOT-23 Example

XXNN

8-Lead PDIP (300 mil) Example

XXXXXXXX

XXXXXNNN

YYWW

8-Lead DFN (2x3x0.9 mm) Example

10F320

1110

I/P 07Q

LA11

BAA

110

PIC10(L)F320/322

DS41585A-page 194 Preliminary  2011 Microchip Technology Inc.

TABLE 27-1: 8-LEAD 2x3 DFN (MC) TOP

MARKING TABLE 27-2: 6-LEAD SOT-23 (OT)

PACKAGE TOP MARKING

Part Number Marking

PIC10F322(T)-I/MC BAA

PIC10F322(T)-E/MC BAB

PIC10F320(T)-I/MC BAC

PIC10F320(T)-E/MC BAD

PIC10LF322(T)-I/MC BAF

PIC10LF322(T)-E/MC BAG

PIC10LF320(T)-I/MC BAH

PIC10LF320(T)-E/MC BAJ

Part Number Marking

PIC10F322(T)-I/OT LA

PIC10F322(T)-E/OT LB

PIC10F320(T)-I/OT LC

PIC10F320(T)-E/OT LD

PIC10LF322(T)-I/OT LE

PIC10LF322(T)-E/OT LF

PIC10LF320(T)-I/OT LG

PIC10LF320(T)-E/OT LH

 2011 Microchip Technology Inc. Preliminary DS41585A-page 195

PIC10(L)F320/322

27.2 Package Details

The following sections give the technical details of the packages.

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2YHUDOO+HLJKW $  ± 

0ROGHG3DFNDJH7KLFNQHVV $  ± 

6WDQGRII $  ± 

2YHUDOO:LGWK (  ± 

0ROGHG3DFNDJH:LGWK (  ± 

2YHUDOO/HQJWK '  ± 

)RRW/HQJWK /  ± 

)RRWSULQW /  ± 

)RRW$QJOH  ± 

/HDG7KLFNQHVV F  ± 

/HDG:LGWK E  ± 

PIN 1 ID BY

LASER MARK

123

A2 c

0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%

PIC10(L)F320/322

DS41585A-page 196 Preliminary  2011 Microchip Technology Inc.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

 2011 Microchip Technology Inc. Preliminary DS41585A-page 197

PIC10(L)F320/322

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 6LJQLILFDQW&KDUDFWHULVWLF

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KWWSZZZPLFURFKLSFRPSDFNDJLQJ

8QLWV ,1&+(6

'LPHQVLRQ/LPLWV 0,1 120 0$;

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3LWFK H %6&

7RSWR6HDWLQJ3ODQH $ ± ± 

0ROGHG3DFNDJH7KLFNQHVV $   

%DVHWR6HDWLQJ3ODQH $  ± ±

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0ROGHG3DFNDJH:LGWK (   

2YHUDOO/HQJWK '   

7LSWR6HDWLQJ3ODQH /   

/HDG7KLFNQHVV F   

8SSHU/HDG:LGWK E   

/RZHU/HDG:LGWK E   

2YHUDOO5RZ6SDFLQJ H% ± ± 

NOTE 1

123

0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%

PIC10(L)F320/322

DS41585A-page 198 Preliminary  2011 Microchip Technology Inc.

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6WDQGRII $   

&RQWDFW7KLFNQHVV $ 5()

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([SRVHG3DG/HQJWK '  ± 

([SRVHG3DG:LGWK (  ± 

&RQWDFW:LGWK E   

&RQWDFW/HQJWK /   

&RQWDFWWR([SRVHG3DG .  ± ±

NOTE 1

EXPOSED PAD

NOTE 1

A3 A1

NOTE 2

BOTTOM VIEW

TOP VIEW

0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &&

 2011 Microchip Technology Inc. Preliminary DS41585A-page 199

PIC10(L)F320/322

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

PIC10(L)F320/322

DS41585A-page 200 Preliminary  2011 Microchip Technology Inc.

NOTES:

 2011 Microchip Technology Inc. Preliminary DS41585A-page 201

PIC10(L)F320/322

APPENDIX A: DATA SHEET

REVISION HISTORY

Revision A

Original release (7/2011).

PIC10(L)F320/322

DS41585A-page 202 Preliminary  2011 Microchip Technology Inc.

