
6-2
Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified RFD3055LE, RFD3055LESM,
RFP3055LE UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS 60 V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR 60 V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VGS ±16 V
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM 11
Refer to Peak Current Curve A
Single Pulse Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .EAS Refer to UIS Curve
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PD
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
0.25 W
W/oC
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ, TSTG -55 to 175 oC
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg 300
260
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ= 25oC to 150oC.
Electrical Specifications TC = 25oC, Unless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BVDSS ID = 250µA, VGS = 0V 60 - - V
Gate Threshold Voltage VGS(TH) VGS = VDS, ID = 250µA1-3V
Zero Gate Voltage Drain Current IDSS VDS = 55V, VGS = 0V - - 1 µA
VDS = 50V, VGS = 0V, TC = 150oC - - 250 µA
Gate to Source Leakage Current IGSS VGS = ±16V - - ±100 nA
Drain to Source On Resistance (Note 2) rDS(ON) ID = 8A, VGS = 5V (Figure 11) - - 0.107 Ω
Turn-On Time tON VDD ≈ 30V, ID = 8A,
VGS = 4.5V, RGS = 32Ω
(Figures 10, 18, 19)
- - 170 ns
Turn-On Delay Time td(ON) -8- ns
Rise Time tr- 105 - ns
Turn-Off Delay Time td(OFF) -22- ns
Fall Time tf-39- ns
Turn-Off Time tOFF - - 92 ns
Total Gate Charge Qg(TOT) VGS = 0V to 10V VDD = 30V, ID = 8A,
Ig(REF) = 1.0mA
(Figures 20, 21)
- 9.4 11.3 nC
Gate Charge at 5V Qg(5) VGS = 0V to 5V - 5.2 6.2 nC
Threshold Gate Charge Qg(TH) VGS = 0V to 1V - 0.36 0.43 nC
Input Capacitance CISS VDS = 25V, VGS = 0V, f = 1MHz
(Figure 14) - 350 - pF
Output Capacitance COSS - 105 - pF
Reverse Transfer Capacitance CRSS -23- pF
Thermal Resistance Junction to Case RθJC - - 3.94 oC/W
Thermal Resistance Junction to Ambient RθJA TO-220AB - - 62 oC/W
TO-251AA, TO-252AA - - 100 oC/W
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage VSD ISD = 8A - 1.25 V
Diode Reverse Recovery Time trr ISD = 8A, dISD/dt = 100A/µs - 66 ns
NOTES:
2. Pulse Test: Pulse Width ≤ 300ms, Duty Cycle ≤ 2%.
3. Repetitive Rating: Pulse Width limited by max junction temperature. See Transient Thermal Impedance Curve (Figure 3) and Peak Current
Capability Curve (Figure 5).
RFD3055LE, RFD3055LESM, RFP3055LE