LM3519
-+
Cin
4.7 PF
L
2.2 PHD
Cout
1 PF
Gnd LED_rtn
Vout
Vin Sw
En
Vin
Vout
Vx
Logic
Voltage
Signal
Input
LM3519
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SNVS394B –AUGUST 2005–REVISED MAY 2013
LM3519 High Frequency Boost White LED Driver with High-Speed PWM Brightness
Control
Check for Samples: LM3519
1FEATURES DESCRIPTION
The LM3519 drives up to 4 white LEDs with constant
2• Drives 2 to 4 LEDs at 20mA current to provide LCD backlighting in handheld
• Up to 30kHz PWM Dimming Control Capability devices. The LED current is internally set to 20mA.
• >80% Peak Efficiency The series connection allows the LED current to be
identical for uniform brightness and minimizes the
• Up to 8MHz Switching Frequency number of traces to the LEDs. Brightness control is
• Small External Components: 1µH - achieved by applying a PWM signal on enable with
3.3µH(typ.2.2μH) Inductor and 1µF Output frequencies up to 30kHz.
Capacitor The LM3519 features a proprietary PFM regulation
• True Shutdown Isolation architecture with switching frequencies between
• Over-Voltage Protection 2MHz to 8MHz, minimizing inductor size.
• Wide Input Voltage Range: 2.7V to 5.5V Over-voltage protection circuitry and high frequency
• Small Footprint SOT-23 Package operation permit the use of low-cost small output
capacitors. During shutdown, the output is
APPLICATIONS disconnected from the input in order to avoid leakage
current path through the LEDs to ground.
• LCD, White LED Backlighting on Mobile The LM3519 is available in a tiny 6-pin SOT-23
Phones package.
• Digital Still Cameras and PDAs
• General Purpose LED Lighting in Handheld
Devices
Typical Application
Figure 1. Typical Application Circuit
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2005–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
2
6
1
5
34
LM3519
SNVS394B –AUGUST 2005–REVISED MAY 2013
www.ti.com
Connection Diagram
6-Lead SOT-23 Package
Top View
PIN DESCRIPTIONS
Pin # Name Description
1 En Device Enable Connection
2 Gnd Ground Connection
3 VOUT Output Voltage Connection
4 LED_rtn White LED Current Sensing Input Connection
5 SWDrain Connection of the Internal Power Field Effect Transistor (FET) Switch
6 VIN Input or Supply Voltage Connection
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)
VIN , En, & LED_rtn Pin −0.3V to +6.5V
VOUT , Sw Pin −0.3V to +21V
Maximum Junction Temperature, (TJ-MAX) +150°C
Storage Temperature Range −65°C to +150°C
ESD Rating(2)
Human Body Model: 2kV
Machine Model: 200V
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is ensured. Operating Ratings do not imply ensured limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics table.
(2) The human body model is a 100pF capacitor discharged through a 1.5kΩresistor into each pin. The machine model is a 200pF
capacitor discharged directly into each pin.
Operating Ratings(1)
Junction Temperature (TJ) Range −40°C to +125°C
Ambient Temperature (TA) Range −40°C to +85°C
Input Voltage Range 2.7V to 5.5V
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is ensured. Operating Ratings do not imply ensured limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics table.
Thermal Properties(1)
Junction-to-Ambient Thermal Resistance (θJA) 220°C/W
(1) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal
resistance, θJA, and the ambient temperature, TA. See Thermal Properties for the thermal resistance. The maximum allowable power
dissipation at any ambient temperature is calculated using: PD(MAX) = (TJ(MAX) – TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature.
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Electrical Characteristics (1)(2)
Limits in standard typeface are for TJ= +25°C. Limits in bold typeface apply over the full operating junction temperature
range (−40°C ≤TJ≤+125°C). VIN = 3.6V, unless otherwise stated. Uni
Symbol Parameter Conditions Min Typ Max ts
IQSupply Current Shutdown: VEN = 0V 0.1
Not Switching: VEN = 1.8V 360 500 µA
Switching: VEN = 1.8V, LED_rtn current = 550 900
30mA
ILED(TOL) LED Current Tolerance/Variation VIN = 3.6V, 2.2μH, –10 5.5 10 %
4LEDs
OVP Over-Voltage Protection Threshold OVP ON 18 18.9 20 V
OVP OFF 17.8 18.6 19.8
ILIM Switch Current Limit L = 2.2µH 750 mA
RDS(ON) Power NMOS Switch ON Resistance 455 mΩ
ILEAKAGE Switch Leakage VSW = 3.6V, VEN = 0V 0.1 2µA
RLED_rtn(ON) LED_rtn NMOS Switch ON Resistance 8.0 Ω
FSSwitching Frequency ILED = 20 mA , L = 1μH MH
5.4
4LEDs z
IEN Enable Pin Bias Current (3) VEN = 0V 0.1 µA
VEN = 1.8V 1.1 2
En Enable Threshold Device On 0.9 V
Device Off 0.3
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is ensured. Operating Ratings do not imply ensured limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics table.