NOTES:

 2011 Microchip Technology Inc. Preliminary DS41585A-page 203

PIC10(L)F320/322

INDEX

A/D

Specifications............................................................ 184

Absolute Maximum Ratings (PIC10(L)F320/322) ............. 169

AC Characteristics

Industrial and Extended (PIC10(L)F320/322) ........... 180

Load Conditions ........................................................ 179

ADC .................................................................................... 91

Acquisition Requirements ........................................... 98

Associated registers.................................................. 100

Block Diagram............................................................. 91

Calculating Acquisition Time....................................... 98

Channel Selection....................................................... 92

Configuration............................................................... 92

Configuring Interrupt ................................................... 95

Conversion Clock........................................................ 92

Conversion Procedure ................................................ 95

Internal Sampling Switch (RSS) Impedance................ 98

Interrupts..................................................................... 94

Operation .................................................................... 94

Operation During Sleep .............................................. 94

Port Configuration ....................................................... 92

Reference Voltage (VREF)........................................... 92

Source Impedance...................................................... 98

ADCON Register................................................................. 17

ADRES Register ................................................................. 97

ADRESH Register............................................................... 17

Analog-to-Digital Converter. See ADC

ANSELA Register ............................................................... 78

Assembler

MPASM Assembler................................................... 190

Block Diagrams

ADC ............................................................................ 91

ADC Transfer Function ............................................... 99

Analog Input Model ..................................................... 99

Clock Source............................................................... 27

Interrupt Logic............................................................. 41

NCO .......................................................................... 130

On-Chip Reset Circuit ................................................. 33

PIC10(L)F320/322 ........................................................ 8

PWM ......................................................................... 107

Timer2....................................................................... 105

TMR0/WDT Prescaler............................................... 101

Voltage Reference ...................................................... 85

BORCON Register.............................................................. 35

Brown-out Reset (BOR) ...................................................... 35

Timing and Characteristics ....................................... 182

C Compilers

MPLAB C18 .............................................................. 190

CCP1CON Register ............................................................ 17

CCPR1H Register............................................................... 17

CLCxCON Register........................................................... 119

CLCxGLS0 Register ......................................................... 123

CLCxGLS1 Register ......................................................... 124

CLCxGLS2 Register ......................................................... 125

CLCxGLS3 Register ......................................................... 126

CLCxPOL Register ........................................................... 120

CLCxSEL0 Register.......................................................... 121

CLCxSEL1 Register.......................................................... 122

Clock Sources

External Modes........................................................... 31

EC ...................................................................... 31

Code Examples

Indirect Addressing..................................................... 19

Initializing PORTA ...................................................... 75

Saving Status and W Registers in RAM ..................... 45

Writing to Flash Program Memory.............................. 66

Complementary Waveform Generator (CWG).................. 139

CONFIG Register ............................................................... 22

Customer Change Notification Service............................. 207

Customer Notification Service .......................................... 207

Customer Support............................................................. 207

CWG

Auto-shutdown Control ............................................. 146

Clock Source ............................................................ 142

Output Control .......................................................... 142

Selectable Input Sources.......................................... 142

CWGxCON0 Register....................................................... 149

CWGxCON1 Register....................................................... 150

CWGxCON2 Register....................................................... 151

CWGxDBF Register.......................................................... 152

CWGxDBR Register ......................................................... 152

Data Memory ...................................................................... 13

DC and AC Characteristics............................................... 187

DC Characteristics

Extended and Industrial (PIC10(L)F320/322)........... 176

Industrial and Extended (PIC10(L)F320/322)........... 171

Development Support....................................................... 189

Device Configuration .......................................................... 21

Code Protection.......................................................... 24

Configuration Word..................................................... 21

User ID ................................................................. 24, 25

Device Overview............................................................. 7, 53

EECON1 Register............................................................... 18

EEDATL Register ............................................................... 70

Effects of Reset

PWM mode............................................................... 109

Electrical Specifications (PIC10(L)F320/322)................... 169

Errata.................................................................................... 6

Firmware Instructions ....................................................... 159

Fixed Voltage Reference (FVR)

Associated Registers.................................................. 86

Flash Program Memory ...................................................... 57

Associated Registers.................................................. 73

Configuration Word w/ Flash Program Memory ......... 73

Erasing ....................................................................... 61

Modifying .................................................................... 67

Write Verify ................................................................. 69

Writing ........................................................................ 63

FSR Register ...................................................................... 17

FVRCON (Fixed Voltage Reference Control) Register....... 86

General Purpose Register File ........................................... 13

PIC10(L)F320/322

DS41585A-page 204 Preliminary  2011 Microchip Technology Inc.

