2006-05-10
1
BCR199...
PNP Silicon Digital Transistor
• Switching circuit, inverter, interface circuit,
driver circuit
• Built in bias resistor (R1 = 47kΩ)
BCR199F/L3
BCR199T
EHA07180
3
12
BE
C
1
R
Type Marking Pin Configuration Package
BCR199F*
BCR199L3*
BCR199T*
UBs
UB
UB
1=B
1=B
1=B
2=E
2=E
2=E
3=C
3=C
3=C
-
-
-
-
-
-
-
-
-
TSFP-3
TSLP-3-4
SC75
* Preliminary
Maximum Ratings
Parameter Symbol Value Unit
Collector-emitter voltage VCEO 50 V
Collector-base voltage VCBO 50
Input forward voltage Vi(fwd) 80
Input reverse voltage Vi(rev) 5
Collector current IC70 mA
Total power dissipation-
BCR199F, TS ≤ 128°C
BCR199L3, TS ≤ 135°C
BCR199T, TS ≤ 109°C
Ptot
250
250
250
mW
Junction temperature Tj150 °C
Storage temperature Tst
g
-65 ... 150
2006-05-10
2
BCR199...
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point1)
BCR199F
BCR199L3
BCR199T
RthJS
≤ 90
≤ 60
≤ 165
K/W
Electrical Characteristics at T
A
= 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Collector-emitter breakdown voltage
IC = 100 µA, IB = 0
V(BR)CEO 50 - - V
Collector-base breakdown voltage
IC = 10 µA, IE = 0
V(BR)CBO 50 - -
Collector-base cutoff current
VCB = 40 V, IE = 0
ICBO - - 100 nA
Emitter-base cutoff current
VEB = 5 V, IC = 0
IEBO - - 100 nA
DC current gain2)
IC = 5 mA, VCE = 5 V
hFE 120 - 630 -
Collector-emitter saturation voltage2)
IC = 10 mA, IB = 0.5 mA
VCEsat - - 0.3 V
Input off voltage
IC = 100 µA, VCE = 5 V
Vi(off) 0.4 - 0.8
Input on voltage
IC = 2 mA, VCE = 0.3 V
Vi(on) 0.5 - 1.5
Input resistor R132 47 62 kΩ
AC Characteristics
Transition frequency
IC = 10 mA, VCE = 5 V, f = 100 MHz
fT- 200 - MHz
Collector-base capacitance
VCB = 10 V, f = 1 MHz
Ccb - 3 - -
1For calculation of RthJA please refer to Application Note Thermal Resistance
2Pulse test: t < 300µs; D < 2%
2006-05-10
3
BCR199...
DC current gain hFE = ƒ(IC)
VCE = 5 V (common emitter configuration)
10 -4 10 -3 10 -2 10 -1
A
IC
1
10
2
10
3
10
hFE
Collector-emitter saturation voltage
VCEsat = ƒ(IC), hFE = 20
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 V1
VCEsat
-4
10
-3
10
-2
10
-1
10
A
IC
Input on Voltage Vi(on) = ƒ(IC)
VCE = 0.3V (common emitter configuration)
10 -1 10 0 10 1 10 2
V
Vi(on)
-4
10
-3
10
-2
10
-1
10
hFE
Input off voltage Vi(off) = ƒ(IC)
VCE = 5V (common emitter configuration)
0 1 2 V4
Vi(off)
-6
10
-5
10
-4
10
-3
10
-2
10
A
IC
2006-05-10
4
BCR199...
Total power dissipation Ptot = ƒ(TS)
BCR199F
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mW
300
Ptot
Total power dissipation Ptot = ƒ(TS)
BCR199L3
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mW
300
Ptot
Total power dissipation Ptot = ƒ(TS)
BCR199T
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mW
300
Ptot
2006-05-10
5
BCR199...
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
BCR199F
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
2
10
3
10
Ptotmax/PtotDC
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
Permissible Puls Load RthJS = ƒ (tp)
BCR199F
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
-1
10
0
10
1
10
2
10
K/W
RthJS
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
Permissible Puls Load RthJS = ƒ (tp)
BCR199L3
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
-1
10
0
10
1
10
2
10
RthJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
BCR199L3
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
2
10
3
10
Ptotmax/ PtotDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
2006-05-10
6
BCR199...
Permissible Puls Load RthJS = ƒ (tp)
BCR199T
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
-1
10
0
10
1
10
2
10
3
10
K/W
RthJS
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
BCR199T
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
2
10
3
10
Ptotmax / PtotDC
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
2006-05-10
7
BCR199...
Package SC75
Package Outline
Foot Print
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
1.6
±0.2
0.5
0.10 M0.5
A
0.2
0.2
+0.1
-0.05
1 2
-0.05
3
+0.1
1.6±0.2
0.20 MA
0.7
0.15
10˚
MAX.
0.1 MAX.
±0.1
±0.1
±0.1
0.8
MAX.
10˚
1.15
0.65
0.4
0.4
0.65
0.50.5
BCR108T
Type code
Pin 1
4
8
1.8
0.2 MAX.
0.9
1.4
1.75
0.45
Pin 1
2005, December
Date code
Marking Layout (Example)
2006-05-10
8
BCR199...
Date Code marking for discrete packages with
one digit (SCD80, SC79, SC75
1)
) CES-Code
1) New Marking Layout for SC75, implemented at October 2005.
.
Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
01apAPapAPapAP
02bqBQbqBQbqBQ
03crCRcrCRcrCR
04dsDSdsDSdsDS
05et ETet ETet ET
06fuFUfuFUfuFU
07gvGVgvGVgvGV
08hxHXhxHXhxHX
09jyJYjyJYjyJY
10kzKZkzKZkzKZ
11l 2L4l 2L4l 2L4
12n3N5n3N5n3N5
2006-05-10
9
BCR199...
Package TSFP-3
4
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
±0.05
0.2
3
±0.05
1.2
12
10˚ MAX.
±0.05
0.8
1.2±0.05
±0.04
0.55
±0.05
0.2
±0.05
0.15
±0.05
0.2
0.4
±0.05
0.4
±0.05
0.4
0.45
1.05
0.4 0.4
BCR847BF
Type code
Pin 1
0.2
1.35
0.3
0.7
1.2
1.5
8
Pin 1
Manufacturer
2006-05-10
10
BCR199...
Package TSLP-3-4
Package Outline
Foot Print
Marking Layout
Standard Packing
2
3
1
0.76
4
1.16
0.5
Pin 1
marking
8
Reel ø180 mm = 15.000 Pieces/Reel
For board assembly information please refer to Infineon website "Packages"
Stencil aperturesCopper Solder mask
0.38
0.2
0.315
0.95
0.5
0.17
0.255
0.2
0.45
0.225
1
0.6
0.225
0.15
0.35
0.2
R0.1
R0.19
Pin 1
Top view
0.05 MAX.
Bottom view
21
±0.035
0.5
3
0.575
1)
±0.035
0.4
1)
±0.035
2x
0.25
1)
0.35
±0.035
2x0.15
1)
marking
1) Dimension applies to plated terminal
0.4
+0.1
±0.05
±0.05
±0.05
1
0.6
±0.05
BCR133L3
Type code
Pin 1 marking
Laser marking
2006-05-10
11
BCR199...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2006.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