(2) Min and max limits are ensured by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the most likely
norm.
(3) Current flows into the pin.
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+
-
ERROR
AMPLIFIER
ON-TIME
GENERATOR
OVER
VOLTAGE
PROTECTION
DRIVER
LOGIC
CURRENT
LIMIT
R
S
RQ
En
LED_rtn
Vout
Gnd
Vin
Sw
N2
Vin
N1
N3
Vin
IREF
VREF
1
2
3
4
5
6
LM3519
SNVS394B –AUGUST 2005–REVISED MAY 2013
www.ti.com
BLOCK DIAGRAM
Figure 2. Block Diagram
Circuit Description
The LM3519 is a step-up converter for white LED applications that uses a unique and proprietary pulse
frequency modulation (PFM) architecture to optimize high efficiency at high frequency operation. Unlike most
PFM architecture implementations, the LM3519’s unique architectural implementation results in non-pulse
skipping variable frequency operation. The regulator is forced to operate at the edge of Continous Conduction
Mode (CCM). The error amplifier will set the end of the on-time (IPEAK of inductor) based on the load (LEDs)
current. During this operation, the inductor current ramps up and reaches a peak current at end of the on-time. At
this point, the internal power switch is turned off until the inductor current reaches zero, and the cycle repeats
again. The switching frequency is set based on the charge (on-time) and discharge(off-time) of the inductor
current. The frequency can range between 2MHz to 8MHz over the operating input range.
The LM3519 operation can be best understood through an examination of the block diagram in Figure 2. When
LED current is out of regulation, the LED_rtn voltage falls below or rises above the internal reference voltage
(VREF). The error amplifier will output a signal to increase or decrease the proper on-time duration of N1 power
FET. This correction allows the inductor's stored energy to increase or decrease to a sufficient level that when
transferred to the load will bring the LED_rtn current back into regulation.
During steady-state operation for a typical switching cycle, the oscillator sets the driver logic and turns on N1
power device. N1 conducts current through the inductor and reverse biases the external diode. The LED current
is supplied by the output capacitor when N1 is conducting. Once N1 on-time period is concluded, the internal
power device is turned off and the external diode is forward baised. The inductor current then flows through the
diode to the LED load to replenish the output capacitor and keep the LED current regulated at the trimmed
target.
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-4
-2
0
2
4
10
2.7 3.0 3.3 3.6 3.9 4.2 4.5
VIN (V)
ACCURACY (%)
6
8
25°C
85°C
-40°C
0
2
4
6
8
16
2.7 3.0 3.3 3.6 3.9 4.2 4.5
VIN (V)
ACCURACY (%)
1 PH
10
12
14
3.3 PH
2.2 PH
50
60
70
80
90
2.5 3.0 3.5 4.0 4.5 5.0 5.5
VIN (V)
EFFICIENCY (%)
1 PH
2.2 PH
3.3PH
1.5 PH
100
3 LEDs
50
60
70
80
90
2.5 3.0 3.5 4.0 4.5 5.0 5.5
VIN (V)
EFFICIENCY (%)
3.3PH
1.5 PH
100
1 PH
2 LEDs
50
60
70
80
90
2.5 3.0 3.5 4.0 4.5 5.0 5.5
VIN (V)
EFFICIENCY (%)
1 PH
2.2 PH
3.3PH
1.5 PH
4 LEDs
75
77
79
81
83
85
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
VIN (V)
EFFICIENCY (%)
-40°C
85°C
4 LEDs
25°C
LM3519
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SNVS394B –AUGUST 2005–REVISED MAY 2013
Typical Performance Characteristics
(See Figure 1: VIN = 3.6V, CIN = 4.7µF and COUT = 1µF, L = 2.2µH and 4 LEDs. TA= +25°C, unless otherwise stated.)