INDF Register ..................................................................... 17

Indirect Addressing, INDF and FSR registers ..................... 19

Instruction Format .............................................................159

Instruction Set ................................................................... 159

ADDLW ..................................................................... 161

ADDWF ..................................................................... 161

ANDLW ..................................................................... 161

ANDWF ..................................................................... 161

MOVF........................................................................ 164

BCF........................................................................... 161

BSF ........................................................................... 161

BTFSC ...................................................................... 161

BTFSS ...................................................................... 162

CALL ......................................................................... 162

CLRF......................................................................... 162

CLRW ....................................................................... 162

CLRWDT................................................................... 162

COMF ....................................................................... 162

DECF ........................................................................ 162

DECFSZ.................................................................... 163

GOTO ....................................................................... 163

INCF.......................................................................... 163

INCFSZ ..................................................................... 163

IORLW ...................................................................... 163

IORWF ...................................................................... 163

MOVLW .................................................................... 164

MOVWF .................................................................... 164

NOP .......................................................................... 164

RETFIE ..................................................................... 165

RETLW ..................................................................... 165

RETURN ................................................................... 165

RLF ........................................................................... 166

RRF........................................................................... 166

SLEEP ...................................................................... 166

SUBLW ..................................................................... 166

SUBWF ..................................................................... 167

SWAPF ..................................................................... 167

XORLW..................................................................... 167

XORWF..................................................................... 167

Summary Table......................................................... 160

INTCON Register................................................................ 46

Internal Oscillator Block

INTOSC

Specifications.................................................... 180

Internal Sampling Switch (RSS) Impedance ........................ 98

Internet Address................................................................ 207

Interrupt-On-Change ........................................................... 81

Associated Registers .................................................. 84

Interrupts ............................................................................. 41

ADC ............................................................................ 95

Associated registers w/ Interrupts...............................49

Configuration Word w/ Clock Sources ........................31

Context Saving............................................................ 45

INTOSC Specifications .....................................................180

IOCBP Register...................................................................83

LATA Register..................................................................... 78

Load Conditions ................................................................ 179

MCLR .................................................................................. 36

Internal ........................................................................ 36

Memory Organization........................................................ 139

Data ............................................................................ 13

Program...................................................................... 11

Microchip Internet Web Site.............................................. 207

MPLAB ASM30 Assembler, Linker, Librarian ................... 190

MPLAB Integrated Development Environment Software .. 189

MPLAB PM3 Device Programmer .................................... 192

MPLAB REAL ICE In-Circuit Emulator System ................ 191

MPLINK Object Linker/MPLIB Object Librarian ................ 190

NCO

Associated registers ................................................. 138

NCOxACCH Register ....................................................... 136

NCOxACCL Register ........................................................ 136

NCOxACCU Register ....................................................... 136

NCOxCLK Register........................................................... 135

NCOxCON Register.......................................................... 135

NCOxINCH Register......................................................... 137

NCOxINCL Register ......................................................... 137

Numerically Controlled Oscillator (NCO) .......................... 129

OPCODE Field Descriptions............................................. 159

OPTION_REG Register.................................................... 103

OSCCON Register.............................................................. 30

Oscillator

Associated registers ........................................... 31, 153

Oscillator Module ................................................................ 27

EC............................................................................... 27

INTOSC ...................................................................... 27

Reference Clock Output Control................................. 29

Oscillator Parameters ....................................................... 180

Oscillator Specifications.................................................... 180

Packaging ......................................................................... 193

Marking............................................................. 193, 195

PDIP Details ............................................................. 195

PCL and PCLATH............................................................... 19

Stack........................................................................... 19

PCL Register ...................................................................... 17

PCLATH Register ............................................................... 17

PCON Register ............................................................. 17, 39

PIE1 Register................................................................ 17, 47

Pinout Descriptions

PIC10(L)F320/322 ........................................................ 9

PIR1 Register ............................................................... 17, 48

PMADR Registers............................................................... 57

PMADRH Registers............................................................ 57

PMADRL Register .............................................................. 71

PMADRL Registers............................................................. 57

PMCON1 Register ........................................................ 57, 72

PMCON2 Register ........................................................ 57, 73

PMDATH Register ........................................................ 70, 71

PORTA ............................................................................... 76

ANSELA Register ....................................................... 76

Associated Registers.................................................. 80

PORTA Register......................................................... 17

Specifications ........................................................... 181

PORTA Register................................................................. 77