Efficiency Efficiency
vs vs
VIN VIN
Efficiency Efficiency
vs vs
VIN VIN
IOUT_ACCURACY IOUT_ACCURACY
vs vs
VIN VIN
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5 15 25 35 45 55 65 75 85 95
DUTY CYCLE (%)
2
5
8
11
14
17
20
23
IOUT (mA)
20 kHz
50 kHz
30 kHz
EN = 20 kHz, 30 kHz, and 50 kHz
5 15 25 35 45 55 65 75 85 95
DUTY CYCLE (%)
1
4
7
10
13
16
19
22
IOUT (mA)
EN = 100 Hz and 500 Hz
19.5
20.0
20.5
21.0
21.5
22.0
2.7 3.0 3.3 3.6 3.9 4.2 4.5
VIN (V)
IOUT (mA)
25°C
85°C
-40°C
5 15 25 35 45 55 65 75 85 95
DUTY CYCLE (%)
1
4
7
10
13
16
19
22
IOUT (mA)
EN =100 Hz and 500 Hz
2.5 3.0 3.5 4.0 4.5 5.0 5.5
VIN (V)
IOUT (mA)
1 PH
3.3 PH
1.5 PH
2.2 PH
16.0
18.0
20.0
22.0
24.0
26.0
28.0
30.0
4 LEDs
1.5 PH
2.5 3.0 3.5 4.0 4.5 5.0 5.5
VIN (V)
IOUT (mA)
3.3 PH
16.0
18.0
20.0
22.0
24.0
26.0
28.0
32.0
2.2 PH
1 PH
30.0
3 LEDs
LM3519
SNVS394B –AUGUST 2005–REVISED MAY 2013
www.ti.com
Typical Performance Characteristics (continued)
(See Figure 1: VIN = 3.6V, CIN = 4.7µF and COUT = 1µF, L = 2.2µH and 4 LEDs. TA= +25°C, unless otherwise stated.)
IOUT IOUT
vs vs
VIN VIN
IOUT
IOUT vs
vs PWM Duty Cycle
VIN (VIN = 3.6V, L = 2.2µH)
IOUT IOUT
vs vs
PWM Duty Cycle PWM Duty Cycle
(VIN= 3.6V, L = 2.2µH) (VIN = 3.6V, L = 1µH)
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2.7 3.0 3.3 3.6 3.9 4.2 4.5
VIN (V)
IPEAK (mA)
1 PH
3.3 PH
2.2 PH
4 LEDS
100
150
200
250
300
350
400
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
VIN (V)
FREQUENCY (MHz)
3.3 PH
2.2 PH
1 PH
1.5
4.5
6.0
7.5
9.0
10.5
3.0
4 LEDs
2.7 3.0 3.3 3.6 3.9 4.2 4.5
VIN (V)
FREQUENCY (MHz)
2 LEDS
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
3.3 PH
2.2 PH
1 PH
4.0
5.0
6.0
7.0
8.0
9.0
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
VIN (V)
FREQUENCY (MHz)
-40°C and 85°C
4 LEDs
1 PH,
25°C
2.7 3.0 3.3 3.6 3.9 4.2 4.5
VIN (V)
FREQUENCY (MHz)
3.3 PH
3 LEDS
2.2 PH
1 PH
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10 20 30 40 50 60 70 80 90 100
DUTY CYCLE (%)
1
4
7
10
13
16
19
22
25
IOUT (mA)
50 kHz
20 kHz
30 kHz
EN = 20 kHz, 30 kHz, and 50 kHz
LM3519
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SNVS394B –AUGUST 2005–REVISED MAY 2013
Typical Performance Characteristics (continued)
(See Figure 1: VIN = 3.6V, CIN = 4.7µF and COUT = 1µF, L = 2.2µH and 4 LEDs. TA= +25°C, unless otherwise stated.)
IOUT
vs Switching Frequency
PWM Duty Cycle vs
(VIN = 3.6V, L = 1µH) VIN
Switching Frequency Switching Frequency
vs vs
VIN VIN
Switching Frequency Peak Inductor Current
vs vs
VIN VIN
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-40 -20 0 20 40 60 80 100
TEMPERATURE (°C)
IQ NON SWITCHING (PA)
320
360
370
380
390
400
350
340
330
-40 -20 0 20 40 60 80 100
TEMPERATURE (°C)
IQ SWITCHING (PA)
500
520
540
560
580
600
510
530
550
570
590
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
VIN (V)
CURRENT LIMIT (mA)
25°C and -40°C
85°C
700
800
900
1000
1100
1200
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
VIN (V)
CURRENT LIMIT (mA)
3.3 PH
2.2 PH
1 PH
600
800
900
1000
1100
1200
700
2.7 3.0 3.3 3.6 3.9 4.2 4.5
VIN (V)
IPEAK (mA)
1 PH
3.3 PH
2.2 PH
3 LEDS
100
150
200
250
300
350
400
2.7 3.0 3.3 3.6 3.9 4.2 4.5
VIN (V)
IPEAK (mA)
1 PH
3.3 PH
2.2 PH
2 LEDS
100
150
200
250
300
350
400
LM3519
SNVS394B –AUGUST 2005–REVISED MAY 2013
www.ti.com
Typical Performance Characteristics (continued)
(See Figure 1: VIN = 3.6V, CIN = 4.7µF and COUT = 1µF, L = 2.2µH and 4 LEDs. TA= +25°C, unless otherwise stated.)
Peak Inductor Current Peak Inductor Current
vs vs
VIN VIN
Current Limit Current Limit
vs vs
VIN (4LEDs, 1µH) VIN
Iq (non switching) Iq (switching)
vs vs
Temperature Temperature
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-40 -20 0 20 40 60 80 100
TEMPERATURE (°C)
LED SWITCH RDSON (:)
6
7
8
9
10
11
-40 -20 0 20 40 60 80 100
TEMPERATURE (°C)
POWER SWITCH RDSON (m:)
320
420
470
520
570
620
370
LM3519
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SNVS394B –AUGUST 2005–REVISED MAY 2013
Typical Performance Characteristics (continued)
(See Figure 1: VIN = 3.6V, CIN = 4.7µF and COUT = 1µF, L = 2.2µH and 4 LEDs. TA= +25°C, unless otherwise stated.)
LED Switch RDS_ON Power Switch RDS_ON
vs vs
Temperature Temperature
Start-up, (VIN = 3.6V, 4LEDs, 2.2µH) Start-up (VIN = 3.6V, 4LEDs, 3.3µH)
Start-up (VIN = 3.6V, 2LEDs, 3.3µH) Start-up, (VIN = 3.6V, 2LEDs, 2.2µH)
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SNVS394B –AUGUST 2005–REVISED MAY 2013
www.ti.com
Typical Performance Characteristics (continued)
(See Figure 1: VIN = 3.6V, CIN = 4.7µF and COUT = 1µF, L = 2.2µH and 4 LEDs. TA= +25°C, unless otherwise stated.)
Typical Switching Waveform Typical Switching Waveform
(VIN = 3.6V, 4LEDs, 3.3µH) (VIN = 3.6V, 4LEDs, 2.2µH)
Typical Switching Waveform Typical Switching Waveform
(VIN = 3.6V, 3LEDs, 2.2µH) (VIN = 3.6V, 2LEDs, 2.2µH)
Typical Switching Waveform Typical Switching Waveform
(VIN = 3.6V, 3LEDs, 1µH) (VIN = 3.6V, 4LEDs, 1µH)
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SNVS394B –AUGUST 2005–REVISED MAY 2013
APPLICATION INFORMATION
Capacitor Selection
To minimize output and input voltage ripple, low equivalent series resistance (ESR) ceramic capacitors are the
best choice to use for the input and output filters. For most display applications, a 4.7µF capacitor is
recommended for CIN and 1µF for COUT .
Larger output capacitors can be used to reduce ripple voltage. To ensure good performance, a minimum of
0.47µF COUT is required to trade off for large ripple voltage. Care must be taken to account for the true
capacitance of a multilayer ceramic capacitor. Smaller case size capacitors typically have less capacitance for a
given bias voltage as compared to a larger case size capacitor with the same bias voltage. Please confirm with
capacitor manufacturer data before selecting the capacitor.
Recommended capacitor manufacturers include but are not limited to:
Table 1.
Manufacturer Description Case Size
AVX 06033D105MAT-25V 0603
06036D475MAT-6.3V 0603
TDK C2012X5R1A475M-10V 0805
Taiyo Yuden TMK212BJ105KG-J 0805
EM212BJ475MG-16V 0805
muRata GRM40-034B105K25 0805
GRM39X5R475K6.3 0603
Inductor Selection
In order to maintain sufficient inductance, the saturation current rating of the inductor used with the LM3519
should be higher than the peak inductor current in the target application. Inductors with low DCR values have
less power loss and higher efficiency. Larger inductor values such as 2.2µH and 3.3µH can be used to optimize
efficiency, frequency and peak current. If 1µH is used, the peak inductor current, frequency will be higher and the
efficiency will be lower. Note that the switching frequency ranges will be higher at lower inductance. Typical
frequency range is between 4 to 8MHz for 1µH, 2 to 5MHz for 2.2µH and 2 to 4MHz for 3.3µH over the input
range. Below is a sample list of low profile inductors.