Power-Down Mode (Sleep)................................................. 51

Associated Registers.................................................. 52

Power-on Reset.................................................................. 34

Power-up Time-out Sequence ............................................ 36

Power-up Timer (PWRT) .................................................... 34

Specifications ........................................................... 183

 2011 Microchip Technology Inc. Preliminary DS41585A-page 205

PIC10(L)F320/322

PR2 Register....................................................................... 17

Prescaler

Shared WDT/Timer0................................................. 102

Program Memory ................................................................ 11

Map and Stack (PIC10(L)F320 ................................... 12

Programming, Device Instructions .................................... 159

Pulse Width Modulation (PWM) ........................................ 107

Associated registers w/ PWM ................................... 112

PWM Mode

Duty Cycle ........................................................ 108

Effects of Reset ................................................ 109

Example PWM Frequencies and

Resolutions, 20 MHZ ................................ 109

Example PWM Frequencies and

Resolutions, 8 MHz................................... 109

Operation in Sleep Mode .................................. 109

Setup for Operation using PWMx pins.............. 110

System Clock Frequency Changes .................. 109

PWM Period.............................................................. 108

Setup for PWM Operation using PWMx Pins............ 110

PWMxCON Register ......................................................... 111

PWMxDCH Register ......................................................... 112

PWMxDCL Register.......................................................... 112

Reader Response ............................................................. 208

Read-Modify-Write Operations ......................................... 159

Registers

ADRES (ADC Result) ................................................. 97

ANSELA (PORTA Analog Select)............................... 78

BORCON Brown-out Reset Control)........................... 35

CLCxCON (CLCx Control)........................................ 119

CLCxGL1 (Gate 2 Logic Select) ............................... 124

CLCxGLS0 (Gate 1 Logic Select) ............................. 123

CLCxGLS2 (Gate 3 Logic Select) ............................. 125

CLCxGLS3 (Gate 4 Logic Select) ............................. 126

CLCxPOL (Signal Polarity Control)........................... 120

CLCxSEL0 (Multiplexer Data 1 and 2 Select)........... 121

CLCxSEL1 (Multiplexer Data 3 and 4 Select)........... 122

Configuration Word..................................................... 22

CWGxCON0 (CWG Control 0).................................. 149

CWGxCON1 (CWG Control 1).................................. 150

CWGxCON2 (CWG Control 1).................................. 151

CWGxDBF (CWGx Dead Band Falling Count) ......... 152

CWGxDBR (CWGx Dead Band Rising Count) ......... 152

EEDATL (EEPROM Data) .......................................... 70

FVRCON..................................................................... 86

INTCON (Interrupt Control)......................................... 46

IOCBP (Interrupt-on-Change Positive Edge) .............. 83

LATA (Data Latch PORTA)......................................... 78

NCOxACCH (NCOx Accumulator High Byte) ........... 136

NCOxACCL (NCOx Accumulator Low Byte)............. 136

NCOxACCU (NCOx Accumulator Upper Byte)......... 136

NCOxCLK (NCOx Clock Control) ............................. 135

NCOxCON (NCOx Control) ...................................... 135

NCOxINCH (NCOx Increment High Byte)................. 137

NCOxINCL (NCOx Increment Low Byte).................. 137

OPTION_REG (Option) ............................................ 103

OSCCON (Oscillator Control) ..................................... 30

PCON (Power Control) ............................................... 39

PIE1 (Peripheral Interrupt Enable 1)........................... 47

PIR1 (Peripheral Interrupt Register 1) ........................ 48

PMADRL (Program Memory Address)........................ 71

PMCON1 (Program Memory Control 1)...................... 72

PMCON2 (Program Memory Control 2)...................... 73

PMDATH (Program Memory Data) ....................... 70, 71

PORTA ....................................................................... 77

PWMxCON (PWM Control) ...................................... 111

PWMxDCH (PWM Control) ...................................... 112

PWMxDCL (PWM Control)....................................... 112

Special Function Registers......................................... 13

Special Function, Summary........................................ 17

STATUS ..................................................................... 15

T2CON ..................................................................... 106

TRISA (Tri-State PORTA) .......................................... 77

WDTCON (Watchdog Timer Control) ......................... 55

Reset .................................................................................. 33

Resets ................................................................................ 33

Associated Registers.................................................. 39

Configuration Word w/ Clock Resets.......................... 39

Revision History................................................................ 201

Software Simulator (MPLAB SIM) .................................... 191

SPBRG Register................................................................. 17