Some recommended inductor manufacturers include but are not limited to:
Manufacturer L Case Size ISAT
CoilCraft: 2.1A
1µH
DO3314-102 3.3x3.3x1.4mm
DO3314-222 2.2µH 1.6A
DO3314-332 3.3µH 1.4A
Coilcraft: 1.6A
1µH
LPO3310-102ML 3.3x3.3x1.0 mm
LPO3310-222ML 2.2µH 1.1A
LPO3310-332ML 3.3µH 0.95A
Cooper: 2.07A
1µH
SD31121R0 3.1x3.1x1.4 mm
SD3114-2R2 2.2µH 1.48A
SD3114-3R3 3.3uH 1.15A
Taiyo Yuden: 2.1A
1µH
NR3015T1R0N 3.0x3.0x1.5 mm
NR3015T2R2M 2.2µH 1.48A
NR3015T3R3M 3.3µH 1.21A
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SNVS394B –AUGUST 2005–REVISED MAY 2013
www.ti.com
Diode Selection
Diodes with low forward voltage ratings (VF) and low junction capacitance magnitudes (CJor CTor CD) are
conducive to high efficiency. The chosen diode must have a reverse breakdown voltage rating (VRand/or VRRM)
that is larger than the output voltage. The following criteria should be followed when choosing a diode:
1. VR(Diode Blocking Voltage Range) and VRRM (Diode Peak Repetitive Reverse Voltage Rating) > VOUT
(Output Voltage)
2. IFor IO(Diode Average Forward Current Rating) ≥ILOAD (Load Current)
3. IFRM (Diode Peak Repetitive Forward Current Rating) ≥ILpeak (Peak Inductor Current)
Some recommended diode manufacturers include but are not limited to:
Manufacturer Description
Vishay SS12(1A/20V)
SS14(1A/40V)
SS16(1A/60V)
Central Semiconductor CMSH1- 40M(1A/40V)
ONSemi MBRS1540T3(1.5A/40V)
PWM DIMMING
The LED current is set internally by the LM3519 to 20mA (typical); dimming control may be realized by applying
a pulse width modulated(PWM) signal to the En pin. For example, a 50% duty cycle waveform will produce an
average current of 10mA. A control signal frequency between 17kHz and 30kHz is suitable for dimming.
Although the LM3519 is capable of operation outside this frequency range, it is not recommended to operate
below 17kHz for the following reasons: 1) frequency below 100Hz is likely to cause visible flicker in the light
emitted by the LED string. 2) frequency below 17kHz may induce audible noise due to combinations of some
capacitance/PCB. A PWM frequency above 30kHz is possible but the current linearity vs duty cycle will be
affected.
If it is not possible to operate the dimming control above 17kHz, audible noise emission may be minimized by
using capacitors with low susceptibility to piezoelectric induced stresses, such as poly film designs. Minimum
audible noise is most likely to occur when the PWM frequency is less than 2kHz. It is recommended that any
application using a PWM control signal below 17kHz be thoroughly evaluated for undesirable audible or visible
noise.
DRIVING 2 LEDs
The LM3519 is optimized to drive up to 4LEDs. When driving 2LEDs, a minimum inductance of 2.2µH is required
to maintain good loop regulation and current accuracy. If a smaller inductor is used, the LED current will have
more variation with input voltage than a typical application. The following curve illustrates the behavior.
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2.5 3.0 3.5 4.0 4.5 5.0 5.5
VIN (V)
IOUT (mA)
1 PH
3.3 PH
1.5 PH
15.0
20.0
25.0
30.0
35.0
40.0
45.0
50.0
2 LEDs
LM3519
www.ti.com
SNVS394B –AUGUST 2005–REVISED MAY 2013
Figure 3. IOUT vs VIN
LAYOUT GUIDELINES
The input capacitor, CIN, must be placed close to the LM3519. Placing CIN close to the device will reduce the
metal trace resistance effect on input voltage ripple. Metal trace connections for the COUT capacitor can increase
the effective series resistance, which affects output voltage ripple and efficiency. Trace connections to the
inductor should be short and wide to reduce power dissipation, increase overall efficiency and reduce EMI
radiation. The diode, like the inductor, should have trace connections that are short and wide to reduce power
dissipation and increase overall efficiency. For more details regarding layout guidelines for switching regulators,
refer to Application Note AN1149 SNVA021.
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SNVS394B –AUGUST 2005–REVISED MAY 2013
www.ti.com
REVISION HISTORY
Changes from Revision A (May 2013) to Revision B Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 13
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PACKAGE OPTION ADDENDUM
www.ti.com 28-Feb-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM3519MK-20/NOPB ACTIVE SOT-23-THIN DDC 6 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 D52B
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 28-Feb-2017
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM3519MK-20/NOPB SOT-
23-THIN DDC 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Mar-2017
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM3519MK-20/NOPB SOT-23-THIN DDC 6 1000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Mar-2017
Pack Materials-Page 2
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