Special Function Registers................................................. 13

Special Function Registers (SFRs)..................................... 17

STATUS Register ............................................................... 15

T2CON Register ......................................................... 17, 106

Temperature Indicator Module............................................ 89

Thermal Considerations (PIC10(L)F320/322)................... 178

Timer0 .............................................................................. 101

Associated Registers................................................ 103

Interrupt .................................................................... 103

Operation.................................................................. 101

Specifications ........................................................... 183

Timer1 .............................................................................. 105

Timer2

Associated registers ................................................. 106

Timers

Timer2

T2CON ............................................................. 106

Timing Diagrams

A/D Conversion ........................................................ 185

A/D Conversion (Sleep Mode).................................. 185

Brown-out Reset (BOR)............................................ 182

Brown-out Reset Situations ........................................ 35

CLKR and I/O ........................................................... 181

Clock Timing............................................................. 180

INT Pin Interrupt ......................................................... 44

Reset Start-up Sequence ........................................... 37

Timer0 External Clock .............................................. 183

Wake-up from Interrupt............................................... 52

Timing Parameter Symbology .......................................... 179

TMR0 Register.................................................................... 17

TMR2 Register.................................................................... 17

TRISA Register................................................................... 77

VREF. SEE ADC Reference Voltage

Wake-up Using Interrupts................................................... 52

Watchdog Timer (WDT)...................................................... 36

Associated Registers.................................................. 56

Configuration Word w/ Watchdog Timer..................... 56

Modes......................................................................... 54

Specifications ........................................................... 183

WDTCON Register ............................................................. 55

Write Protection .................................................................. 24

PIC10(L)F320/322

DS41585A-page 206 Preliminary  2011 Microchip Technology Inc.

WWW Address..................................................................207

WWW, On-Line Support........................................................ 6

 2011 Microchip Technology Inc. Preliminary DS41585A-page 207

PIC10(L)F320/322

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

•Product Support – Data sheets and errata,

application notes and sample programs, design

resources, user’s guides and hardware support

documents, latest software releases and archived

software

•General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,

online discussion groups, Microchip consultant

program member listing

•Business of Microchip – Product selector and

ordering guides, latest Microchip press releases,

listing of seminars and events, listings of

Microchip sales offices, distributors and factory

representatives

CUSTOMER CHANGE NOTIFICATION

SERVICE

Microchip’s customer notification service helps keep

customers current on Microchip products. Subscribers

will receive e-mail notification whenever there are

changes, updates, revisions or errata related to a

specified product family or development tool of interest.

To register, access the Microchip web site at

www.microchip.com. Under “Support”, click on

“Customer Change Notification” and follow the

registration instructions.

CUSTOMER SUPP ORT

Users of Microchip products can receive assistance

through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Development Systems Information Line

Customers should contact their distributor,

representative or field application engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

Technic al suppo rt is avail able throug h the we b site

at: http://microchip.com/support

PIC10(L)F320/322

DS41585A-page 208 Preliminary  2011 Microchip Technology Inc.

READER RESP ONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip

product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our

documentation can better serve you, please FAX your comments to the Technical Publications Manager at

(480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

TO: Technical Publications Manager

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FAX: (______) _________ - _________

DS41585APIC10(L)F320/322

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

 2011 Microchip Technology Inc. Preliminary DS41585A-page 209

PIC10(L)F320/322

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X/XX XXX

PatternPackageTemperature

Range

Device

Device: PIC10F320, PIC10LF320, PIC10F322, PIC10LF322

Tape and Reel

Option: Blank = Standard packaging (tube or tray)

T = Tape and Reel(1)

Temperature

Range: I= -40C to +85C(Industrial)

E= -40

C to +125C (Extended)

Package: OT = SOT-23

P=PDIP

MC = DFN

Pattern: QTP, SQTP, Code or Special Requirements

(blank otherwise)

Examples:

a) PIC10LF320T - I/OT

Tape and Reel,

Industrial temperature,

SOT-23 package

b) PIC10F322 - I/P

Industrial temperature

PDIP package

c) PIC10F320 - E/MC

Extended temperature,

DFN package

Note 1: Tape and Reel identifier only appears in the

catalog part number description. This

identifier is used for ordering purposes and is

not printed on the device package. Check

with your Microchip Sales Office for package

availability with the Tape and Reel option.

[X](1)

Tape and Reel

Option

DS41585A-page 210 Preliminary  2011 Microchip Technology Inc.

AMERICAS

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05/02/11